Anti-shatter PTC heater

By designing a buffer layer and a multi-layer protective shell structure, the problems of insufficient mechanical protection, mutual constraints between heat dissipation and protection, and lack of electromagnetic interference and condition monitoring in PTC heaters are solved. This achieves synergistic enhancement of the structural integrity, heat dissipation performance and electromagnetic interference protection of PTC ceramic chips, thereby improving their reliability and stability under complex operating conditions.

CN224319533UActive Publication Date: 2026-06-02YANGZHOU ASPRIANT ELECTRIC CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
YANGZHOU ASPRIANT ELECTRIC CO LTD
Filing Date
2025-06-03
Publication Date
2026-06-02

AI Technical Summary

Technical Problem

Existing PTC heaters suffer from insufficient mechanical protection, a trade-off between heat dissipation and protection, and a lack of electromagnetic interference and condition monitoring, resulting in fragility and insufficient operational stability.

Method used

The design employs a buffer layer, including a first spring, a shock-absorbing spring assembly, and a second spring. Combined with the multi-layered structure of the protective shell, it enhances mechanical protection and heat dissipation performance. Electromagnetic interference protection and status monitoring are achieved through an electromagnetic shielding layer and a fiber optic grating sensor.

Benefits of technology

It effectively absorbs mechanical stress, prevents chip breakage, improves heat dissipation efficiency, blocks electromagnetic interference, enables real-time monitoring of chip status, and ensures the reliability and stability of PTC ceramic chips under complex working conditions.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model is suitable for PTC heater technical field provides a kind of anti-cracking PTC heater, including PTC ceramic chip;Buffer layer is located in PTC ceramic chip periphery;Protective housing;Wherein, protective housing includes: outer protective layer, intermediate layer and inner heat conduction layer;Buffer layer includes: first elastic sheet, shock-absorbing spring group and second elastic sheet;The device utilizes elastic buffer layer, corrugated radiating fin, aluminium corrugated thin plate radiating fin and three layers of protective layer, synergic enhancement structure protection and heat management, effectively absorb mechanical stress, strengthen heat dissipation efficiency, and form gradient protection system, significantly improve the reliability and stability of chip under complex working conditions;On the other hand, copper foil and conductive foam composite electromagnetic shielding layer of protective housing inner side wall block electromagnetic interference, combined with the elastic heat-conducting glue bonding and fixing of second elastic sheet and protective housing inner wall, realize efficient heat conduction and real-time accurate monitoring, provide electromagnetic shielding and state monitoring double protection for chip safe operation.
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