A single-sided double-layer or single-sided multi-layer metal substrate

Abstract

The utility model discloses a single face double -deck or single face multilayer's metal base plate, including metal carrier plate, heat conducting adhesive layer, bottom circuit layer, top circuit layer and first insulating layer, heat conducting adhesive layer pastes on the top surface of metal carrier plate, bottom circuit layer pastes the top surface of heat conducting adhesive layer, and first insulating layer is arranged between top circuit layer and bottom circuit layer, top circuit layer includes the first heat dissipation pedestal for fixing first heating electronic device and with first heat dissipation pedestal matched first conductive pad, and bottom circuit layer includes the heat conduction base corresponding with first heat dissipation pedestal, first insulating layer includes the first through -hole between first heat dissipation pedestal and heat conduction base, the first through -hole is filled with first heat conducting metal layer, and first heat conducting metal layer is connected first heat dissipation pedestal with heat conduction base, the utility model discloses can improve the local heat dissipation efficiency of heating electronic device significantly.

Description

Technical Field

[0001] This utility model relates to printed circuit boards, and more particularly to a single-sided double-layer or single-sided multi-layer metal substrate. Background Technology

[0002] High thermal conductivity metal substrates (such as aluminum and copper substrates) have been widely used in power electronics, LED lighting, and automotive electronics due to their excellent heat dissipation capabilities. With the continuous improvement of electronic system integration and power density, the wiring capabilities of single-layer metal substrates are often insufficient to meet the requirements. Therefore, the development of multilayer high thermal conductivity metal substrates has become an industry trend.

[0003] Existing multilayer high thermal conductivity metal substrate solutions typically face the following challenges:

[0004] 1) If all the insulating layers between the layers are made of materials with high thermal conductivity, the overall thermal conductivity can be guaranteed. However, such high thermal conductivity insulating materials (such as polymers with high ceramic filling) are expensive, which leads to a sharp increase in the manufacturing cost of multilayer substrates and limits their large-scale application.

[0005] 2) If ordinary dielectric materials are used as all insulating layers in order to reduce costs, the thermal conductivity from the key heat source to the bottom metal substrate will be sacrificed. Especially in multilayer structures, the thermal resistance accumulation effect is obvious, making it difficult to meet the heat dissipation requirements of high-heat devices.

[0006] 3) Although some designs take heat dissipation into account, they fail to optimize the balance between the selection of insulating layer materials and cost, or fail to fully integrate device layout to maximize heat dissipation efficiency.

[0007] A novel thermally conductive single-sided double-layer and single-sided multilayer metal substrate, patent number CN202122088744.1, includes a metal carrier plate. An adhesive layer is attached to one surface of the metal carrier plate, and a composite mechanism is attached to the surface of the adhesive layer away from the metal carrier plate. In this invention, the metal carrier plate absorbs heat, maintains its shape, and protects the topmost thin sheet material. The circuit board material is modified to increase its thermal conductivity.

[0008] This utility model has the following disadvantages:

[0009] 1) Metal substrates mainly dissipate heat through low thermal resistance and high thermal conductivity adhesive layers and metal carriers. They lack efficient heat dissipation structures for localized heat dissipation of heat-generating electronic devices, which may lead to heat concentration in certain areas and insufficient heat dissipation efficiency.

[0010] 2) The circuit layout is achieved only through a double-layer thin copper sheet (first circuit 301 and second circuit 302), without involving multi-layer circuits, which limits the arrangement and heat dissipation requirements of high-density electronic devices. Summary of the Invention

[0011] The technical problem to be solved by this utility model is to provide a single-sided double-layer or single-sided multi-layer metal substrate that significantly improves the local heat dissipation efficiency of heat-generating electronic devices.

[0012] To solve the above-mentioned technical problems, the present invention adopts a technical solution of a single-sided double-layer or single-sided multi-layer metal substrate, comprising a metal carrier plate, a thermally conductive adhesive layer, a bottom circuit layer, a top circuit layer, and a first insulating layer. The thermally conductive adhesive layer is adhered to the top surface of the metal carrier plate, and the bottom circuit layer is adhered to the top surface of the thermally conductive adhesive layer. The first insulating layer is disposed between the top circuit layer and the bottom circuit layer. The top circuit layer includes a first heat dissipation base for fixing a first heat-generating electronic device and a first conductive pad matching the first heat dissipation base. The bottom circuit layer includes a thermally conductive base corresponding to the first heat dissipation base. The first insulating layer includes a first through hole between the first heat dissipation base and the thermally conductive base. The first through hole is filled with a first thermally conductive metal layer, and the first thermally conductive metal layer connects the first heat dissipation base and the thermally conductive base.

[0013] The metal substrate described above includes a double-sided circuit board, wherein the top circuit layer of the double-sided circuit board is the top circuit layer, the bottom circuit layer of the double-sided circuit board is the bottom circuit layer, and the substrate layer of the double-sided circuit board is the first insulating layer.

[0014] The metal substrate described above includes an intermediate circuit layer and an intermediate insulating layer. The intermediate circuit layer is disposed between the first insulating layer and the intermediate insulating layer, and the top circuit layer is disposed on the top surface of the first insulating layer. The intermediate circuit layer includes an intermediate heat-conducting disk corresponding to the first heat dissipation base. The first thermally conductive metal layer connects the intermediate heat-conducting disk and the first heat dissipation base. The intermediate insulating layer includes a second through hole between the thermally conductive base and the intermediate heat-conducting disk. The second through hole is filled with a second thermally conductive metal layer, and the second thermally conductive metal layer connects the thermally conductive base and the intermediate heat-conducting disk.

[0015] The metal substrate described above, the first heat dissipation base includes a copper foil layer and a connecting layer, the connecting layer including a thermally conductive adhesive layer or a metal solder layer, the connecting layer being attached to the top surface of the copper foil layer.

[0016] The metal substrate described above has a first heat dissipation base that is an island or connected to the circuitry on the top circuitry layer, a middle heat conduction plate that is an island or connected to the circuitry on the middle circuitry layer, and a heat conduction base that is an island or connected to the circuitry on the bottom circuitry layer.

[0017] The metal substrate described above includes a second heat dissipation base for fixing a second heat-generating electronic device and a second conductive pad that matches the second heat dissipation base. The second heat dissipation base is disposed on the top surface of the thermally conductive adhesive layer or disposed on the top surface of the metal substrate through a through hole in the thermally conductive adhesive layer. The second conductive pad that matches the second heat dissipation base is disposed on the bottom circuit layer or the top circuit layer. The bottom circuit layer and the first insulating layer include clearance holes for the second heat dissipation base.

[0018] The metal substrate described above includes a second heat dissipation base comprising a copper pillar and a connecting layer. The connecting layer comprises a thermally conductive adhesive layer or a metal welding layer, and the connecting layer of the second heat dissipation base is attached to the top surface of the copper pillar.

[0019] The metal substrate described above includes a second heat dissipation base comprising a connecting layer, which includes a thermally conductive adhesive layer or a metal welding layer. The connecting layer of the second heat dissipation base is attached to the top surface of the thermally conductive adhesive layer or the top surface of the metal carrier plate.

[0020] The metal substrate described above, the copper pillars of the second heat dissipation base and the second conductive pads that are matched with the second heat dissipation base are all arranged on the bottom circuit layer and are part of the bottom circuit layer, formed by etching or etching of the copper foil of the bottom circuit layer.

[0021] This invention connects the heat dissipation base of the top circuit layer and the heat dissipation base of the bottom circuit layer through through holes filled with the first thermally conductive metal layer, forming a vertical heat dissipation path, which can significantly improve the local heat dissipation efficiency of heat-generating electronic devices. Attached Figure Description

[0022] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0023] Figure 1 This is an assembly diagram of a single-sided double-layer high thermal conductivity metal substrate and a heat-generating electronic device according to Embodiment 1 of this utility model.

[0024] Figure 2 This is an assembly diagram of a single-sided double-layer high thermal conductivity metal substrate and a heat-generating electronic device according to Embodiment 2 of this utility model.

[0025] Figure 3 This is an assembly diagram of a single-sided double-layer high thermal conductivity metal substrate and a heat-generating electronic device according to Embodiment 3 of this utility model.

[0026] Figure 4 This is an assembly diagram of a single-sided double-layer high thermal conductivity metal substrate and a heat-generating electronic device according to Embodiment 4 of this utility model.

[0027] Figure 5 This is an assembly diagram of a single-sided double-layer high thermal conductivity metal substrate and a heat-generating electronic device according to Embodiment 5 of this utility model.

[0028] Figure 6This is an assembly diagram of a single-sided double-layer high thermal conductivity metal substrate and a heat-generating electronic device according to Embodiment 6 of this utility model.

[0029] Figure 7 This is an assembly diagram of a single-sided double-layer high thermal conductivity metal substrate and a heat-generating electronic device according to Embodiment 7 of this utility model. Detailed Implementation

[0030] The structure of the assembly of the single-sided double-layer high thermal conductivity metal substrate and the heat-generating electronic device in Embodiment 1 of this utility model is as follows: Figure 1 As shown, the single-sided double-layer high thermal conductivity metal substrate includes a metal carrier plate 1, a high thermal conductivity adhesive layer 2, a bottom circuit layer 3, a top circuit layer 5, and a first insulating layer 4. The high thermal conductivity adhesive layer 2 is adhered to the top surface of the metal carrier plate 1, and the bottom circuit layer 3 is adhered to the top surface of the high thermal conductivity adhesive layer 2. The first insulating layer 4 is disposed between the top circuit layer 5 and the bottom circuit layer 3. The top circuit layer 5 includes a first heat dissipation base 51 for fixing a first heat-generating electronic device 9 and two first conductive pads 52 corresponding to the first heat dissipation base 51. The bottom circuit layer 3 includes a thermally conductive base 31 corresponding to the first heat dissipation base 51. The first insulating layer 4 has a first through hole between the first heat dissipation base 51 and the thermally conductive base 31, and the first through hole is filled with a first thermally conductive metal layer 42, which connects the first heat dissipation base 51 and the thermally conductive base 31. The first heat dissipation base 51 includes a copper foil layer and a connecting layer. The connecting layer can be a high thermal conductivity adhesive layer or a metal solder layer, and the connecting layer is attached to the top surface of the copper foil layer.

[0031] The first heat dissipation base 51 can be an island or connected to the circuitry on the top circuitry layer 5. The heat-conducting base 31 can be an island or connected to the circuitry on the bottom circuitry layer 3.

[0032] The single-sided double-layer high thermal conductivity metal substrate also includes a second heat dissipation base 8 for fixing the second heat-generating electronic device 6 and two second conductive pads 32 corresponding to the second heat dissipation base 8. The second heat dissipation base 8 includes copper pillars and a connecting layer. The bottom circuit layer 3 and the first insulating layer 4 include clearance holes for the second heat dissipation base 8. The copper pillars of the second heat dissipation base 8 pass through the through holes in the high thermal conductivity adhesive layer 2, the clearance holes in the bottom circuit layer 3 and the first insulating layer 4, and are directly fixed to the top surface of the metal carrier plate 1. The second heat dissipation base 8 includes copper pillars and a connecting layer. The connecting layer can be a high thermal conductivity adhesive layer or a metal solder layer. The connecting layer of the second heat dissipation base 8 is attached to the top surface of the copper pillars. The second conductive pads 32 corresponding to the second heat dissipation base 8 are arranged on the top surface of the bottom circuit layer 3. Corresponding to the second conductive pads 32, the first insulating layer 4 has corresponding pad holes.

[0033] The bottom surface of the first heat-generating electronic device 9 is fixed to the top surface of the copper foil layer through the connecting layer of the first heat dissipation base 51. The two electrodes on the bottom surface of the first heat-generating electronic device 9 are respectively soldered to the two first conductive pads 52. The heat generated by the first heat-generating electronic device 9 during operation is transferred to the metal carrier plate 1 through the first heat dissipation base 51, the first thermally conductive metal layer 42, the thermally conductive base 31 and the high thermal conductivity adhesive layer 2, and then dissipated outward through the metal carrier plate 1.

[0034] The bottom surface of the second heating electronic device 6 is fixed to the top surface of the copper pillar through the connecting layer of the second heat dissipation base 8. The two electrodes on the top surface of the second heating electronic device 6 are respectively connected to two second conductive pads 32 through bonding wires 61. The heat generated by the second heating electronic device 6 during operation is directly transferred to the metal carrier plate 1 through the second heat dissipation base 8, and then dissipated outward through the metal carrier plate 1.

[0035] The structure of the assembly of the single-sided double-layer high thermal conductivity metal substrate and the heat-generating electronic device in Embodiment 2 of this utility model is as follows: Figure 2 As shown, the difference between Embodiment 2 and Embodiment 1 is only that the second heat dissipation base 8 has only a connecting layer and no copper pillars. The connecting layer can be a highly thermally conductive adhesive layer or a metal welding layer. The connecting layer of the second heat dissipation base 8 is attached to the top surface of the metal carrier plate 1. The bottom surface of the sunken second heat-generating electronic device 6 is directly fixed to the top surface of the metal carrier plate through the connecting layer by adhesive or welding.

[0036] The structure of the assembly of the single-sided double-layer high thermal conductivity metal substrate and the heat-generating electronic device in Embodiment 3 of this utility model is as follows: Figure 3 As shown, the difference between Embodiment 3 and Embodiment 1 is only that the thermally conductive adhesive layer 2 does not have the aforementioned through holes. The copper pillars of the second heat dissipation base 8 and the two second conductive pads 32 are both part of the bottom circuit layer 3, formed by etching or etching the copper foil of the bottom circuit layer 3. The heat generated when the second heat-generating electronic device 6 is working is transferred to the metal carrier plate 1 through the second heat dissipation base 8 formed by the copper foil of the bottom circuit layer 3 and the thermally conductive adhesive layer 2, and then dissipated outward through the metal carrier plate 1.

[0037] The structure of the assembly of the single-sided double-layer high thermal conductivity metal substrate and the heat-generating electronic device in Embodiment 4 of this utility model is as follows: Figure 4 As shown, the difference between Embodiment 4 and Embodiment 3 is that the second heating electronic device 6 is a flip device with two electrodes on its bottom surface. The two electrodes on the bottom surface of the second heating electronic device 6 are respectively welded to two second conductive pads 32.

[0038] The structure of the assembly of the single-sided double-layer high thermal conductivity metal substrate and the heat-generating electronic device in Embodiment 5 of this utility model is as follows: Figure 5As shown, the difference between Embodiment 5 and Embodiment 1 is that the second heating electronic device 6 is a flip device with two electrodes on its bottom surface. The two electrodes on the bottom surface of the second heating electronic device 6 are respectively welded to two second conductive pads 32.

[0039] The structure of the assembly of the single-sided double-layer high thermal conductivity metal substrate and the heat-generating electronic device in Embodiment 6 of this utility model is as follows: Figure 6 As shown, the difference between Embodiment 6 and Embodiment 5 is that the lower circuit layer 3, the top circuit layer 5, and the first insulating layer 4 are provided by a double-sided circuit board 10. The top circuit layer of the double-sided circuit board 10 is the top circuit layer 5 of this embodiment, the bottom circuit layer of the double-sided circuit board 10 is the bottom circuit layer 3 of this embodiment, and the substrate layer of the double-sided circuit board 10 is the first insulating layer 4 of this embodiment. In addition, the two second conductive pads 32 of the second heat dissipation base 8 are arranged on the top circuit layer 5.

[0040] The structure of the assembly of the single-sided multilayer high thermal conductivity metal substrate and the heat-generating electronic device in Embodiment 7 of this utility model is as follows: Figure 7 As shown, the difference between Embodiment 7 and Embodiment 2 is that the multilayer metal substrate includes an intermediate circuit layer 7 and an intermediate insulating layer 11. The intermediate circuit layer 7 is disposed between the first insulating layer 4 and the intermediate insulating layer 11, and the top circuit layer 5 is disposed on the top surface of the first insulating layer 4. The intermediate circuit layer 7 includes an intermediate heat-conducting disk 71 corresponding to the first heat dissipation base 51, and a first thermally conductive metal layer 42 connects the intermediate heat-conducting disk 71 and the first heat dissipation base 51. The intermediate insulating layer 11 includes a second through hole between the heat-conducting base 31 and the intermediate heat-conducting disk 71, and the second through hole is filled with a second thermally conductive metal layer 111, which connects the heat-conducting base 31 and the intermediate heat-conducting disk 71. The intermediate heat-conducting disk 71 can be an island or connected to the circuit on the intermediate circuit layer 7. The heat generated when the first heat-generating electronic device 9 is working is transferred to the metal carrier plate 1 through the first heat dissipation base 51, the first thermally conductive metal layer 42, the intermediate thermally conductive plate 71, the second thermally conductive metal layer 111, the thermally conductive base 31 and the high thermal conductivity adhesive layer 2, and then dissipated to the outside through the metal carrier plate 1.

[0041] The single-sided double-layer or single-sided multi-layer high thermal conductivity metal substrates of the above embodiments of this utility model have the following beneficial effects:

[0042] 1) High-efficiency vertical heat dissipation: The heat dissipation base of the top circuit layer and the heat dissipation base of the bottom circuit layer are connected through the through hole (first through hole) filled by the first thermally conductive metal layer, forming a vertical heat dissipation path, which can significantly improve the local heat dissipation efficiency.

[0043] 2) Supports single-sided multi-layer structure, which can meet the needs of high-density electronic device layout, and achieves cross-layer heat dissipation through multi-layer thermally conductive metal layers.

[0044] 3) The dedicated heat dissipation base and matching thermal pads for heat-generating electronic devices optimize the heat conduction path.

[0045] 4) The heat dissipation base and heat conduction plate can be isolated or connected to the circuit, which supports independent heat dissipation and is also compatible with the circuit conduction requirements, thus improving the flexibility of the structure.

[0046] 5) The heat dissipation base can be made of a high thermal conductivity adhesive layer or a metal welding layer, which can adapt to different process and performance requirements.

[0047] In summary, compared with the prior art, the technical solution of this utility model solves the problem of local heat dissipation under high-density electronic device layout through multi-layer thermal conductive structure, vertical heat dissipation path and dedicated heat dissipation base structure, while expanding the number of circuit layers and flexibility of metal substrate, significantly improving heat dissipation efficiency and applicability.

[0048] The single-sided double-layer or single-sided multi-layer high thermal conductivity metal substrates of the above embodiments of this utility model can be used to mount power electronic devices, LED lighting devices, automotive electronic devices or other high-power, high-density heat-generating electronic devices.

Claims

1. A single-sided double-layer or single-sided multi-layer metal substrate, comprising a metal carrier plate, a thermally conductive adhesive layer, a bottom circuit layer, a top circuit layer, and a first insulating layer, wherein the thermally conductive adhesive layer is adhered to the top surface of the metal carrier plate, the bottom circuit layer is adhered to the top surface of the thermally conductive adhesive layer, and the first insulating layer is disposed between the top circuit layer and the bottom circuit layer; characterized in that, The top circuit layer includes a first heat dissipation base for fixing the first heat-generating electronic device and a first conductive pad that matches the first heat dissipation base. The bottom circuit layer includes a thermally conductive base corresponding to the first heat dissipation base. The first insulating layer includes a first through hole between the first heat dissipation base and the thermally conductive base. The first through hole is filled with a first thermally conductive metal layer, and the first thermally conductive metal layer connects the first heat dissipation base and the thermally conductive base.

2. The metal substrate according to claim 1, characterized in that, It includes a double-sided circuit board, wherein the top circuit layer of the double-sided circuit board is the top circuit layer, the bottom circuit layer of the double-sided circuit board is the bottom circuit layer, and the substrate layer of the double-sided circuit board is the first insulating layer.

3. The metal substrate according to claim 1, characterized in that, It includes an intermediate circuit layer and an intermediate insulating layer. The intermediate circuit layer is disposed between the first insulating layer and the intermediate insulating layer, and the top circuit layer is disposed on the top surface of the first insulating layer. The intermediate circuit layer includes an intermediate heat-conducting disk corresponding to the first heat dissipation base, and the first heat-conducting metal layer connects the intermediate heat-conducting disk and the first heat dissipation base. The intermediate insulating layer includes a second through hole between the heat-conducting base and the intermediate heat-conducting plate. The second through hole is filled with a second heat-conducting metal layer, which connects the heat-conducting base and the intermediate heat-conducting plate.

4. The metal substrate according to claim 1, characterized in that, The first heat dissipation base includes a copper foil layer and a connecting layer. The connecting layer includes a thermally conductive adhesive layer or a metal solder layer, and the connecting layer is attached to the top surface of the copper foil layer.

5. The metal substrate according to claim 3, characterized in that, The first heat dissipation base is an island or connected to the circuitry on the top circuitry layer, the middle heat conduction plate is an island or connected to the circuitry on the middle circuitry layer, and the heat conduction base is an island or connected to the circuitry on the bottom circuitry layer.

6. The metal substrate according to claim 1, characterized in that, It includes a second heat dissipation base for fixing a second heat-generating electronic device and a second conductive pad that matches the second heat dissipation base. The second heat dissipation base is disposed on the top surface of the thermally conductive adhesive layer or disposed on the top surface of the metal carrier plate through a through hole in the thermally conductive adhesive layer. The second conductive pad that matches the second heat dissipation base is disposed on the bottom circuit layer or the top circuit layer. The bottom circuit layer and the first insulating layer include clearance holes of the second heat dissipation base.

7. The metal substrate according to claim 6, characterized in that, The second heat dissipation base includes a copper pillar and a connecting layer. The connecting layer includes a thermally conductive adhesive layer or a metal welding layer, and the connecting layer of the second heat dissipation base is attached to the top surface of the copper pillar.

8. The metal substrate according to claim 6, characterized in that, The second heat dissipation base includes a connecting layer, which includes a thermally conductive adhesive layer or a metal welding layer. The connecting layer of the second heat dissipation base is attached to the top surface of the thermally conductive adhesive layer or the top surface of the metal carrier plate.

9. The metal substrate according to claim 7, characterized in that, The copper pillars of the second heat sink base and the second conductive pads that are matched with the second heat sink base are both arranged on the bottom circuit layer and are part of the bottom circuit layer. They are formed by etching or etching the copper foil of the bottom circuit layer.

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