Heat dissipation structure and power module

Abstract

This application discloses a heat dissipation structure and a power module. The heat dissipation structure includes a substrate and pin fins. The substrate has a substrate surface for coolant flow, and the substrate surface includes a port area and a flow area. The pin fins include port pin fins and conventional pin fins. Conventional pin fins are distributed in the flow area, and port pin fins are distributed in the port area. The height of the port pin fins is lower than the height of the conventional pin fins to form an inlet and an outlet. This structural arrangement allows the pin fins to not only dissipate heat but also guide the coolant flow, thus eliminating the need for a flow guiding structure in related technologies, increasing space utilization, facilitating product miniaturization, and significantly reducing raw material costs. Simultaneously, the inlet and outlet formed by the port pin fins eliminate the need for reinforcing plates in related technologies, reducing the number of parts and further expanding the cost advantage of this heat dissipation structure. The power module including this heat dissipation structure possesses all its beneficial effects.

Description

Technical Field

[0001] This utility model relates to the field of cooling plate technology, and in particular to a heat dissipation structure and power module. Background Technology

[0002] As the power density requirements for controllers become increasingly stringent, the market is paying more and more attention to the miniaturization of heat dissipation structures and their cost advantages.

[0003] The heat dissipation structures in related technologies are mainly divided into two categories: 1. Open cooling plates, such as... Figure 1 As shown, the main body of the cooling plate is an extruded pinfin structure, which is locked to the die-cast or injection-molded flow channel plate by fastening parts such as screws and pressure plates. Its sealing effect is achieved through built-in sealing rings; 2. Closed-type cooling plate, such as Figure 2 As shown, the cooling plate is formed by welding multiple plates together using welding processes such as brazing and soldering. The welded cooling plate can achieve the functions of self-sealing and regulating the flow of fluid.

[0004] Functional partitioning of cooling plates in related technologies, such as Figure 3 As shown, the function of the heat dissipation area is to provide a system mounting surface for power devices and to dissipate heat. The mainstream heat dissipation structures are PINFIN and WAVYFIN. Figure 3 (As shown) Two forms; the function of the flow guiding area is to guide the fluid and reduce pressure drop; the function of the sealing area is to seal the coolant flow channels and connect the multi-layer plates. Combined Figures 1-3 It is known that the flow guiding area of ​​a conventional water-cooled plate occupies space along the long side of the product; and the flow guiding area has a certain degree of cavity, and the strength of this area is poor. It is necessary to add a reinforcing structure to the outside of the cavity or add a reinforcing rib to the inside to optimize the problem of poor strength of the area, but this will further increase the space occupied by the cooling plate.

[0005] Therefore, the heat dissipation structure in related technologies cannot meet the requirements of miniaturization. Utility Model Content

[0006] The purpose of this utility model is to provide a heat dissipation structure and power module. The heat dissipation structure arranges low-height port pins to form a liquid inlet and outlet in the area where they are located. This allows the pins to not only dissipate heat but also guide the flow of coolant, thereby eliminating the need for the flow guiding structure in related technologies, increasing space utilization, and facilitating the miniaturization of the product.

[0007] This application discloses a heat dissipation structure, which includes:

[0008] A substrate having a substrate surface for through which coolant flows, the substrate surface including a port region and a flow region;

[0009] Needle wings include port needle wings and regular needle wings. Regular needle wings are distributed in the flow area, while port needle wings are distributed in the port area.

[0010] The height of the port needle fin is lower than that of the conventional needle fin, so as to form the liquid inlet and liquid outlet.

[0011] Furthermore, there are two port regions, which are arranged in opposite directions on two sides of the substrate surface to correspond to the liquid inlet and the liquid outlet, respectively.

[0012] Furthermore, the two port regions are arranged diagonally at two corners of the substrate surface to correspond to the liquid inlet and liquid outlet, respectively.

[0013] Furthermore, the circulation area includes the import area, the intermediate area and the export area. The conventional needle wing located in the import area is defined as the first needle wing, the conventional needle wing located in the intermediate area is defined as the second needle wing, and the conventional needle wing located in the export area is defined as the third needle wing.

[0014] Among them, the shapes of the first needle wing, the second needle wing and the third needle wing are not exactly the same, and / or the arrangement density of the first needle wing, the second needle wing and the third needle wing is not exactly the same.

[0015] Furthermore, the first needle wing and / or the second needle wing are elliptical needle wings, teardrop-shaped needle wings, or rhomboid needle wings.

[0016] Furthermore, at least a portion of the first needle fins are arranged radially diffusely in the inlet region along the flow direction of the coolant, and the angle between the long axis direction of at least a portion of the first needle fins and the flow direction of the coolant is an acute angle, so that the coolant can flow along the long axis direction of the first needle fins after impacting them.

[0017] Furthermore, at least a portion of the first needle fins, arranged in a radially diffused manner, are positioned on the side of the flow area near the liquid inlet.

[0018] Furthermore, the third needle wing is a circular needle wing.

[0019] Furthermore, the arrangement density of the first needle wing and the arrangement density of the second needle wing are both less than the arrangement density of the third needle wing.

[0020] Furthermore, the number of third needle fins gradually decreases along the flow direction of the coolant, so that the third needle fins near the outlet are sparsely arranged.

[0021] Furthermore, the substrate is formed by cold extrusion.

[0022] Furthermore, it also includes a frame, one side of which is welded to the surface of the substrate, and the frame and the needle fins are independent of each other and do not contact each other.

[0023] Furthermore, the frame is formed by cold extrusion.

[0024] Furthermore, it also includes a cover plate, which is connected to the other side of the frame away from the substrate to cover the needle fin;

[0025] The cover plate, frame, base plate and needle fins work together to form a fluid flow channel for coolant flow.

[0026] Furthermore, the cover plate and frame are integrally formed using die casting or forging processes.

[0027] Furthermore, the cover plate and the frame are connected to each other by a brazing process.

[0028] Furthermore, the cover plate is connected to the conventional needle fins by brazing.

[0029] Furthermore, it also includes a connecting layer, and the substrate also includes a substrate back side opposite to the substrate surface, with the connecting layer and the substrate back side interconnected.

[0030] This application also discloses a power module that includes the above-described heat dissipation structure.

[0031] The heat dissipation structure and power module provided by this utility model have at least the following beneficial effects, including but not limited to:

[0032] 1) This heat dissipation structure arranges low-height port pins, forming liquid inlet and outlet in their respective areas. This allows the pins to not only dissipate heat but also guide the flow of coolant, eliminating the need for the flow guiding structure in related technologies, increasing space utilization, facilitating miniaturization of the product, and significantly reducing raw material costs. At the same time, the liquid inlet and outlet formed by the port pins eliminate the need for the reinforcing plate design in related technologies, reducing the number of parts and further expanding the cost advantage of this heat dissipation structure.

[0033] 2) The frame in this heat dissipation structure is formed by cold extrusion, which has a significant cost advantage in terms of mold cost and process cycle compared to stamped flow channel plates. In addition, the cold extrusion forming of the frame results in good overall structural rigidity, and the cold extrusion frame has no demolding angle, which can effectively reduce the fit gap between the frame and the pin fins, reduce the waste of space and heat dissipation capacity caused by the bypass area, and thus achieve better heat dissipation performance with a smaller volume. At the same time, the miniaturized heat dissipation structure will have greater flexibility in the subsequent arrangement of power modules and inverter levels, which is beneficial to the platform deformation design.

[0034] 3) Due to the flexibility in the molding of the frame and cover plate, this heat dissipation structure can be designed in various sizes and shapes for mating and installation with other parts. The extruded frame, compared to stamping, does not suffer from the strength loss caused by wall thinning; simultaneously, the cold extrusion process hardens the material, effectively increasing its strength. Therefore, the cooling plate has excellent overall rigidity, effectively absorbing mechanical stresses such as vibration and impact, reducing the risk of warping. The mounting surface with power devices can be designed as a thin plate of 0.5mm-1mm, providing sufficient flexibility and thus ensuring the durability of the connection layer between the power devices and the system.

[0035] 4) This heat dissipation structure combines zoned heat dissipation and flow guidance designs, effectively utilizing the pressure drop in the inlet and outlet areas for cooling the core power devices and reducing pressure drop waste in non-functional areas. Therefore, it achieves higher heat dissipation under the same pressure drop conditions. Furthermore, this design, taking into account the temperature rise characteristics of the coolant, rationally optimizes the heat dissipation capacity of different zones. The inlet and outlet areas employ elliptical needle-fin designs (or teardrop-shaped or rhomboid needle-fins) for better overall heat dissipation and flow guidance; the outlet area uses denser cylindrical needle-fins to maximize heat dissipation capacity. Through this rational allocation of heat dissipation capacity, the overall heat dissipation effect of the power module is improved. Therefore, during the power device selection phase, it is possible to achieve higher power output for the same power devices; or to select chips with a more cost-effective option within the same power range. Attached Figure Description

[0036] This specification will be further described by way of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not limiting; in these embodiments, the same reference numerals denote the same structures, wherein:

[0037] Figure 1 This is a schematic diagram of the structure of an open-type cooling plate in related technologies;

[0038] Figure 2 This is a schematic diagram of the structure of a closed-loop cooling plate in related technologies;

[0039] Figure 3 This is a schematic diagram of the functional partitioning of a closed cooling plate in related technologies;

[0040] Figure 4 This is one of the structural schematic diagrams of the heat dissipation structure provided in the embodiments of this application;

[0041] Figure 5 This is a second schematic diagram of the heat dissipation structure provided in the embodiments of this application;

[0042] Figure 6 This is the third schematic diagram of the heat dissipation structure provided in the embodiments of this application;

[0043] Figure 7 A top view of the heat dissipation structure provided in an embodiment of this application;

[0044] Figure 8 Another top view of the heat dissipation structure provided in the embodiments of this application;

[0045] Figure 9 An enlarged schematic diagram of at least a portion of the first needle fin provided in the embodiments of this application.

[0046] Icon: 100 - Heat dissipation structure;

[0047] 10-Substrate; 101-Substrate surface; 102-Port area; 103-Flow area; 1031-Inlet area; 1032-Intermediate area; 1033-Outlet area; 104-Liquid inlet; 105-Liquid outlet; 106-Back side of substrate;

[0048] 111 - Port needle wing; 112 - Regular needle wing; 1121 - First needle wing; 1122 - Second needle wing; 1123 - Third needle wing

[0049] 12-Frame; 13-Cover plate; 14-Connecting layer. Detailed Implementation

[0050] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model. It should be noted that, unless otherwise specified, the following embodiments and features described therein can be combined with each other.

[0051] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of the present invention. Therefore, the illustrations only show the components related to the present invention and are not drawn according to the number, shape and size of the components in actual implementation. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0052] Please refer to Figures 4-8This application discloses a heat dissipation structure 100, including a substrate 10 and pin fins. The substrate 10 has a substrate surface 101 for flowing coolant. The substrate surface 101 includes a port region 102 and a flow region 103. The pin fins include port pin fins 111 and conventional pin fins 112. The conventional pin fins 112 are distributed in the flow region 103, and the port pin fins 111 are distributed in the port region 102. The height of the port pin fins 111 is lower than the height of the conventional pin fins 112 to form a liquid inlet 104 and a liquid outlet 105.

[0053] It should be noted that the relatively low height of the port pin fins 111 creates a low-resistance space, allowing coolant to flow more easily and thus forming a natural inlet 104 or outlet 105 at its location. In other words, according to the basic principles of fluid mechanics, fluids always preferentially flow through the region of least resistance. Because of its short height and low resistance, the port pin fin area 111 is naturally "chosen" as the inlet or outlet path for the liquid. In this structural arrangement, the lower-height port pin fins 111 provide an initial guiding zone or a terminal slow-release zone, rather than a main heat dissipation zone, allowing the coolant to be quickly guided to the flow area 103, which contains the taller conventional pin fins 112, for intensive heat exchange.

[0054] It is worth noting that this structural arrangement allows the pin fins to not only dissipate heat but also guide the flow of coolant, thereby eliminating the need for the flow guiding structure in related technologies, increasing space utilization, facilitating product miniaturization, and significantly reducing raw material costs. At the same time, the liquid inlet 104 and liquid outlet 105 formed by the port pin fins 111 can eliminate the need for the reinforcing plate design in related technologies, reducing the number of parts and further expanding the cost advantage of the heat dissipation structure 100.

[0055] Please refer to this again. Figure 7 There are two port areas, and the two port areas 102 are arranged in opposite directions on the two sides of the substrate surface 101, respectively corresponding to the liquid inlet 104 and the liquid outlet 105.

[0056] It is worth noting that, such as Figure 7 As shown, the port region 102 is located in the middle of the side of the substrate surface 101, surrounded by the flow region 103 on three sides, and connected to the side on the other side. This layout allows the substrate surface 101 to be fully equipped with port pins 111 or conventional pins 112, thereby further improving the space utilization of the substrate surface 101 and enhancing the miniaturization capability of the heat dissipation structure.

[0057] In some embodiments, the two port regions are arranged diagonally at two corners of the substrate surface (not shown in the figure) to correspond to the liquid inlet and outlet, respectively. It is understood that this diagonal arrangement effectively extends the liquid flow path within the substrate, thereby increasing the contact time and area between the liquid and the heat dissipation structure, thus facilitating more thorough heat removal and improving overall heat dissipation efficiency. Simultaneously, this extended path also promotes heat distribution and conduction over a wider area, preventing localized overheating and further optimizing heat dissipation performance.

[0058] Please refer to this again. Figure 6 and Figure 7 The circulation area 103 includes an import area 1031, an intermediate area 1032, and an export area 1033. The conventional needle wing 112 located in the import area 1031 is defined as the first needle wing 1121, the conventional needle wing 112 located in the intermediate area 1032 is defined as the second needle wing 1122, and the conventional needle wing 112 located in the export area 1033 is defined as the third needle wing 1123. The shapes of the first needle wing 1121, the second needle wing 1122, and the third needle wing 1123 are not completely the same, and / or the arrangement density of the first needle wing 1121, the second needle wing 1122, and the third needle wing 1123 is not completely the same.

[0059] It is worth noting that there are temperature and velocity gradients in the flow path of the coolant. The temperature is lowest and the velocity is fastest in the inlet area 1031, while the temperature is highest and the velocity slows down in the outlet area 1033. By configuring different pin fin structures for different areas, local optimal heat dissipation can be achieved under the premise of uneven heat load distribution, effectively avoiding heat exchange redundancy or insufficiency, thereby achieving uniform heat distribution of power devices and maximizing heat dissipation efficiency, while not causing the negative effect of excessive pressure drop.

[0060] Optionally, the first needle wing 1121 and / or the second needle wing 1122 are elliptical needle wings, teardrop-shaped needle wings, or rhomboid needle wings.

[0061] Specifically, elliptical, teardrop, and rhomboid fins have smooth frontal surfaces and low drag coefficients. Compared to traditional cylindrical or square prism shapes, they effectively reduce resistance and turbulence during coolant impact, thus ensuring rapid and smooth entry of the coolant into the flow channel as it first flows into the heat dissipation structure 100, improving overall flow efficiency. Simultaneously, the natural directionality of elliptical, teardrop, or rhomboid fins allows their long axis to be arranged in accordance with the coolant diffusion path, enhancing radial diffusion and effectively preventing localized stagnation or backflow of liquid in the inlet area 1031.

[0062] Please refer to this again. Figure 7 and Figure 9 ,in, Figure 9This is an enlarged schematic diagram of at least a portion of the first needle fins 1121 provided in an embodiment of this application. At least a portion of the first needle fins 1121 are arranged radially diffused in the flow area 103 along the flow direction of the coolant, and the angle between the major axis of at least a portion of the first needle fins 1121 and the flow direction of the coolant is an acute angle (e.g., ...). Figure 9 As shown in the figure, this allows the coolant to flow radially outward after impacting the first needle fin 1121. It can be understood that the coolant flow direction can be referenced to the direction shown in the figure, i.e., from right to left.

[0063] It is worth noting that the first needle fins 1121 arranged in a radial diffusion pattern allow the coolant to be naturally guided outward after impacting the needle fins, so as to cover a wider heat exchange area. As shown in the figure, it can form a flow path that radiates from the center to the surroundings, optimize the flow path, and make full use of the entire heat dissipation surface of the flow area 103, avoiding local overheating or heat exchange blind spots.

[0064] It is also worth noting that after the coolant impacts the first needle fin 1121, it can flow in a radial outward direction. This means that the long axis of the first needle fin 1121 will not be perpendicular or at an obtuse angle to the direction of liquid flow. This can avoid causing greater flow resistance and backflow disturbance. After impact, the liquid can slide or flow around the surface of the needle fin more smoothly, effectively reducing pressure drop and flow interference.

[0065] Optionally, at least a portion of the first needle fin 1121, arranged radially in the flow area 103, is located near the liquid inlet.

[0066] Specifically, the first diffused needle fin 1121 is arranged near the liquid inlet 104, which helps to quickly change the flow direction when the liquid just enters the flow area 103, guide its flow, and reduce eddies, accumulation or dead zones. This arrangement makes the pressure drop more reasonable and avoids the phenomenon of flow instability caused by impact direct current.

[0067] Optionally, the third needle wing 1123 is a circular needle wing.

[0068] Specifically, circular needle fins can achieve higher density per unit area, increasing the surface area in contact with coolant. At the same time, the circular needle fin structure is mold-friendly, easy to process, and has high manufacturing consistency, making it suitable for low-cost mass production in the end area of ​​the cooling plate. Its structure is stable, easy to form, and suitable for efficient production processes such as cold extrusion, which helps to improve overall production efficiency.

[0069] Please refer to this again. Figure 7 The arrangement density of the first needle wing 1121 and the arrangement density of the second needle wing 1122 are both less than the arrangement density of the third needle wing 1123.

[0070] It is worth noting that in the heat dissipation structure 100, the fin arrangement density of the inlet area 1031 (first fin 1121) and the middle area 1032 (second fin 1122) is relatively low, which can effectively reduce the resistance in the coolant inflow area, facilitating smoother coolant flow and avoiding sluggish or uneven flow caused by excessive density, thereby improving fluid flow efficiency. Simultaneously, the outlet area 1033 (third fin 1123) employs a higher arrangement density, which helps to increase the heat dissipation surface area, enhance the heat dissipation capacity of this area, and ensure that the coolant can absorb and remove heat more efficiently. This structural arrangement can also reduce pressure loss in non-functional areas. Specifically, the lower arrangement density of the first fin 1121 and the second fin 1122 reduces pressure loss at the inlet 104 and the flow area 103, allowing the coolant to flow more smoothly into the flow area 103 and avoiding unnecessary energy waste.

[0071] Please refer to this again. Figure 8 The number of third needle fins 1123 gradually decreases along the flow direction of the coolant, so that the third needle fins 1123 near the outlet 105 are sparsely arranged.

[0072] It is worth noting that the sparse arrangement of the third fins 1123 near the outlet 105 indicates that a certain amount of heat has already accumulated in this area as the coolant flows. The sparse fins facilitate smoother coolant flow and prevent excessive heat dissipation in the outlet area 1033. Furthermore, by gradually reducing the number of third fins 1123 in the outlet 105 area, the heat dissipation structure 100 can better adapt to the natural flow patterns of the coolant. As the coolant flows in, the heat gradually disperses, and the flow velocity and heat load near the outlet area 1033 are relatively low. The sparse arrangement design is more in line with fluid dynamics principles, improving the system's flow stability and heat dissipation effect.

[0073] In some embodiments, the substrate 10 can be cold-extruded to improve its structural rigidity. Depending on the specific implementation environment, other processes such as MIM (Metal Injection Molding) may also be used.

[0074] Please refer to this again. Figure 4 It also includes a frame 12, one side of which is welded to the substrate surface 101, and the frame 12 and the needle fin are independent of each other and do not contact each other.

[0075] Optionally, frame 12 is formed by cold extrusion.

[0076] Specifically, the frame 12 in the heat dissipation structure 100 adopts a cold extrusion molding process, which has a significant cost advantage in terms of mold cost and process cycle compared to stamped flow channel plates. In addition, the cold extrusion molding of the frame 12 results in good overall structural rigidity, and the cold extruded frame 12 has no demolding angle, which can effectively reduce the fit gap between the frame 12 and the pin fins, reduce the waste of space and heat dissipation capacity caused by the bypass area, thereby achieving better heat dissipation performance with a smaller volume. At the same time, the miniaturized heat dissipation structure 100 will have greater flexibility in the subsequent arrangement of power modules and inverter levels, which is beneficial for platform deformation design.

[0077] In some embodiments, a cover plate 13 is also included, which is connected to the other side of the frame 12 away from the substrate 10 to cover the needle fin.

[0078] The cover plate 13, frame 12, base plate 10 and needle fins cooperate to form a fluid flow channel for coolant flow.

[0079] It is worth noting that the heat dissipation structure 100, due to the molding flexibility of the frame 12 and cover plate 13, can be designed in various sizes and shapes for mating and installation with other parts. The extruded frame 12, compared to stamping, does not suffer from strength loss due to wall thickness reduction; simultaneously, the cold extrusion process hardens the material, effectively increasing its strength. Therefore, the cooling plate has excellent overall rigidity, effectively absorbing mechanical stresses such as vibration and impact, reducing the risk of warping deformation. The mounting surface with the power devices can be designed as a thin plate of 0.5mm-1mm, providing sufficient flexibility, thus ensuring the durability of the power devices and the system connection layer 14.

[0080] In some embodiments, the cover plate 13 and the frame 12 are integrally formed using die casting or forging processes. It is understood that by integrally forming the cover plate 13 and the frame 12 using die casting or forging processes, a unified integral structure can be formed, eliminating connection points in traditional connection methods, thereby improving the overall strength and rigidity of the component. Simultaneously, die casting and forging processes can produce high-quality parts in a shorter time. The integral forming process saves additional assembly time compared to traditional assembly connection methods, especially in mass production, improving production efficiency and reducing assembly costs.

[0081] In other embodiments, the cover plate 13 and the frame 12 are connected to each other by brazing. It is understood that brazing, by filling the joint surfaces with filler metal, forms a high-strength connection, ensuring the structural strength and durability of the joint. Brazed joints are not easily affected by external forces, can withstand certain mechanical stresses and temperature changes, provide a high-strength connection, and do not affect the properties of the base material.

[0082] It should be noted that, depending on the specific implementation environment, the cover plate 13, frame 12, and base plate 10 can also be integrally cast using a sand casting process to improve the integration of the heat dissipation structure 100.

[0083] In some embodiments, the cover plate 13 and the conventional needle fin 112 are connected to each other by brazing to improve the stability of the fluid flow channel and avoid gaps between the cover plate 13 and the conventional needle fin 112 that would affect the flow of coolant.

[0084] In some embodiments, other functional structures may be added to the substrate 10. For example, fixing pillars, heat dissipation bosses, water inlets and outlets may be added by means of brazing, laser welding, riveting, bonding, etc., to increase the functionality of the heat dissipation structure 100.

[0085] Optionally, the heat dissipation structure 100 further includes a connecting layer 14, and the substrate 10 further includes a substrate back surface 106 facing away from the substrate surface 101, with the connecting layer 14 connected to the substrate back surface 106. It is understood that for certain specific materials (such as polymers, plastics, etc.) or substrates 10 with poor surface conditions, the connecting layer 14 can improve its adhesion to subsequent system connecting layers 14. Specifically, if the subsequent system connecting layer 14 is a polymer material with adhesive properties, or if the substrate 10 base material is a material with good solderability such as copper or silver, the connecting layer 14 can be omitted.

[0086] In summary, this heat dissipation structure 100 employs a combination of zoned heat dissipation and flow guidance designs. This effectively utilizes the pressure drop in the inlet and outlet areas for heat dissipation of the core power devices, reducing pressure drop waste in non-functional areas. Therefore, it achieves higher heat dissipation under the same pressure drop conditions. Furthermore, this design, taking into account the temperature rise characteristics of the coolant, rationally optimizes the heat dissipation capacity of different zones. The inlet area 1031 and outlet area 1033 utilize elliptical needle-fin designs (or teardrop-shaped or rhomboid needle-fins) for superior overall heat dissipation and flow guidance performance; the outlet area uses denser-packed circular needle-fins to maximize heat dissipation capacity. Through the rational allocation of heat dissipation capacity, the overall heat dissipation effect of the power module assembly is improved. Therefore, during the power device selection stage, it is possible to achieve higher power output for the same power device; or to select chips with a more cost-effective option within the same power range.

[0087] This application further discloses a power module including the aforementioned heat dissipation structure 100, which possesses all its beneficial effects. It should be noted that the heat dissipation structure 100 can also be used as a heat dissipation and fixing structure for other functional modules.

[0088] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

[0089] Throughout this description, numerous specific details, such as examples of components and / or methods, are provided to provide a complete understanding of embodiments of this application. However, those skilled in the art will recognize that embodiments of this invention may be practiced without one or more of these specific details or by other devices, systems, components, methods, parts, materials, components, etc. In other instances, well-known structures, materials, or operations have not been specifically shown or described in detail to avoid obscuring aspects of embodiments of this application.

[0090] Throughout this specification, references to "an embodiment," "an embodiment," or "a specific embodiment" mean that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment of the present invention, but not necessarily in all embodiments. Therefore, the various representations of the phrases "in one embodiment," "in an embodiment," or "in a specific embodiment" in different places throughout the specification do not necessarily refer to the same embodiment. Furthermore, a particular feature, structure, or characteristic of any specific embodiment of the present invention can be combined with one or more other embodiments in any suitable manner. It should be understood that other variations and modifications of the embodiments described herein may be based on the teachings herein and will be considered part of the spirit and scope of the present invention.

[0091] It should also be understood that one or more of the elements shown in the figures may be implemented in a more separate or more integrated manner, or may even be removed because they are inoperable in certain circumstances or provided because they may be useful for a particular application.

[0092] Furthermore, unless otherwise expressly stated, any arrows in the accompanying drawings should be considered illustrative only and not limiting. Additionally, unless otherwise stated, the term "or" as used herein is generally intended to mean "and / or". Where a term is anticipated to provide a separation or combination capability that is unclear, a combination of components or steps will also be considered as indicated.

[0093] As used herein and throughout the claims below, unless otherwise specified, “a” and “the” include the plural references. Similarly, as used herein and throughout the claims below, unless otherwise specified, “in” means “in” and “on”.

[0094] The above description of the embodiments shown in this utility model (including the content in the abstract of the specification) is not intended to be an exhaustive enumeration or to limit the utility model to the precise forms disclosed herein. Although specific embodiments and examples of the utility model have been described herein for illustrative purposes only, various equivalent modifications are possible within the spirit and scope of the utility model, as will be recognized and understood by those skilled in the art. As indicated, these modifications can be made to the utility model in accordance with the above description of the embodiments of this application, and such modifications will be within the spirit and scope of the utility model.

[0095] This document has generally described the systems and methods in detail to aid in understanding the present invention. Furthermore, various specific details have been set forth to provide a general understanding of the embodiments of this application. However, those skilled in the art will recognize that embodiments of the present invention can be practiced without one or more specific details, or using other devices, systems, accessories, methods, components, materials, parts, etc. In other instances, well-known structures, materials, and / or operations have not been specifically shown or described in detail to avoid obscuring various aspects of the embodiments of this application.

Claims

1. A heat dissipating structure, characterized by comprising: include: A substrate having a substrate surface for through which a coolant flows, the substrate surface including a port region and a flow region; The needle fin includes port needle fins and conventional needle fins, wherein the conventional needle fins are distributed in the flow area and the port needle fins are distributed in the port area; The height of the port needle fin is lower than that of the conventional needle fin, so as to form a liquid inlet and a liquid outlet.

2. The heat dissipation structure according to claim 1, characterized in that, The number of port regions is two, and the two port regions are arranged in opposite directions on two sides of the substrate surface, respectively corresponding to the liquid inlet and the liquid outlet.

3. The heat dissipation structure according to claim 2, characterized in that, The two port regions are arranged diagonally at two corners of the substrate surface, corresponding to the liquid inlet and the liquid outlet, respectively.

4. The heat dissipation structure according to claim 1, characterized in that, The circulation area includes an import area, an intermediate area and an export area. The conventional needle wing located in the import area is defined as the first needle wing, the conventional needle wing located in the intermediate area is defined as the second needle wing, and the conventional needle wing located in the export area is defined as the third needle wing. The first needle wing, the second needle wing, and the third needle wing are not exactly the same in shape, and / or the arrangement density of the first needle wing, the second needle wing, and the third needle wing is not exactly the same.

5. The heat dissipation structure according to claim 4, characterized in that, The first needle wing and / or the second needle wing are elliptical needle wings, teardrop-shaped needle wings, or rhomboid needle wings.

6. The heat dissipation structure according to claim 5, characterized in that, At least a portion of the first needle fins are arranged radially diffusely in the inlet area along the flow of the coolant, and the angle between the long axis direction of at least a portion of the first needle fins and the flow direction of the coolant is an acute angle, so that the coolant can flow along the long axis direction of the first needle fins after impacting them.

7. The heat dissipation structure according to claim 6, characterized in that, At least a portion of the first needle fins, arranged in a radially diffused manner, are located on the side of the flow area near the liquid inlet.

8. The heat dissipation structure according to claim 4, characterized in that, The third needle wing is a circular needle wing.

9. The heat dissipation structure according to claim 4, characterized in that, The arrangement density of the first needle wing and the arrangement density of the second needle wing are both less than the arrangement density of the third needle wing.

10. The heat dissipation structure according to claim 4, characterized in that, The number of the third needle fins gradually decreases along the flow direction of the coolant, so that the third needle fins near the outlet are sparsely arranged.

11. The heat dissipation structure according to claim 1, characterized in that, The substrate is formed by cold extrusion.

12. The heat dissipation structure according to any one of claims 1-11, characterized in that, It also includes a frame, one side of which is welded to the surface of the substrate, and the frame and the needle fin are independent of each other and do not contact each other.

13. The heat dissipation structure according to claim 12, characterized in that, The frame is formed by cold extrusion.

14. The heat dissipation structure according to claim 12, characterized in that, It also includes a cover plate, which is connected to the other side of the frame opposite to the substrate, to cover the needle fin; The cover plate, the frame, the base plate and the needle fins work together to form a fluid flow channel for coolant flow.

15. The heat dissipation structure according to claim 14, characterized in that, The cover plate and the frame are integrally formed by die casting or forging.

16. The heat dissipation structure according to claim 14, characterized in that, The cover plate and the frame are connected to each other by a brazing process.

17. The heat dissipation structure according to claim 14, characterized in that, The cover plate and the conventional needle fin are connected to each other by brazing.

18. The heat dissipation structure according to claim 1, characterized in that, It also includes a connecting layer, and the substrate also includes a substrate back side opposite to the surface of the substrate, and the connecting layer is connected to the substrate back side.

19. A power module, characterized in that, Includes the heat dissipation structure as described in any one of claims 1-18.

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