A multi-stage machine room cooling system

By using a multi-level dynamic heat dissipation control system, combined with temperature monitoring and internal circulation flow control, the problems of uneven heat dissipation and high energy consumption in high-density data centers have been solved, achieving stable and reliable heat dissipation and reducing energy consumption and noise.

CN224319745UActive Publication Date: 2026-06-02SHANGHAI INST OF TECH

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHANGHAI INST OF TECH
Filing Date
2025-05-30
Publication Date
2026-06-02

AI Technical Summary

Technical Problem

Traditional air-cooling methods are insufficient to meet the heat dissipation requirements of high-density data centers, leading to overheating in local hotspot areas, affecting system stability and reliability, and consuming a lot of energy.

Method used

It adopts a multi-level dynamic heat dissipation control system, including multi-level heat dissipation modules, internal circulation units and server rack units. The system regulates the flow elements and coolant circulation through temperature monitoring devices, dynamically switches between cooling towers, chillers and heat pipe loop units for heat dissipation, and achieves precise adjustment by combining internal circulation flow control and speed control.

Benefits of technology

It achieves energy saving, good compatibility, stable performance, improves the heat dissipation uniformity and reliability of data centers, reduces the air conditioning load in computer rooms, and avoids fan noise problems.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The utility model relates to a kind of multi-stage computer room heat dissipation system, comprising: multistage heat dissipation module, internal circulation unit and server cabinet unit;Server cabinet unit includes server cabinet, and temperature monitoring device is installed on server cabinet;Internal circulation unit is the closed circulation loop consisting of liquid accumulator, working medium feeding pipeline, flow driving element, flow control element, liquid cooling radiator and working medium return pipeline;Liquid cooling radiator is attached to the surface of server heating device, and is connected with third cabinet feeding branch pipe and cabinet return branch pipe;The outlet side of liquid accumulator is provided with control element;Multistage heat dissipation module includes: cooling pond loop unit, water chiller loop unit and heat pipe loop unit, and the operating state of multistage heat dissipation module is dynamically regulated by the outlet temperature of liquid accumulator obtained by control element.Compared with prior art, the utility model uses multistage dynamic heat dissipation control, improves energy efficiency, saves energy consumption;Good compatibility;Stable performance, improve reliability.
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Description

Technical Field

[0001] This utility model relates to the field of computer room heat dissipation technology, and in particular to a multi-level computer room heat dissipation system. Background Technology

[0002] With the development of technologies such as cloud computing and big data, modern data centers are trending towards higher device density, meaning deploying more servers within a limited space to increase computing power. High-density deployment significantly increases the heat load per unit area, placing more stringent demands on heat dissipation. A good heat dissipation solution can support the stable operation of high-density server clusters, fully utilize space resources, and reduce the physical space costs of data centers.

[0003] Traditional data centers use air cooling, which has low initial construction costs but low energy efficiency and significant noise pollution. As high-power-density large-scale data centers become mainstream, conventional air cooling, with its limited heat dissipation capacity, is no longer sufficient to meet the extremely high cooling demands of data centers. Furthermore, the varying cooling requirements of different servers in different locations within the server room can create localized hotspots. If these hotspots are not properly managed, they can cause individual servers to overheat, affecting the stability and reliability of the entire system. Achieving uniform heat distribution and avoiding the heat island effect is a major challenge in thermal design. Designing energy-efficient, stable, and compatible data center cooling systems is a common concern for those skilled in the art. Utility Model Content

[0004] The purpose of this utility model is to overcome the defects of the existing technology and provide a multi-level computer room heat dissipation system. It adopts multi-level dynamic heat dissipation control, improves energy efficiency, saves energy consumption, has good compatibility, stable performance, and improves reliability.

[0005] The objective of this utility model can be achieved through the following technical solutions:

[0006] This utility model provides a multi-level computer room heat dissipation system, including: a multi-level heat dissipation module, an internal circulation unit, and a server rack unit;

[0007] The server rack unit includes a server rack, and a computer motherboard with heat-generating devices is installed on the chassis tray of the server rack. The server rack is equipped with a temperature monitoring device to monitor the outlet temperature of the coolant in the server rack unit and regulate the flow rate.

[0008] The internal circulation unit is a closed loop consisting of a liquid reservoir, a working fluid feed pipeline, a flow drive element, a flow control element, a liquid cooler, and a working fluid return pipeline. The liquid cooler is attached to the surface of the server's heat-generating components and is connected to the third rack feed branch pipe and the rack return branch pipe. Heat dissipation of the heat-generating components is achieved through the circulation of the cooling working fluid. A control element is provided on the outlet side of the liquid reservoir.

[0009] The multi-stage heat dissipation module includes: a cooling tower loop unit, a chiller loop unit, and a heat pipe loop unit. The operation status of the multi-stage heat dissipation module is dynamically regulated by the liquid receiver outlet temperature obtained by the control element.

[0010] The control element obtains the outlet temperature T of the liquid reservoir via a temperature sensor. C The system controls the operating status of the cooling tower loop unit, chiller loop unit, and heat pipe loop unit according to preset temperature values, including T. C1 T C2 T C3 ,in,

[0011] When T C >T C1 When T is reached, the cooling fan of the heat pipe loop unit is activated until T is reached. C ≤T C1 ;

[0012] When T C >T C2 When T is activated, the chiller loop unit is started until T is reached. C ≤T C2 ;

[0013] When T C >T C3 When T is activated, the cooling tower loop unit is engaged until T is reached. C ≤T C3 ;

[0014] The preset temperature value T C1 T C2 T C3 Configure according to the operating conditions.

[0015] Furthermore, the cooling tower loop unit is a circulation loop consisting of a cooling tower, a first cooling feed main pipe, a first control valve, a first cooling feed branch pipe, a first cooling flow pump, a second cooling feed branch pipe, a second cooling flow pump, a second cooling feed main pipe, a first heat exchanger, and a cooling return water main pipe.

[0016] The cooling tower is diverted to the first and second parallel cooling feed branches via a first control valve;

[0017] The first cooling flow pump is controlled by the valve of the first control valve and has the same specifications as the second cooling flow pump, serving as a backup for each other.

[0018] The upstream of the first cooling feed main pipe is connected to the outlet of the cooling tower, and the downstream is connected to the first cooling feed branch pipe and the second cooling feed branch pipe through the first control valve. The downstream of the first cooling feed branch pipe and the second cooling feed branch pipe are connected in parallel and then connected to the second cooling feed main pipe. The downstream of the second cooling feed main pipe is connected to the inlet of the first heat exchanger. The cooling return water pipeline connects the outlet of the first heat exchanger and the inlet of the cooling tower. The first control valve is a three-way reversing valve.

[0019] The first cooling tower feed branch pipe is equipped with a first cooling flow pump, and the second cooling feed branch pipe is equipped with a second cooling flow pump.

[0020] Furthermore, the chiller loop unit is a circulation loop consisting of a chiller, a first chilled water inlet main pipe, a second control valve, a first chilled water inlet branch pipe, a first chilled water flow pump, a second chilled water inlet branch pipe, a second chilled water flow pump, a second chilled water inlet main pipe, a second heat exchanger, and a chilled water return main pipe.

[0021] The chiller distributes water to the first chilled water inlet branch pipe and the second chilled water inlet branch pipe in parallel via the second control valve;

[0022] The first cold water flow pump is controlled by the valve of the second control valve and has the same specifications as the second cold water flow pump, serving as a backup for each other.

[0023] The upstream of the first chilled water inlet main pipe is connected to the outlet of the chiller, and the downstream is connected to the first chilled water inlet branch pipe and the second chilled water inlet branch pipe through the second control valve; the downstream of the first chilled water inlet branch pipe and the second chilled water inlet branch pipe are connected in parallel to the second chilled water inlet main pipe; the downstream of the second chilled water inlet main pipe is connected to the inlet of the second heat exchanger; the chilled water return pipe is connected to the outlet of the second heat exchanger and the inlet of the chiller; the second control valve is a three-way reversing valve.

[0024] The first cold water inlet branch pipe is equipped with a first cold water flow pump, and the second cold water inlet branch pipe is equipped with a second chiller flow pump.

[0025] Furthermore, the heat pipe loop unit includes: a third heat exchanger, a gravity heat pipe, and a condensing section; a cooling fan is installed on the surface of the condensing section; the highest end face of the third heat exchanger is lower than the lowest end face of the condensing section; the gravity heat pipe is bent into a closed loop and is in full contact with the third heat exchanger and the condensing section.

[0026] Furthermore,

[0027] The liquid reservoir is a closed device, and all pipelines connected to the liquid reservoir are sealed to prevent leakage. A guide plate is installed inside the liquid reservoir to guide the flow path of the working fluid.

[0028] The working fluid feed pipeline includes: a first internal circulation feed main pipe, a first internal circulation feed branch pipe, a second internal circulation feed branch pipe, a second internal circulation feed main pipe, a first cabinet feed main pipe, a first cabinet feed branch pipe, a second cabinet feed branch pipe, a second cabinet feed main pipe, and a third cabinet feed branch pipe.

[0029] The upstream of the first internal circulation feed main pipe is a liquid reservoir, and the downstream is connected to the first internal circulation feed branch pipe and the second internal circulation feed branch pipe; the downstream of the first internal circulation feed branch pipe and the second internal circulation feed branch pipe are connected in parallel and then merge into the second internal circulation feed main pipe; the downstream of the second internal circulation feed main pipe is connected to multiple first cabinet feed main pipes; the downstream of the first cabinet feed main pipe is connected to the first cabinet feed branch pipe and the second cabinet feed branch pipe; the downstream of the first cabinet feed branch pipe and the second cabinet feed branch pipe are connected in parallel and then merge into the second cabinet feed main pipe; the downstream of the second cabinet feed main pipe is connected to multiple third cabinet feed branch pipes; the other end of the third cabinet feed branch pipe is connected to the liquid cooling radiator;

[0030] An internal circulation flow pump is installed on the first internal circulation feed branch pipe, an electronic throttle valve is installed on the first cabinet feed branch pipe, and a cabinet flow pump is installed on the second cabinet feed branch pipe.

[0031] Furthermore, the working fluid return pipeline includes: cabinet return branch pipe, cabinet return main pipe, and internal circulation return main pipe;

[0032] The upstream of multiple cabinet return branch pipes is connected to the liquid cooling radiator, and the downstream is connected in parallel to merge into the cabinet return main pipe;

[0033] The cabinet return main is equipped with a shut-off valve. The downstream of the cabinet return main is connected in parallel to the internal circulation return main, and the internal circulation return main is connected to the liquid storage tank to form a complete circulation pipeline.

[0034] Furthermore, the flow control of the internal circulation unit includes two methods: throttling control and speed control. The flow driving element is an internal circulation flow pump or a cabinet flow pump, and the flow control element is an electronic throttling valve and a cabinet flow pump.

[0035] Furthermore, the throttling control method uses an internal circulation flow pump to drive the cooling medium at a constant speed, and an electronic throttling valve is configured on the inlet pipe of each server rack unit. The opening of the electronic throttling valve is dynamically adjusted according to the rack outlet temperature collected by the temperature monitoring device to achieve precise control of the flow rate of different racks.

[0036] The speed control method uses a cabinet flow pump to drive the cooling medium and adjusts the speed of the cabinet flow pump according to the cabinet outlet temperature collected by the temperature monitoring device to meet the flow requirements of different cabinets.

[0037] Furthermore, the flow control method can also simultaneously employ throttling control and speed control for redundancy, thereby enhancing the reliability of system operation; when the third control valve and the fourth control valve are used to switch between the two control methods, wherein,

[0038] When the third control valve connects to the first internal circulation feed branch pipe and the fourth control valve connects to the first cabinet feed branch pipe, the internal circulation flow pump drives the flow of the entire pipeline. The flow is supplied to the cabinet unit in a targeted manner by adjusting the valve size of the electronic throttle valve on the first cabinet feed branch pipe.

[0039] When the third control valve connects to the second internal circulation feed branch pipe and the fourth control valve connects to the second cabinet feed branch pipe, the pipeline where the internal circulation flow pump is located is closed, and the cooling working fluid is driven by the cabinet flow pump on the second cabinet feed branch pipe. The flow supply to the cabinet unit is adapted by adjusting the speed of the cabinet flow pump.

[0040] Both the third and fourth control valves are three-way directional valves.

[0041] Furthermore, the temperature monitoring device collects the outlet temperature T of the server rack unit. F The system controls the operation of the electronic throttle valve or cabinet flow pump according to a preset temperature value, where the preset temperature value includes T. F1 T F2 T F3 ,in,

[0042] When the outlet temperature T F ≤T F1 At that time, the electronic throttle valve or cabinet flow pump is kept at one-quarter open; when the outlet temperature T F1 <T F ≤T F2 At that time, the electronic throttle valve or cabinet flow pump is kept half open; when the outlet temperature T F2 <T F ≤T F3 At that time, the electronic throttle valve or cabinet flow pump is kept three-quarters open; when the outlet temperature T F >T F3 At this time, the electronic throttle valve or cabinet flow pump should remain fully open. The preset temperature value T... F1 T F2 T F3 Configure according to the operating conditions.

[0043] The basic operating principle of a data center cooling system is as follows: the coolant is transported from the receiver to the heat exchange chamber of the liquid cooler by an internal circulation pump or a rack flow pump. The heat-generating components in the server rack conduct heat to the liquid cooler, and the coolant carries away the heat before circulating it back to the receiver. Depending on the different requirements of each server rack, the electronic flow valve or rack flow pump can be adjusted by a temperature monitoring device to meet the usage requirements of different server racks. The coolant in the receiver removes heat through a multi-stage cooling system.

[0044] Compared with the prior art, the present invention has the following advantages:

[0045] (1) Multi-stage dynamic heat dissipation control is adopted to improve energy efficiency and save energy consumption. The three-stage heat dissipation unit (heat pipe / chiller / cooling tower) is started in stages according to the liquid receiver outlet temperature threshold (Tc1-Tc3). A multi-stage computer room heat dissipation system is used to cool the internal circulating working fluid. Depending on the different liquid receiver outlet temperatures, the cooling measures can be dynamically enhanced or weakened to save energy consumption as much as possible while meeting the usage requirements. The internal circulation flow control method of this application has two types: throttling control and speed control. It can be selected or combined according to the actual situation to improve the reliability of system operation and further improve the energy consumption problem of the computer room system.

[0046] (2) Good compatibility. The flow pumps connected in parallel in the cooling tower / chiller loop are switched and backed up by a three-way valve; the internal circulation system supports dual-mode redundancy of throttling control and speed control. The liquid receiver and multi-stage heat dissipation unit can be expanded according to the room size.

[0047] (3) Stable performance and improved reliability. This application uses an insulating fluid as the working medium in the internal circulation system, avoiding the leakage risk of general water cooling systems. The use of liquid cooling radiators not only has high heat exchange efficiency, but also solves the problem of indoor fan noise in server rooms. The heat dissipation system of this application greatly reduces the workload of the server room air conditioner and improves the thermal environment of the server rack by collecting the heat from the main heat sources in the server room through pipelines to the liquid storage tank. Attached Figure Description

[0048] Figure 1 This is a schematic diagram of a multi-level computer room cooling system.

[0049] Figure 2 This is a schematic diagram of the cooling tower loop unit.

[0050] Figure 3 This is a schematic diagram of the chiller loop unit.

[0051] Figure 4 This is a schematic diagram of the heat pipe loop unit.

[0052] Figure 5This is a schematic diagram of the inner loop unit.

[0053] Figure 6 This is a structural diagram of a server rack unit.

[0054] Reference numerals: 100 - Cooling tower loop unit; 101 - Cooling tower; 102 - First cooling feed main pipe; 103 - First control valve; 104 - First cooling feed branch pipe; 105 - First cooling flow pump; 106 - Second cooling feed branch pipe; 107 - Second cooling flow pump; 108 - Second cooling feed main pipe; 109 - First heat exchanger; 110 - Cooling return water main pipe;

[0055] 200 - Chiller loop unit; 201 - Chiller; 202 - First chilled water inlet main pipe; 203 - Second control valve; 204 - First chilled water inlet branch pipe; 205 - First chilled water flow pump; 206 - Second chilled water inlet branch pipe; 207 - Second chilled water flow pump; 208 - Second chilled water inlet main pipe; 209 - Second heat exchanger; 210 - Chiller water return main pipe;

[0056] 300 - Heat pipe loop unit; 301 - Third heat exchanger; 302 - Gravity heat pipe; 303 - Condensation section; 304 - Cooling fan;

[0057] 400 - Internal circulation unit; 401 - Liquid reservoir; 402 - Control element; 403 - Baffle plate; 404 - First internal circulation feed main pipe; 405 - Third control valve; 406 - First internal circulation feed branch pipe; 407 - Internal circulation flow pump; 408 - Second internal circulation feed branch pipe; 409 - Second internal circulation feed main pipe; 410 - First cabinet feed main pipe; 411 - Fourth control valve; 412 - First cabinet feed branch pipe; 413 - Electronic throttle valve; 414 - Second cabinet feed branch pipe; 415 - Cabinet flow pump; 416 - Second cabinet feed main pipe; 417 - Third cabinet feed branch pipe; 418 - Liquid cooling radiator; 419 - Cabinet return branch pipe; 420 - Cabinet return main pipe; 421 - Shut-off valve; 422 - Internal circulation return main pipe;

[0058] 500 - Server rack unit; 501 - Server rack; 502 - Temperature monitoring device; 503 - Chassis tray; 504 - Computer motherboard; 505 - Heat-generating components. Detailed Implementation

[0059] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. Component models, material names, connection structures, control methods, algorithms, and other features not explicitly described in this technical solution are considered common technical features disclosed in the prior art.

[0060] Example 1

[0061] This utility model provides a multi-level computer room heat dissipation system, such as Figure 1-6 As shown, it includes: a multi-stage heat dissipation module, an internal circulation unit 400, and a server rack unit 500;

[0062] The server rack unit 500 includes a server rack 501. A computer motherboard 504 with a heat-generating device 505 is mounted on the chassis tray 503 of the server rack 501. A temperature monitoring device 502 is installed on the server rack 501 via a threaded connection to monitor the outlet temperature of the coolant in the server rack unit 500 and to regulate the flow rate.

[0063] The internal circulation unit 400 is a closed loop consisting of a liquid reservoir 401, a working fluid feed pipeline, a flow drive element, a flow control element, a liquid-cooled radiator 418, and a working fluid return pipeline. The liquid-cooled radiator 418 is attached to the surface of the server heat-generating device 505 via a threaded connection or a spring clip connection, and is connected to the third cabinet feed branch pipe 417 and the cabinet return branch pipe 419 via a quick-connect fitting, threaded fitting, pagoda fitting, or compression fitting. The heat dissipation of the heat-generating device 505 is achieved through the circulation of the cooling working fluid. A control element 402 is provided on the outlet side of the liquid reservoir 401.

[0064] The multi-stage heat dissipation module includes: a cooling tower loop unit 100, a chiller loop unit 200, and a heat pipe loop unit 300. The operation status of the multi-stage heat dissipation module is dynamically regulated by the outlet temperature of the liquid receiver 401 obtained by the control element 402.

[0065] The control element 402 obtains the outlet temperature T of the liquid reservoir 401 through a temperature sensor. C The system controls the operating status of the cooling tower loop unit 100, the chiller loop unit 200, and the heat pipe loop unit 300 according to a preset temperature value, wherein the preset temperature value includes T. C1 T C2 T C3 ,in,

[0066] When T C >T C1 When T is activated, the cooling fan 304 of the heat pipe loop unit 300 is turned on until T C ≤T C1 ;

[0067] When T C >T C2 When the chiller loop unit 200 is activated, the chiller 201 and either the first chiller flow pump 205 or the second chiller flow pump 207 are engaged until T. C ≤T C2 ;

[0068] When T C >T C3 When T is activated, the cooling tower 101 of the cooling tower loop unit 100 and the first cooling tower flow pump 105 or the second cooling tower flow pump 107 are activated until T C ≤T C3 ;

[0069] The preset temperature value T C1 T C2 T C3 Configure according to the operating conditions.

[0070] In a specific embodiment, the cooling tower loop unit 100 is a circulation loop consisting of a cooling tower 101, a first cooling feed main pipe 102, a first control valve 103, a first cooling feed branch pipe 104, a first cooling flow pump 105, a second cooling feed branch pipe 106, a second cooling flow pump 107, a second cooling feed main pipe 108, a first heat exchanger 109, and a cooling return water main pipe 110.

[0071] The cooling tower 101 is diverted to the parallel first cooling feed branch pipe 104 and second cooling feed branch pipe 106 via the first control valve 103;

[0072] The first cooling flow pump 105 is controlled by the valve of the first control valve 103 and has the same specifications as the second cooling flow pump 107, serving as a backup for each other.

[0073] The upstream of the first cooling feed main pipe 102 is connected to the outlet of the cooling tower 101, and the downstream is connected to the first cooling feed branch pipe 104 and the second cooling feed branch pipe 106 through the first control valve 103. The downstream of the first cooling feed branch pipe 104 and the second cooling feed branch pipe 106 are connected in parallel and then connected to the second cooling feed main pipe 108. The downstream of the second cooling feed main pipe 108 is connected to the inlet of the first heat exchanger 109. The cooling return water pipe 110 connects the outlet of the first heat exchanger 109 and the inlet of the cooling tower 101. The first control valve 103 is a three-way reversing valve.

[0074] The first cooling tower feed branch pipe 104 is equipped with a first cooling flow pump 105, and the second cooling feed branch pipe 106 is equipped with a second cooling flow pump 107.

[0075] In a specific embodiment, the chiller loop unit 200 is a circulation loop consisting of a chiller 201, a first chilled water inlet main pipe 202, a second control valve 203, a first chilled water inlet branch pipe 204, a first chilled water flow pump 205, a second chilled water inlet branch pipe 206, a second chilled water flow pump 207, a second chilled water inlet main pipe 208, a second heat exchanger 209, and a chilled water return main pipe 210.

[0076] The chiller 201 is diverted to the first chilled water inlet branch pipe 204 and the second chilled water inlet branch pipe 206 in parallel via the second control valve 203;

[0077] The first cold water flow pump 205 is controlled by the valve of the second control valve 203 and has the same specifications as the second cold water flow pump 207, serving as a backup for each other.

[0078] The upstream of the first cold water inlet main pipe 202 is connected to the outlet of the chiller 201, and the downstream is connected to the first cold water inlet branch pipe 204 and the second cold water inlet branch pipe 206 through the second control valve 203; the downstream of the first cold water inlet branch pipe 204 and the second cold water inlet branch pipe 206 are connected in parallel to the second cold water inlet main pipe 208; the downstream of the second cold water inlet main pipe 208 is connected to the inlet of the second heat exchanger 209; the cold water return pipe 210 connects the outlet of the second heat exchanger 209 to the inlet of the chiller 202; the second control valve 203 is a three-way reversing valve.

[0079] The first cold water inlet branch pipe 204 is equipped with a first cold water flow pump 205, and the second cold water inlet branch pipe 206 is equipped with a second chiller flow pump 207.

[0080] In a specific embodiment, the heat pipe loop unit 300 includes: a third heat exchanger 301, a gravity heat pipe 302, and a condensing section 303; a cooling fan 304 is installed on the surface of the condensing section 303 via a threaded connection; the highest end face of the third heat exchanger 301 is lower than the lowest end face of the condensing section 303; the gravity heat pipe 302 is bent into a closed loop and is fully in contact with the third heat exchanger 301 and the condensing section 303 by welding.

[0081] In a specific implementation,

[0082] The liquid reservoir 401 is a closed device, and all pipelines connected to the liquid reservoir 401 are sealed to prevent leakage. A guide plate 403 is provided inside the liquid reservoir 401 to guide the flow path of the working fluid.

[0083] The working fluid feed pipeline includes: a first internal circulation feed main pipe 404, a first internal circulation feed branch pipe 406, a second internal circulation feed branch pipe 408, a second internal circulation feed main pipe 409, a first cabinet feed main pipe 410, a first cabinet feed branch pipe 412, a second cabinet feed branch pipe 414, a second cabinet feed main pipe 416, and a third cabinet feed branch pipe 417;

[0084] The upstream of the first internal circulation feed main pipe 404 is a liquid reservoir 401, and the downstream is connected to the first internal circulation feed branch pipe 406 and the second internal circulation feed branch pipe 408; the downstream of the first internal circulation feed branch pipe 406 and the second internal circulation feed branch pipe 408 are connected in parallel and then merge into the second internal circulation feed main pipe 409; the downstream of the second internal circulation feed main pipe 409 is connected to multiple first cabinet feed main pipes 410; the downstream of the first cabinet feed main pipe 410... The first cabinet feed branch pipe 412 is connected to the second cabinet feed branch pipe 414; the first cabinet feed branch pipe 412 and the second cabinet feed branch pipe 414 are connected in parallel downstream and then merge into the second cabinet feed main pipe 416; the downstream of the second cabinet feed main pipe 416 is connected to multiple third cabinet feed branch pipes 417; the other end of the third cabinet feed branch pipe 417 is connected to the liquid cooling radiator 418 through a quick-connect water-stop joint, threaded joint, pagoda joint or compression fitting joint;

[0085] An internal circulation flow pump 407 is provided on the first internal circulation feed branch pipe 406, an electronic throttle valve 413 is provided on the first cabinet feed branch pipe 412, and a cabinet flow pump 415 is provided on the second cabinet feed branch pipe 414.

[0086] In a specific embodiment, the working fluid return pipeline includes: cabinet return branch pipe 419, cabinet return main pipe 420, and internal circulation return main pipe 422;

[0087] The upstream of multiple cabinet return branch pipes 419 are connected to the liquid cooling radiator 418 through quick-stop joints, threaded joints, pagoda joints or compression fittings, and the downstream are connected in parallel to the cabinet return main pipe 420.

[0088] The cabinet return main pipe 420 is equipped with a shut-off valve 421. The downstream of the cabinet return main pipe 420 is connected in parallel to the internal circulation return main pipe 422, and the internal circulation return main pipe 422 is connected to the liquid storage tank 401 to form a complete circulation pipeline.

[0089] In a specific implementation, the flow control of the internal circulation unit 400 includes two methods: throttling control and speed control. The flow driving element is an internal circulation flow pump 407 or a cabinet flow pump 415, and the flow control element is an electronic throttling valve 413 and a cabinet flow pump 415.

[0090] In a specific implementation, the throttling control method uses an internal circulation flow pump 407 to drive the cooling working fluid at a constant speed, and an electronic throttling valve 413 is configured on the inlet pipe of each server rack unit 500. The opening of the electronic throttling valve 413 is dynamically adjusted according to the rack outlet temperature collected by the temperature monitoring device 502, so as to achieve precise control of the flow of different racks.

[0091] The speed control method uses the cabinet flow pump 415 to drive the cooling medium and adjusts the speed of the cabinet flow pump 415 according to the cabinet outlet temperature collected by the temperature monitoring device 502 to meet the flow requirements of different cabinets.

[0092] In a specific implementation, the flow control method can also simultaneously employ throttling control and speed control for redundancy, thereby enhancing the reliability of system operation; when the third control valve 405 and the fourth control valve 411 are used to switch between the two control methods, wherein,

[0093] When the third control valve 405 connects to the first internal circulation feed branch pipe 406 and the fourth control valve 411 connects to the first cabinet feed branch pipe 412, the internal circulation flow pump 407 drives the flow of the entire pipeline. The flow is supplied to the cabinet unit in a targeted manner by adjusting the valve size of the electronic throttle valve 413 on the first cabinet feed branch pipe 412.

[0094] When the third control valve 405 connects to the second internal circulation feed branch pipe 408 and the fourth control valve 411 connects to the second cabinet feed branch pipe 414, the pipeline where the internal circulation flow pump 407 is located is closed, and the cooling working fluid is driven by the cabinet flow pump 415 on the second cabinet feed branch pipe 414. The flow supply to the cabinet unit is adapted by adjusting the speed of the cabinet flow pump 415.

[0095] Both the third control valve 405 and the fourth control valve 411 are three-way directional valves.

[0096] In a specific embodiment, the temperature monitoring device 502 collects the outlet temperature T of the server rack unit 500. F The system controls the operation of the electronic throttle valve 413 or the cabinet flow pump 415 according to a preset temperature value, wherein the preset temperature value includes T. F1 T F2 T F3 ,in,

[0097] When the outlet temperature T F ≤T F1 When the outlet temperature T is reached, the electronic throttle valve 413 or the cabinet flow pump 415 is kept at one-quarter open; F1 <T F ≤T F2 When the outlet temperature T is reached, the electronic throttle valve 413 or the cabinet flow pump 415 is kept half open; F2 <T F ≤T F3 At this time, the electronic throttle valve 413 or the cabinet flow pump 415 is kept three-quarters open; when the outlet temperature T F >T F3At this time, the electronic throttle valve 413 or the cabinet flow pump 415 shall remain fully open. The preset temperature value T F1 T F2 T F3 Configure according to the operating conditions.

[0098] The liquid-cooled radiator 418 is a heat dissipation device with a heat exchange cavity and a reinforced structure. For example, the liquid-cooled radiator 418 is a microchannel radiator or a micro-pin fin radiator.

[0099] The heat-generating device 505 is a high-power device on the server motherboard, and the heat-generating device 505 is a CPU chip and a GPU chip; the cooling medium is selected from deionized water, fluorinated compounds, mineral oil and coolant according to the applicable operating conditions.

[0100] The basic operating principle of the data center cooling system is as follows: the coolant is transported from the liquid reservoir 401 to the heat exchange chamber of the liquid-cooled radiator 418 under the drive of the internal circulation flow pump 407 or the rack flow pump 415. The heat-generating components 505 in the server rack 501 conduct heat to the liquid-cooled radiator 418, and the coolant carries away the heat and then circulates back to the liquid reservoir 401. According to the different requirements of different racks, the electronic flow valve 413 or the rack flow pump 415 can be adjusted by the temperature monitoring device 502 to meet the usage requirements of different server racks. The coolant in the liquid reservoir 401 removes heat through a multi-stage cooling system.

[0101] Components not described in detail in this embodiment are all existing components that can be purchased through public channels.

[0102] The above description of the embodiments is provided to enable those skilled in the art to understand and use the utility model. It will be apparent to those skilled in the art that various modifications can be easily made to these embodiments, and the general principles described herein can be applied to other embodiments without inventive effort. Therefore, the present utility model is not limited to the above embodiments, and any improvements and modifications made by those skilled in the art based on the disclosure of the present utility model without departing from its scope should be within the protection scope of the present utility model.

Claims

1. A multi-level computer room heat dissipation system, characterized in that, include: Multi-level heat dissipation module, internal circulation unit (400) and server rack unit (500); The server rack unit (500) includes a server rack (501), on which a computer motherboard (504) with a heat-generating device (505) is mounted on the chassis tray (503) of the server rack (501), and a temperature monitoring device (502) is mounted on the server rack (501). The internal circulation unit (400) is a closed loop consisting of a liquid reservoir (401), a working fluid feed pipeline, a flow drive element, a flow control element, a liquid cooler (418), and a working fluid return pipeline. The liquid cooler (418) is attached to the surface of the server heat-generating device (505) and connected to the third cabinet feed branch pipe (417) and the cabinet return branch pipe (419). The heat dissipation of the heat-generating device (505) is achieved through the circulation of the cooling working fluid. A control element (402) is provided on the outlet side of the liquid reservoir (401). The multi-stage heat dissipation module includes: a cooling tower loop unit (100), a chiller loop unit (200), and a heat pipe loop unit (300). The control element (402) acquires the outlet temperature T of the reservoir (401). C The system controls the operating status of the cooling tower loop unit (100), chiller loop unit (200), and heat pipe loop unit (300) according to a preset temperature value, wherein the preset temperature value includes T. C1 T C2 T C3 ,in, When T C >T C1 When T is activated, the cooling fan (304) of the heat pipe loop unit (300) is turned on until T C ≤T C1 ; When T C >T C2 At that time, the chiller loop unit (200) is activated until T. C ≤T C2 ; When T C >T C3 When T is activated, the cooling tower loop unit (100) is engaged until T is reached. C ≤T C3 .

2. The multi-level computer room heat dissipation system according to claim 1, characterized in that, The cooling tower loop unit (100) is a circulation loop consisting of a cooling tower (101), a first cooling feed main pipe (102), a first control valve (103), a first cooling feed branch pipe (104), a first cooling flow pump (105), a second cooling feed branch pipe (106), a second cooling flow pump (107), a second cooling feed main pipe (108), a first heat exchanger (109), and a cooling return water main pipe (110). The cooling tower (101) is diverted to the first cooling feed branch pipe (104) and the second cooling feed branch pipe (106) in parallel through the first control valve (103). The first cooling flow pump (105) and the second cooling flow pump (107) have the same specifications and serve as backups for each other.

3. The multi-level computer room heat dissipation system according to claim 1, characterized in that, The chiller loop unit (200) is a circulation loop consisting of a chiller (201), a first chilled water inlet main pipe (202), a second control valve (203), a first chilled water inlet branch pipe (204), a first chilled water flow pump (205), a second chilled water inlet branch pipe (206), a second chilled water flow pump (207), a second chilled water inlet main pipe (208), a second heat exchanger (209), and a chilled water return main pipe (210). The chiller (201) is diverted to the first chilled water inlet branch pipe (204) and the second chilled water inlet branch pipe (206) in parallel via the second control valve (203). The first cold water flow pump (205) and the second cold water flow pump (207) have the same specifications and serve as backups for each other.

4. The multi-level computer room heat dissipation system according to claim 1, characterized in that, The heat pipe loop unit (300) includes: a third heat exchanger (301), a gravity heat pipe (302), and a condensing section (303); a cooling fan (304) is installed on the surface of the condensing section (303); the highest end face of the third heat exchanger (301) is lower than the lowest end face of the condensing section (303); the gravity heat pipe (302) is bent into a closed loop and contacts the third heat exchanger (301) and the condensing section (303).

5. A multi-level computer room heat dissipation system according to claim 1, characterized in that, The reservoir (401) is a closed device, and a guide plate (403) is provided inside the reservoir (401) to guide the flow path of the working fluid. The working fluid feed pipeline includes: a first internal circulation feed main pipe (404), a first internal circulation feed branch pipe (406), a second internal circulation feed branch pipe (408), a second internal circulation feed main pipe (409), a first cabinet feed main pipe (410), a first cabinet feed branch pipe (412), a second cabinet feed branch pipe (414), a second cabinet feed main pipe (416), and a third cabinet feed branch pipe (417). The upstream of the first internal circulation feed main pipe (404) is a liquid reservoir (401), and the downstream is connected to the first internal circulation feed branch pipe (406) and the second internal circulation feed branch pipe (408); the downstream of the first internal circulation feed branch pipe (406) and the second internal circulation feed branch pipe (408) are connected in parallel and then merge into the second internal circulation feed main pipe (409); the downstream of the second internal circulation feed main pipe (409) is connected to multiple first cabinet feed main pipes (410); the first cabinet Downstream of the feed main pipe (410) is connected to the first cabinet feed branch pipe (412) and the second cabinet feed branch pipe (414); downstream of the first cabinet feed branch pipe (412) and the second cabinet feed branch pipe (414) are connected in parallel and then merge into the second cabinet feed main pipe (416); downstream of the second cabinet feed main pipe (416) is connected to multiple third cabinet feed branch pipes (417); the other end of the third cabinet feed branch pipe (417) is connected to the liquid cooling radiator (418); An internal circulation flow pump (407) is provided on the first internal circulation feed branch pipe (406), an electronic throttle valve (413) is provided on the first cabinet feed branch pipe (412), and a cabinet flow pump (415) is provided on the second cabinet feed branch pipe (414).

6. A multi-level computer room heat dissipation system according to claim 1, characterized in that, The working fluid return pipeline includes: cabinet return branch pipe (419), cabinet return main pipe (420), and internal circulation return main pipe (422). The upstream of the multiple cabinet return branch pipes (419) is connected to the liquid cooling radiator (418), and the downstream is connected in parallel to the cabinet return main pipe (420). The cabinet return main pipe (420) is equipped with a shut-off valve (421). The downstream of the cabinet return main pipe (420) is connected in parallel to the internal circulation return main pipe (422), and the internal circulation return main pipe (422) is connected to the liquid storage tank (401) to form a complete circulation pipeline.

7. A multi-level computer room heat dissipation system according to claim 5, characterized in that, The flow control of the internal circulation unit (400) includes two methods: throttling control and speed control. The flow driving element is an internal circulation flow pump (407) or a cabinet flow pump (415). The flow control element is an electronic throttling valve (413) and a cabinet flow pump (415).

8. A multi-level computer room heat dissipation system according to claim 7, characterized in that, The throttling control method drives the cooling medium at a constant speed through an internal circulation flow pump (407), and an electronic throttling valve (413) is configured on the inlet pipe of each server rack unit (500). The opening degree of the electronic throttling valve (413) is dynamically adjusted according to the rack outlet temperature collected by the temperature monitoring device (502) to achieve control of the flow rate of different racks. The speed control method uses the cabinet flow pump (415) to drive the cooling medium and adjusts the speed of the cabinet flow pump (415) according to the cabinet outlet temperature collected by the temperature monitoring device (502) to meet the flow requirements of different cabinets.

9. A multi-level computer room heat dissipation system according to claim 7, characterized in that, The flow control method employs both throttling control and speed control for redundancy; when the third control valve (405) and the fourth control valve (411) are used to switch between the two control methods, wherein, When the third control valve (405) connects to the first internal circulation feed branch pipe (406) and the fourth control valve (411) connects to the first cabinet feed branch pipe (412), the internal circulation flow pump (407) drives the flow of the entire pipeline. The flow is supplied to the cabinet unit in a targeted manner by adjusting the valve size of the electronic throttle valve (413) on the first cabinet feed branch pipe (412). When the third control valve (405) connects to the second internal circulation feed branch pipe (408) and the fourth control valve (411) connects to the second cabinet feed branch pipe (414), the pipeline where the internal circulation flow pump (407) is located is closed, and the cooling working fluid is driven by the cabinet flow pump (415) on the second cabinet feed branch pipe (414). The flow supply to the cabinet unit is adapted by adjusting the speed of the cabinet flow pump (415).

10. A multi-level computer room heat dissipation system according to claim 5, characterized in that, The temperature monitoring device (502) collects the outlet temperature T of the server rack unit (500). F The system controls the operation of the electronic throttle valve (413) or the cabinet flow pump (415) according to a preset temperature value, wherein the preset temperature value includes T. F1 T F2 T F3 ,in, When the outlet temperature T F ≤T F1 At this time, the electronic throttle valve (413) or the cabinet flow pump (415) is kept at one-quarter open; when the outlet temperature T F1 <T F ≤T F2 When the outlet temperature T is reached, the electronic throttle valve (413) or the cabinet flow pump (415) is kept half open; F2 <T F ≤T F3 At this time, the electronic throttle valve (413) or the cabinet flow pump (415) is kept three-quarters open; when the outlet temperature T F >T F3 At this time, the electronic throttle valve (413) or the cabinet flow pump (415) is kept fully open.