An insulating liquid cooling heat dissipation structure applied to high-power heat dissipation requirements

Abstract

This utility model discloses an insulating liquid-cooled heat dissipation structure for high-power heat dissipation applications, comprising: a circuit board, an insulating liquid-cooled heat sink, a thermally conductive and electrically conductive fixing component, and a thermally conductive insulating medium. The thermally conductive and electrically conductive fixing component is fixed to the surface of the insulating liquid-cooled heat sink, and the thermally conductive insulating medium is disposed between the thermally conductive and electrically conductive fixing component and the insulating liquid-cooled heat sink. The surface of the thermally conductive and electrically conductive fixing component is in close contact with the components on the circuit board. The heat generated by the components on the circuit board during operation is transferred to the thermally conductive insulating medium through the thermally conductive and electrically conductive fixing component. The thermally conductive insulating medium isolates the electrical connection between the thermally conductive and electrically conductive fixing component, the circuit board, and the insulating liquid-cooled heat sink, and conducts heat to the insulating liquid-cooled heat sink. The insulating liquid-cooled heat sink dissipates heat through an internal liquid cooling cycle. This utility model achieves efficient heat dissipation performance for high-power instruments while ensuring stable and safe electrical performance.

Description

Technical Field

[0001] This utility model relates to the field of radiator technology, specifically to an insulating liquid-cooled heat dissipation structure for high-power heat dissipation needs. Background Technology

[0002] Under current technological conditions, the structural layout of large-section heat sinks used in high-power instruments has significant limitations. Existing large-section heat sinks, except for the front and rear air inlets and outlets, have high-power devices mounted on all four sides. From a heat dissipation principle perspective, since these high-power devices generate a large amount of heat during operation, and the heat sink is largely covered by these devices, the effective heat dissipation area is relatively reduced, making it difficult to quickly and effectively dissipate heat to the surrounding environment. Furthermore, this layout makes the internal heat flow channels complex and narrow, hindering the flow of hot air and preventing efficient convection cooling, severely impacting the efficiency of heat transfer from the heat source to the heat dissipation medium (such as air). Therefore, existing large-section heat sinks are insufficient to meet the actual needs of high-power instruments with their continuous high heat generation, becoming a key factor restricting the stable and efficient operation of these instruments. Summary of the Invention

[0003] The purpose of this invention is to overcome the deficiencies in the prior art and provide an insulating liquid-cooled heat dissipation structure applicable to high-power heat dissipation needs.

[0004] This utility model discloses an insulating liquid-cooled heat dissipation structure for high-power heat dissipation needs, comprising: a circuit board, an insulating liquid-cooled heat sink, a thermally conductive and electrically conductive fixing component, and a thermally conductive insulating medium. The thermally conductive and electrically conductive fixing component is disposed on the surface of the insulating liquid-cooled heat sink, and the thermally conductive insulating medium is disposed between the thermally conductive and electrically conductive fixing component and the insulating liquid-cooled heat sink. The surface of the thermally conductive and electrically conductive fixing component is in close contact with the components on the circuit board. The heat generated by the components on the circuit board during operation is transferred to the thermally conductive insulating medium through the thermally conductive and electrically conductive fixing component. The thermally conductive insulating medium isolates the electrical connection between the thermally conductive and electrically conductive fixing component, the circuit board, and the insulating liquid-cooled heat sink, and conducts heat to the insulating liquid-cooled heat sink. The insulating liquid-cooled heat sink dissipates heat through an internal liquid cooling cycle.

[0005] Furthermore, the thermally conductive and electrically conductive fixing component is provided with an insulating post, which is used to install a connector. The thermally conductive and electrically conductive fixing component is fixed to the surface of the insulating liquid-cooled heat sink through the connector. The circuit board and the thermally conductive and electrically conductive fixing component are electrically insulated from the insulating liquid-cooled heat sink through the thermally conductive insulating medium and the insulating post.

[0006] Furthermore, at least one thermally and electrically conductive fixing member is provided on the surface of the insulating liquid-cooled heat sink. The thermally and electrically conductive fixing member forms a conductive path to output electrical energy through connecting electrodes, while maintaining electrical insulation with the insulating liquid-cooled heat dissipation structure.

[0007] Furthermore, the insulating liquid-cooled radiator is provided with heat dissipation fins to form heat dissipation channels, and the surface of the insulating liquid-cooled radiator in contact with the thermally conductive insulating medium is provided with grooves. Pipes filled with refrigerant are embedded in the grooves, and heat dissipation is achieved through the refrigerant circulating in the pipes.

[0008] Furthermore, the pipe is higher than the surface of the groove, and the portion of the pipe that protrudes above the surface of the groove is deformed by extrusion to become flush with the surface of the insulating liquid-cooled radiator. The gap between the pipe and the groove is filled with thermally conductive silicone, so that the pipe and the groove fit together fully.

[0009] Furthermore, the structure of the pipeline includes single inlet and single outlet or single inlet and multiple outlets, with the single inlet and multiple outlet structure forming multiple independently adjustable liquid cooling circulation paths.

[0010] Furthermore, the circuit board is fixed on a thermally and electrically conductive fastener, and electrical insulation is achieved between the thermally conductive insulating medium and the insulating liquid-cooled heat sink. Alternatively, the circuit board is fixed to the surface of the insulating liquid-cooled heat sink by a shim column, so that an insulating gap is maintained between the circuit board and the insulating liquid-cooled heat sink to achieve electrical insulation.

[0011] Furthermore, the component is a transistor. The two side pins of the transistor are fixed to one circuit board, and the middle pin is fixed to another circuit board, so that the two circuit boards form a differential signal transmission path through the transistor. One circuit board is fixed to the surface of the insulating liquid-cooled heat sink by a shim, so that the circuit board and the insulating liquid-cooled heat sink maintain an insulating gap. The other circuit board is arranged parallel to the circuit board fixed to the surface of the insulating liquid-cooled heat sink and is fixed to the side of the thermally conductive and electrically conductive fixing component. The circuit board fixed to the side of the thermally conductive and electrically conductive fixing component and the thermally conductive and electrically conductive fixing component are electrically insulated from the insulating liquid-cooled heat sink through the thermally conductive and insulating medium.

[0012] The beneficial effects of this utility model's technical solution are as follows:

[0013] 1. This utility model achieves high-efficiency heat dissipation performance for high-power instruments through an insulating liquid-cooled radiator, while ensuring the stability and safety of electrical performance;

[0014] 2. By utilizing the efficient thermal conductivity of refrigerant, the heat transfer rate and heat dissipation capacity are greatly improved. It can quickly and effectively dissipate the heat generated by high-power instruments, significantly enhancing the radiator's ability to cope with high-heat conditions. The radiator fins, together with the external airflow, form an auxiliary air-cooled heat dissipation, which further accelerates the diffusion of heat to the surrounding environment. The synergistic effect of the two breaks through the performance limit of a single heat dissipation method and achieves higher heat dissipation efficiency.

[0015] 3. A special process is used to treat the pipes filled with refrigerant, making the pipes higher than the surface of the groove. Then, the pipes are deformed by extrusion to make them flush with the surface of the insulating liquid-cooled radiator. The gaps are filled with thermally conductive silicone, which increases the contact area between the pipes and the insulating liquid-cooled radiator, effectively reduces the contact thermal resistance, and greatly improves the heat transfer efficiency from the thermally conductive insulating medium to the pipes. This enhances the heat dissipation performance of the entire heat dissipation system and provides a more reliable heat dissipation guarantee for the stable operation of high-power instruments.

[0016] 4. The heat-conducting and conductive fixing component is designed as an electrode output structure. While achieving efficient heat dissipation, it also gives it a new function of electrode output. This multi-functional integrated design reduces the number and complexity of internal parts of high-power instruments, optimizes the overall structural layout of the instrument, saves installation space, reduces assembly costs and system complexity, and improves the integration and reliability of the instrument.

[0017] 5. The circuit board layout enables three-dimensional electrical connections of transistors, forming differential signal transmission paths, achieving efficient heat dissipation of the circuit while ensuring the stability and safety of transistor performance. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of an insulating liquid-cooled heat dissipation structure disclosed in this utility model for high-power heat dissipation applications.

[0019] Figure 2 This is an exploded view of the insulating liquid-cooled heat dissipation structure disclosed in this utility model, which is applied to high-power heat dissipation requirements.

[0020] Figure 3 This is a schematic diagram of the insulating liquid-cooled heat dissipation side structure disclosed in this utility model for high-power heat dissipation applications.

[0021] Marked in the image:

[0022] 1. Insulating liquid-cooled heat sink; 2. Thermally conductive and electrically conductive fastener; 3. Thermally conductive and insulating medium; 4. Transistor; 5. First circuit board; 6. Second circuit board; 7. Heat sink fins; 8. Groove; 9. Insulating post; 10. Electrode; 11. Elevating post; 12. Pipe; 13. Screw. Detailed Implementation

[0023] The technical solution of this utility model will be described in detail below, but the protection scope of this utility model is not limited to the embodiments described.

[0024] like Figure 1-3 As shown, this utility model discloses an insulating liquid-cooled heat dissipation structure for high-power heat dissipation needs, including a circuit board, a thermally conductive and electrically conductive fixing component 2, an insulating liquid-cooled heat sink 1, and a thermally conductive and insulating medium 3. The thermally conductive and electrically conductive fixing component 2 is fixed to the surface of the insulating liquid-cooled heat sink 1, and the thermally conductive and electrically conductive medium 3 is disposed between the thermally conductive and electrically conductive fixing component 2 and the insulating liquid-cooled heat sink 1. The high-power components on the circuit board are in close contact with the thermally conductive and electrically conductive fixing component 2, and the heat generated by the components during operation is transferred to the thermally conductive and electrically conductive medium 3 through the thermally conductive and electrically conductive fixing component 2. The thermally conductive and electrically conductive medium 3 isolates the electrical connection between the thermally conductive and electrically conductive fixing component 2, the circuit board, and the insulating liquid-cooled heat sink 1, and conducts heat to the insulating liquid-cooled heat sink 1. The insulating liquid-cooled heat sink 1 achieves heat dissipation through internal air cooling and water cooling circulation.

[0025] The thermally and electrically conductive fixing component 2 is a metal strip structure, such as an aluminum strip. The insulating liquid-cooled radiator 1 has a cubic structure with internal heat dissipation fins 7 forming a heat dissipation channel, which can cooperate with an external fan to form an air-cooled heat dissipation channel. The surface of the insulating liquid-cooled radiator 1 that contacts the thermally conductive insulating medium 3 has a groove 8, and a pipe 12 filled with refrigerant is embedded in the groove 8. The pipe 12 is a copper pipe, and the refrigerant carries away a large amount of heat through circulation. The refrigerant is a mixed solution of deionized water and antifreeze, with a thermal conductivity of not less than 0.5 W / (m·K). The heat dissipation fins 7 and the pipe 12 are arranged in an alternating pattern to form a liquid-cooled and air-cooled combined heat dissipation channel. An insulating post 9 is provided on the thermally conductive and electrically conductive fastener 2. Screws 13 and the insulating post 9 are used to fix the thermally conductive and electrically conductive fastener 2 to the surface of the insulating liquid-cooled radiator 1, ensuring mechanical connection strength while achieving electrical insulation between the thermally conductive and electrically conductive fastener 2 and the insulating liquid-cooled radiator 1. The contact area between the thermally conductive and electrically conductive fastener 2 and the insulating liquid-cooled radiator 1 is 100~200cm², and the thermal resistance does not exceed 0.1℃ / W. The insulating post 9 is made of high-voltage resistant insulating material with a withstand voltage of not less than 1000V. The thermally conductive insulating medium 3 is a thermally conductive insulating sheet, set according to the contact position between the thermally conductive and electrically conductive fastener 2 and the insulating liquid-cooled radiator 1, isolating the thermally conductive and electrically conductive fastener 2 and the insulating liquid-cooled radiator 1. The refrigerant thermal conductivity, the contact area between the thermally conductive and electrically conductive fastener and the insulating liquid-cooled radiator, the thermal resistance, and the withstand voltage of the insulating post can be adjusted according to the actual number of components, heat dissipation requirements, and the area of ​​the insulating liquid-cooled radiator.

[0026] The pipe 12 is higher than the surface of the groove 8, making the surface of the copper pipe higher than the surface of the insulating liquid-cooled radiator 1. The copper pipe is deformed by compression to make it flush with the surface of the insulating liquid-cooled radiator 1. Thermally conductive silicone is filled into the gap between the pipe 12 and the groove 8, ensuring a close fit between them. This increases the contact area between the copper pipe and the insulating liquid-cooled radiator 1, effectively reducing contact thermal resistance and improving the heat transfer efficiency from the insulating liquid-cooled radiator 1 to the copper pipe. The pipe 12 can have a single-inlet / single-outlet or single-inlet / multiple-outlet structure. The single-inlet / multiple-outlet structure forms multiple independent parallel liquid-cooling circulation paths, each corresponding to a different heat dissipation area. A flow distribution valve can be installed at the branch point of the pipe 12 in the single-inlet / multiple-outlet structure. This flow distribution valve dynamically adjusts the coolant flow rate of each liquid-cooling circuit according to the heat generation of different areas of the component. The pipe diameter, wall thickness, and surface roughness of pipe 12 can be set according to the pipe material, the size of the groove, etc. For example, the pipe diameter is 16-25mm, the pipe wall thickness is 0.5-1.2mm, the surface roughness Ra≤0.8μm, and it is coated with a nickel-phosphorus alloy anti-corrosion layer with a thickness of 5-10μm.

[0027] The components on the circuit board are arranged in the same shape as the thermally conductive and electrically conductive fixing component. In this embodiment, the thermally conductive and electrically conductive fixing component is an aluminum strip. The components soldered onto the circuit board are arranged in strips, ensuring that the components are tightly attached to the thermally conductive and electrically conductive fixing component 2. The circuit board is fixed to the side of the insulating liquid-cooled heat sink 1 by the shim 11, thus fixing the circuit board to the heat dissipation structure. The shim 11 is made of high-voltage resistant insulating material, and its withstand voltage is set according to actual conditions, for example, not less than 1000V. The shim 11 maintains an insulating gap between the circuit board and the insulating liquid-cooled heat sink 1 to achieve electrical insulation, for example, an insulation gap of 3-5mm is set according to the size of the circuit board and components. Alternatively, the circuit board can be directly fixed to the thermally conductive and electrically conductive fixing component 2, and electrical insulation between the circuit board and the insulating liquid-cooled heat sink 1 is achieved through the thermally conductive insulating medium 3.

[0028] The component is a transistor 4. The circuit board includes a first circuit board 5 and a second circuit board 6. The middle pin of transistor 4 is soldered to the second circuit board 6, and the two side pins of transistor 4 are soldered to the first circuit board 5, forming a three-dimensional electrical connection structure. The first circuit board 5 and the second circuit board 6 form a differential signal transmission path through the transistor 4. The first circuit board 5 is fixed to the surface of the insulating liquid-cooled heat sink by a support post 11. The second circuit board 6 is parallel to the first circuit board 5 and fixed to the side of the thermally conductive and electrically conductive fixing member 2. The thermally conductive and insulating medium 3 electrically insulates the second circuit board 6, the thermally conductive and electrically conductive fixing member 2, the transistor 4, and the insulating liquid-cooled heat sink 1. The middle pin of the transistor can also be soldered to the first circuit board, and the two side pins can be soldered to the second circuit board to form a differential signal transmission path.

[0029] In use, this structure firstly involves attaching and fixing multiple transistors 4 to the surface of the thermally conductive and electrically conductive fixing component 2, opposite to the contact surface of the insulating liquid-cooled heat sink 1, ensuring good thermal conductivity contact. The pins of the transistors 4 face outwards from the structure, and the middle pin of the transistor 4 passes through the second circuit board 6 for soldering and fixing, achieving electrical connection. The second circuit board 6 is fixed to the side of the thermally conductive and electrically conductive fixing component 2, and is electrically insulated from the insulating liquid-cooled heat sink 1 by the thermally conductive insulating medium 3. The first circuit board 5 and the second circuit board 6 are arranged parallel to each other on the side of the insulating liquid-cooled heat sink 1. The pins on both sides of the transistors 4 are soldered to the first circuit board 5 to complete the electrical connection between the transistors 4 and the first circuit board 5. The first circuit board is securely mounted on the surface of the insulating liquid-cooled heat sink 1 by the shims 11, and the insulating gap formed by the shims ensures electrical insulation between the first circuit board and the insulating liquid-cooled heat sink 1. Transistor 4 continuously generates heat during operation. This heat is conducted through the thermally conductive and electrically conductive fixing component 2, which is in close contact with it. The fixing component 2 acts as a primary heat-conducting medium, rapidly transferring heat to the thermally conductive insulating sheet. While achieving heat conduction, the insulating sheet effectively isolates the electrical connection between the fixing component 2 and the insulating liquid-cooled heat sink 1, ensuring the electrical safety of the system. The heat is then conducted through the insulating sheet to the insulating liquid-cooled heat sink 1. The insulating liquid-cooled heat sink 1 achieves efficient heat dissipation from transistor 4 through a combination of air cooling and water cooling, meeting the high-power heat dissipation requirements. The number of thermally conductive and electrically conductive fixing parts 2 can be set as needed. Taking an insulating liquid-cooled heat sink 1 with 4 sides as an example, 2 sets of thermally conductive and electrically conductive fixing parts 2 are set on the upper and lower sides of the insulating liquid-cooled heat sink 1. A first circuit board 5 is fixed on each of the left and right sides. Each first circuit board 5 can be soldered with 2 sets of transistors 4, which are respectively attached to the thermally conductive and electrically conductive fixing parts 2 set on the upper and lower sides. The number of second circuit boards 6 is the same as the number of transistors 4, and they are fixed on the side of the thermally conductive and electrically conductive fixing parts 2. This enables heat dissipation of multiple sets of transistors 4 on multiple circuit boards, meeting the heat dissipation requirements of high-power devices with large area coverage.

[0030] Electrode 10 is fixed to the surface of thermally conductive and electrically conductive fastener 2 by screw 13. Two thermally conductive and electrically conductive fasteners 2 on the same surface of the insulating liquid-cooled heat sink 1 are connected by electrode 10 to output electrical energy and achieve the conductive function. Through the reasonable layout and connection of each component, the entire structure achieves efficient heat dissipation while ensuring the stability and safety of electrical performance.

[0031] As described above, although the present invention has been shown and described with reference to specific preferred embodiments, it should not be construed as limiting the present invention itself. Various changes in form and detail may be made to the present invention without departing from the spirit and scope of the appended claims.

Claims

1. An insulating liquid-cooled heat dissipation structure for high-power heat dissipation applications, characterized in that, include: The system comprises a circuit board, an insulating liquid-cooled heat sink, a thermally conductive and electrically conductive fastener, and a thermally conductive insulating medium. The thermally conductive and electrically conductive fastener is disposed on the surface of the insulating liquid-cooled heat sink, and the thermally conductive insulating medium is disposed between the thermally conductive and electrically conductive fastener and the insulating liquid-cooled heat sink. The surface of the thermally conductive and electrically conductive fastener is in close contact with the components on the circuit board. The heat generated by the components on the circuit board during operation is transferred to the thermally conductive insulating medium through the thermally conductive and electrically conductive fastener. The thermally conductive insulating medium isolates the electrical connection between the thermally conductive and electrically conductive fastener, the circuit board, and the insulating liquid-cooled heat sink, and conducts heat to the insulating liquid-cooled heat sink. The insulating liquid-cooled heat sink dissipates heat through an internal liquid cooling cycle.

2. The insulating liquid-cooled heat dissipation structure for high-power heat dissipation applications according to claim 1, characterized in that, The thermally conductive and electrically conductive fastener is provided with an insulating post, which is used to install a connector. The connector fixes the thermally conductive and electrically conductive fastener to the surface of the insulating liquid-cooled heat sink. The circuit board and the thermally conductive and electrically conductive fastener are electrically insulated from the insulating liquid-cooled heat sink through the thermally conductive insulating medium and the insulating post.

3. The insulating liquid-cooled heat dissipation structure for high-power heat dissipation applications according to claim 2, characterized in that, At least one thermally and electrically conductive fixing component is provided on the surface of the insulating liquid-cooled heat sink. The thermally and electrically conductive fixing component forms a conductive path to output electrical energy through connecting electrodes, while maintaining electrical insulation with the insulating liquid-cooled heat sink.

4. The insulating liquid-cooled heat dissipation structure for high-power heat dissipation applications according to claim 1, characterized in that, The insulating liquid-cooled radiator has heat dissipation fins to form heat dissipation channels. The surface of the insulating liquid-cooled radiator that contacts the thermally conductive insulating medium has grooves. Pipes filled with refrigerant are embedded in the grooves, and heat dissipation is achieved through the refrigerant circulating in the pipes.

5. The insulating liquid-cooled heat dissipation structure for high-power heat dissipation applications according to claim 4, characterized in that, The pipe is higher than the surface of the groove. The portion of the pipe that protrudes above the surface of the groove is deformed by extrusion and becomes flush with the surface of the insulating liquid-cooled radiator. The gap between the pipe and the groove is filled with thermally conductive silicone to ensure that the pipe and the groove fit together perfectly.

6. The insulating liquid-cooled heat dissipation structure for high-power heat dissipation applications according to claim 5, characterized in that, The pipeline structure includes single inlet / single outlet or single inlet / multiple outlets, with the single inlet / multiple outlet structure forming multiple independently adjustable liquid cooling circulation paths.

7. The insulating liquid-cooled heat dissipation structure for high-power heat dissipation applications according to claim 1, characterized in that, The circuit board is fixed on a thermally and electrically conductive fastener, and electrical insulation is achieved between the thermally conductive insulating medium and the insulating liquid-cooled heat sink. Alternatively, the circuit board can be fixed to the surface of the insulating liquid-cooled heat sink by a shim column, so that an insulating gap is maintained between the circuit board and the insulating liquid-cooled heat sink to achieve electrical insulation.

8. The insulating liquid-cooled heat dissipation structure for high-power heat dissipation applications according to claim 7, characterized in that, The component is a transistor. The two pins of the transistor are fixed to one circuit board, and the middle pin is fixed to another circuit board, so that the two circuit boards form a differential signal transmission path through the transistor. One circuit board is fixed to the surface of the insulating liquid-cooled heat sink by a shim, so that the circuit board and the insulating liquid-cooled heat sink maintain an insulating gap. The other circuit board is arranged parallel to the circuit board fixed to the surface of the insulating liquid-cooled heat sink and is fixed to the side of the thermally conductive and electrically conductive fixing component. The circuit board fixed to the side of the thermally conductive and electrically conductive fixing component and the thermally conductive and electrically conductive fixing component are electrically insulated from the insulating liquid-cooled heat sink through the thermally conductive and insulating medium.

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