A shield for chip shielding and optical module thereof

Abstract

The utility model discloses a kind of protection for chip shielding and its optical module, the protection includes: four sides and enclose into shape protection component (1), from the corner of the side edge of the protection component (1) to the center extension lap block (2) and setting in ground block (3) of another side edge;The protection component (1) is to cover in the four around of chip (200), the lap block (2) is to be set on the heat dissipation component of the chip (200), the ground block (3) is to be connected to the ground end of the plate body (300) bearing the chip (200).The utility model realizes electromagnetic shielding to chip using protection component, and through lap block and ground block, the heat dissipation docking and ground docking of the protection are realized, so that the utility model has good shielding performance and heat dissipation performance.

Description

Technical Field

[0001] This utility model relates to the field of optical module composition technology, specifically to a protective component for chip shielding and its optical module. Background Technology

[0002] An optical module comprises optoelectronic devices, functional circuits, and optical interfaces. The optoelectronic devices include both transmitting and receiving components. The function of an optical module is to convert electrical signals into optical signals at the transmitting end and vice versa at the receiving end. However, the photoelectric or electro-optical conversion process often involves optical or electrical chips, which are frequently subject to electromagnetic interference (EMI) during operation, affecting the transmission accuracy of the optical module.

[0003] In existing technologies, the chips of optical modules are soldered to the substrate (PCB) via pins. They are often constructed with a partially hollowed-out design to facilitate chip installation and connection. However, this will generate electromagnetic interference (EMI, which will be used hereafter) to the outside world, affecting the performance of the optical module. Utility Model Content

[0004] To address the EMI problem caused by exposed chip pins in existing optical modules, this invention provides a protective component for chip shielding and its optical module, which has advantages such as low cost, simple operation, and good protection effect.

[0005] First aspect

[0006] This utility model provides a protective component for chip shielding, the protective component comprising: a protective member formed by four sides, overlapping blocks extending from each corner of one side edge of the protective member toward the center, and a grounding block disposed on the other side edge;

[0007] The protective component is used to cover the chip, the mounting block is used to mount the chip's heat dissipation component, and the grounding block is used to connect to the grounding terminal of the board that supports the chip.

[0008] Specifically, the main technical concept of this utility model is to use protective components to achieve electromagnetic shielding of the chip, and to achieve heat dissipation and grounding of the protective components through connecting blocks and grounding blocks, thereby enabling this utility model to have good shielding and heat dissipation performance.

[0009] Furthermore, the protective components are made of aluminum, copper, aluminum alloys, or copper alloys.

[0010] Furthermore, the protective component is in the form of a sheet or a mesh.

[0011] Optionally, if the protective member is sheet-like, the protective member includes a first extension block extending inward from one of its edges and disposed between the two overlapping blocks.

[0012] Furthermore, the protective member includes a second extension block extending outwards from its other edge in all directions.

[0013] Specifically, another technical concept of this utility model is to improve the side edge protection performance of the protective component by means of the first extension block and the second extension block, while ensuring heat dissipation performance, thereby further reducing the EMI of the chip.

[0014] Optionally, the protective component includes: external protrusions evenly distributed around its perimeter;

[0015] The outer protrusion is plate-shaped and protrudes outward, so that the side of the outer protrusion forms a hole.

[0016] Furthermore, the external protrusion can be triangular, quadrilateral, pentagonal, hexagonal, or circular.

[0017] Optionally, the overlapping block is triangular or semi-circular.

[0018] Optionally, the protective member is welded to the plate via its other edge.

[0019] Second aspect

[0020] This invention provides an optical module, including a protective component for chip shielding as described in any possible embodiment of the first aspect. The protective component is disposed around the chip of the optical module by means of a cover. It is worth noting that an optical module refers to a device known in the prior art, which at least includes optoelectronic devices, functional circuits, and an optical interface. In the optical module, the chip is protected by the protective component provided by this invention to reduce EMI emitted by the chip to the outside world and ensure the performance of the optical module.

[0021] In summary, this utility model provides a protective component for chip shielding, and its main technical concept has at least the following advantages:

[0022] 1. This utility model utilizes protective components to achieve electromagnetic shielding of the chip, and uses connecting blocks and grounding blocks to achieve heat dissipation and grounding connection of the protective components, thereby enabling this utility model to have good shielding and heat dissipation performance.

[0023] 2. Under the premise of ensuring heat dissipation performance, this utility model improves the side edge protection performance of the protective component by using the first extension block and the second extension block, thereby further reducing the EMI of the chip. Attached Figure Description

[0024] The present invention will be further described in detail below with reference to the accompanying drawings and preferred embodiments. However, those skilled in the art will understand that these drawings are drawn only for the purpose of explaining the preferred embodiments and therefore should not be construed as limiting the scope of the present invention. Furthermore, unless specifically indicated, the drawings are only schematic representations of the composition or structure of the described objects and may contain exaggerated depictions, and the drawings are not necessarily drawn to scale.

[0025] Figure 1 A schematic diagram of the structure of a protective component for chip shielding provided in one embodiment of this utility model;

[0026] Figure 2 A schematic diagram of the structure of a protective component for chip shielding is provided in another embodiment of this utility model;

[0027] Figure 3 A schematic diagram of the external protrusion and the hole provided in an embodiment of this utility model;

[0028] Figure 4 A schematic diagram of the structure of an optical module provided in one embodiment of this utility model;

[0029] 100. Protective component; 200. Chip; 300. Board body; 1. Protective component; 2. Overlapping block; 3. Grounding block; 11. First extension block; 12. Second extension block; 13. Outer protrusion; 14. Hole. Detailed Implementation

[0030] The following is in conjunction with the appendix Figures 1 to 4 The present invention will be described in detail below.

[0031] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0032] This utility model provides a protective component 100 for shielding chip 200 and its optical module. Through the structural design of the protective component 1, the connecting block 2 and the grounding block 3, this utility model has both EMI shielding and heat dissipation functions, and is low in application cost and easy to operate. Example 1

[0033] For details, please see Figure 1 The diagram shown is a structural schematic of a protective component 100 for shielding a chip 200 according to an embodiment of the present invention. Figure 1 The top view and front view of the protective component 100 are shown in the figure. Figure 1 The top view is shown above. Figure 1 Below is its front view. Figure 2 same Figure 1 In the top view, the protective component 100 is formed by the four sides of the protective component 100, and the overlapping blocks 2 extending from each corner of one side of the protective component 1 towards the center are visible. It can be understood that the center of the protective component 1 formed by the four sides is hollow. In the front view, one side of the protective component 1, the overlapping block 2 integrally formed with the protective component 1 and extending inward, and the grounding block 3 integrally formed with the protective component 1 and extending downward are visible. The protective component 1 is used to cover the chip 200, the overlapping block 2 is used to support the heat dissipation component of the chip 200, and the grounding block 3 is used to connect to the grounding terminal of the board 300 that supports the chip 200 (the chip 200 and the board 300 are not shown, but can be understood with reference to the prior art). Therefore, the working principle of this utility model is: to electromagnetically shield the chip 200 through the protective component 1 and the grounding block 3, thereby reducing its EMI to the outside world, and at the same time to use the overlapping block 2 to realize its installation positioning and heat dissipation due to the heat accumulation caused by the protection of the protective component 100.

[0034] Optionally, the grounding block 3 is connected to the plate 300 by welding.

[0035] Furthermore, the protective component 1 is made of aluminum, copper, aluminum alloys, or copper alloys. Aluminum, copper, aluminum alloys, or copper alloys have good heat dissipation performance and are inexpensive and lightweight.

[0036] Furthermore, the protective component 1 is in the form of a sheet or a fine mesh. It is worth explaining that the mesh structure combines electromagnetic shielding and heat dissipation properties, but its fabrication process is more complex than that of the sheet-like structure. A schematic diagram of the mesh can be obtained by referring to the mesh shapes in existing technologies. Example 2

[0037] Based on Example 1, please refer to Figure 2 The diagram shows a schematic representation of a protective member 100 for shielding a chip 200 according to another embodiment of the present invention. If the protective member 1 is sheet-like, it includes a first extension block 11 extending inward from one edge and disposed between two overlapping blocks 2, and / or, the protective member 1 includes a second extension block 12 extending outward from its other edge. Figure 2 It is understood that the first extension block 11 is formed by bending inward from one side edge of the protective member 1, and the second extension block 12 is formed by bending outward from the other side edge of the protective member 1 (this can be understood by referring to its top view and front view), so that the electromagnetic shielding effect provided by this utility model is better without generating heat accumulation. Example 3

[0038] Based on Example 1 or Example 2, please refer to Figure 3 The diagram shows a schematic of the external protrusion 13 and the hole 14 provided in an embodiment of the present invention. Embodiment 3 mainly addresses the situation where the protective component 1 is composed of a sheet, and the protective component 1 includes: external protrusions 13 evenly distributed around its perimeter; the external protrusions 13 are sheet-shaped and protrude outwards, so that the side of the external protrusions 13 forms a hole 14.

[0039] Optionally, the external protrusion 13 can be triangular, quadrilateral, pentagonal, hexagonal, or circular. Example 4

[0040] In any of the possible implementations of Examples 1 to 3, please refer to Figure 4 The diagram shown is a structural schematic of an optical module according to an embodiment of the present invention. Specifically, the optical module includes a chip 200 (the present invention is mainly used for the chip 200; other structures of the optical module are not shown, but can be understood by referring to the prior art), a protective component 100 is mounted on the chip 200 or a heat dissipation structure outside the chip 200 via a mounting block 2, a protective member 1 covers the chip 200 from all sides, and a grounding block 3 connects to the grounding terminal of the board 300.

[0041] The present invention has been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only for the purpose of helping to understand the present invention and its core ideas. It should be noted that for those skilled in the art, several improvements and modifications can be made to the present invention without departing from the principles of the present invention, and these improvements and modifications also fall within the protection scope of the claims of the present invention.

Claims

1. A protective component (100) for shielding a chip (200), characterized in that, The protective component (100) includes: a protective component (1) formed by four sides, an overlapping block (2) extending from each corner of one side edge of the protective component (1) toward the center, and a grounding block (3) disposed on the other side edge. The protective component (1) is used to cover the chip (200) around its perimeter, the mounting block (2) is used to mount the heat dissipation component of the chip (200), and the grounding block (3) is used to connect to the grounding terminal of the plate (300) that carries the chip (200).

2. The protective component (100) for shielding a chip (200) as described in claim 1, characterized in that, The protective component (1) is made of aluminum, copper, aluminum alloy or copper alloy.

3. The protective component (100) for shielding a chip (200) as described in claim 2, characterized in that, The protective component (1) is in the form of a sheet or a mesh.

4. The protective component (100) for shielding a chip (200) as described in claim 3, characterized in that, If the protective member (1) is sheet-like, the protective member (1) includes a first extension block (11) extending inward from one of its edges and disposed between the two overlapping blocks (2).

5. A protective component (100) for shielding a chip (200) as described in claim 4, characterized in that, The protective member (1) includes a second extension block (12) extending outwards from its other edge.

6. The protective component (100) for shielding a chip (200) as described in claim 4, characterized in that, The protective component (1) includes: external protrusions (13) evenly distributed around its perimeter; The outer protrusion (13) is sheet-shaped and protrudes outward so that the side of the outer protrusion (13) forms a hole (14).

7. A protective component (100) for shielding a chip (200) as described in claim 6, characterized in that, The external protrusion (13) is triangular, quadrilateral, pentagonal, hexagonal or circular.

8. The protective component (100) for shielding a chip (200) as described in claim 1, characterized in that, The aforementioned assembling block (2) is triangular or semi-circular.

9. A protective component (100) for shielding a chip (200) as described in claim 1, characterized in that, The protective component (1) is welded to the plate (300) via its other edge.

10. An optical module comprising a protective element (100) for shielding a chip (200) as described in any one of claims 1-9, characterized in that, The protective component (100) is disposed around the chip (200) of the optical module by means of a cover.

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