A cleaning device

Abstract

The utility model provides a kind of cleaning device, and it is related to the field of semiconductor technology, including process cavity, liquid gas supply chamber, chemical liquid recovery tank, pure water recovery tank and spray head assembly.Spray head assembly is connected liquid gas supply chamber by support tube, its inside is equipped with rotatable control cylinder, control cylinder outer wall distribution two groups of deflection angle different communicating pipe and spray head, utilize fluid back force to drive spray head autorotation, realize 360 ° dead angle free shower.By electromagnetic and permanent magnet linkage control column displacement, dynamically regulate communicating pipe flow area, synchronous change spray pressure and spray head rotating speed, adapt to different pollution degree cleaning demand.After cleaning, liquid gas supply chamber is switched to hot nitrogen supply, and in-situ drying is realized by rotating spray head.The utility model integrates cleaning-drying integrated function, significantly improves cleaning uniformity, process efficiency and equipment compatibility.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a cleaning device. Background Technology

[0002] In the semiconductor manufacturing industry, wafer cleaning is a critical process step to ensure chip yield. As integrated circuit process nodes continue to shrink, contaminants on the wafer surface (such as nanoparticles, organic residues, metal ions, etc.) have an increasingly significant impact on device performance, and traditional cleaning technologies are no longer sufficient to meet the process requirements of high precision, high efficiency, and low damage.

[0003] Currently, most mainstream wafer cleaning equipment adopts a fixed spray system or a rotating nozzle design. Traditional nozzles spray at a fixed angle or rotate in a single direction, resulting in cleaning blind spots at wafer edges and complex structural areas (such as trenches and vias). This requires repeated spraying or mechanical brushing, which leads to uneven cleaning coverage and dead corners.

[0004] Based on this, the present invention provides a cleaning device to solve one or more of the problems mentioned above. Utility Model Content

[0005] This invention provides a cleaning device to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution, including: a process chamber, a liquid-gas supply chamber, a chemical liquid recovery tank and a pure water recovery tank installed at the bottom of the process chamber, a nozzle assembly provided inside the process chamber, and the liquid-gas supply chamber connected to the nozzle assembly through a support pipe.

[0007] Preferably, the chemical liquid recovery tank is interconnected with the process chamber and the liquid-gas supply chamber, and the pure water recovery tank is interconnected with the process chamber and the liquid-gas supply chamber.

[0008] Preferably, a support platform is installed at the bottom of the telescopic shaft, and the edge of the support platform is provided with an edge holder, and the wafer is installed to the bottom of the support platform through the edge holder.

[0009] Preferably, the same solenoid valve is installed on the connecting pipes of the liquid-gas supply chamber, the chemical liquid recovery tank, and the pure water recovery tank.

[0010] Preferably, the nozzle assembly includes: a cleaning disc, the top of which has a concave cavity structure, a connector installed at the bottom of which is connected to the liquid-gas supply chamber via a support pipe, and several sets of air holes opened at the top of the cleaning disc.

[0011] Preferably, the control cylinder is movably installed at the top center of the cleaning tray, and the top of the connector is fixedly inserted through the cleaning tray and extends into the control cylinder.

[0012] Preferably, two sets of connecting pipe 1 and two sets of connecting pipe 2 are provided around the outer wall of the control cylinder, and nozzle 1 is installed at the end of connecting pipe 1 away from the control cylinder, and nozzle 2 is installed at the end of connecting pipe 2 away from the control cylinder.

[0013] Preferably, nozzle one is deflected 15° clockwise around the axis of connecting pipe one, and nozzle two is deflected 30° clockwise around the axis of connecting pipe two.

[0014] Preferably, an electromagnet is fixedly embedded inside the top shell of the control cylinder, a sealing support ring is fixedly installed inside the control cylinder, the control column is slidably connected to the sealing support ring, and a permanent magnet is fixedly installed on the top of the control column. Reset spring one and reset spring two are both sleeved on the outer wall of the control column, and reset spring one and reset spring two are symmetrically arranged on both sides of the sealing support ring.

[0015] Preferably, the top of the connector extends upward to form an L-shaped boss structure, and the control cylinder is rotatably connected to the L-shaped boss at the top of the connector. The trapezoidal plug is fixedly sleeved on the lower outer wall of the control column, and a stepped structure is formed between the trapezoidal plug and the bottom of the control column.

[0016] Compared with the prior art, the beneficial effects of this utility model are:

[0017] This invention utilizes an innovative design of a deflection nozzle assembly and a rotating control cylinder linkage mechanism to achieve automatic nozzle rotation and spraying using fluid recoil force. Combined with an adjustable support structure, this significantly improves the uniformity of cleaning coverage on the wafer surface and effectively eliminates cleaning dead zones. Simultaneously, an electromagnetic-mechanical collaborative control system is employed, using a magnetic drive component to precisely adjust the cross-sectional area of ​​the fluid channel, achieving dynamic matching control of cleaning fluid flow rate and pressure. This adapts to cleaning needs with varying degrees of contamination and automatically optimizes the spray intensity based on real-time operating conditions, improving the intelligence level of process control while ensuring cleaning effectiveness. Attached Figure Description

[0018] The accompanying drawings are provided to further understand the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation thereof.

[0019] In the attached diagram:

[0020] Figure 1 This is a schematic diagram illustrating the working principle of this utility model;

[0021] Figure 2 This is a schematic diagram of the nozzle assembly in this utility model;

[0022] Figure 3 This is a schematic cross-sectional view of the nozzle assembly in this utility model;

[0023] Figure 4This is a schematic diagram of the cross-sectional structure of the control cylinder in this utility model.

[0024] In the diagram: 1. Process chamber; 2. Liquid / gas supply chamber; 3. Solenoid valve; 4. Nozzle assembly; 5. Telescopic shaft; 6. Edge clamp; 7. Support platform; 8. Wafer; 9. Chemical liquid recovery tank; 10. Pure water recovery tank; 11. Wastewater discharge pipe; 12. Support pipe; 13. Cleaning tray; 14. Connector; 15. Stepped structure; 16. Control cylinder; 17. Connecting pipe one; 18. Connecting pipe two; 19. Nozzle one; 20. Nozzle two; 21. L-shaped boss; 22. Control column; 23. Return spring one; 24. Trapezoidal plug; 25. Electromagnet; 26. Permanent magnet; 27. Return spring two; 28. Sealing support ring. Detailed Implementation

[0025] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0026] Furthermore, in this utility model, the use of terms such as "first" and "second" is for descriptive purposes only and does not specifically refer to any order or sequence, nor is it intended to limit the utility model. They are merely used to distinguish components or operations described using the same technical terms, and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions and features of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, such a combination should be considered non-existent and not within the scope of protection claimed by this utility model.

[0027] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0028] Please see Figures 1-4 This utility model provides a cleaning device, including: a process chamber 1, a liquid-gas supply chamber 2, a chemical liquid recovery tank 9 and a pure water recovery tank 10 installed at the bottom of the process chamber 1, a nozzle assembly 4 provided in the process chamber 1, and the liquid-gas supply chamber 2 connected to the nozzle assembly 4 through a support pipe 12.

[0029] Preferably, the chemical liquid recovery tank 9 is interconnected with the process chamber 1 and the liquid-gas supply chamber 2, and the pure water recovery tank 10 is interconnected with the process chamber 1 and the liquid-gas supply chamber 2.

[0030] Preferably, a support platform 7 is installed at the bottom of the telescopic shaft 5, and the edge holder 6 is provided on the frame of the support platform 7, and the wafer 8 is installed to the bottom of the support platform 7 through the edge holder 6.

[0031] Preferably, the same solenoid valve 3 is installed on the connecting pipes of the liquid-gas supply chamber 2, the chemical liquid recovery tank 9, and the pure water recovery tank 10.

[0032] Preferably, the nozzle assembly 4 includes: a cleaning disc 13, the top of the cleaning disc 13 is a concave cavity structure, a connector 14 is installed at the bottom of the cleaning disc 13, and the connector 14 is connected to the liquid-gas supply chamber 2 through a support pipe 12. Several sets of air holes 15 are opened on the top of the cleaning disc 13.

[0033] Preferably, the control cylinder 16 is movably installed at the top center of the cleaning tray 13, and the top of the connector 14 is fixedly inserted through the cleaning tray 13 and extends into the control cylinder 16.

[0034] Preferably, two sets of connecting pipes 17 and two sets of connecting pipes 18 are provided around the outer wall of the control cylinder 16, and a nozzle 19 is installed at the end of the connecting pipe 17 away from the control cylinder 16, and a nozzle 20 is installed at the end of the connecting pipe 18 away from the control cylinder 16.

[0035] Preferably, nozzle 19 is rotated 15° clockwise around the axis of connecting pipe 17, and nozzle 20 is rotated 30° clockwise around the axis of connecting pipe 28.

[0036] Preferably, an electromagnet 25 is fixedly embedded in the top shell of the control cylinder 16, a sealing support ring 28 is fixedly disposed inside the control cylinder 16, the control column 22 is slidably connected to the sealing support ring 28, and a permanent magnet 26 is fixedly disposed on the top of the control column 22. The first reset spring 23 and the second reset spring 27 are both sleeved on the outer wall of the control column 22, and the first reset spring 23 and the second reset spring 27 are symmetrically disposed on both sides of the sealing support ring 28.

[0037] Preferably, the top of the connector 14 extends upward to form an L-shaped boss 21 structure, and the control cylinder 16 is rotatably connected to the L-shaped boss 21 at the top of the connector 14. The trapezoidal plug 24 is fixedly sleeved on the lower outer wall of the control column 22, and a stepped structure 29 is formed between the trapezoidal plug 24 and the bottom of the control column 22.

[0038] Preferably, the gas and liquid in the liquid-gas supply chamber 2 are stored in two separate chambers without interfering with each other, and a gas pump and a liquid pump are installed in the liquid-gas supply chamber 2 for pressurization.

[0039] Preferably, the solenoid valve model 3 can be: ASCO Numatics 316 series / SMC VDW / VEX series.

[0040] Preferably, the electromagnet model 25 can be: Geeplus P21 / 52 series or Johnson Electric HPL series.

[0041] Preferably, the air pump model can be: KNF NMP 830 series / Gardner Denver GLS series.

[0042] Preferably, the pump model can be: Cole-Parmer Masterflex L / S series / Yamada SP series pneumatic double diaphragm pump.

[0043] The working principle and beneficial effects of the above scheme are as follows: In use, after the telescopic shaft 5 with the support platform 7 is installed on the robot arm, the wafer 8 is clamped and moved into the process chamber 1 by the edge gripper 6. Then, the solenoid valve 3 and the liquid pump in the liquid-gas supply chamber 2 are opened to draw the cleaning liquid out of the liquid-gas supply chamber 2 and enter the control cylinder 16 along the support pipe 12. It is then sprayed out from the nozzle 19 and nozzle 20 through the connecting pipe 17 and connecting pipe 28. Due to the deflection setting of the nozzle 19 and nozzle 20, when the cleaning liquid is sprayed through the nozzle 19 and nozzle 20, the cleaning liquid will have a recoil force on the control cylinder 16, thereby driving the control cylinder 16 to rotate around the center of the cleaning plate 13, thereby expanding the cleaning range and achieving a 360-degree cleaning effect without dead angles.

[0044] The cleaning of wafer 8 is performed in multiple stages. First, a chemical solution is used to clean wafer 8. At this stage, because wafer 8 is still contaminated, the chemical cleaning process generates wastewater containing impurities. Therefore, the solenoid valves 3 on the chemical solution recovery tank 9 and the pure water recovery tank 10 are simultaneously closed, allowing the wastewater to drain through the wastewater discharge pipe 11. After a period of time, the solenoid valve 3 on the wastewater discharge pipe 11 is closed, and the solenoid valve 3 on the chemical solution recovery tank 9 is opened. This allows the chemical solution accumulated at the bottom of the process chamber 1 to enter the chemical solution recovery tank 9 for storage and filtration, awaiting the next use. After the chemical cleaning is complete, pure water is used to clean wafer 8. At this time, the solenoid valve 3 on the pure water recovery tank 10 is opened, and the solenoid valve 3 on the chemical solution recovery tank 9 is closed. The pure water accumulated at the bottom of the process chamber 1 enters the pure water recovery tank 10 for storage and filtration, awaiting the next use.

[0045] During cleaning, the movement distance of the control column 22 can be adjusted by the attraction force of the electromagnet 25 on the permanent magnet 26. This allows the trapezoidal plug 24 at its bottom to seal the connecting pipes 17 and 18 at different heights, thereby controlling the amount of cleaning fluid sprayed. The trapezoidal plug 24 can also change the area of ​​the connecting hole between the connecting pipe 17 and the control cylinder 16, i.e., the height of the trapezoidal plug 24 at the connecting hole, thereby changing the spray pressure of the cleaning fluid. This, in turn, can synchronously change the rotation speed of the control cylinder 16, thus achieving a cleaning force of the cleaning fluid on the wafer 8 within the same time, which is simpler and more convenient (the same applies to the connecting pipe 18).

[0046] In the liquid-gas supply chamber 2, the gas and liquid are stored in two separate chambers without interfering with each other, and a gas pump and a liquid pump are installed in the liquid-gas supply chamber 2 for pressurization.

[0047] After the wafer 8 is cleaned, hot nitrogen gas can be sprayed out from nozzle 19 and nozzle 20 through support tube 12 along connecting tube 17 and connecting tube 28 to dry the wafer 8.

[0048] Obviously, those skilled in the art can make various modifications and variations to this utility model without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this utility model and their equivalents, this utility model also intends to include these modifications and variations.

Claims

1. A cleaning device, characterized in that: include: The process chamber (1) has a liquid-gas supply chamber (2), a chemical liquid recovery tank (9) and a pure water recovery tank (10) installed at the bottom. The process chamber (1) is equipped with a nozzle assembly (4). The liquid-gas supply chamber (2) is connected to the nozzle assembly (4) through a support pipe (12).

2. The cleaning device as described in claim 1, characterized in that: The chemical liquid recovery tank (9) is connected to the process chamber (1) and the liquid-gas supply chamber (2), and the pure water recovery tank (10) is connected to the process chamber (1) and the liquid-gas supply chamber (2).

3. The cleaning device as described in claim 1, characterized in that: A support platform (7) is installed at the bottom of the telescopic shaft (5). An edge clamp (6) is provided on the frame of the support platform (7), and the wafer (8) is installed on the bottom of the support platform (7) through the edge clamp (6).

4. The cleaning device as described in claim 1, characterized in that: The same solenoid valve (3) is installed on the connecting pipes of the liquid-gas supply chamber (2), the chemical liquid recovery tank (9) and the pure water recovery tank (10).

5. The cleaning device as described in claim 1, characterized in that: The nozzle assembly (4) includes a cleaning disc (13), the top of which is a concave cavity structure, and a connector (14) installed at the bottom of the cleaning disc (13), and the connector (14) is connected to the liquid-gas supply chamber (2) through a support tube (12).

6. The cleaning device as described in claim 5, characterized in that: The control cylinder (16) is movably installed at the top center of the cleaning tray (13), and the top of the connector (14) is fixed through the cleaning tray (13) and extends into the control cylinder (16).

7. The cleaning device as described in claim 6, characterized in that: Two sets of connecting pipes (17) and two sets of connecting pipes (18) are provided around the outer wall of the control cylinder (16). The connecting pipe (17) is located below the connecting pipe (18). The end of the connecting pipe (17) away from the control cylinder (16) is equipped with a nozzle (19), and the end of the connecting pipe (18) away from the control cylinder (16) is equipped with a nozzle (20).

8. The cleaning device as described in claim 7, characterized in that: Nozzle 1 (19) rotates 15° clockwise around the axis of connecting pipe 1 (17), and nozzle 2 (20) rotates 30° clockwise around the axis of connecting pipe 2 (18).

9. A cleaning device as described in claim 8, characterized in that: An electromagnet (25) is fixedly embedded in the top shell of the control cylinder (16). A sealing support ring (28) is fixedly installed inside the control cylinder (16). The control column (22) is slidably connected to the sealing support ring (28) and a permanent magnet (26) is fixedly installed on the top of the control column (22). The first reset spring (23) and the second reset spring (27) are both sleeved on the outer wall of the control column (22) and the first reset spring (23) and the second reset spring (27) are symmetrically arranged on both sides of the sealing support ring (28).

10. A cleaning device as described in claim 9, characterized in that: The top of the connector (14) extends upward to form an L-shaped boss (21) structure, and the control cylinder (16) is rotatably connected to the L-shaped boss (21) at the top of the connector (14). The trapezoidal plug (24) is fixedly sleeved on the lower outer wall of the control column (22), and a stepped structure (29) is formed between the trapezoidal plug (24) and the bottom of the control column (22). One end of the reset spring (23) is fixedly connected to the bottom of the sealing support ring (28), and the other end of the reset spring (23) is fixedly connected to the top of the trapezoidal plug (24). One end of the reset spring (27) is fixedly connected to the top of the sealing support ring (28), and the other end of the reset spring (27) is fixedly connected to the top of the inner wall of the control cylinder (16).

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