Semiconductor package pin bending degree correction device

Abstract

The utility model discloses a semiconductor packaging pin bending degree correction device relates to semiconductor packaging pin technical field. A semiconductor packaging pin bending degree correction device, include: fixed station, the fixed station upper end's center place fixedly connected with correction groove, the lower end of correction groove inside is provided with correction block, the upper end fixedly connected with fixed frame of fixed station, top pressure subassembly and adjusting assembly, top pressure subassembly is located fixed frame, top pressure subassembly is used to carry out top pressure to the pin in correction groove, adjusting assembly is located in fixed station, adjusting assembly is used for adjusting the height of correction block, top pressure subassembly includes hydraulic pressure rod, the output of hydraulic pressure rod is through to the lower end of fixed frame and is fixedly connected with the platen. The existing correction device has solved, cannot adjust the bending size, when people use the correction device, cannot according to the correction demand, adjust the bending size of pin, the technical problem of inconvenient people's use.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging pin technology, and in particular to a semiconductor packaging pin bending correction device. Background Technology

[0002] One important function of chip packaging is to allow the chip's internal circuitry to communicate with external circuitry through pins. When adjusting the curvature of semiconductor package pins, a straightening device is required.

[0003] However, existing technologies have some problems: existing straightening devices cannot adjust the bending size. When people use the straightening device, they cannot adjust the bending size of the pin according to the straightening requirements, which is inconvenient for people to use. Therefore, it is necessary to provide a semiconductor package pin bending correction device to solve the above technical problems. Utility Model Content

[0004] This invention provides a semiconductor package pin bending correction device, which solves the technical problem that existing correction devices cannot adjust the bending size, making it inconvenient for users to adjust the bending size of the pins according to the correction requirements.

[0005] To solve the above-mentioned technical problems, this utility model provides a semiconductor package pin bending correction device, comprising:

[0006] A fixed platform, wherein a calibration groove is fixedly connected to the center of the upper end of the fixed platform, a calibration block is provided at the lower end of the calibration groove, and a fixed frame is fixedly connected to the upper end of the fixed platform.

[0007] The top-pressing assembly and the adjusting assembly are located on a fixed frame and are used to press the pins in the calibration slot. The adjusting assembly is located in a fixed platform and is used to adjust the height of the calibration block.

[0008] Preferably, the top-pressing assembly includes a hydraulic rod, the output end of which extends through to the lower end of the fixed frame and is fixedly connected to a pressure plate.

[0009] Preferably, the adjustment assembly includes an electric push rod, the output end of which is fixedly connected to a support plate, and the front and rear sides of the upper end of the support plate are fixedly connected to support columns, the upper end of which extends through the interior of the correction groove and is fixedly connected to the lower end of the correction block.

[0010] Preferably, guide blocks are fixedly connected to both the front and rear sides of the support plate, and guide rods are slidably connected inside the guide blocks, with the guide rods vertically fixed inside the fixed platform.

[0011] Preferably, support legs are fixedly connected around the lower end of the fixed platform, and pads are fixedly connected to the lower ends of the support legs.

[0012] Compared with related technologies, the semiconductor package pin bending correction device provided by this utility model has the following beneficial effects:

[0013] This utility model provides a semiconductor package pin bending correction device. Through the cooperation of the guide block and the guide rod, the support plate moves smoothly during use, solving the problem of the support plate easily shaking during use.

[0014] This invention provides a semiconductor package pin bending correction device. The device uses a fixing frame to fix and stabilize the top pressure assembly during use, thus solving the problem that the top pressure assembly is prone to falling off during use.

[0015] This invention provides a semiconductor package pin bending correction device. By utilizing the cooperation of support legs and pads, the fixed platform is prevented from shifting during use, thus solving the problem of easy displacement and slippage of the fixed platform during use. Attached Figure Description

[0016] Figure 1 A schematic diagram of a preferred embodiment of a semiconductor package pin bending correction device provided by this utility model;

[0017] Figure 2 This is a schematic diagram showing the unfolded structure of the correction block and correction groove of this utility model;

[0018] Figure 3 This is a partial sectional view of the fixed platform structure of this utility model.

[0019] The following are the labels in the diagram: 1. Fixed platform; 2. Correction groove; 3. Correction block; 4. Fixed frame; 5. Top pressure assembly; 51. Hydraulic rod; 52. Pressure plate; 6. Adjustment assembly; 61. Electric push rod; 62. Support plate; 63. Support column; 7. Guide block; 8. Guide rod; 9. Support leg. Detailed Implementation

[0020] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0021] Example 1:

[0022] Please see Figure 1-3This utility model provides a technical solution: a semiconductor package pin bending correction device, comprising: a fixed platform 1, a correction groove 2 fixedly connected to the center of the upper end of the fixed platform 1, a correction block 3 provided at the lower end inside the correction groove 2, a fixed frame 4 fixedly connected to the upper end of the fixed platform 1, a pressing component 5 and an adjusting component 6, the pressing component 5 being located on the fixed frame 4, the pressing component 5 being used to press the pin in the correction groove 2, and the adjusting component 6 being located in the fixed platform 1, the adjusting component 6 being used to adjust the height of the correction block 3.

[0023] In this implementation scheme, when it is necessary to adjust the height of the correction block 3, the electric push rod 61 drives the support plate 62 to move upward, the support plate 62 drives the guide block 7 to slide on the guide rod 8, and at the same time the support plate 62 drives the support column 63 to move upward, the support column 63 drives the correction block 3 to move upward, so that the correction block 3 is raised or lowered to the specified height.

[0024] Example 2:

[0025] Please see Figure 1-3 As shown, based on Embodiment 1, this utility model provides a technical solution: the top pressing component 5 includes a hydraulic rod 51, the output end of the hydraulic rod 51 passes through to the lower end of the fixed frame 4 and is fixedly connected to a pressure plate 52; the adjusting component 6 includes an electric push rod 61, the output end of the electric push rod 61 is fixedly connected to a support plate 62; the front and rear sides of the upper end of the support plate 62 are both fixedly connected to support columns 63; the upper end of the support column 63 passes through the interior of the correction groove 2 and is fixedly connected to the lower end of the correction block 3; the front and rear sides of the support plate 62 are both fixedly connected to guide blocks 7; the interior of the guide block 7 is slidably connected to a guide rod 8; the guide rod 8 is vertically fixedly connected to the interior of the fixed platform 1; the lower end of the fixed platform 1 is fixedly connected to support legs 9 around its perimeter; and the lower end of the support legs 9 is fixedly connected to a pad.

[0026] In this embodiment: the pin that needs to be corrected is then placed into the correction groove 2, and at the same time the hydraulic rod 51 starts to run. The hydraulic rod 51 drives the pressure plate 52 to move downward, and the pressure plate 52 presses against the pin in the correction groove 2, thereby adjusting the bending degree of the pin.

[0027] The working principle of the semiconductor package pin bending correction device provided by this utility model is as follows:

[0028] Implementation steps for the first innovation point:

[0029] Step 1: When the height of the correction block 3 needs to be adjusted, the electric push rod 61 drives the support plate 62 to move upward, and the support plate 62 drives the guide block 7 to slide on the guide rod 8;

[0030] Step 2: At the same time, the support plate 62 drives the support column 63 to move upward, and the support column 63 drives the correction block 3 to move upward, so that the correction block 3 is raised or lowered to the specified height.

[0031] Implementation steps for the second innovation point:

[0032] Step 1: Then, place the pin that needs to be calibrated into the calibration slot 2, and at the same time, the hydraulic rod 51 starts to run, and the hydraulic rod 51 drives the pressure plate 52 to move downward.

[0033] Step 2: The pressure plate 52 presses down on the pins in the correction slot 2, thereby adjusting the bending degree of the pins.

[0034] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor package pin bending correction device, characterized in that: include: A fixed platform (1) is fixedly connected to the center of the upper end of the fixed platform (1), and a correction groove (2) is fixedly connected to the lower end of the correction groove (2). A correction block (3) is provided inside the lower end of the fixed platform (1), and a fixed frame (4) is fixedly connected to the upper end of the fixed platform (1). The pressing component (5) and the adjusting component (6) are located on the fixed frame (4) and are used to press the pins in the correction slot (2). The adjusting component (6) is located in the fixed platform (1) and is used to adjust the height of the correction block (3).

2. The semiconductor package pin bending correction device according to claim 1, characterized in that, The top pressure assembly (5) includes a hydraulic rod (51), the output end of which extends through to the lower end of the fixing frame (4) and is fixedly connected to a pressure plate (52).

3. The semiconductor package pin bending correction device according to claim 1, characterized in that, The adjustment component (6) includes an electric push rod (61), the output end of which is fixedly connected to a support plate (62). Support columns (63) are fixedly connected to the front and rear sides of the upper end of the support plate (62). The upper end of the support column (63) extends through the interior of the correction groove (2) and is fixedly connected to the lower end of the correction block (3).

4. The semiconductor package pin bending correction device according to claim 3, characterized in that, The front and rear sides of the support plate (62) are fixedly connected to guide blocks (7), and the guide blocks (7) are slidably connected to guide rods (8), which are vertically fixed inside the fixed platform (1).

5. The semiconductor package pin bending correction device according to claim 1, characterized in that, Support legs (9) are fixedly connected around the lower end of the fixed platform (1), and pads are fixedly connected to the lower end of the support legs (9).

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