SMT tin paste temperature recovery equipment

Abstract

The utility model discloses a kind of SMT tin cream back temperature equipment, it is related to tin cream back temperature technical field, including tin cream box, device ontology and back temperature cavity, the both ends of the both sides of the bottom end of device ontology are connected with sucking disc, the both sides of device ontology are provided with back temperature cavity, and the inside of back temperature cavity is placed with tin cream box, the upper of back temperature cavity is movably installed with sealing cover, the inner wall of tin cream box outside back temperature cavity is installed with heating ring pipe, the inside of device ontology of back temperature cavity outside is provided with installation cavity, and the inner wall of installation cavity is wound with cold water coil pipe, the inside wall of one side of back temperature cavity upper is installed with temperature sensor.The utility model when tin cream box needs to be taken out, sealing cover is pulled with a little force, make the separation between magnetic block, and positioning block is away from positioning groove, then pull rod is pulled outward, make clamping block is away from clamping groove, then damper and first return spring reset make movable plate upward make tin cream box eject, solve the problem of inconvenient taking.

Description

Technical Field

[0001] This utility model relates to the field of solder paste warming technology, specifically to an SMT solder paste warming device. Background Technology

[0002] SMT solder paste is a key material in electronic assembly, mainly used to solder electronic components onto PCBs. It combines the functions of metal solder and flux, achieving reliable electrical connections and mechanical bonding during reflow soldering. Solder paste warming is an important step in SMT production, mainly referring to the process of restoring refrigerated solder paste from a low temperature (usually 2~10℃) to room temperature (such as around 25℃). The solder paste is sealed and placed in an environment below 25℃ and left to stand for 4-6 hours for natural warming. Current warming equipment does not have a constant temperature function, thus failing to guarantee the effectiveness of the solder paste. Furthermore, once the solder paste container is placed in the warming chamber, it is inconvenient for workers to remove it, causing inconvenience. In view of these issues, this case was developed through in-depth research. Utility Model Content

[0003] The purpose of this utility model is to provide an SMT solder paste warming device to solve the problem mentioned in the background art that the existing SMT solder paste warming device does not have the function of maintaining constant temperature and is easy to remove.

[0004] To achieve the above objectives, this utility model provides the following technical solution: an SMT solder paste warming device, comprising a solder paste box, a device body, and a warming chamber. A control panel is installed on the outer wall of one side of the device body. Suction cups are connected to both ends of the bottom of the device body. Warming chambers are provided on both sides of the device body, and solder paste boxes are placed inside the warming chambers. A sealing cover is movably installed on the top of each warming chamber. A heating ring tube is installed on the inner wall of the warming chamber outside the solder paste box. An installation cavity is provided inside the device body outside the warming chamber, and a cold water coil is wound around the inner wall of the installation cavity. A cold water tank is installed in the middle of the device body. A temperature sensor is installed on the inner wall of one side of the warming chamber. A movable plate is installed on the lower inner side of the warming chamber. Water pumps are connected to both sides of the cold water tank, and the output end of each water pump is connected to one end of the cold water coil.

[0005] Preferably, dampers are installed on both sides of the bottom end of the movable plate, and a first return spring is installed on the outer wall above the dampers.

[0006] Preferably, the inner walls on both sides below the reheating chamber are provided with limiting grooves, and both sides of the movable plate are movably connected to the limiting grooves through limiting wheels.

[0007] Preferably, a second return spring is installed on both outer walls above the device body, and a pull rod is movably installed on the inner side of each second return spring. One end of each pull rod is connected to a locking block, and the outer wall of the solder paste box is provided with a locking groove that cooperates with the locking block.

[0008] Preferably, a positioning block is connected to the bottom end of one side of the sealing cover, and a positioning groove that cooperates with the positioning block is provided at the top of the device body.

[0009] Preferably, the bottom end of the positioning block and the inner wall of the positioning groove are both connected to magnetic blocks, and the magnetic poles of opposite sides of the magnetic blocks are different.

[0010] Preferably, the other end of each of the cold water coils is connected to a circulating pump, and one end of each circulating pump is connected to a heat exchanger via a water pipe. One end of each heat exchanger is connected to a circulating pipe, and one end of each circulating pipe is fixedly connected to the cold water tank.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] This utility model provides a temperature sensor, a heating ring tube, and a circulation pump. The temperature sensor detects the temperature inside the rewarming chamber and maintains the rewarming chamber at a specified temperature. When the temperature is low, the heating ring tube operates to heat the chamber. When the temperature inside the rewarming chamber is high, the water pump operates to draw cold water from the cold water tank. The cold water flows into the cold water coil and then the water that has absorbed heat enters the heat exchanger through the circulation pump for heat exchange. After the water is cooled down by the heat exchange, it returns to the cold water tank through the circulation pipe, realizing the circulation of cold water in the cold water coil. This cools the rewarming chamber and maintains a constant temperature inside the rewarming chamber, solving the problem of not having a constant temperature maintenance function.

[0013] This utility model provides a solder paste box, a pull rod, and a positioning block. When it is necessary to remove the solder paste box, the sealing cover is pulled with a little force to separate the magnetic blocks and move the positioning block away from the positioning groove. Then, the pull rod is pulled outward to move the locking block away from the locking groove. Then, the damper and the first reset spring reset to make the movable plate rise and push the solder paste box out, thus solving the problem of inconvenience in retrieving the product. Attached Figure Description

[0014] Figure 1 This is a cross-sectional structural diagram of the device body of this utility model;

[0015] Figure 2 This is a front view structural diagram of the chilled water coil of this utility model;

[0016] Figure 3 This is a schematic diagram of the movable plate structure of this utility model;

[0017] Figure 4 This utility model Figure 1 Enlarged structural diagram at point A in the middle.

[0018] In the diagram: 1. Damper; 2. First return spring; 3. Cold water coil; 4. Mounting cavity; 5. Locking block; 6. Pull rod; 7. Second return spring; 8. Locking slot; 9. Solder paste box; 10. Cold water tank; 11. Water pump; 12. Temperature sensor; 13. Sealing cover; 14. Heating ring pipe; 15. Control panel; 16. Device body; 17. Suction cup; 18. Circulation pipe; 19. Heat exchanger; 20. Circulation pump; 21. Movable plate; 22. Positioning block; 23. Positioning groove; 24. Magnetic block; 25. Warm-up cavity. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Example 1: Please refer to Figures 1-4 An SMT solder paste reheating device includes a solder paste container 9, a device body 16, and a reheating chamber 25. A control panel 15 is installed on the outer wall of one side of the device body 16. Suction cups 17 are connected to both ends of the bottom of the device body 16. Reheating chambers 25 are provided on both sides of the device body 16, and a solder paste container 9 is placed inside each reheating chamber 25. A sealing cover 13 is movably installed on the top of each reheating chamber 25. Heating rings are installed on the inner wall of the reheating chamber 25 outside the solder paste container 9. The device body 16 outside the tube 14 and the reheating chamber 25 are both provided with mounting cavities 4, and the inner walls of the mounting cavities 4 are all wrapped with cold water coils 3. A cold water tank 10 is installed in the middle of the device body 16. A temperature sensor 12 is installed on one side of the inner wall above the reheating chamber 25. A movable plate 21 is installed on the lower inner side of the reheating chamber 25. Water pumps 11 are connected to both sides of the cold water tank 10, and the output end of the water pump 11 is connected to one end of the cold water coil 3.

[0021] The other end of each cold water coil 3 is connected to a circulating pump 20, and one end of each circulating pump 20 is connected to a heat exchanger 19 through a water pipe. One end of each heat exchanger 19 is connected to a circulating pipe 18, and one end of each circulating pipe 18 is fixedly connected to the cold water tank 10.

[0022] Specifically, such as Figure 1 and Figure 2As shown, when using this structure, the temperature inside the reheating chamber 25 is detected by the temperature sensor 12, so that the reheating chamber 25 is kept at a specified temperature. When the temperature is low, the heating ring pipe 14 is used to heat the chamber. When the temperature inside the reheating chamber 25 is high, the water pump 11 is used to draw cold water from the cold water tank 10. The cold water flows into the cold water coil 3. Then, the water that has absorbed heat enters the heat exchanger 19 through the circulation pump 20 for heat exchange. After the water is cooled down by heat exchange, it enters the cold water tank 10 again through the circulation pipe 18, so as to realize the circulation of cold water in the cold water coil 3, cool down the reheating chamber 25, and keep the temperature inside the reheating chamber 25 constant.

[0023] Example 2: Damperes 1 are installed on both sides of the bottom end of the movable plate 21, and a first return spring 2 is installed on the outer wall above the damper 1.

[0024] Limit grooves are provided on both inner walls below the reheating chamber 25, and both sides of the movable plate 21 are movably connected to the limit grooves through limit wheels;

[0025] A second reset spring 7 is installed on both outer walls above the main body 16, and a pull rod 6 is movably installed on the inner side of the second reset spring 7. One end of the pull rod 6 is connected to a locking block 5. The outer wall of the solder paste box 9 is provided with a locking groove 8 that cooperates with the locking block 5.

[0026] The bottom of one side of the sealing cover 13 is connected to a positioning block 22, and the top of the device body 16 is provided with a positioning groove 23 that cooperates with the positioning block 22.

[0027] The bottom of the positioning block 22 and the inner wall of the positioning groove 23 are both connected to magnetic blocks 24, and the magnetic poles of opposite sides of the magnetic blocks 24 are different.

[0028] Specifically, such as Figure 1 , Figure 3 and Figure 4 As shown, when using this structure, when it is necessary to remove the solder paste box 9, pull the sealing cover 13 with a little force to separate the magnetic blocks 24 and move the positioning block 22 away from the positioning groove 23. Then pull the pull rod 6 outward to move the locking block 5 away from the locking groove 8. Then the damper 1 and the first reset spring 2 reset to make the movable plate 21 rise and push the solder paste box 9 out, making it easy to remove the object.

[0029] Working principle: When using this device, first put the solder paste box 9 into the warming chamber 25, then close the sealing cover 13. At the same time, the positioning block 22 is positioned in the positioning groove 23 and fixed by magnetic attraction between the magnetic blocks 24, so that the solder paste box 9 warms up in the warming chamber 25.

[0030] Implementation steps for the first innovation point:

[0031] Step 1: By pulling the lever 6 outward, the second return spring 7 is stretched and deformed. Then, by placing the solder paste box 9 into the warming chamber 25 and pressing the solder paste box 9 downward, the solder paste box 9 is pressed downward against the movable plate 21. At the same time, the damper 1 and the first return spring 2 are compressed and deformed. After the solder paste box 9 enters, the lever 6 is released, and the second return spring 7 returns to its original position, causing the locking block 5 to lock into the slot 8.

[0032] Step 2: When it is necessary to remove the solder paste box 9, pull the sealing cover 13 with a little force to separate the magnetic blocks 24 and move the positioning block 22 away from the positioning groove 23. Then pull the pull rod 6 outward to move the locking block 5 away from the locking groove 8. Then the damper 1 and the first reset spring 2 reset to make the movable plate 21 move upward to push the solder paste box 9 out.

[0033] Implementation steps for the second innovation point:

[0034] Step 1: The temperature inside the warming chamber 25 is detected by the temperature sensor 12, and the warming chamber 25 is kept at the specified warming temperature. When the temperature is low, the heating ring tube 14 is used to heat the chamber.

[0035] Step 2: When the temperature inside the warming chamber 25 is high, the water pump 11 draws cold water from the cold water tank 10. The cold water flows into the cold water coil 3. Then, the water that has absorbed heat enters the heat exchanger 19 through the circulation pump 20 for heat exchange. After the water is cooled down by heat exchange, it enters the cold water tank 10 again through the circulation pipe 18, realizing the circulation of cold water in the cold water coil 3 and cooling the warming chamber 25.

[0036] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0037] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An SMT solder paste reheating device, comprising a solder paste container (9), a device body (16), and a reheating chamber (25), characterized in that: A control panel (15) is installed on the outer wall of one side of the device body (16). Suction cups (17) are connected to both ends of the bottom of the device body (16). A reheating chamber (25) is provided on both sides of the device body (16), and a solder paste box (9) is placed inside the reheating chamber (25). A sealing cover (13) is movably installed on the top of the reheating chamber (25). A heating ring tube (14) is installed on the inner wall of the reheating chamber (25) outside the solder paste box (9). The device body is located outside the reheating chamber (25). (16) is provided with an installation cavity (4) inside, and the inner wall of the installation cavity (4) is wrapped with a cold water coil (3). A cold water tank (10) is installed in the middle of the device body (16). A temperature sensor (12) is installed on the inner wall of the upper side of the reheating cavity (25). A movable plate (21) is installed on the lower side of the inner side of the reheating cavity (25). A water pump (11) is connected to both sides of the cold water tank (10), and the output end of the water pump (11) is connected to one end of the cold water coil (3).

2. The SMT solder paste reheating equipment according to claim 1, characterized in that: Dampers (1) are installed on both sides of the bottom end of the movable plate (21), and a first return spring (2) is installed on the outer wall above the damper (1).

3. The SMT solder paste warming equipment according to claim 1, characterized in that: The inner walls on both sides below the warming chamber (25) are provided with limiting grooves, and both sides of the movable plate (21) are movably connected to the limiting grooves through limiting wheels.

4. The SMT solder paste reheating equipment according to claim 1, characterized in that: The outer walls on both sides of the device body (16) are equipped with second reset springs (7), and pull rods (6) are movably installed on the inner side of the second reset springs (7). One end of the pull rods (6) is connected to a locking block (5), and the outer wall of the solder paste box (9) is provided with a locking groove (8) that cooperates with the locking block (5).

5. The SMT solder paste reheating equipment according to claim 1, characterized in that: The bottom of one side of the sealing cover (13) is connected to a positioning block (22), and the top of the device body (16) is provided with a positioning groove (23) that cooperates with the positioning block (22).

6. The SMT solder paste reheating equipment according to claim 5, characterized in that: The bottom of the positioning block (22) and the inner wall of the positioning groove (23) are both connected to magnetic blocks (24), and the magnetic poles of the opposite sides of the magnetic blocks (24) are different.

7. The SMT solder paste reheating equipment according to claim 1, characterized in that: The other end of each of the cold water coils (3) is connected to a circulating pump (20), and one end of each circulating pump (20) is connected to a heat exchanger (19) through a water pipe. One end of each heat exchanger (19) is connected to a circulating pipe (18), and one end of each circulating pipe (18) is fixedly connected to the cold water tank (10).

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