A relay package structure

Abstract

The utility model relates to electrical packaging field especially relates to a relay packaging structure, including shell, PCB board, outer pin group, relay and non silicon base adhesive layer, the pin of relay and outer pin group all are fixed on PCB board, and relay passes through PCB board with outer pin group electricity is connected, relay, PCB board and outer pin group set up in the cavity, and PCB board sets up in bottom surface, relay and outer pin group set up in the first surface of PCB board, outer pin group passes through first opening, makes relay with external circuit electricity is connected, non silicon base adhesive layer fills in the cavity, and cooperation shell seals the pin of relay and PCB board. The utility model can still keep the low heat output of relay under the long -term use, promotes the work stability of relay and prolongs the service life.

Description

Technical Field

[0001] This utility model relates to the field of electrical packaging, and in particular to a relay packaging structure. Background Technology

[0002] In LED driver power supply manufacturing, potting process is widely used to improve the waterproofness (IP rating) and heat dissipation efficiency of products. At present, the industry generally uses silicone-based potting compounds (such as silicone rubber and silicone gel), which have advantages such as high thermal conductivity, excellent flowability and wide temperature range, and are suitable for harsh environments.

[0003] Among them, relays are frequently used components in LED driver power supplies. As the usage time increases, the heat generated by relays during operation will increase, resulting in a significant decrease in the working stability of relays after a certain period of use, and a shorter lifespan for relays.

[0004] Therefore, how to suppress the heat generation during relay use, improve the relay's operational stability, and extend its service life is a problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0005] The purpose of this invention is to provide a relay packaging structure to solve the problems of poor relay stability and short service life in the prior art.

[0006] To solve the above-mentioned technical problems, this utility model provides a relay packaging structure, including a housing, a PCB board, an external pin group, a relay, and a non-silicone adhesive layer;

[0007] The relay pins and the external pin group are both fixed on the PCB board, and the relay is electrically connected to the external pin group through the PCB board;

[0008] The outer shell includes a first opening, a bottom surface, and a side wall, the bottom surface and the side wall forming a cavity of the outer shell; the edge of the side wall away from the bottom surface forms the first opening;

[0009] The relay, the PCB board, and the external pin assembly are disposed within the cavity, with the PCB board disposed on the bottom surface and the relay and the external pin assembly disposed on the first surface of the PCB board; the first surface is the surface of the PCB board facing the first opening;

[0010] The external pin group passes through the first opening, so that the relay is electrically connected to the external circuit;

[0011] The non-silicone adhesive layer fills the cavity and, together with the housing, seals the relay pins and the PCB board.

[0012] Optionally, in the relay packaging structure, the non-silicone adhesive layer is a polyurethane layer.

[0013] Optionally, in the relay packaging structure, the bottom surface of the housing is further provided with protruding reinforcing ribs;

[0014] The PCB board is positioned in contact with the protruding reinforcing rib, but not with the bottom surface.

[0015] Optionally, in the relay package structure, the relay pins and / or the external pin group penetrate the PCB substrate and form pin protrusions on the second surface of the PCB substrate; the second surface is the surface of the PCB board that faces away from the first opening;

[0016] The protrusion height of the protruding part of the tube foot is less than the protrusion height of the protruding reinforcing rib.

[0017] Optionally, in the relay packaging structure, the non-silicone adhesive layer is a cured layer of liquid non-silicone adhesive.

[0018] Optionally, in the relay packaging structure, the sidewall of the housing is further provided with a fixing reinforcing rib;

[0019] The fixing reinforcing rib abuts against the relay.

[0020] Optionally, in the relay packaging structure, the first opening is a stepped opening;

[0021] The stepped opening includes an isolation and protective sidewall;

[0022] The isolation and protective sidewall surrounds the outside of the outer pin assembly and partially encloses the outer pin assembly.

[0023] Optionally, in the relay packaging structure, the non-silicone adhesive layer completely or partially fills the cavity.

[0024] The relay packaging structure provided by this utility model includes a housing, a PCB board, an external pin assembly, a relay, and a non-silicone adhesive layer. The relay pins and the external pin assembly are fixed to the PCB board, and the relay is electrically connected to the external pin assembly through the PCB board. The housing includes a first opening, a bottom surface, and a side wall, with the bottom surface and the side wall forming a cavity. The edge of the side wall away from the bottom surface forms the first opening. The relay, the PCB board, and the external pin assembly are disposed within the cavity, with the PCB board disposed on the bottom surface and the relay and the external pin assembly disposed on a first surface of the PCB board. The first surface is the surface of the PCB board facing the first opening. The external pin assembly passes through the first opening, enabling the relay to be electrically connected to an external circuit. The non-silicone adhesive layer fills the cavity, sealing the relay pins and the PCB board in conjunction with the housing.

[0025] In existing technologies, the encapsulating colloid material often contains silicon ions. Since relays experience continuous temperature increases during prolonged operation, the silicone molecular chains in the encapsulating colloid break down at high temperatures. The resulting free siloxane (Si-O) compounds penetrate the contact area through gaps in the relay housing or pin gaps, depositing on the contact surface and forming a nanoscale insulating layer (SiO2). In other words, an insulating material forms on the relay contacts, significantly increasing the contact resistance. This increased contact resistance leads to localized temperature rise, accelerating contact oxidation and arc erosion, ultimately causing contact adhesion or open-circuit failure. This invention utilizes a non-silicone-based adhesive layer to replace the existing silicon-based encapsulating colloid for sealing the relay and PCB board within the housing. This fundamentally eliminates the silicon ion migration path, preventing the formation of insulating material on the contacts over time during relay use. This prevents increased contact resistance and allows the relay to maintain low heat generation even under long-term use, significantly improving its operational stability and extending its service life. Attached Figure Description

[0026] To more clearly illustrate the technical solutions of the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 An exploded view of one specific embodiment of the relay packaging structure provided by this utility model;

[0028] Figure 2A schematic diagram of the housing of another specific embodiment of the relay packaging structure provided by this utility model;

[0029] Figure 3 This is a schematic diagram of another specific embodiment of the relay packaging structure provided by this utility model.

[0030] Figure label:

[0031] 100-Relay; 200-External pin group; 300-PCB board; 400-Non-silicone adhesive layer; 500-Housing; 510-Bottom surface; 501-Protruding reinforcing rib; 520-Side wall; 502-Fixing reinforcing rib; 521-Isolation and protection side wall. Detailed Implementation

[0032] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0033] The core of this utility model is to provide a relay 100 package structure, the structural diagram of one specific embodiment of which is shown below. Figures 1 to 3 This is referred to as Specific Implementation Method 1, the relay 100 package structure, including a housing 500, a PCB board 300, an external pin group 200, a relay 100, and a non-silicone adhesive layer 400.

[0034] The pins of the relay 100 and the external pin group 200 are both fixed on the PCB board 300, and the relay 100 is electrically connected to the external pin group 200 through the PCB board 300.

[0035] The outer shell 500 includes a first opening, a bottom surface 510, and a side wall 520. The bottom surface 510 and the side wall 520 form a cavity of the outer shell 500. The edge of the side wall 520 away from the bottom surface 510 forms the first opening.

[0036] The relay 100, the PCB board 300, and the external pin group 200 are disposed within the cavity, and the PCB board 300 is disposed on the bottom surface 510. The relay 100 and the external pin group 200 are disposed on the first surface of the PCB board 300; the first surface is the surface of the PCB board 300 facing the first opening.

[0037] The external pin group 200 passes through the first opening, so that the relay 100 is electrically connected to the external circuit;

[0038] The non-silicone adhesive layer 400 fills the cavity and, together with the housing 500, seals the pins of the relay 100 and the PCB board 300.

[0039] Please refer to Figure 1 , Figure 1 This is an exploded view of the relay 100 packaging structure. The outer pin assembly 200 and the relay 100 can be pre-assembled outside the housing 500. The assembled integrated structure is called the relay workpiece. The relay workpiece is then placed into the cavity of the housing 500 through the first opening and secured. After securing it, the non-silicone adhesive layer 400 is filled into the cavity to seal the relay workpiece. The outer pin assembly 200 typically uses straight-line pins, but other types of pins can be used if other requirements exist. The distance between the pins meets the safety specifications required for the relay 100. It can be assumed that the silicon content of the non-silicone adhesive layer 400 is very low, such as 0.01%. Through technical analysis (such as using SEM-EDS analysis), it can be seen that after using the non-silicone adhesive layer 400, the silicon content on the contact surface of the relay 100 is significantly reduced. For example, the silicon content on the contact surface of the relay 100 is reduced to below 0.5%, and the corresponding contact resistance fluctuation rate is ≤3%. In some experimental embodiments, the lifespan of the relay 100 packaging structure is increased to 120,000 cycles, which is significantly better than the 50,000 cycles of the traditional silicone solution.

[0040] You can refer to this. Figure 1 The PCB board 300, the relay 100 and the external pin group 200 are disposed in the cavity of the housing 500 through the first opening.

[0041] In other words, in this specific embodiment, not only does the outer pin group 200 pass through the first opening to achieve electrical connection between the inner and outer structures of the housing 500, but it also limits the PCB board 300 and the relay 100 to be placed into the cavity of the housing 500 through the first opening. In other words, the housing 500 only needs to have one opening, the first opening. Of course, the subsequent non-silicone adhesive layer 400 is also filled into the cavity through the first opening, which reduces the sealing difficulty of the PCB board 300 and the relay 100 and improves the yield of finished products.

[0042] Furthermore, the bottom surface 510 of the outer shell 500 is also provided with protruding reinforcing ribs 501;

[0043] The PCB board 300 is positioned in contact with the protruding reinforcing rib 501, but not with the bottom surface 510.

[0044] You can refer to this. Figure 2 , Figure 2 The diagram shows the structure of the housing 500. The protruding reinforcing rib 501 is disposed on the bottom surface 510 of the cavity of the housing 500. After the PCB board 300 is placed inside, it is supported by the protruding reinforcing rib 501, so that there is a space between the PCB board 300 and the bottom surface 510. This ensures that the relay 100 has a sufficient safe distance from surrounding live components and also helps the relay 100 dissipate heat, preventing the relay 100 from overheating during operation and further improving the working stability of the relay 100.

[0045] Furthermore, the pins of the relay 100 and / or the external pin group 200 penetrate the PCB substrate and form pin protrusions on the second surface of the PCB substrate; the second surface is the surface of the PCB board 300 that faces away from the first opening;

[0046] The protrusion height of the protruding part of the tube foot is less than the protrusion height of the protruding reinforcing rib 501.

[0047] refer to Figure 1 It is known that the pins of the relay 100 and the external pin group 200 are inserted into the PCB board 300. However, in actual production, in order to ensure the stability of the soldering between the device and the PCB board 300, the pads on the PCB board 300 need to be set as through holes, and then the two types of pins are soldered through the through holes. This will cause the two types of pins to protrude from the surface of the PCB board 300 away from the relay 100 and the external pin group 200, forming the pin protrusion.

[0048] In this preferred embodiment, the protrusion height of the pin protrusion is limited to be less than the protrusion height of the reinforcing rib 501. This ensures that after the PCB board 300 contacts the reinforcing rib 501, the pin protrusion still cannot contact the bottom surface 510, preventing localized overheating on the bottom surface 510 and thus extending the service life of the relay 100 package structure. As a specific embodiment, the protrusion height of the reinforcing rib 501 is any one of 1.5 mm, 2.5 mm, or 3 mm. These ranges represent the optimal ranges after extensive theoretical calculations and practical testing. Of course, other parameter ranges can also be used, and this invention does not limit the choice.

[0049] In this utility model, the protrusion height refers to the height of the corresponding structure protruding from its surface. For example, the protrusion height of the pin protrusion is the height of the pin protrusion protruding from the PCB board by 300. The protrusion heights of other structures can be compared by analogy, and will not be described in detail here.

[0050] As another specific embodiment, the side wall 520 of the outer shell 500 is also provided with a fixing reinforcing rib 502;

[0051] The fixing reinforcing rib 502 abuts against the relay 100.

[0052] It can still be used as a reference. Figure 2 , Figure 2 The fixing reinforcing rib 502 is marked in the diagram. After the relay 100 is inserted into the housing 500, the relay 100 and the fixing reinforcing rib 502 mechanically interfere with each other. That is, during the insertion of the relay 100 into the housing 500, the relay 100 will compress the fixing reinforcing rib 502, causing the fixing reinforcing rib 502 to undergo compressive deformation (for example, the deformation can be any one of 0.1 mm, 0.2 mm, or 0.3 mm). Of course, although Figure 2 The fixed reinforcing rib 502 is a reinforcing rib extending perpendicularly to the bottom surface 510. However, in actual production, the fixed reinforcing rib 502 extending parallel to the bottom surface 510 can also be provided. Furthermore, the density of the fixed reinforcing rib 502 should not be too low. In some embodiments, the density of the fixed reinforcing rib 502 is not less than 3 ribs per square centimeter. For example, any one of 3 ribs per square centimeter, 4 ribs per square centimeter, or 5 ribs per square centimeter can achieve better results. The above range is the optimal range after a large number of theoretical calculations and actual tests. Of course, other parameter ranges can also be selected, and this utility model does not limit them here. The protruding reinforcing rib 501 and the fixed reinforcing rib 502 can also reinforce the structure of the housing 500, and at the same time, they are used to balance the relay 100, prevent misalignment during assembly, and improve the durability of the relay 100 packaging structure. Specifically, the fixed reinforcing rib 502 can effectively offset the potting heat stress (e.g., ΔCTE < 5ppm / ℃). In some embodiments, adding the protruding reinforcing rib 501 can reduce the welding misalignment rate from 15% to 2% (results from X-ray inspection), and the corresponding yield is increased to 98% (process capability index CPK = 1.8).

[0053] In another preferred embodiment, the first opening is a stepped opening;

[0054] The stepped opening includes an isolation and protective sidewall 521;

[0055] The isolation and protection sidewall 521 surrounds the outer side of the outer pin group 200 and partially encloses the outer pin group 200.

[0056] For reference Figure 2 and Figure 3 , Figure 2 and Figure 3 The outer casing 500 includes the isolation and protective sidewall 521. Figure 2 and Figure 3 The isolation and protective sidewall 521 is composed of three single-sided sidewalls 520. It should be noted that the isolation and protective sidewall 521 is a part of the sidewall 520. Further reference is available. Figure 3 , Figure 3 To complete the assembly of the relay 100 package structure, from Figure 3 The image clearly shows that the outer pin group 200 is partially surrounded by the isolation protection sidewall 521. The relay 100 package structure connects to an external circuit via the outer pin group 200. In this preferred embodiment, the first opening of the housing 500 is set as a stepped opening. In other words, except for the sidewall 520 at the location of the outer pin group 200, the sidewalls 520 at other locations are partially missing, thereby greatly reducing the space occupied by the relay 100 package structure, improving circuit integration, and giving the relay 100 package structure a wider range of applications. Of course, the first opening can also be a planar opening, such as... Figure 1 As shown.

[0057] Furthermore, the non-silicone adhesive layer 400 completely or partially fills the cavity. Optimal sealing is achieved when the non-silicone adhesive layer 400 completely fills the cavity, as can be seen from [reference needed]. Figure 3 , Figure 3 This is a schematic diagram of the structure after the cavity is completely filled by the non-silicone adhesive layer 400; of course, the non-silicone adhesive layer 400 can also only partially fill the cavity, which can greatly reduce the production cost of the relay 100 packaging structure. This can be selected according to actual production needs, and this utility model does not limit it here.

[0058] In one specific embodiment, the non-silicone adhesive layer 400 is a polyurethane layer. The polyurethane layer has excellent sealing performance. In actual use, the relay 100 encapsulation structure needs to be placed in the switching power supply. Currently, the switching power supply still needs to use silicone matrix adhesive. The dense polyurethane layer can prevent external silicone matrix adhesive from seeping into the relay 100 encapsulation structure.

[0059] In another specific embodiment, the non-silicone adhesive layer 400 is a cured layer of liquid non-silicone adhesive. In other words, the non-silicone adhesive layer 400 can be a liquid non-silicone adhesive, which, after being poured into the cavity of the outer shell 500, solidifies inside the cavity to form the non-silicone adhesive layer 400, thus ensuring good sealing performance and greatly reducing the installation difficulty of the non-silicone adhesive layer 400.

[0060] The relay 100 packaging structure provided by this utility model includes a housing 500, a PCB board 300, an external pin group 200, a relay 100, and a non-silicone adhesive layer 400. The pins of the relay 100 and the external pin group 200 are both fixed on the PCB board 300, and the relay 100 is electrically connected to the external pin group 200 through the PCB board 300. The housing 500 includes a first opening, a bottom surface 510, and a side wall 520, with the bottom surface 510 and the side wall 520 forming a cavity within the housing 500. The edge of the side wall 520 away from the bottom surface 510 forms the first opening. The relay 100, the PCB board 300, and the external pin group 200 are disposed within the cavity, with the PCB board 300 disposed on the bottom surface 510. The relay 100 and the external pin group 200 are disposed on the first surface of the PCB board 300; the first surface is the surface of the PCB board 300 facing the first opening; the external pin group 200 passes through the first opening, enabling the relay 100 to be electrically connected to an external circuit; the non-silicone adhesive layer 400 fills the cavity, and together with the housing 500, seals the pins of the relay 100 and the PCB board 300. In the prior art, the encapsulating colloid material often contains silicon ions, and the temperature of the relay 100 will continue to rise during long-term operation. When the temperature is high (such as 93°C), the silicone molecular chains in the encapsulating colloid material will break, and the resulting free siloxane compounds will invade the contact area through the gaps in the relay 100 housing 500 or the pin gaps, causing the siloxane to deposit on the contact surface and form a nanoscale insulating layer. In other words, an insulating material is formed on the contacts of the relay 100, which leads to a significant increase in the contact resistance at the contact position (reaching up to 50% in the test). This increases the contact resistance of the relay 100, causing local temperature rise, accelerating contact oxidation and arc erosion, and ultimately leading to contact adhesion or open circuit failure. In this invention, a non-silicone adhesive layer 400 is used to replace the silicon-based potting compound in the prior art to seal the relay 100 and PCB board 300 in the housing 500. This fundamentally eliminates the migration path of silicon ions, preventing the formation of insulating material on the contacts over time during the use of the relay 100. This also prevents an increase in contact resistance, allowing the relay 100 to maintain low heat generation even after long-term use, significantly improving the working stability of the relay 100 and extending its service life.

[0061] In addition, in some embodiments of this utility model, it can be ensured that the electrical clearance and creepage distance meet the UL 60950-1 Class B requirements (2.5mm / 4.0mm) and pass the 3kV withstand voltage test (leakage current <0.5mA), blocking the risk of external electric arc (IEC 60664-1 verification).

[0062] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the apparatus disclosed in the embodiments, since it corresponds to the method disclosed in the embodiments, the description is relatively simple; relevant parts can be referred to in the method section.

[0063] It should be noted that in this specification, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0064] The relay 100 packaging structure provided by this utility model has been described in detail above. Specific examples have been used to illustrate the principle and implementation of this utility model. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core idea of ​​this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made to this utility model without departing from the principle of this utility model, and these improvements and modifications also fall within the protection scope of this utility model.

Claims

1. A relay packaging structure, characterized in that, This includes the casing, PCB board, external pin group, relay, and non-silicone adhesive layer; The relay pins and the external pin group are both fixed on the PCB board, and the relay is electrically connected to the external pin group through the PCB board; The outer shell includes a first opening, a bottom surface, and a side wall, wherein the bottom surface and the side wall form a cavity of the outer shell; The edge of the sidewall away from the bottom surface forms the first opening; The relay, the PCB board, and the external pin assembly are disposed within the cavity, with the PCB board disposed on the bottom surface and the relay and the external pin assembly disposed on the first surface of the PCB board; the first surface is the surface of the PCB board facing the first opening; The external pin group passes through the first opening, so that the relay is electrically connected to the external circuit; The non-silicone adhesive layer fills the cavity and, together with the housing, seals the relay pins and the PCB board.

2. The relay packaging structure as described in claim 1, characterized in that, The non-silicone adhesive layer is a polyurethane layer.

3. The relay packaging structure as described in claim 1, characterized in that, The bottom surface of the outer shell is also provided with protruding reinforcing ribs; The PCB board is positioned in contact with the protruding reinforcing rib, but not with the bottom surface.

4. The relay packaging structure as described in claim 3, characterized in that, The relay pins and / or the external pin group penetrate the PCB substrate and form pin protrusions on the second surface of the PCB substrate; the second surface is the surface of the PCB board that faces away from the first opening; The protrusion height of the protruding part of the tube foot is less than the protrusion height of the protruding reinforcing rib.

5. The relay packaging structure as described in claim 1, characterized in that, The non-silicone adhesive layer is a cured layer of liquid non-silicone adhesive.

6. The relay packaging structure as described in claim 1, characterized in that, The sidewalls of the outer casing are also provided with fixing reinforcing ribs; The fixing reinforcing rib abuts against the relay.

7. The relay packaging structure as described in claim 1, characterized in that, The first opening is a stepped opening; The stepped opening includes an isolation and protective sidewall; The isolation and protective sidewall surrounds the outside of the outer pin assembly and partially encloses the outer pin assembly.

8. The relay packaging structure as described in claim 1, characterized in that, The non-silicone adhesive layer completely or partially fills the cavity.

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