Dehumidifier and energy storage system

Abstract

The application discloses a dehumidifier and an energy storage system, and belongs to the technical field of dehumidification. The dehumidifier comprises a refrigeration fin assembly, which has a cold supply side and a heat supply side and comprises a semiconductor refrigeration fin, a cold end of the semiconductor refrigeration fin forms at least part of the cold supply side, the cold supply side is configured to extend in a cabin of the energy storage system and contact with air in the cabin, and a hot end of the semiconductor refrigeration fin forms at least part of the heat supply side; wherein the heat supply side has a containing structure for accommodating a liquid cooling pipeline of a liquid cooling system of the energy storage system, and a wall surface of the containing structure is attached to an outer wall of the liquid cooling pipeline. Through the arrangement of the containing structure and the design that the wall surface of the containing structure is attached to the outer wall of the liquid cooling pipeline, the liquid cooling pipeline is directly inserted and mounted, the assembly process is simplified, the production efficiency is improved, the use of parts is reduced, the production cost is reduced, the risk of leakage of the cooling liquid in long-term use is significantly reduced, and the stability of the dehumidification effect is maintained.

Description

Technical Field

[0001] This application belongs to the field of dehumidification technology, and in particular relates to a dehumidifier and an energy storage system. Background Technology

[0002] Traditional energy storage systems utilize the thermoelectric effect of semiconductor materials to achieve dehumidification. Specifically, when a semiconductor cooling chip is energized, one end cools down to form a cold end, while the other end heats up to form a hot end. The hot and humid air in the air condenses when it encounters the cold end, thus achieving a dehumidification effect. The hot end can dissipate heat through a heat dissipation device to maintain its temperature below a set value.

[0003] In related technologies, a common hot-end heat dissipation method involves attaching the hot end of a semiconductor cooling chip to a liquid cooling plate, which is then connected to the liquid-cooled unit of the energy storage system via liquid-cooled piping. The internally circulating coolant continuously removes heat from the hot end. However, in practical applications, this hot-end heat dissipation method has several drawbacks. First, the assembly process of the liquid cooling plate and piping is extremely complex. To prevent coolant leakage, numerous sealing measures are required, making the installation process cumbersome, reducing production efficiency, and increasing the number of required components, thus increasing production costs. Second, with prolonged use, leakage is inevitable at the connection between the liquid cooling plate and the piping. The leaked coolant evaporates in a high-temperature environment, further increasing the humidity inside the energy storage system's compartment, which is detrimental to dehumidification. Utility Model Content

[0004] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application proposes a dehumidifier and energy storage system that simplifies the assembly process, improves production efficiency, reduces the use of parts, lowers production costs, and maintains the stability of dehumidification performance.

[0005] In a first aspect, this application provides a dehumidifier for use in an energy storage system, comprising:

[0006] A cooling chip assembly having a cooling side and a heating side, and including a thermoelectric cooler, the cold end of the thermoelectric cooler forming at least a portion of the cooling side, the cooling side being configured to extend within the compartment of an energy storage system and contact the air within the compartment, the hot end of the thermoelectric cooler forming at least a portion of the heating side; wherein,

[0007] The heating side has a receiving structure for the liquid cooling pipeline of the liquid cooling system of the energy storage system to pass through, and the wall of the receiving structure is in contact with the outer wall of the liquid cooling pipeline.

[0008] According to the dehumidifier of this application, by setting up the aforementioned receiving structure for the liquid-cooled pipeline, combined with the structural design of the receiving structure wall fitting with the outer wall of the liquid-cooled pipeline, the direct insertion installation of the liquid-cooled pipeline is realized, which simplifies the assembly process, reduces the need for sealing measures, thereby improving production efficiency and reducing the number of parts used, thereby reducing production costs. At the same time, it significantly reduces the risk of coolant leakage under long-term use, thereby maintaining the stability of the dehumidification effect and improving the reliability of the energy storage system. Furthermore, it reduces the contact thermal resistance between the liquid-cooled pipeline and the semiconductor cooling chip, thereby improving heat transfer efficiency and reducing heat accumulation at the hot end.

[0009] According to one embodiment of this application, the receiving structure is a through hole, the wall surface of the through hole is in contact with the outer wall of the liquid cooling pipeline, and the through hole extends for a predetermined length along the extension direction of the liquid cooling pipeline.

[0010] According to the dehumidifier of this application, by setting the housing structure as a through hole as described above, the through hole design can make full use of the internal space of the dehumidifier, reduce the probability of interference between the liquid cooling pipeline and other components, and the extended through hole structure can be flexibly adjusted according to the spatial layout to improve space utilization.

[0011] According to one embodiment of this application, the receiving structure is a groove, the wall of the groove is in contact with the outer wall of the liquid cooling pipeline, and the liquid cooling pipeline has at least two slots penetrating the groove.

[0012] According to one embodiment of this application, the cooling chip assembly further includes:

[0013] The first heat sink, wherein the hot end of the semiconductor cooling chip and the first heat sink form the heating side, the first heat sink includes a connected main board body and an adapter ring, the side of the main board body opposite to the adapter ring is attached to the hot end of the semiconductor cooling chip, and the receiving structure is formed inside the adapter ring.

[0014] According to the dehumidifier of this application, by setting the first radiator as described above, combined with the integrated design of the main board and the adapter ring, heat transfer between the hot end of the liquid cooling pipe and the semiconductor cooling chip and stable assembly of the liquid cooling pipe are realized, reducing the number of parts and assembly steps, shortening the assembly time, thereby significantly improving production efficiency. At the same time, while maintaining basic functions, the overall structure of the first radiator is simplified as much as possible, realizing the miniaturization design of the first radiator.

[0015] According to one embodiment of this application, the adapter ring is an integrated structure.

[0016] According to one embodiment of this application, the adapter ring includes multiple detachable and splicable parts, each of the parts including a first segment and a second segment connected together, the first segment being used to fit against the outer wall of the liquid cooling pipeline, and the second segment being used to connect with the adjacent part.

[0017] According to one embodiment of this application, the semiconductor refrigeration chip is a flexible semiconductor refrigeration chip, the flexible semiconductor refrigeration chips are connected end to end to form the receiving structure, the hot end forms the heating side, and the hot end is attached to the outer wall of the liquid cooling pipeline.

[0018] According to the dehumidifier of this application, the design of directly forming a housing structure with the aforementioned flexible semiconductor cooling chip utilizes the properties of flexible materials to allow the semiconductor cooling chip to directly conform to the outer wall of the liquid cooling pipeline, thereby achieving seamless contact heat exchange. There is no need to add an additional auxiliary heat dissipation structure to adapt to the liquid cooling pipeline, eliminating intermediate heat transfer components and significantly reducing the thermal resistance between the hot end and the liquid cooling pipeline, thereby maximizing the heat conduction efficiency and optimizing the heat dissipation and cooling effect of the hot end.

[0019] According to one embodiment of this application, the cooling chip assembly further includes:

[0020] The second heat sink is disposed at the cold end of the thermoelectric cooler, and the second heat sink and the cold end of the thermoelectric cooler together form the cooling side.

[0021] According to one embodiment of this application, multiple thermoelectric cooling chip assemblies and liquid cooling pipelines are provided in a one-to-one correspondence. The cold ends of the multiple thermoelectric cooling chips are arranged close to each other, and the hot ends of the multiple thermoelectric cooling chips are arranged opposite to each other. The second heat sink is attached to the multiple cold ends.

[0022] According to one embodiment of this application, the dehumidifier further includes:

[0023] A fan shroud, wherein a portion of the liquid cooling system and at least a portion of the cooling chip assembly are disposed within the fan shroud;

[0024] A fan, which is installed on the shroud, is used to drive airflow through the shroud;

[0025] A water receiving box is located below the cooling side along the direction of gravity.

[0026] According to one embodiment of this application, the dehumidifier further includes:

[0027] The third radiator is installed inside the shroud and is located at least once on the heating side and in the liquid cooling pipeline.

[0028] Secondly, this application provides an energy storage system, which includes:

[0029] Dehumidifiers as described in any of the above solutions;

[0030] A liquid cooling system, comprising a liquid cooling unit and liquid cooling pipelines connected end-to-end to the liquid cooling unit, wherein the heating side of the dehumidifier exchanges heat with the liquid cooling pipelines through a housing structure;

[0031] A battery system, which is connected to the liquid cooling system, is used to exchange heat with the liquid cooling unit through the liquid cooling pipeline.

[0032] According to the energy storage system of this application, the above-mentioned dehumidifier enables direct-insertion installation of liquid cooling pipes, which simplifies the assembly process, reduces the need for sealing measures, thereby improving production efficiency and reducing the number of parts used, thus reducing production costs. At the same time, it significantly reduces the risk of coolant leakage under long-term use, thereby maintaining the stability of dehumidification effect and improving the reliability of the energy storage system. Furthermore, it reduces the contact thermal resistance between the liquid cooling pipes and the semiconductor cooling chip, thereby improving heat transfer efficiency and reducing heat accumulation at the hot end.

[0033] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0034] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0035] Figure 1 This is one of the structural schematic diagrams of the cooling chip assembly and liquid cooling pipeline provided in the embodiments of this application;

[0036] Figure 2 This is one of the structural schematic diagrams of the first radiator and liquid cooling pipeline provided in the embodiments of this application;

[0037] Figure 3 This is a second schematic diagram of the structure of the first radiator and liquid cooling pipeline provided in the embodiments of this application;

[0038] Figure 4 This is the third schematic diagram of the structure of the first radiator and liquid cooling pipeline provided in the embodiments of this application;

[0039] Figure 5 This is the fourth schematic diagram of the structure of the first radiator and liquid cooling pipeline provided in the embodiments of this application;

[0040] Figure 6 This is the fifth schematic diagram of the structure of the first radiator and liquid cooling pipeline provided in the embodiments of this application;

[0041] Figure 7 This is a second schematic diagram of the structure of the cooling chip assembly and liquid cooling pipeline provided in the embodiments of this application;

[0042] Figure 8 This is the third schematic diagram of the structure of the cooling chip assembly and liquid cooling pipeline provided in the embodiments of this application;

[0043] Figure 9 This is one of the structural schematic diagrams of the cooling chip assembly, liquid cooling pipeline and fan provided in the embodiments of this application;

[0044] Figure 10 This is a second schematic diagram of the structure of the cooling chip assembly, liquid cooling pipeline and fan provided in the embodiments of this application;

[0045] Figure 11 This is one of the structural schematic diagrams of the dehumidifier and liquid cooling pipeline provided in the embodiments of this application;

[0046] Figure 12 This is the second schematic diagram of the dehumidifier and liquid cooling pipeline provided in the embodiments of this application;

[0047] Figure 13 This is the third schematic diagram of the dehumidifier and liquid cooling pipeline provided in the embodiments of this application;

[0048] Figure 14 This is one of the structural schematic diagrams of the energy storage system provided in the embodiments of this application;

[0049] Figure 15 This is a second schematic diagram of the energy storage system provided in the embodiments of this application;

[0050] Figure 16 This is the third schematic diagram of the energy storage system provided in the embodiments of this application.

[0051] Figure label:

[0052] Energy storage system 1;

[0053] Dehumidifier 10;

[0054] Cooling chip assembly 11, cooling side 11a, heating side 11b, housing structure 11b1, semiconductor cooling chip 111, cold end 111a, hot end 111b;

[0055] First heat sink 112, main board body 1121, adapter ring 1122, split body 1122', first segment 11221, second segment 11222;

[0056] Second radiator 113;

[0057] 12. Fan shroud, 13. Water collection box, 14. Third radiator, 15.

[0058] Liquid cooling system 20, liquid cooling unit 21, liquid cooling pipeline 22;

[0059] Battery system 30. Detailed Implementation

[0060] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0061] This application discloses a dehumidifier 10, which is applied to an energy storage system 1.

[0062] The following is for reference. Figures 1-16 Dehumidifier 10 according to an embodiment of this application is described.

[0063] In some embodiments, refer to Figure 1 and Figures 7-13 The dehumidifier 10 includes a cooling chip assembly 11. The cooling chip assembly 11 has a cooling side 11a and a heating side 11b, and includes a semiconductor cooling chip 111. The cold end 111a of the semiconductor cooling chip 111 forms at least a portion of the cooling side 11a, which is configured to extend within the compartment of the energy storage system 1 and contact the air within the compartment. The hot end 111b of the semiconductor cooling chip 111 forms at least a portion of the heating side 11b. The heating side 11b has a receiving structure 11b1 through which a liquid cooling pipe 22 of the liquid cooling system 20 of the energy storage system 1 passes, and the wall of the receiving structure 11b1 is in contact with the outer wall of the liquid cooling pipe 22.

[0064] The cold end 111a of the semiconductor cooling chip 111 can directly constitute the cooling side 11a of the cooling chip assembly 11 for dehumidification; or the cold end 111a of the semiconductor cooling chip 111 can be combined with an auxiliary heat dissipation structure to constitute the cooling side 11a of the cooling chip assembly 11 for dehumidification. This application embodiment does not limit this.

[0065] The cold end 111a of the semiconductor cooling chip 111 is directly exposed to the compartment of the energy storage system 1 and comes into direct contact with the air in the compartment, thereby achieving the effect of dehumidification by condensing the moisture in the air on the surface of the cold end 111a.

[0066] The hot end 111b of the semiconductor cooling chip 111 can directly constitute the heating side 11b of the cooling chip assembly 11 for heat exchange with the liquid cooling pipe 22; or the hot end 111b of the semiconductor cooling chip 111 can be combined with an auxiliary heat dissipation structure to constitute the heating side 11b of the cooling chip assembly 11 for heat exchange with the liquid cooling pipe 22. This application embodiment does not limit this.

[0067] The hot end 111b of the semiconductor cooling chip 111 can define the receiving structure 11b1; or, the corresponding auxiliary heat dissipation structure can define the receiving structure 11b1; or, the hot end 111b of the semiconductor cooling chip 111 and the corresponding auxiliary heat dissipation structure can jointly define the receiving structure 11b1, and the embodiments of this application do not limit this.

[0068] The hot end 111b of the semiconductor cooling chip 111 is connected to the liquid cooling pipe 22 of the energy storage system 1 through the housing structure 11b1. The wall of the housing structure 11b1 is in close contact with the outer wall of the liquid cooling pipe 22 so that the heat generated by the hot end 111b can be effectively carried away by the coolant circulating in the liquid cooling pipe 22.

[0069] The receiving structure 11b1 of the heating side 11b can take many forms, such as fixing holes, grooves, clamping structures or adjustable clamp designs, etc., and the embodiments of this application do not limit this.

[0070] The shape of the receiving structure 11b1 can be adapted to the through-run portion of the liquid cooling pipe 22 to achieve a good coupling and encapsulation effect. It should be noted that, based on the simple insertion, the receiving structure 11b1 on the heating side 11b and the liquid cooling pipe 22 can also be filled with elastic thermally conductive materials (such as silicone pads / graphene films) or thermally conductive adhesives to compensate for processing errors, further reduce gaps, achieve a tight fit, and optimize heat dissipation.

[0071] Understandably, on the one hand, in traditional liquid cooling plate solutions, the liquid cooling plate and liquid cooling pipeline need to be connected by multiple sets of seals (such as sealing rings and flanges), which makes the installation process cumbersome. On the other hand, in the dehumidifier 10 provided in this application embodiment, the housing structure 11b1 is directly attached to the liquid cooling pipeline 22, eliminating the need for complex sealing structures, reducing assembly steps, significantly improving production efficiency, and eliminating components such as liquid cooling plates and additional seals, thus reducing the number of parts and reducing material costs. It also reduces maintenance costs caused by aging of seals. On the other hand, in traditional liquid-cooled plate solutions, the connection between the liquid-cooled plate and the liquid-cooled pipe becomes a major leakage hazard due to the aging of seals after long-term use. However, in this application, the contact surface between the housing structure 11b1 and the liquid-cooled pipe 22 has no fluid channel, and the coolant only flows inside the liquid-cooled pipe 22. Frequent inspection and maintenance of the connection between the heating side 11b and the liquid-cooled pipe 22 is unnecessary; only periodic inspection and maintenance of the joints of the liquid-cooled pipe 22 itself is required. This not only effectively alleviates the problem of secondary humidification caused by large-scale coolant leakage, thus maintaining the stability of the dehumidification effect, but also reduces short-circuit faults caused by leakage contacting electrical components, thereby improving the reliability of the energy storage system 1. Furthermore, since the wall of the housing structure 11b1 is directly attached to the outer wall of the liquid-cooled pipe 22, the contact thermal resistance between the liquid-cooled pipe 22 and the semiconductor cooling chip 111 is reduced, thereby improving heat transfer efficiency.

[0072] The dehumidifier 10 provided in this application embodiment, through the aforementioned arrangement of the receiving structure 11b1 for the liquid cooling pipe 22, combined with the structural design of the wall of the receiving structure 11b1 fitting against the outer wall of the liquid cooling pipe 22, achieves direct insertion installation of the liquid cooling pipe 22, simplifies the assembly process, reduces the need for sealing measures, thereby improving production efficiency and reducing the number of parts used, thus reducing production costs. At the same time, it significantly reduces the risk of coolant leakage under long-term use, thereby maintaining the stability of the dehumidification effect and improving the reliability of the energy storage system 1. It also reduces the contact thermal resistance between the liquid cooling pipe 22 and the semiconductor cooling chip 111, thereby improving the heat transfer efficiency and reducing heat accumulation at the hot end 111b.

[0073] In some embodiments, refer to Figures 1-4 and Figure 7 The receiving structure 11b1 is a through hole, the wall of which is in contact with the outer wall of the liquid cooling pipe 22, and the through hole extends for a set length along the extension direction of the liquid cooling pipe 22.

[0074] The shape of the through hole can be a regular geometric shape such as a circle, square or ellipse, or it can be customized according to the shape of the liquid cooling pipeline 22, such as a D-shaped or semi-circular irregular hole.

[0075] For example, refer to Figures 1-4 and Figure 7The liquid cooling pipe 22 is a general circular pipe, and the through hole shape is a matching circle. This application embodiment does not limit this.

[0076] The extension length of the through hole can be adjusted according to the heat dissipation requirements, such as extending it by 50mm or 100mm along the pipe extension direction. This application embodiment does not limit this.

[0077] The path of the liquid cooling pipeline 22 can take many forms, such as single-pipe through, multiple-pipe parallel, spiral or wavy, etc., and the embodiments of this application do not limit this.

[0078] As an example, refer to Figures 1-3 and Figure 7 The insertion part of the liquid cooling pipe 22 is a straight pipe, and correspondingly, the through hole is straight to reduce the processing difficulty.

[0079] As an example, refer to Figure 4 The insertion part of the liquid cooling pipe 22 is a bent pipe, and correspondingly, the through hole is bent to increase the heat exchange area.

[0080] The dehumidifier 10 provided in this application embodiment has a through hole in the housing structure 11b1 as described above. The through hole design can make full use of the internal space of the dehumidifier 10, reduce the probability of interference between the liquid cooling pipe 22 and other components, and the extended through hole structure can be flexibly adjusted according to the spatial layout to improve space utilization.

[0081] In some embodiments, refer to Figure 5 and Figure 6 The receiving structure 11b1 is a groove, the wall of the groove is in contact with the outer wall of the liquid cooling pipe 22, and the liquid cooling pipe 22 has at least two slots that penetrate the groove.

[0082] The groove can be straight, spiral, or wavy, etc. Different shapes of grooves have different effects on the fixation and heat exchange effect of liquid cooling pipeline 22. This application embodiment does not limit this.

[0083] As an example, refer to Figure 5 The insertion part of the liquid cooling pipe 22 is designed as a U-shaped pipe structure. Thus, the liquid cooling pipe 22 has two straight sections that pass through the groove. Correspondingly, the groove is also designed as a U-shaped groove of the same size.

[0084] As an example, refer to Figure 6The insertion part of the liquid cooling pipe 22 is designed as a U-shaped pipe structure. Thus, the liquid cooling pipe 22 has two main pipes with grooves through which the grooves pass. The ends of the two adjacent main pipes can be connected by an arc pipe. At least one branch pipe can be set between the two adjacent main pipes to further connect them, so as to accelerate the heat exchange efficiency. The diameter of the branch pipe can be smaller than that of the main pipe, so that the coolant flow distribution between the branch pipes and the main pipe is more uniform.

[0085] The dehumidifier 10 provided in this application embodiment, by setting the receiving structure 11b1 as a groove and combining it with the structural design of at least two main pipes passing through the groove, significantly increases the contact area between the liquid cooling pipe 22 and the receiving structure 11b1, extends the heat exchange path, and thus greatly improves the heat exchange efficiency.

[0086] In some embodiments, refer to Figures 1-3 The cooling chip assembly 11 also includes a first heat sink 112.

[0087] The hot end 111b of the thermoelectric cooler 111 and the first heat sink 112 form a heating side 11b. The first heat sink 112 includes a connected main board body 1121 and a transition ring 1122. The side of the main board body 1121 facing away from the transition ring 1122 is attached to the hot end 111b of the thermoelectric cooler 111. An accommodating structure 11b1 is formed inside the transition ring 1122.

[0088] In this embodiment, refer to Figures 1-3 The main body 1121 is used to directly contact the hot end 111b of the thermoelectric cooler 111 for heat exchange, thereby conducting the heat of the hot end 111b of the thermoelectric cooler 111 to the adapter ring 1122. The adapter ring 1122 defines a receiving structure 11b1 suitable for matching the shape of the liquid cooling pipe 22. The inner wall of the adapter ring 1122 is the wall surface of the receiving structure 11b1. The adapter ring 1122 maximizes the heat exchange area by surrounding and clamping it to the outside of the liquid cooling pipe 22, thereby further conducting the heat of the hot end 111b to the liquid cooling pipe 22, and then to the internal coolant.

[0089] The connection method between the main board body 1121 and the adapter ring 1122 may include, but is not limited to, integral molding, welding or threaded connection, etc., and the embodiments of this application do not limit this.

[0090] The dehumidifier 10 provided in this application embodiment, through the setting of the first radiator 112 and the integrated design of the main board 1121 and the adapter ring 1122, realizes the heat transfer between the liquid cooling pipe 22 and the hot end 111b of the semiconductor cooling chip 111, as well as the stable assembly of the liquid cooling pipe 22, reducing the number of parts and assembly steps, shortening the assembly time, thereby significantly improving production efficiency. At the same time, while maintaining basic functions, the overall structure of the first radiator 112 is simplified as much as possible, realizing the miniaturization design of the first radiator 112.

[0091] In some embodiments, refer to Figure 1 and Figure 2 The adapter ring 1122 is an integrated structure.

[0092] Understandably, since the adapter ring 1122 is an integrated structure, the wall of the housing structure 11b1 is continuous without any connecting gaps. On the one hand, this avoids the thermal resistance caused by connecting gaps, improving heat conduction efficiency, shortening the heat transfer time from the hot end 111b to the liquid cooling pipe 22, effectively reducing the temperature of the hot end 111b, and improving dehumidification efficiency. On the other hand, integrated manufacturing maintains the continuity of materials and structure between the adapter ring 1122 and the main body 1121, reducing heat flow concentration caused by material differences or unevenness at the joints, allowing heat to be transferred more evenly to the liquid cooling pipe 22, reducing the risk of local overheating, and thus extending the service life of the semiconductor cooling chip 111. Furthermore, integrated manufacturing reduces the assembly of multiple components, reducing production processes and shortening the production cycle. At the same time, it eliminates the need to purchase additional connectors, reducing manufacturing costs. Moreover, the overall structure of the adapter ring 1122 is more robust, reducing the risk of loosening between the adapter ring 1122 and the liquid cooling pipe 22, and maintaining long-term stable heat exchange performance.

[0093] In some embodiments, refer to Figure 3 The adapter ring 1122 includes multiple detachable and splicable parts 1122'. Each part 1122' includes a connected first segment 11221 and a second segment 11222. The first segment 11221 is used to fit against the outer wall of the liquid cooling pipeline 22, and the second segment 11222 is used to connect with the adjacent part 1122'.

[0094] "Multiple" here means two or more.

[0095] For example, in some embodiments, reference Figure 3 The adapter ring 1122 includes two detachable and connectable parts 1122'.

[0096] In this embodiment, refer to Figure 3The first segment 11221 of some of the multiple sub-units 1122' is connected to the main body 1121. Each sub-unit 1122' may include one first segment 11221 and two second segments 11222. The two second segments 11222 are respectively located at both ends of the first segment 11221 for connection with two adjacent second segments 11222. During manufacturing, a portion of the receiving structure 11b1 can be machined for each sub-unit 1122'. Then, the multiple sub-units 1122' are connected end to end to form a clamping structure, which connects and fixes the second segments 11222 of two adjacent sub-units 1122', ultimately forming the entire receiving structure 11b1.

[0097] The connection methods between two adjacent parts 1122' include, but are not limited to, threaded connection, snap-fit ​​or riveting, etc., and this application embodiment does not limit them.

[0098] The dehumidifier 10 provided in this application embodiment, by designing the adapter ring 1122 as composed of multiple parts 1122', makes the installation of the adapter ring 1122 more flexible, reduces the complexity of the assembly process, and each part 1122' can be installed or replaced independently, reducing assembly difficulty and maintenance costs. It can also flexibly adapt to liquid cooling pipes 22 of various shapes and paths. Whether it is a straight, curved or irregular pipe, it can be matched by adjusting the number and shape of the parts 1122', thereby improving the flexibility and adaptability of the heating side 11b and the liquid cooling pipes 22 in terms of structure, and increasing the application range of the refrigeration unit.

[0099] In some embodiments, refer to Figure 7 , Figure 10 and Figure 11 The semiconductor refrigeration chip 111 is a flexible semiconductor refrigeration chip 111. The flexible semiconductor refrigeration chips 111 are connected end to end to form a housing structure 11b1. The hot end 111b forms the heating side 11b, and the hot end 111b is attached to the outer wall of the liquid cooling pipe 22.

[0100] In this embodiment, refer to Figure 7 , Figure 10 and Figure 11The flexible material properties endow the thermoelectric cooler 111 with strong deformation capabilities. In other words, the thermoelectric cooler 111 can be bent and twisted to a certain extent without breaking. Thus, the hot end 111b of the thermoelectric cooler 111 can directly form the heating side 11b. During assembly, the thermoelectric cooler 111 can be directly wrapped around the outer wall of the liquid cooling pipe 22. At the connection points at the beginning and end, adhesive tape, glue, or welding can be used to connect the thermoelectric cooler 111 to the liquid cooling pipe 22. The outer contour of the insertion part of 2 is provided with an annular structure. The central hole area of ​​the annular structure is the receiving structure 11b1. The inner side of the annular structure is the hot end 111b, and the outer side of the annular structure is the cold end 111a. Both the cold end 111a and the hot end 111b are arc-shaped. The arc surface of the hot end 111b of the semiconductor cooling chip 111 is the wall surface of the receiving structure 11b1. The arc surface of the hot end 111b of the semiconductor cooling chip 111 is directly attached to the outer wall of the liquid cooling pipe 22 in the circumferential direction to achieve heat exchange.

[0101] The dehumidifier 10 provided in this application embodiment uses the design of directly forming the receiving structure 11b1 with the flexible semiconductor cooling chip 111. By utilizing the characteristics of flexible materials, the semiconductor cooling chip 111 can be directly conformally attached to the outer wall of the liquid cooling pipe 22 to achieve seamless contact heat exchange. There is no need to add an additional auxiliary heat dissipation structure to adapt to the liquid cooling pipe 22, and the intermediate heat transfer component is eliminated. This significantly reduces the thermal resistance between the hot end 111b and the liquid cooling pipe 22, thereby maximizing the heat conduction efficiency and optimizing the heat dissipation and cooling effect of the hot end 111b to the maximum extent.

[0102] In some embodiments, refer to Figure 1 , Figures 7-12 The cooling chip assembly 11 also includes a second heat sink 113.

[0103] The second heat sink 113 is disposed at the cold end 111a of the semiconductor cooling chip 111, and the second heat sink 113 and the cold end 111a of the semiconductor cooling chip 111 together form the cooling side 11a.

[0104] The second heat sink 113 may include, but is not limited to, heat sink fins or heat pipes, and the embodiments of this application do not limit this.

[0105] In this embodiment, refer to Figure 1 , Figures 7-12The second heat sink 113 serves as an extension of the cold end 111a of the thermoelectric cooler 111, increasing the surface area of ​​the cooling side 11a, thus increasing the contact area between the cooling side 11a and the cabin air. The second heat sink 113 can be directly attached to the cold end 111a of the thermoelectric cooler 111. The cold end 111a of the thermoelectric cooler 111 directly transfers cooling energy to the second heat sink 113. When the humid air in the cabin comes into contact with the low-temperature outer surfaces of the cold end 111a and the second heat sink 113, it condenses directly into liquid and adheres to the outer surfaces of the cold end 111a and the second heat sink 113. The second heat sink 113 may include multiple spaced-apart heat dissipation fins, and the arrangement of these fins can be specifically designed according to actual needs.

[0106] The dehumidifier 10 provided in this application embodiment increases the surface area of ​​the cooling side 11a by setting the second radiator 113, thereby increasing the contact area between the cooling side 11a and the air, so that the cold end 111a continuously and efficiently condenses water vapor, increasing the dehumidification capacity of the cooling side 11a per unit time, thereby improving the condensation efficiency and achieving a better dehumidification effect.

[0107] In some embodiments, refer to Figure 8 Multiple thermoelectric cooling chip assemblies 11 and liquid cooling pipes 22 are arranged in a one-to-one correspondence. The cold ends 111a of the multiple thermoelectric cooling chips 111 are arranged close to each other, and the hot ends 111b of the multiple thermoelectric cooling chips 111 are arranged away from each other. The second heat sink 113 is in contact with the multiple cold ends 111a.

[0108] "Multiple" here means two or more.

[0109] For example, in some embodiments, reference Figure 8 Two thermoelectric cooling chip assemblies 11 and two liquid cooling pipes 22 are arranged in a one-to-one correspondence. The two liquid cooling pipes 22 are arranged opposite each other, and the two thermoelectric cooling chip assemblies 11 are arranged opposite each other. The two thermoelectric cooling chips 111 are located between the two liquid cooling pipes 22. The hot ends 111b of the two thermoelectric cooling chips 111 face outward and exchange heat with the two liquid cooling pipes 22 respectively. The cold ends 111a of the two thermoelectric cooling chips 111 face inward. The second heat sink 113 is arranged between the cold ends 111a of the two thermoelectric cooling chips 111 so that the cold ends 111a of the two thermoelectric cooling chips 111 share the second heat sink 113.

[0110] For example, in other embodiments, six thermoelectric cooler assemblies 11 and six liquid cooling pipes 22 are arranged in a one-to-one correspondence. The six liquid cooling pipes 22 are arranged in a circumferential manner, and the six thermoelectric cooler assemblies 11 are arranged in a circumferential manner. The six thermoelectric coolers 111 are located within the enclosure formed by the six liquid cooling pipes 22. The hot ends 111b of the six thermoelectric coolers 111 face outward and exchange heat with the six liquid cooling pipes 22 respectively. The cold ends 111a of the six thermoelectric coolers 111 face inward. The second heat sink 113 is arranged between the cold ends 111a of the six thermoelectric coolers 111 so that the cold ends 111a of the six thermoelectric coolers 111 share the second heat sink 113.

[0111] The dehumidifier 10 provided in this application embodiment, through the structural layout design of the second radiator 113 being attached to multiple cold ends 111a, enables multiple cold ends 111a to share the same second radiator 113. This can fully utilize the heat dissipation area of ​​the second radiator 113, improve the heat dissipation efficiency of the second radiator 113, reduce the number of second radiators 113 used, reduce material and processing costs, simplify the assembly process, improve production efficiency, and increase the integration and compactness of the dehumidifier 10 structure, thereby improving space utilization.

[0112] In some embodiments, refer to Figures 11-13 The dehumidifier 10 also includes: a fan cover 12, a fan 13, and a water collection box 14.

[0113] A portion of the liquid cooling system 20 and at least a portion of the cooling chip assembly 11 are disposed within the shroud 12; a fan 13 is mounted on the shroud 12 to drive airflow through the shroud 12; and a water collection box 14 is disposed below the cooling side 11a along the direction of gravity.

[0114] The shroud 12 can be designed as a closed or semi-closed structure. Its specific function is to guide airflow, improve dehumidification efficiency, and protect internal components such as the cooling chip assembly 11.

[0115] The shape of the wind shield 12 may include, but is not limited to, a cylinder, a cube, or a prism, etc., and this application embodiment does not limit this.

[0116] The air inlet and outlet of the hood 12 can have various layout forms, such as front air inlet and rear air outlet, bottom air inlet and top air outlet, or bottom air inlet and side air outlet, etc. This application embodiment does not limit this.

[0117] As an example, refer to Figure 11 , Figure 11 The thick arrows indicate the airflow path. The shroud 12 can be a bottom air intake and a side air outlet.

[0118] As an example, refer to Figure 12 , Figure 12The medium-thick arrows indicate the airflow path, and the shroud 12 can be an air intake at the bottom and an air outlet at the top.

[0119] As an example, refer to Figure 13 , Figure 13 The thick arrows indicate the airflow path. The shroud 12 can be designed with air intake at both ends of the top and air outlet in the center area of ​​the top.

[0120] The function of the fan 13 is to accelerate airflow in order to enhance the heat exchange effect between the cooling chip assembly 11 and the air.

[0121] The fan 13 can be an axial flow fan 13, a centrifugal fan 13, or a cross-flow fan 13, etc., and this application embodiment does not limit this.

[0122] The water collection box 14 is used to receive and store condensate below the cooling side 11a. Furthermore, the water collection box 14 can also be configured with an automatic drainage function and / or an anti-overflow function to improve the user experience.

[0123] As an example, a liquid level sensor can be installed in the water receiving box 14. When the condensate level in the water receiving box 14 reaches the maximum set liquid level value, the liquid level sensor can provide feedback to the control system in the energy storage system 1. The control system can then issue an early warning to relevant personnel to clean the water or initiate automatic drainage.

[0124] As an example, an inclined guide surface can be designed inside the water collection box 14 so that condensate can flow smoothly into the drain pipe.

[0125] The dehumidifier 10 provided in this application embodiment, through the arrangement of the aforementioned shroud 12, fan 13, and water collection box 14, allows the fan 13 to accelerate the heat exchange between the air and the cooling side 11a. Compared with natural convection, forced convection can significantly improve the heat transfer coefficient between the air and the cold surface, thereby significantly increasing the dehumidification capacity of the cooling side 11a and rapidly reducing the humidity in the cabin. The shroud 12 can effectively constrain the airflow path, thereby reducing turbulence and energy loss, and thus improving the heat exchange efficiency between the air and the cooling chip assembly 11. The water collection box 14 effectively collects the condensate generated on the cooling side 11a, thereby reducing the probability of short circuits caused by condensate dripping onto the electrical components of the energy storage system 1, and thus improving the reliability of the energy storage system 1.

[0126] In some embodiments, refer to Figures 9-11 The dehumidifier 10 also includes a third radiator 15.

[0127] The third radiator 15 is installed inside the fan cover 12, and the third radiator 15 is located at least one of the heating side 11b and the liquid cooling pipeline 22.

[0128] The third heat sink 15 may include, but is not limited to, heat dissipation fins or heat pipes, and the embodiments of this application do not limit this.

[0129] As an example, refer to Figure 9 The hot end 111b of the semiconductor cooling chip 111 and the first heat sink 112 together form the heating side 11b, and the third heat sink 15 is installed on the first heat sink 112 on the heating side 11b.

[0130] As an example, refer to Figure 7 and Figure 10 The hot end 111b of the semiconductor cooling chip 111 forms the heating side 11b, and the third heat sink 15 is installed on the liquid cooling pipeline 22.

[0131] As an example, refer to Figure 11 The hot end 111b of the semiconductor cooling chip 111 forms the heating side 11b, and the third heat sink 15 is installed between the heating side 11b and the liquid cooling pipe 22.

[0132] In actual implementation, refer to Figures 9-11 When the dehumidifier 10 is in operation, the hot end 111b of the semiconductor cooling chip 111 generates a large amount of heat. The inserted part of the liquid cooling pipe 22 absorbs a large amount of heat from the hot end 111b through direct contact or indirect heat exchange. The heat carried by the liquid cooling pipe 22 is continuously carried away by the internal circulating coolant. In order to further improve the heat dissipation efficiency based on liquid cooling, a third radiator 15 is added to the heating side 11b and / or the liquid cooling pipe 22. Driven by the fan 13, the high-speed air flows through the fan cover 12, and part of the heat from the hot end 111b is conducted to the third radiator 15. The air and the third radiator 15 undergo forced convection heat exchange, and this part of the heat is quickly dissipated into the air.

[0133] The dehumidifier 10 provided in this embodiment, through the aforementioned third radiator 15, adds a forced air cooling path to the liquid cooling system, forming a composite heat dissipation system combining liquid cooling and forced air cooling. The liquid cooling absorbs most of the heat from the hot end 111b, while the air cooling quickly removes the remaining heat, thereby significantly reducing the temperature of the hot end 111b and enhancing its heat dissipation capacity. Especially under high load conditions, where liquid cooling may be insufficient for rapid heat dissipation, air cooling can improve efficiency. Furthermore, adding an air cooling path can also reduce the burden on the liquid cooling system 20 to some extent, extend its service life, or allow for the use of a smaller power liquid cooling system 20, thus reducing costs.

[0134] This application also discloses an energy storage system 1.

[0135] In some embodiments, refer to Figures 14-16The energy storage system 1 includes: a liquid cooling system 20, a battery system 30, and a dehumidifier 10 as described above.

[0136] The liquid cooling system 20 includes a liquid cooling unit 21 and a liquid cooling pipeline 22 connected to the liquid cooling unit 21. The heating side 11b of the dehumidifier 10 exchanges heat with the liquid cooling pipeline 22 through the housing structure 11b1. The battery system 30 is connected to the liquid cooling system 20 and is used to exchange heat with the liquid cooling unit 21 through the liquid cooling pipeline 22.

[0137] As an example, refer to Figure 14 The battery system 30 and the dehumidifier 10 are connected in parallel on the liquid cooling circuit. Specifically, the low-temperature coolant flowing out of the liquid cooling unit 21 is diverted to the dehumidifier 10 and the battery system 30. This reduces the system flow resistance, and the coolant flow rate of the respective branch of the dehumidifier 10 and the battery system 30 can be adjusted according to demand.

[0138] As an example, refer to Figure 15 The battery system 30 can be connected in series downstream of the dehumidifier 10 in the liquid cooling circuit. Specifically, the low-temperature coolant flowing out of the liquid cooling unit 21 first flows through the battery system 30 and then through the dehumidifier 10. In this way, the coolant flow through the dehumidifier 10 is large, and after being partially heated, it enters the battery system 30, thus slowing down the condensation of the battery system 30.

[0139] As an example, refer to Figure 16 The battery system 30 can be connected in series upstream of the dehumidifier 10 in the liquid cooling circuit. Specifically, the low-temperature coolant flowing out from the liquid cooling unit 21 first flows through the dehumidifier 10 and then through the battery system 30. In this way, the liquid cooling system 20 simultaneously undertakes the functions of battery heat dissipation and heat dissipation of the hot end 111b of the dehumidifier 10. There is no need to redesign the heat dissipation circuit, realizing the functional reuse of the liquid cooling system 20 and improving the integration of the energy storage system 1.

[0140] The energy storage system 1 provided in this application embodiment, through the setting of the dehumidifier 10, realizes the direct insertion installation of the liquid cooling pipe 22, which simplifies the assembly process, reduces the need for sealing measures, thereby improving production efficiency and reducing the number of parts used, thereby reducing production costs. At the same time, it significantly reduces the risk of coolant leakage under long-term use, thereby maintaining the stability of the dehumidification effect and improving the reliability of the energy storage system 1. It also reduces the contact thermal resistance between the liquid cooling pipe 22 and the semiconductor cooling chip 111, thereby improving the heat transfer efficiency and reducing heat accumulation at the hot end 111b.

[0141] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0142] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0143] In the description of this application, "first feature" and "second feature" may include one or more of the features.

[0144] In the description of this application, "multiple" means two or more.

[0145] In the description of this application, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or the first and second features being in contact through another feature between them.

[0146] In the description of this application, the terms "above," "over," and "on top" for the first feature and the second feature include the first feature being directly above or diagonally above the second feature, or simply indicate that the first feature is at a higher horizontal level than the second feature.

[0147] Other configurations of the embodiments of this application, such as ... and ..., and operations, are known to those skilled in the art and will not be described in detail here.

[0148] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0149] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A dehumidifier, used in an energy storage system, characterized in that, include: A cooling chip assembly having a cooling side and a heating side, and including a thermoelectric cooler, the cold end of the thermoelectric cooler forming at least a portion of the cooling side, the cooling side being configured to extend within the compartment of an energy storage system and contact the air within the compartment, the hot end of the thermoelectric cooler forming at least a portion of the heating side; wherein, The heating side has a receiving structure for the liquid cooling pipeline of the liquid cooling system of the energy storage system to pass through, and the wall of the receiving structure is in contact with the outer wall of the liquid cooling pipeline.

2. The dehumidifier according to claim 1, The receiving structure is a through hole, the wall of the through hole is in contact with the outer wall of the liquid cooling pipeline, and the through hole extends a predetermined length along the extension direction of the liquid cooling pipeline; or, The receiving structure is a groove, the wall of which is in contact with the outer wall of the liquid cooling pipeline, and the liquid cooling pipeline has at least two slots that penetrate the groove.

3. The dehumidifier according to claim 1, characterized in that, The cooling chip assembly also includes: The first heat sink, wherein the hot end of the semiconductor cooling chip and the first heat sink form the heating side, the first heat sink includes a connected main board body and an adapter ring, the side of the main board body opposite to the adapter ring is attached to the hot end of the semiconductor cooling chip, and the receiving structure is formed inside the adapter ring.

4. The dehumidifier according to claim 3, characterized in that, The adapter ring is an integrated structure; or, The adapter ring includes multiple detachable and connectable parts. Each part includes a first segment and a second segment connected together. The first segment is used to fit against the outer wall of the liquid cooling pipeline, and the second segment is used to connect to the adjacent part.

5. The dehumidifier according to claim 1, characterized in that, The semiconductor refrigeration chip is a flexible semiconductor refrigeration chip, which is connected end to end to form the housing structure. The hot end forms the heating side, and the hot end is attached to the outer wall of the liquid cooling pipeline.

6. The dehumidifier according to any one of claims 1-5, characterized in that, The cooling chip assembly also includes: The second heat sink is disposed at the cold end of the thermoelectric cooler, and the second heat sink and the cold end of the thermoelectric cooler together form the cooling side.

7. The dehumidifier according to claim 6, characterized in that, Multiple thermoelectric cooling chip assemblies and liquid cooling pipelines are provided in a one-to-one correspondence. The cold ends of the multiple thermoelectric cooling chips are arranged close to each other, and the hot ends of the multiple thermoelectric cooling chips are arranged away from each other. The second heat sink is attached to the multiple cold ends.

8. The dehumidifier according to any one of claims 1-5, characterized in that, Also includes: A fan shroud, wherein a portion of the liquid cooling system and at least a portion of the cooling chip assembly are disposed within the fan shroud; A fan, which is installed on the shroud, is used to drive airflow through the shroud; A water receiving box is located below the cooling side along the direction of gravity.

9. The dehumidifier according to claim 8, characterized in that, Also includes: The third radiator is installed inside the shroud and is located at least once on the heating side and in the liquid cooling pipeline.

10. An energy storage system, characterized in that, include: The dehumidifier as described in any one of claims 1-9; A liquid cooling system, comprising a liquid cooling unit and liquid cooling pipelines connected end-to-end to the liquid cooling unit, wherein the heating side of the dehumidifier exchanges heat with the liquid cooling pipelines through a housing structure; A battery system, which is connected to the liquid cooling system, is used to exchange heat with the liquid cooling unit through the liquid cooling pipeline.

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