Elastic conductive PIN with double springs for protecting wafer
By introducing a dual-spring protection mechanism into the conductive pin device, the problem of wafer damage caused by hard contact in traditional pin devices is solved, achieving effective wafer protection and improved yield.
CN224328923UActive Publication Date: 2026-06-05SHENYANG YINGXIN SEMICONDUCTOR TECHNOLOGY CO LTD
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Patent Information
- Application Number
- CN202521570375.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-25
- Publication Date
- 2026-06-05
- Estimated Expiration
- 2035-07-25
AI Technical Summary
Technical Problem
Traditional conductive pin devices may damage wafers due to hard contact during wafer processing, affecting yield.
Method used
A dual-spring protection mechanism is adopted, including a central spring and a shield spring, which protect the wafer through elastic contact and avoid damage caused by hard contact.
Benefits of technology
It effectively protects the wafer from damage due to excessive pressure, thereby improving the wafer yield.
✦ Generated by Eureka AI based on patent content.
Abstract
The utility model discloses an elastic conductive PIN needle with double springs for protecting a wafer, relates to the technical field of conductive PI N needles, and aims to solve the problem that the wafer is punctured due to poor contact or overweight wafer, the elastic conductive PIN needle comprises a base, a plug wire base and a PIN needle, the plug wire base is arranged on the base through a vacuum screw, and the PIN needle is arranged on the plug wire base. The PINs are mounted on the plug wire base, and the lower half part of the middle shaft is in a two-step shape with the diameter decreasing progressively. Through the protection mechanism of the center shaft spring, the PIN can move downwards for buffering when the PIN receives too large pressure, wafer damage caused by rigid contact between the PIN and the wafer is avoided, through adding the protection mechanism of the shade spring, the wafer bearing force is increased, and through cooperation with the protection mechanism of the center shaft spring, the effect of double protection of wafer damage can be achieved when the wafer is too heavy.
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