A test system for a communication module
By using a combination of development board, evaluation board and connection board in the communication module test system, the problems of high-speed signal loss and high cost were solved, and cost reduction and stable signal path transmission were achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- FIBOCOM WIRELESS
- Filing Date
- 2025-05-26
- Publication Date
- 2026-06-05
AI Technical Summary
In the testing system for communication modules, high-speed signals suffer losses when passing through the switch to the connector, and each evaluation board requires the deployment of a circuit switch, which is costly.
The design employs a combination of development board, evaluation board, and connection board. The evaluation board has multiple physically isolated connection components. The connection board replaces the traditional switching switch, enabling dynamic adjustment of the signal path and avoiding impedance abrupt changes and reflection problems caused by signal path bifurcation.
This reduces the cost of the testing system, minimizes signal loss, and allows damaged connection boards or peripheral sub-modules to be replaced independently, avoiding the need for the entire board to be scrapped.
Smart Images
Figure CN224329476U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of communications, and in particular to a testing system for a communication module. Background Technology
[0002] In the design and application of communication modules, due to the physical limitations of their size, only core functional circuits can be integrated internally. External expansion circuits are required to build a complete functional testing and verification system. Currently, this is typically achieved by providing ADP (Adapter Product) and EVB (Evaluation Board), combined with various peripheral daughterboards to form a system-level test platform, to meet customer needs for prototype verification and certification testing.
[0003] To enhance the reusability and configuration flexibility of the test platform, EVB typically employs a modular circuit design, separating peripheral circuits with different functions into independent pluggable sub-modules. Each sub-module is electrically interconnected with the EVB via a BTB (Board to Board) connector. Since different ADPs support different interface signals for peripherals, circuit switching switches need to be deployed on the EVB to switch the same set of interface signals from the ADP to different BTB connector pins, thus supporting the use of different peripheral circuits. However, high-speed signals experience some loss after passing through the switching switches before reaching the connectors, and the need to deploy circuit switching switches on each EVB results in high costs.
[0004] Therefore, how to provide a solution to the above-mentioned technical problems is a problem that needs to be solved by those skilled in the art. Utility Model Content
[0005] The purpose of this invention is to provide a testing system for communication modules that can avoid impedance abrupt changes and reflection problems caused by signal path bifurcation, thereby reducing costs.
[0006] To solve the above-mentioned technical problems, this utility model provides a testing system for a communication module, comprising:
[0007] The development board is connected to the communication module under test and is used to output the functional test signals of the communication module under test.
[0008] The evaluation board is provided with multiple first connection components. The first pins of the first connection components are connected to the functional test signals. The first connection components are selectively connected to each other through first pins and second pins. The first pins and second pins on the same first connection component are physically isolated.
[0009] When the connecting board is connected to the target first connecting component, it connects n signal pins in the first pin row and n signal pins in the second pin row of the target first connecting component, where n is a non-negative integer.
[0010] Optionally, the connecting board is a bridging board. When the bridging board is connected to the target first connecting component, all signal pins in the first pin row and the second pin row of the target first connecting component are connected one by one.
[0011] Optionally, the first connection component includes a first pin bar and at least one second pin bar;
[0012] The bridge board is provided with a second connection component, which includes a third pin row and at least one fourth pin row. Each signal pin in the third pin row is connected to each signal pin in the target fourth pin row, so that when the second connection component is connected to the target first connection component, all signal pins in the first pin row of the target first connection component are connected to all signal pins in the target second pin row, and the target second pin row is the second pin row that contacts the target fourth pin row.
[0013] Optionally, the connecting board is a first functional board. When the first functional board is connected to the target first connecting component, at least one target signal pin in the first pin row and the second pin row of the target first connecting component is connected one-to-one.
[0014] Optionally, the first functional board is provided with a third connection component, which includes a fifth pin row and a sixth pin row. At least one target signal pin in the fifth pin row and at least one target signal pin on the sixth pin row are connected in a one-to-one correspondence, so that when the third connection component is connected to the target first connection component, at least one target signal pin in the first pin row of the target first connection component is connected in a one-to-one correspondence with at least one target signal pin in the second pin row. The target signal pin in the first pin row is the signal pin that contacts the target signal pin in the fifth pin row, and the target signal pin in the second pin row is the signal pin that contacts the target signal pin in the sixth pin row. The target signal pin is determined based on the functional test signal.
[0015] Optionally, the connecting board includes a second functional board, which disconnects all signal pins in the first pin row and the second pin row of the target first connecting component when the second functional board is connected to the target first connecting component.
[0016] Optionally, the second functional board is provided with a fourth connection component, which includes a seventh pin bar and an eighth pin bar, and the seventh pin bar and the eighth pin bar are physically isolated.
[0017] Optionally, the connecting plate and the first connecting component are connected by a snap-fit.
[0018] Optionally, the dimensions of the traces on the evaluation board for the first and second pin arrays meet the standard impedance requirements of the functional test signals.
[0019] Optionally, the first connection component is a board-to-board connector.
[0020] This application provides a testing system for a communication module. Multiple first connection components are arranged on an evaluation board. The two rows of pins of the same first connection component are physically isolated by default. The connection board replaces the traditional switching switch to realize signal path switching. When the connection board is connected to the corresponding target first connection component, the functional test signal output by the development board can be transmitted to the corresponding peripheral module through the connection board. There is no need to integrate high-cost circuit switching switches on each evaluation board, avoiding impedance abruptness and reflection problems caused by signal path bifurcation, and reducing costs. Attached Figure Description
[0021] To more clearly illustrate the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0022] Figure 1 A schematic diagram of the structure of a test system for a communication module provided by this utility model;
[0023] Figure 2 This is a schematic diagram of the structure of a first connecting component provided by this utility model;
[0024] Figure 3 A schematic diagram of the structure of a test system for another communication module provided by this utility model;
[0025] Figure 4 This is a schematic diagram of the structure of a second connecting component provided by this utility model. Detailed Implementation
[0026] The core of this invention is to provide a testing system for communication modules that can avoid impedance abrupt changes and reflection problems caused by signal path bifurcation, thereby reducing costs.
[0027] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0028] Please refer to Figure 1 This utility model embodiment provides a testing system for a communication module. The testing system includes: a development board 1, connected to the communication module under test (DUT), used to output functional test signals of the DUT; an evaluation board 2, provided with multiple first connection components 11, the first pins of the first connection components 11 are connected to the functional test signals, and the first connection components 11 are selectively connected to each other through first pins and second pins; the first pins and second pins on the same first connection component 11 are physically isolated; and a connection board, which, when connected to the target first connection component 11, connects n signal pins in the first pins and n signal pins in the second pins of the target first connection component 11, where n is a non-negative integer.
[0029] The test system for the communication module in this embodiment consists of at least a development board 1, an evaluation board 2, and a connection board. The development board 1 has a connection component for mounting the communication module under test (DUT). The development board 1 also has a communication output port for outputting functional test signals from the DUT. In this embodiment, the communication output port supports multi-protocol signal output, and the interface layout is compatible with both high-speed differential pairs and single-ended signals. Correspondingly, the functional test signals include, but are not limited to, high-speed signals and low-speed signals. High-speed signals include, but are not limited to, PCIe (Peripheral Component Interconnect Express) signals, USB (Universal Serial Bus) signals, and Ethernet signals. Low-speed signals include, but are not limited to, I2C (Inter-Integrated Circuit) signals, SPI (Serial Peripheral Interface) signals, and UART (Universal Asynchronous Receiver / Transmitter) signals. Of course, functional test signals can also include radio frequency signals, including but not limited to WiFi, Bluetooth, and 5G. NR signals, etc., can be selected according to the actual engineering needs, and this embodiment does not make specific limitations.
[0030] The evaluation board 2 is provided with multiple first connection components 11, each corresponding to a different submodule. For example, assuming two first connection components 11 are included, the first first connection component 11 corresponds to the WiFi submodule, and the second first connection component 11 corresponds to the Ethernet submodule. In this embodiment, the first connection components 11 can specifically be BTB connectors. Each first connection component 11 includes multiple pin rows, denoted as the first pin row and the second pin row. As an optional embodiment, the number of first pin rows is one, and the number of second pin rows is at least one. Each pin row includes the same number of signal pins. For example, refer to... Figure 2 As shown, the first connection component 11 includes two pin rows, each containing nine signal pins. There is physical isolation between multiple pin rows on the same first connection component 11; that is, the initial state of the signal pins of each pin row is physically disconnected to avoid short-stub effects caused by signal forks. Any two first connection components 11 are connected via first and second pin rows. Assuming the evaluation board 2 has two first connection components 11, a second pin row of the first first connection component 11 is connected to a first pin row of the second first connection component 11. It is important to note that the second pin row of the first first connection component 11 needs to be connected to the first pin row of the second first connection component 11 according to the hardware design rules for functional test signals (such as PCIe differential pair impedance matching).
[0031] The connecting board can be detachably connected to any of the first connecting components 11. In this embodiment, the first connecting component 11 connected to the connecting board is defined as the target first connecting component 11. The connecting board is used to connect n signal pins on the first pin row and the second pin row on the target first connecting component 11, thereby dynamically adjusting the transmission path of the functional test signal output by the development board 1. It can be understood that in this embodiment, selecting the corresponding connecting board can achieve connection of all signal pins on the first pin row and the second pin row on the first connecting component 11, connection of some signal pins, or maintenance of the initial state, that is, all signal pins are not connected.
[0032] When all or some signal pins of the first and second pin rows of the first-level connection component 11 are connected under the action of the connection board, the functional test signal output by the development board 1 can be transmitted to the next-level first connection component 11. When all signal pins are not connected, the functional test signal output by the development board 1 is not transmitted to the next-level first connection component 11. Figure 3For example, the evaluation board 2 is equipped with two first connection components 11. The first first connection component 11 corresponds to the WiFi submodule, and the second first connection component 11 corresponds to the Ethernet submodule. The functional test signal output by the development board 1 is first transmitted to the first first connection component 11. Figure 3 (Illustrated by B2B-WiFi) When the connection board is connected to B2B-WiFi, if both rows of signal pins of B2B-WiFi are connected one-to-one (adapting to the scenario of functional testing of the Ethernet submodule), or partially connected (adapting to the scenario of simultaneous functional testing of the WiFi submodule and the Ethernet submodule), the functional test signal output by the development board 1 is transmitted to the second first connection component 11. Figure 3 (Illustrated with B2B-Ethernet). When the connection board is connected to B2B-WiFi, if both rows of signal pins of B2B-WiFi are kept disconnected (in a scenario suitable for WiFi submodule function testing), the function test signal output by development board 1 will not be transmitted down to B2B-Ethernet. In this embodiment, a physical connection board replaces the traditional circuit switch, reducing the cost of a single board. In addition, damaged connection boards or peripheral submodules can be replaced independently, avoiding the scrapping of the entire board.
[0033] As can be seen, in this embodiment, multiple first connection components 11 are arranged on the evaluation board 2. The two rows of pins of the same first connection component 11 are physically isolated by default. The signal path switching is realized by replacing the traditional switching switch with the connection board. When the connection board is connected to the corresponding target first connection component 11, the functional test signal output by the development board 1 can be transmitted to the corresponding peripheral module through the connection board. There is no need to integrate a high-cost circuit switching switch on each evaluation board 2, avoiding impedance change and reflection problems caused by signal path bifurcation, and reducing costs.
[0034] Based on the above embodiments:
[0035] In an exemplary embodiment, the connecting board is a bridge board. When the bridge board is connected to the target first connecting component 11, it connects all the signal pins in the first pin row and the second pin row of the target first connecting component 11 one by one.
[0036] In this embodiment, the connecting board can be a bridge board. The bridge board enables one-to-one communication between all signal pins in the first pin row and the second pin row of the target first connecting component 11. That is, when the bridge board is connected to any first connecting component 11, it can connect all signal pins in the first pin row and the second pin row of that first connecting component 11. (Continuing with...) Figure 3 For example, assuming the functional test signal output by development board 1 is a PCIe signal, when implementing PCIeEthernet functionality, the PCIe signal needs to be bridged to... Figure 3 In the BTB-Ethernet connector, a bridge board is attached to the BTB-WiFi connector. The bridge board adjusts the two rows of signal pins of the BTB-WiFi connector to the actual physical connection state, so that the PCIe signal is transmitted from the BTB-WiFi connector to the BTB-Ethernet connector, realizing the PCIeEthernet function.
[0037] In one exemplary embodiment, the first connection component 11 includes a first pin bar and at least one second pin bar;
[0038] The bridge board is provided with a second connection component 12, which includes a third pin row and at least one fourth pin row. Each signal pin in the third pin row is connected to each signal pin in the target fourth pin row, so that when the second connection component 12 is connected to the target first connection component 11, all signal pins in the first pin row of the target first connection component 11 are connected to all signal pins in the target second pin row, and the target second pin row is the second pin row that is in contact with the target fourth pin row.
[0039] In this embodiment, the bridge board is provided with a second connection component 12. The second connection component 12 and the first connection component 11 include the same number of pin rows, and each pin row includes the same number of signal pins. The size and distribution spacing of each signal pin adopt the same design as the first connection component 11 to ensure that the signal pins can make close contact when the two are connected. This ensures that when the bridge board and the first connection component 11 are connected, the signal pins on the second connection component 12 on the bridge board and the signal pins on the first connection component 11 can make one-to-one contact. In this embodiment, the first connection component 11 includes a first pin row and at least one second pin row. When there are multiple second pin rows, different second pin rows can be connected one-to-one with the first pin rows of different other first connection components 11. Corresponding PCB traces can be designed on the evaluation board 2 to achieve testing of different functions. Correspondingly, when there are multiple second pin rows, the bridge board can also include a third pin row and at least one fourth pin row. All signal pins of the third pin row and one of the fourth pin rows are connected, and this fourth pin row is designated as the target fourth pin row. When the bridge board is connected to the target first connection component 11, the third pin row and the first pin row are in contact, and the target second pin row and the target fourth pin row are in contact, thus ensuring that all signal pins of the first pin row and the target second pin row are connected, transmitting the functional test signal to the first connection component 11 connected to the target second pin row. It is understood that multiple bridge boards can be designed; for example, the third pin row and the first fourth pin row on the first bridge board are connected, the third pin row and the second fourth pin row on the second bridge board are connected, and so on. By attaching different bridge boards, the signal transmission path can be switched.
[0040] For example, suppose the first connection component 11 is as follows: Figure 2 As shown, correspondingly, the second connection component 12 is as follows Figure 4 As shown, the two rows of signal keys on the second connection component 12 are connected via PCB traces. (Refer to...) Figure 3 When the bridge board is attached to the BTB-WiFi connector, the PCIe signal in the BTB-WiFi connector can reach the BTB-Ethernet connector to realize the PCIe Ethernet circuit function. Since this section of PCB trace is very short, it has no impact on high-speed signal attenuation.
[0041] In an exemplary embodiment, the connecting board is a first functional board. When the first functional board is connected to the target first connecting component 11, at least one target signal pin in the first pin row and the second pin row of the target first connecting component 11 is connected in a one-to-one correspondence.
[0042] In this embodiment, the first functional board is used to partially connect the signal pins in the target first connection component 11. The signal pins to be connected are selected based on the functional test signal. The purpose is to transmit the functional test signal output by the development board 1 down to other first connection components 11, thereby supporting mixed signal testing.
[0043] In an exemplary embodiment, the first functional board is provided with a third connection component, which includes a fifth pin row and a sixth pin row. At least one target signal pin in the fifth pin row and at least one target signal pin on the sixth pin row are connected in a one-to-one correspondence, so that when the third connection component is connected to the target first connection component 11, at least one target signal pin in the first pin row of the target first connection component 11 is connected in a one-to-one correspondence with at least one target signal pin in the second pin row. The target signal pin in the first pin row is a signal pin that contacts the target signal pin in the fifth pin row, and the target signal pin in the second pin row is a signal pin that contacts the target signal pin in the sixth pin row. The target signal pin is determined based on a functional test signal.
[0044] In this embodiment, the first functional board is provided with a third connection component. The third connection component and the first connection component 11 include the same number of pin rows, and each pin row includes the same number of signal pins. The size and distribution spacing of each signal pin adopt the same design as the first connection component 11 to ensure that the signal pins can make close contact when the two are connected. The third connection component includes a fifth pin row and a sixth pin row. The target signal pins at corresponding positions on the fifth pin row and the sixth pin row are connected one-to-one through PCB traces. The fifth pin row is physically matched with the first pin row of the target first connection component 11. The sixth pin row is physically matched with the second pin row of the target first connection component 11. When the first functional board and the target first connection component 11 are fastened together, each signal pin in the fifth pin row of the third connection component on the first functional board is in close contact with each signal pin in the first pin row of the target first connection component 11, and each signal pin in the sixth pin row of the third connection component on the first functional board is in close contact with each signal pin in the second pin row of the target first connection component 11, so that the functional test signal is transmitted to the next level first connection component 11 through the connected target signal pin.
[0045] Still with Figure 3 For example, if evaluation board 2 needs to be attached to both the WIFI board and the Ethernet board, then there is no need to use an additional bridge board. On the WIFI board (i.e. the first functional board), the upper and lower rows of signal pins on the B2B-WiFi connector that need to be connected to the B2B-Ethernet connector can be connected together with PCB traces. It only uses a few more pins of the BTB connector, which hardly increases the cost.
[0046] In one exemplary embodiment, the connection board includes a second functional board. When the second functional board is connected to the target first connection component 11, all signal pins in the first pin row and the second pin row of the target first connection component 11 are disconnected.
[0047] In this embodiment, the second functional board is used to maintain the physical isolation between the first pin row and the second pin row of the target first connection component 11. The second functional board is provided with a fourth connection component, which includes a seventh pin row and an eighth pin row, and the seventh pin row and the eighth pin row are physically isolated.
[0048] Still with Figure 3 For example, when you want to implement PCIe WiFi function, you only need to attach the second function board to the BTB-WiFi connector. At this time, the two rows of signal pins on the BTB-WiFi connector are physically disconnected and will not affect the PCIe signal.
[0049] In one exemplary embodiment, the connecting plate and the first connecting component 11 are connected by a snap-fit.
[0050] In this embodiment, the connecting plate and the first connecting component 11 are detachably connected by a snap-fit, which facilitates quick adaptation to more test scenarios. At the same time, it can achieve close contact between the first connecting component 11 and other connecting components on the connecting plate, avoiding poor contact in signal transmission. In mobile test equipment or high vibration environments, the snap-fit structure can prevent accidental detachment. If a single snap-fit is damaged, only the connecting plate or connector assembly needs to be replaced, without scrapping the entire evaluation board 2.
[0051] In one exemplary embodiment, the dimensions of the traces on the evaluation board 2 for the first pin bar and the second pin bar meet the requirements of the standard impedance values for the functional test signals.
[0052] In this embodiment, the standard impedance value of the test signal for the impedance matching function of the first pin bar and the second pin bar can avoid signal reflection caused by impedance change, prevent eye diagram closure or increased jitter, and the impedance matching traces form a complete return path with the reference ground plane to reduce radiated noise. The standardized impedance design ensures consistency between different test boards. For example, when testing the same communication module on multiple EVBs, the result deviation is small.
[0053] In summary, the solution adopted in this embodiment can eliminate the need for a high-speed signal switching switch on the EVB board, reducing the design cost of the EVB; at the same time, the absence of a signal switching switch reduces the loss of high-speed signals.
[0054] It should also be noted that, in this specification, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0055] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A testing system for a communication module, characterized in that, include: The development board is connected to the communication module under test and is used to output the functional test signals of the communication module under test. The evaluation board is provided with multiple first connection components. The first pins of the first connection components are connected to the functional test signals. The first connection components are selectively connected to each other through first pins and second pins. The first pins and second pins on the same first connection component are physically isolated. When the connecting board is connected to the target first connecting component, it connects n signal pins in the first pin row and n signal pins in the second pin row of the target first connecting component, where n is a non-negative integer.
2. The testing system for the communication module according to claim 1, characterized in that, The connecting board is a bridging board. When the bridging board is connected to the target first connecting component, it connects all the signal pins in the first pin row and the second pin row of the target first connecting component one by one.
3. The testing system for the communication module according to claim 2, characterized in that, The first connection component includes a first pin bar and at least one second pin bar; The bridge board is provided with a second connection component, which includes a third pin row and at least one fourth pin row. Each signal pin in the third pin row is connected to each signal pin in the target fourth pin row, so that when the second connection component is connected to the target first connection component, all signal pins in the first pin row of the target first connection component are connected to all signal pins in the target second pin row, and the target second pin row is the second pin row that contacts the target fourth pin row.
4. The testing system for the communication module according to claim 1, characterized in that, The connecting board is a first functional board. When the first functional board is connected to the target first connecting component, at least one target signal pin in the first pin row and the second pin row of the target first connecting component is connected one by one.
5. The testing system for the communication module according to claim 4, characterized in that, The first functional board is provided with a third connection component, which includes a fifth pin row and a sixth pin row. At least one target signal pin in the fifth pin row and at least one target signal pin on the sixth pin row are connected in a one-to-one correspondence, so that when the third connection component is connected to the target first connection component, at least one target signal pin in the first pin row of the target first connection component is connected in a one-to-one correspondence with at least one target signal pin in the second pin row. The target signal pin in the first pin row is the signal pin that contacts the target signal pin in the fifth pin row, and the target signal pin in the second pin row is the signal pin that contacts the target signal pin in the sixth pin row. The target signal pin is determined based on the functional test signal.
6. The testing system for the communication module according to claim 1, characterized in that, The connecting board includes a second functional board. When the second functional board is connected to the target first connecting component, all signal pins in the first pin row and the second pin row of the target first connecting component are disconnected.
7. The testing system for the communication module according to claim 6, characterized in that, The second functional board is provided with a fourth connection component, which includes a seventh pin bar and an eighth pin bar, and the seventh pin bar and the eighth pin bar are physically isolated.
8. The testing system for the communication module according to claim 1, characterized in that, The connecting plate and the first connecting component are connected by snap-fit.
9. The testing system for the communication module according to claim 1, characterized in that, The first connecting component is a board-to-board connector.
10. The testing system for the communication module according to any one of claims 1-9, characterized in that, The dimensions of the traces on the evaluation board for the first and second pin arrays meet the standard impedance requirements of the functional test signals.