Electronic device
By setting a buffer structure between the screen assembly and the hinge, and using reinforcing sheets, protective films and supports to absorb impact, the problem of insufficient protection of the screen buffer structure in foldable phones is solved, and reliability and flatness are improved without increasing thickness.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- BEIJING XIAOMI MOBILE SOFTWARE CO LTD
- Filing Date
- 2025-05-08
- Publication Date
- 2026-06-05
AI Technical Summary
In existing technologies, screen buffer structures are difficult to provide reliable protection in foldable phones, especially in the event of drops and localized impacts, as they cannot effectively absorb the impact force, leading to damage to the screen components.
A buffer structure is provided between the bendable area of the screen assembly and the hinge, including first and second reinforcing sheets, a protective film, a support member, and an adhesive. The flexibility of the polytetrafluoroethylene film and the elasticity of the foam absorb the impact force, and the support member and adhesive provide support, covering the irregularities on the hinge surface and improving the flatness of the screen assembly.
Without increasing the thickness of the buffer structure, the reliability of the screen assembly and hinge is improved, the risk of damage during collisions and drops is reduced, and the crease performance and flatness of the screen assembly are optimized.
Smart Images

Figure CN224329482U_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of electronic technology, and in particular to an electronic device. Background Technology
[0002] In the continuous development of foldable phones, new materials such as high-strength aluminum alloy and carbon fiber are used to reduce the weight and size of the body and hinge, and to achieve a more compact internal layout. Among these, screen cushioning materials play a key role in the phone's reliability and crease optimization. Due to the increasingly thinner and lighter design of mobile phones, the internal space of the phone is constantly being compressed, which greatly limits the space for the placement of screen cushioning structures in related technologies. Only smaller screen cushioning structures can be used. When the phone faces harsh conditions such as drops and localized impacts, the screen cushioning structures in these technologies are unable to provide reliable protection for the folding area of the screen. Utility Model Content
[0003] In view of this, the present disclosure provides an electronic device that can better protect the screen components.
[0004] Specifically, the following technical solutions are included:
[0005] This disclosure provides an electronic device including a hinge, a screen assembly, and a buffer structure. The screen assembly has a bendable region, the hinge is opposite to the bendable region, and the buffer structure is located between the bendable region of the screen assembly and the hinge.
[0006] The buffer structure includes a first reinforcing plate and a second reinforcing plate, which are respectively connected to opposite ends of the hinge along its axial direction.
[0007] In some embodiments of this disclosure, a protective film is provided on the side of the first reinforcing sheet and the second reinforcing sheet away from the hinge. The protective film can undergo elastic deformation when subjected to external impact, thereby absorbing the impact force and improving the reliability of the hinge and screen assembly.
[0008] In some embodiments of this disclosure, the protective film is made of polytetrafluoroethylene (PTFE). PTFE film possesses flexibility, elasticity, and a low coefficient of friction, which can reduce friction between the first and second reinforcing sheets and the screen assembly, making the unfolding and retraction of the screen assembly smoother, and further improving the reliability of the hinge and screen assembly.
[0009] In some embodiments of this disclosure, the buffer structure further includes a first support member. The hinge includes a first floating plate, a second floating plate, and a bracket. The first and second floating plates are movably connected to opposite sides of the bracket, respectively. The first support member is bonded to the bracket and is located between the first reinforcing plate and the second reinforcing plate. The first support member is used to cover the area where the bracket is located, thereby covering surface irregularities such as pits and warping generated during the design, processing, and assembly of the bracket, and providing support for the screen assembly to improve the flatness of the screen assembly.
[0010] In some embodiments of this disclosure, the first support member is provided with a plurality of openings, the extending direction of which is perpendicular to the axial direction of the hinge. When the first support member is attached to the bracket, the openings can expel air between the first support member and the bracket, preventing air bubbles from forming inside the colloid.
[0011] In some embodiments of this disclosure, the buffer structure further includes a second support member and a third support member, wherein the second support member is bonded to the first floating plate, and the third support member is bonded to the second floating plate. The second support member is used to support the screen assembly on the first floating plate, and the third support member is used to support the screen assembly on the second floating plate.
[0012] In some embodiments of this disclosure, the second support member includes a first support strip and a second support strip arranged in parallel. The first support strip is located on the side of the first floating plate closer to the first support member, and the second support strip is located on the side of the first floating plate away from the first support member. The first and second support strips can mitigate the impact of the first floating plate on the screen assembly when the electronic device is dropped, providing better protection for the screen assembly.
[0013] In some embodiments of this disclosure, the third support member includes a third support strip and a fourth support strip arranged in parallel. The third support strip is located on the side of the second floating plate closer to the first support member, and the fourth support strip is located on the side of the second floating plate away from the first support member. The third and fourth support strips can mitigate the impact of the second floating plate on the screen assembly when the electronic device is dropped, providing better protection for the screen assembly.
[0014] In some embodiments of this disclosure, the buffer structure further includes a first adhesive and a second adhesive. The first adhesive is located between the first support strip and the second support strip and is bonded to the first floating plate. The second adhesive is located between the third support strip and the fourth support strip and is bonded to the second floating plate. The first and second adhesives are also bonded to the screen assembly, respectively. The adhesives are used to bond the screen assembly to the first and second floating plates, thereby allowing the screen assembly to unfold or retract with the rotation of the hinge.
[0015] In some embodiments of this disclosure, the first support member, the second support member, and the third support member comprise foam. The foam is lightweight, possesses good elasticity and cushioning properties, can absorb vibration and impact, and also has good sealing properties, providing dust and water resistance.
[0016] The beneficial effects of the technical solutions provided in this disclosure include at least the following:
[0017] In the electronic device provided in this embodiment, a buffer structure is provided between the bendable area of the screen assembly and the hinge. This buffer structure acts as a buffer support between the hinge and the screen assembly, providing protection for both and preventing damage to the electronic device due to collisions or drops. Furthermore, reinforcing plates are provided at opposite ends of the hinge. These reinforcing plates increase the local strength at both ends of the hinge, reducing the impact on the hinge and screen assembly during collisions, thus improving the reliability of the electronic device without increasing the thickness of the buffer structure. The buffer structure covers most of the hinge area, effectively improving surface irregularities such as dents and warping that occur during the design, processing, and assembly of the hinge, enhancing the flatness of the bendable area of the screen assembly, and optimizing crease performance. Attached Figure Description
[0018] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0019] Figure 1 A partial schematic diagram of an electronic device provided in an embodiment of this disclosure;
[0020] Figure 2 A schematic diagram of the buffer structure provided in the embodiments of this disclosure;
[0021] Figure 3 An exploded view of the buffer structure provided in the embodiments of this disclosure;
[0022] Figure 4 A partial schematic diagram of the buffer structure provided in the embodiments of this disclosure;
[0023] Figure 5 This is a partial schematic diagram of a buffer structure provided in an embodiment of the present disclosure.
[0024] The reference numerals in the figure are respectively:
[0025] 1-Hinge; 2-Screen assembly; 3-Buffer structure;
[0026] 101-First float plate; 102-Second float plate; 103-Support; 301-First reinforcing sheet; 302-Second reinforcing sheet; 303-Protective film; 304-First support component; 305-Second support component; 306-Third support component; 307-First colloid; 308-Second colloid; 309-Third colloid; 310-Fourth colloid;
[0027] 3041 - Opening groove; 3051 - First support band; 3052 - Second support band; 3061 - Third support band; 3062 - Fourth support band.
[0028] The accompanying drawings have illustrated specific embodiments of this disclosure, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concepts of this disclosure to those skilled in the art through reference to particular embodiments. Detailed Implementation
[0029] The technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.
[0030] Figure 1 This is a schematic diagram of an electronic device provided according to an embodiment of this disclosure. (As shown...) Figure 1 As shown, the electronic device includes a hinge 1, a screen assembly 2, and a buffer structure 3. The screen assembly 2 has a bendable area, the hinge 1 is opposite to the bendable area, and the buffer structure 3 is located between the bendable area of the screen assembly 2 and the hinge 1. The buffer structure 3 includes a first reinforcing piece 301 and a second reinforcing piece 302, which are respectively connected to opposite ends of the hinge 1 along its axial direction.
[0031] In the electronic device provided in this embodiment, a buffer structure 3 is provided between the bendable area of the screen assembly 2 and the hinge 1. The buffer structure 3 can provide buffer support between the hinge 1 and the screen assembly 2, protecting the screen assembly 2 and the hinge 1 and preventing damage to the electronic device due to collision or drop. Furthermore, a first reinforcing piece 301 and a second reinforcing piece 302 are respectively provided at opposite ends of the hinge 1. The first reinforcing piece 301 and the second reinforcing piece 302 can increase the local strength at both ends of the hinge 1, reducing the impact on the hinge 1 and the screen assembly 2 during collision, and improving the reliability of the electronic device without increasing the thickness of the buffer structure 3. The buffer structure 3 can cover most of the area of the hinge 1, effectively improving surface irregularities such as dents and warping caused by the design, processing, and assembly processes of the hinge 1, improving the flatness of the bendable area of the screen assembly 2, and optimizing crease performance.
[0032] To make the technical solutions and advantages of this disclosure clearer, the embodiments of this disclosure will be described in further detail below with reference to the accompanying drawings.
[0033] like Figure 1 As shown, the electronic device provided in this embodiment includes a hinge 1, a screen assembly 2, and a buffer structure 3. The screen assembly 2 is a foldable flexible screen with a bendable area. The hinge 1 and the bendable area of the screen assembly 2 are disposed opposite to each other. The buffer structure 3 is located between the hinge 1 and the bendable area of the screen assembly 2. The buffer structure 3 is connected to the hinge 1 and can bend as the hinge 1 rotates, thereby providing cushioning and support for the screen assembly 2. The buffer structure 3 includes a first reinforcing piece 301 and a second reinforcing piece 302, which are respectively connected to opposite ends of the hinge 1. When the electronic device is dropped or impacted, the buffer structure 3 can absorb the resulting impact, reducing the risk of damage to the screen assembly 2. Moreover, the first reinforcing piece 301 and the second reinforcing piece 302 can increase the strength of the end of the hinge 1, preventing the hinge 1 from being damaged by the impact. The buffer structure 3 can cover most of the area of the hinge 1, effectively improving the surface irregularities such as pits and warping caused by the hinge 1 in the design, processing and assembly process, improving the flatness of the bendable area of the screen component 2 and optimizing the crease performance.
[0034] Optionally, the first reinforcing sheet 301 and the second reinforcing sheet 302 in the embodiments of this disclosure can be made of metal, such as steel sheet, iron sheet, aluminum alloy sheet, etc.
[0035] It should be noted that the thickness of the buffer structure 3 provided in this embodiment is 0.08mm to 0.13mm, and for example, the thickness of the buffer structure 3 is 0.11mm. The small thickness of the buffer structure 3 helps to reduce the space occupied by the buffer structure 3, so as to adapt to the compact structure inside the electronic device.
[0036] Figure 2 This is a schematic diagram of a buffer structure provided for an embodiment of this disclosure. In some embodiments of this disclosure, such as... Figure 2 As shown, the buffer structure 3 also includes a first support member 304. The hinge 1 includes a first floating plate 101, a second floating plate 102, and a bracket 103. The first floating plate 101 and the second floating plate 102 are movably connected to opposite sides of the bracket 103, respectively. The first support member 304 is bonded to the bracket 103 and is located between the first reinforcing plate 301 and the second reinforcing plate 302. During the unfolding and retraction of the hinge 1, the first floating plate 101 and the second floating plate 102 can rotate relative to the bracket 103. The first support member 304 is used to cover the area where the bracket 103 is located, thereby covering the surface irregularities such as pits and warping generated during the design, processing, and assembly process of the bracket 103, and providing support for the screen assembly 2, improving the flatness of the screen assembly 2.
[0037] In some embodiments of this disclosure, such as Figure 2 As shown, the buffer structure 3 also includes a second support member 305 and a third support member 306. The second support member 305 is bonded to the first floating plate 101, and the third support member 306 is bonded to the second floating plate 102. The second support member 305 and the third support member 306 provide support between the first floating plate 101 and the second floating plate 102 and the screen assembly 2. Gaps are provided between the second support member 305 and the first support member 304, and between the third support member 306 and the first support member 304, to facilitate the bonding of the first support member, the second support member 305, and the third support member 306 to the hinge 1, respectively.
[0038] Figure 3 An exploded view of a buffer structure provided for an embodiment of this disclosure. In some embodiments of this disclosure, such as... Figure 2-3 As shown, the second support member 305 includes a first support strip 3051 and a second support strip 3052 arranged in parallel. The first support strip 3051 is located on the side of the first floating plate 101 closer to the first support member 304, and the second support strip 3052 is located on the side of the first floating plate 101 away from the first support member 304. The first support strip 3051 is located between the first reinforcing piece 301 and the second reinforcing piece 302, and the length of the second support strip 3052 is greater than that of the first support strip 3051. The first support strip 3051 and the second support strip 3052 can reduce the impact of the first floating plate 101 on the screen assembly 2 when the electronic device is dropped, providing better protection for the screen assembly 2.
[0039] Optionally, see Figure 2-3The third support member 306 includes a third support strip 3061 and a fourth support strip 3062 arranged in parallel. The third support strip 3061 is located on the side of the second floating plate 102 closer to the first support member 304, and the fourth support strip 3062 is located on the side of the second floating plate 102 away from the first support member 304. The third support strip 3061 is located between the first reinforcing piece 301 and the second reinforcing piece 302. The fourth support strip 3062 is longer than the third support strip 3061, and the first reinforcing piece 301 and the second reinforcing piece 302 are located between the second support strip 3052 and the fourth support strip 3062. The third support strip 3061 and the fourth support strip 3062 can reduce the impact of the second floating plate 102 on the screen assembly 2 when the electronic device is dropped, providing better protection for the screen assembly 2.
[0040] In some embodiments of this disclosure, such as Figure 2-3 As shown, the buffer structure 3 also includes a first adhesive 307 and a second adhesive 308. The first adhesive 307 is located between the first support strip 3051 and the second support strip 3052 and is bonded to the first floating plate 101. The second adhesive 308 is located between the third support strip 3061 and the fourth support strip 3062 and is bonded to the second floating plate 102. The first adhesive 307 and the second adhesive 308 are also bonded to the screen assembly 2. The first adhesive 307 and the second adhesive 308 are used to bond the screen assembly 2 to the first floating plate 101 and the second floating plate 102 respectively, so that the screen assembly 2 can unfold or retract as the hinge 1 rotates.
[0041] Figure 4 This is a partial schematic diagram of a buffer structure provided for an embodiment of this disclosure. In some embodiments of this disclosure, such as... Figure 4 As shown, the first support member 304 is provided with a plurality of opening slots 3041, the extending direction of the opening slots 3041 being perpendicular to the axial direction of the hinge 1. Optionally, see... Figure 4 The buffer structure 3 also includes a third adhesive 309, which is disposed on the side of the first support 304 away from the screen assembly 2, thereby discontinuously attaching the first support 304 to the bracket 103 of the hinge 1. When the first support 304 is attached to the bracket 103, the opening groove 3041 can expel air between the first support 304 and the bracket 103, preventing air bubbles from forming inside the third adhesive 309.
[0042] Figure 5 This is a partial schematic diagram of a buffer structure provided for an embodiment of this disclosure. In some embodiments of this disclosure, such as... Figure 5 As shown, protective films 303 are respectively provided on the side of the first reinforcing plate 301 and the second reinforcing plate 302 away from the hinge 1. When the protective film 303 is impacted by external force, it can undergo elastic deformation, thereby absorbing the impact force and improving the reliability of the hinge 1 and the screen assembly 2.
[0043] Optionally, the protective film 303 in this embodiment is made of polytetrafluoroethylene (PTFE). PTFE film has flexibility, elasticity, and a low coefficient of friction, which can reduce friction between the first reinforcing sheet 301 and the second reinforcing sheet 302 and the screen assembly 2, making the unfolding and retraction of the screen assembly 2 smoother and further improving the reliability of the hinge 1 and the screen assembly 2. Alternatively, the protective film 303 can also be made of nylon, polyoxymethylene, ultra-high molecular weight polyethylene, etc.
[0044] In some embodiments of this disclosure, see Figure 5 The buffer structure 3 also includes a fourth colloid 310. There may be at least two fourth colloids 310, which are respectively disposed between the first reinforcing sheet 301 and the hinge 1 and between the second reinforcing sheet 302 and the hinge 1. The first reinforcing sheet 301 and the second reinforcing sheet 302 are respectively bonded to the hinge 1 through the fourth colloid 310.
[0045] Optionally, the first support member 304, the second support member 305, and the third support member 306 involved in the embodiments of this disclosure include foam. Foam is lightweight, has good elasticity and cushioning properties, can absorb vibration and impact, and also has good sealing properties, making it dustproof and waterproof.
[0046] It should be noted that the electronic device provided in this disclosure embodiment may be, but is not limited to, a remote control, a tablet computer, an MP3 player (Moving Picture Experts Group Audio Layer III), an MP4 player (Moving Picture Experts Group Audio Layer IV), a laptop computer, or other electronic devices with a foldable screen. This electronic device may also be referred to as a user device, a portable terminal, a laptop terminal, or other similar names.
[0047] It should be noted that in this article, "several" and "at least one" refer to one or more, while "multiple" and "at least two" refer to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. The character " / " generally indicates that the preceding and following related objects have an "or" relationship.
[0048] In the description of this disclosure, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.
[0049] In this disclosure, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0050] In the description of this disclosure, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.
[0051] In the description of this specification, the references to the terms "certain embodiments", "one embodiment", "some embodiments", "illustrative embodiment", "example", "specific example", or "some examples" refer to specific features, structures, materials, or characteristics described in connection with the embodiments or examples that are included in at least one embodiment or example of this disclosure.
[0052] The above description is merely an embodiment of this disclosure and is not intended to limit this disclosure. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the protection scope of this disclosure.
Claims
1. An electronic device, characterized in that, It includes a hinge (1), a screen assembly (2) and a buffer structure (3), the screen assembly (2) having a bendable area, the hinge (1) being opposite to the bendable area, and the buffer structure (3) being located between the bendable area of the screen assembly (2) and the hinge (1). The buffer structure (3) includes a first reinforcing plate (301) and a second reinforcing plate (302), which are respectively connected to opposite ends of the hinge (1) along the axial direction.
2. The electronic device according to claim 1, characterized in that, The first reinforcing sheet (301) and the second reinforcing sheet (302) are respectively provided with protective films (303) on the side away from the hinge (1).
3. The electronic device according to claim 2, characterized in that, The protective film (303) is made of polytetrafluoroethylene.
4. The electronic device according to any one of claims 1 to 3, characterized in that, The buffer structure (3) further includes a first support member (304), and the hinge (1) includes a first float plate (101), a second float plate (102) and a bracket (103). The first float plate (101) and the second float plate (102) are movably connected to opposite sides of the bracket (103), the first support member (304) is bonded to the bracket (103), and the first support member (304) is located between the first reinforcing plate (301) and the second reinforcing plate (302).
5. The electronic device according to claim 4, characterized in that, The first support member (304) is provided with a plurality of opening slots (3041), and the extending direction of the opening slots (3041) is perpendicular to the axial direction of the hinge (1).
6. The electronic device according to claim 4, characterized in that, The buffer structure (3) further includes a second support member (305) and a third support member (306), wherein the second support member (305) is bonded to the first float plate (101) and the third support member (306) is bonded to the second float plate (102).
7. The electronic device according to claim 6, characterized in that, The second support member (305) includes a first support belt (3051) and a second support belt (3052) arranged in parallel. The first support belt (3051) is located on the side of the first float (101) close to the first support member (304), and the second support belt (3052) is located on the side of the first float (101) away from the first support member (304).
8. The electronic device according to claim 7, characterized in that, The third support member (306) includes a third support belt (3061) and a fourth support belt (3062) arranged in parallel. The third support belt (3061) is located on the side of the second float (102) closer to the first support member (304), and the fourth support belt (3062) is located on the side of the second float (102) away from the first support member (304).
9. The electronic device according to claim 8, characterized in that, The buffer structure (3) further includes a first colloid (307) and a second colloid (308). The first colloid (307) is located between the first support strip (3051) and the second support strip (3052) and is bonded to the first floating plate (101). The second colloid (308) is located between the third support strip (3061) and the fourth support strip (3062) and is bonded to the second floating plate (102). The first colloid (307) and the second colloid (308) are also bonded to the screen assembly (2) respectively.
10. The electronic device according to claim 6, characterized in that, The first support member (304), the second support member (305) and the third support member (306) comprise foam.