Switching cabinet structure

Abstract

The utility model discloses a kind of switch shell structure, it is related to switch technical field;The switch shell structure includes shell body, the inside of shell body is divided into interface area and chip area, wherein the interface area is used to accommodate network interface, the chip area is used to accommodate processing chip, the network interface is electrically connected with the processing chip;Interface area and the chip area are mutually separated by heat dissipation channel between, and the heat dissipation channel is in the shape of a Chinese character, and the chip area is arranged in the Chinese character inside of heat dissipation channel;Heat dissipation airflow is arranged in the heat dissipation channel and flows;The switch shell structure further includes first radiating fin and second radiating fin.The technical scheme provided by the utility model can realize the modification of the shell structure of switch, so that it can effectively radiate cooling.

Description

Technical Field

[0001] This utility model relates to the field of switch technology, and in particular to a switch housing structure. Background Technology

[0002] A switch is a network device used for forwarding photoelectric signals. It provides a dedicated electrical signal path for any two network nodes connected to the switch. Switches generate a significant amount of heat during data processing, and heat buildup can degrade their performance and stability. Current technology often employs simple switch housings, which are ineffective at dissipating and cooling the switch.

[0003] It should be noted that the above content is only used to help understand the technical solution of this utility model, and does not represent an admission that the above content is prior art. Utility Model Content

[0004] The main purpose of this utility model is to propose a switch housing structure, which aims to modify the switch housing structure to enable it to effectively dissipate heat and reduce temperature.

[0005] To achieve the above objectives, this utility model proposes a switch housing structure, including a housing body. The interior of the housing body is divided into an interface area and a chip area. The interface area is used to accommodate network interfaces, and the chip area is used to accommodate processing chips. The network interfaces are electrically connected to the processing chips. The interface area and the chip area are separated from each other by a heat dissipation channel, and the heat dissipation channel has a U-shaped structure. The chip area is located inside the U-shaped heat dissipation channel. A heat dissipation airflow flows through the heat dissipation channel.

[0006] The switch housing structure further includes a first heat sink and a second heat sink. The first end of the first heat sink is connected to the heat-generating end of the network interface, and the second end of the first heat sink extends into the heat dissipation channel. The first end of the second heat sink is connected to the heat-generating end of the processing chip, and the second end of the second heat sink extends into the heat dissipation channel.

[0007] In one embodiment, the number of the second heat dissipation fins is greater than the number of the first heat dissipation fins.

[0008] In one embodiment, the heat dissipation channel includes a first heat dissipation sub-channel and a second heat dissipation sub-channel arranged vertically, and the first heat dissipation sub-channel and the second heat dissipation sub-channel are isolated from each other by a partition plate; the flow directions of the heat dissipation airflow in the first heat dissipation sub-channel and the second heat dissipation sub-channel are opposite to each other.

[0009] In one embodiment, a first cooling fan is provided at the beginning of the first heat dissipation sub-channel, and a first heat dissipation hole is provided at the end of the first heat dissipation sub-channel; a second cooling fan is provided at the beginning of the second heat dissipation sub-channel, and a second heat dissipation hole is provided at the end of the second heat dissipation sub-channel.

[0010] In one embodiment, guide plates are respectively provided at both ends of the partition plate along the setting path of the heat dissipation channel. The guide plates are inclined and the inclined surface of the guide plates faces the first cooling fan or the second cooling fan.

[0011] In one embodiment, the air inlets of the first cooling fan and the second cooling fan are provided with a filter structure; and / or, the first heat dissipation hole and the second heat dissipation hole are provided with a filter structure.

[0012] In one embodiment, the second ends of the first heat dissipation fin and the second heat dissipation fin are configured as a bifurcated structure, including a first bifurcated portion and a second bifurcated portion, wherein the first bifurcated portion extends to the first heat dissipation sub-channel and the second bifurcated portion extends to the second heat dissipation sub-channel.

[0013] In one embodiment, the housing body is provided with a connection channel, the connection channel is provided with a flexible circuit board, and the network interface and the processing chip are electrically connected to each other through the flexible circuit board.

[0014] In one embodiment, the chip area is provided with a mounting plate and a liquid cooling device, and the processing chip is mounted on the mounting plate; the liquid cooling device includes a liquid cooling pipe disposed in the mounting plate.

[0015] In one embodiment, the liquid cooling pipe is arranged in a serpentine bend within the mounting plate.

[0016] Considering that the heat generated by the processing chip during data processing in a switch is greater than that generated by the network interface, this invention divides the interior of the housing into an interface area and a chip area, which respectively house the network interface and the processing chip. A heat dissipation channel separates the interface area and the chip area to prevent heat from flowing from the chip area to the interface area. The heat dissipation channel has a U-shaped structure, with the chip area positioned inside the U-shape. This ensures that the connection area between the chip area and the heat dissipation channel is larger than that between the interface area and the heat dissipation channel. Consequently, the airflow in the heat dissipation channel has a greater cooling effect on the chip area than on the interface area, thus providing targeted cooling for the switch. Furthermore, a first heat dissipation fin and a second heat dissipation fin serve as the heat dissipation medium for the interface area and the chip area, respectively, thereby modifying the switch's housing structure and improving its cooling performance. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A schematic diagram of an embodiment of the switch housing structure provided by this utility model (the arrows in the figure indicate the flow direction of the heat dissipation airflow).

[0019] Figure 2 for Figure 1 Sectional view along line A;

[0020] Figure 3 for Figure 1 Sectional view along line B;

[0021] Figure 4 A schematic diagram of the mounting plate in one embodiment of the switch housing structure provided by this utility model.

[0022] Explanation of reference numerals in the attached figures:

[0023] 100. Housing body; 110. Interface area; 120. Chip area; 130. Connection channel;

[0024] 200, Network interface; 300, Processing chip; 400, Heat dissipation channel; 410, First heat dissipation sub-channel; 411, First cooling fan; 412, First heat dissipation hole; 420, Second heat dissipation sub-channel; 421, Second cooling fan; 430, Partition plate; 440, Guide plate;

[0025] 500, First heat dissipation fin; 510, First branch; 520, Second branch; 600, Second heat dissipation fin; 700, Flexible circuit board; 800, Mounting plate; 900, Liquid cooling pipe;

[0026] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0027] The technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, what is described is only a part of the embodiments of this utility model, and not all of the embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this utility model.

[0028] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0029] Furthermore, it should be noted that the descriptions involving "first," "second," etc., in this utility model are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this utility model.

[0030] Switches generate a significant amount of heat during data processing, and this heat buildup can degrade their performance and stability. Current technology often employs simple switch housings, which are ineffective at dissipating and cooling the switch.

[0031] To solve the above-mentioned technical problems, this utility model proposes a switch housing structure.

[0032] Please see Figures 1 to 4 In one embodiment of this utility model, the switch housing structure includes a housing body 100. The interior of the housing body 100 is divided into an interface area 110 and a chip area 120. The interface area 110 is used to accommodate a network interface 200, and the chip area 120 is used to accommodate a processing chip 300. The network interface 200 is electrically connected to the processing chip 300. The interface area 110 and the chip area 120 are separated from each other by a heat dissipation channel 400, and the heat dissipation channel 400 has a U-shaped structure. The chip area 120 is disposed inside the U-shape of the heat dissipation channel 400. A heat dissipation airflow flows in the heat dissipation channel 400.

[0033] The switch housing structure also includes a first heat sink 500 and a second heat sink 600. The first end of the first heat sink 500 is connected to the heat-generating end of the network interface 200, and the second end of the first heat sink 500 extends into the heat dissipation channel 400. The first end of the second heat sink 600 is connected to the heat-generating end of the processing chip 300, and the second end of the second heat sink 600 extends into the heat dissipation channel 400.

[0034] Considering that the heat generated by the processing chip 300 during data processing is greater than that generated by the network interface 200, this invention divides the interior of the housing 100 into an interface area 110 and a chip area 120, where the interface area 110 and the chip area 120 respectively accommodate the network interface 200 and the processing chip 300. A heat dissipation channel 400 separates the interface area 110 and the chip area 120 to prevent heat from flowing from the chip area 120 to the interface area 110. The heat dissipation channel 400 has a U-shaped structure, further protecting the chip area 120. The heat dissipation fins 500 and 600 are arranged inside the U-shaped heat dissipation channel 400, making the connection area between the chip area 120 and the heat dissipation channel 400 larger than that between the interface area 110 and the heat dissipation channel 400. As a result, the heat dissipation airflow in the heat dissipation channel 400 has a greater heat dissipation effect on the chip area 120 than on the interface area 110, thus providing targeted heat dissipation and cooling for the switch. At the same time, the first heat dissipation fin 500 and the second heat dissipation fin 600 are set as heat dissipation mediums for the interface area 110 and the chip area 120, respectively, thereby modifying the switch's shell structure and improving its heat dissipation and cooling effect.

[0035] Furthermore, the number of second heat dissipation fins 600 is greater than the number of first heat dissipation fins 500. This arrangement takes into account that the heat generated by the processing chip 300 during data processing is greater than that of the network interface 200. Based on this consideration, this embodiment uses more second heat dissipation fins 600 than first heat dissipation fins 500, resulting in a higher heat dissipation effect for the processing chip 300 than for the network interface 200, thus meeting actual heat dissipation requirements and providing more targeted heat dissipation. Moreover, since the chip area 120 is located inside the U-shaped heat dissipation channel 400, the connection area between the chip area 120 and the heat dissipation channel 400 is larger than the connection area between the interface area 110 and the heat dissipation channel 400, thus providing more space for the arrangement of the second heat dissipation fins 600.

[0036] As a preferred embodiment of the above, the heat dissipation channel 400 includes a first heat dissipation sub-channel 410 and a second heat dissipation sub-channel 420 arranged vertically, and the first heat dissipation sub-channel 410 and the second heat dissipation sub-channel 420 are isolated from each other by a partition plate 430; the flow directions of the heat dissipation airflow in the first heat dissipation sub-channel 410 and the second heat dissipation sub-channel 420 are opposite to each other. With this configuration, considering that the cooling airflow will exchange heat with the first heat dissipation fin 500 and the second heat dissipation fin 600 during the flow process, the temperature of the cooling airflow at the end of the cooling channel 400 is higher than the temperature at the beginning of the cooling channel 400, resulting in uneven heat dissipation in the interface area 110 and the chip area 120. Based on the above considerations, this embodiment sets the cooling channel 400 as a first cooling sub-channel 410 and a second cooling sub-channel 420 arranged vertically, and the flow direction of the cooling airflow in the first cooling sub-channel 410 and the second cooling sub-channel 420 is opposite to each other. In this way, the beginning of the first cooling sub-channel 410 corresponds to the end of the second cooling sub-channel 420, and the end of the first cooling sub-channel 410 corresponds to the beginning of the second cooling sub-channel 420, so that the temperature of the cooling airflow at the end of the cooling channel 400 is basically the same as the temperature at the beginning of the cooling channel 400, avoiding the occurrence of uneven heat dissipation.

[0037] Furthermore, a first cooling fan 411 is provided at the beginning of the first heat dissipation sub-channel 410, and a first heat dissipation hole 412 is provided at the end of the first heat dissipation sub-channel 410; a second cooling fan 421 is provided at the beginning of the second heat dissipation sub-channel 420, and a second heat dissipation hole is provided at the end of the second heat dissipation sub-channel 420 (not shown in the attached figure). With this configuration, part of the external gas flows through the first heat dissipation sub-channel 410 under the action of the first cooling fan 411 to form a cooling airflow, and is finally discharged from the first heat dissipation hole 412; the other part flows through the second heat dissipation sub-channel 420 under the action of the second cooling fan 421 to form a cooling airflow, and is finally discharged from the second heat dissipation hole; thereby ensuring the smooth implementation of the technical solution of this application, with a simple structure and strong practicality.

[0038] Furthermore, guide plates 440 are respectively provided at both ends of the partition plate 430 along the setting path of the heat dissipation channel 400. The guide plates 440 are inclined and the inclined surface of the guide plates 440 faces the first heat dissipation fan 411 or the second heat dissipation fan 421. Considering the large size of the first cooling fan 411 and the second cooling fan 421, and the small area at the beginning of the first cooling sub-channel 410 and the second cooling sub-channel 420 after the heat dissipation channel 400 is divided into the first cooling sub-channel 410 and the second cooling sub-channel 420, in order to ensure that the cooling airflow introduced by the first cooling fan 411 and the second cooling fan 421 can flow entirely to the first cooling sub-channel 410 and the second cooling sub-channel 420, this embodiment provides guide plates 440 at both ends of the setting path of the heat dissipation channel 400. The inclined guide plates 440 indirectly increase the area at the beginning of the first cooling sub-channel 410 and the second cooling sub-channel 420, so that under the guidance of the guide plates 440, the cooling airflow can flow entirely to the first cooling sub-channel 410 and the second cooling sub-channel 420. The structure is simple and practical.

[0039] Furthermore, the air inlets of the first cooling fan 411 and the second cooling fan 421 are provided with filter structures (not shown in the attached drawings); and / or, the first heat dissipation hole 412 and the second heat dissipation hole are provided with filter structures (not shown in the attached drawings). This arrangement utilizes the filter structures to filter dust in the air, preventing dust from entering the heat dissipation channel 400 along with the air and causing contamination of the first heat dissipation sub-channel 410 or the second heat dissipation sub-channel 420.

[0040] Furthermore, the second ends of the first heat sink 500 and the second heat sink 600 are configured as a bifurcated structure, including a first bifurcated portion 510 and a second bifurcated portion 520. The first bifurcated portion 510 extends into the first heat dissipation sub-channel 410, and the second bifurcated portion 520 extends into the second heat dissipation sub-channel 420. This configuration ensures that the second ends of the first heat sink 500 and the second heat sink 600 can simultaneously extend into the first heat dissipation sub-channel 410 and the second heat dissipation sub-channel 420, thereby ensuring effective heat dissipation and cooling of the network interface 200 and the processing chip 300.

[0041] As a preferred embodiment of the above, the housing body 100 is provided with a connection channel 130, and a flexible circuit board 700 is provided in the connection channel 130. The network interface 200 and the processing chip 300 are electrically connected to each other through the flexible circuit board 700. This configuration utilizes the flexible circuit board 700, which can be flexibly bent, as the connection medium between the network interface 200 and the processing chip 300, freeing it from the limitation of the location of the connection channel 130 and improving configuration flexibility.

[0042] In this embodiment, two connection channels 130 are provided; after understanding the technical solution of this application, those skilled in the art can set three or four connection channels 130 without creative effort, and these should also fall within the protection scope of this application.

[0043] As a preferred embodiment of the above, the chip area 120 is provided with a mounting plate 800 and a liquid cooling device (not shown in the figures), and the processing chip 300 is mounted on the mounting plate 800; the liquid cooling device includes a liquid cooling pipe 900 disposed in the mounting plate 800. With this configuration, since the heating of the processing chip 300 will inevitably cause the mounting plate 800 to heat up, the cooling principle of the liquid cooling device is mainly through heat exchange between the liquid cooling pipe 900 and the mounting plate 800, thereby cooling the mounting plate 800 and subsequently cooling the processing chip 300. This further improves the heat dissipation and cooling effect on the processing chip 300, resulting in a simple structure and strong practicality. The liquid cooling device is a conventional technical means, therefore, it will not be described in detail in this application.

[0044] Furthermore, the liquid cooling pipe 900 is arranged in a serpentine bend within the mounting plate 800. This arrangement, utilizing the serpentine bend, increases the connection area between the liquid cooling pipe 900 and the mounting plate 800, thereby further improving the cooling effect on the mounting plate 800, and consequently improving the cooling effect on the processing chip 300.

[0045] It should be noted that other aspects of the switch housing structure disclosed in this utility model are existing technologies and will not be described in detail here.

[0046] The above are merely optional embodiments of this utility model and do not limit the patent scope of this utility model. Any application of this utility model directly or indirectly in other related technical fields is included within the patent protection scope of this utility model.

Claims

1. A switch housing structure, characterized in that, The device includes a housing body, the interior of which is divided into an interface area and a chip area. The interface area is used to accommodate a network interface, and the chip area is used to accommodate a processing chip. The network interface is electrically connected to the processing chip. The interface area and the chip area are separated from each other by a heat dissipation channel, and the heat dissipation channel has a U-shaped structure. The chip area is located inside the U-shaped heat dissipation channel. A heat dissipation airflow flows through the heat dissipation channel. The switch housing structure further includes a first heat dissipation fin and a second heat dissipation fin. The first end of the first heat dissipation fin is connected to the heat-generating end of the network interface, and the second end of the first heat dissipation fin extends into the heat dissipation channel. The first end of the second heat sink fin is connected to the heat-generating end of the processing chip, and the second end of the second heat sink fin extends into the heat dissipation channel.

2. The switch housing structure as described in claim 1, characterized in that: The number of the second heat dissipation fins is greater than the number of the first heat dissipation fins.

3. The switch housing structure as described in claim 1, characterized in that: The heat dissipation channel includes a first heat dissipation sub-channel and a second heat dissipation sub-channel arranged vertically, and the first heat dissipation sub-channel and the second heat dissipation sub-channel are isolated from each other by a partition plate; the flow direction of the heat dissipation airflow in the first heat dissipation sub-channel and the second heat dissipation sub-channel is opposite to that of each other.

4. The switch housing structure as described in claim 3, characterized in that: The first heat dissipation sub-channel is provided with a first heat dissipation fan at its beginning and a first heat dissipation hole at its end; the second heat dissipation sub-channel is provided with a second heat dissipation fan at its beginning and a second heat dissipation hole at its end.

5. The switch housing structure as described in claim 4, characterized in that: The partition plate has guide plates at both ends along the path of the heat dissipation channel. The guide plates are inclined and the inclined surface of the guide plates faces the first cooling fan or the second cooling fan.

6. The switch housing structure as described in claim 4, characterized in that: The air inlets of the first cooling fan and the second cooling fan are provided with a filter structure; and / or, the first heat dissipation hole and the second heat dissipation hole are provided with a filter structure.

7. The switch housing structure as described in claim 4, characterized in that: The second ends of the first heat dissipation fin and the second heat dissipation fin are configured as a bifurcated structure, including a first bifurcated portion and a second bifurcated portion, wherein the first bifurcated portion extends to the first heat dissipation sub-channel and the second bifurcated portion extends to the second heat dissipation sub-channel.

8. The switch housing structure as described in claim 1, characterized in that: The housing body is provided with a connection channel, and the connection channel is provided with a flexible circuit board. The network interface and the processing chip are electrically connected to each other through the flexible circuit board.

9. The switch housing structure as described in claim 1, characterized in that: The chip area is provided with a mounting plate and a liquid cooling device, and the processing chip is mounted on the mounting plate; the liquid cooling device includes a liquid cooling pipe, which is disposed in the mounting plate.

10. The switch housing structure as described in claim 9, characterized in that: The liquid cooling pipe is arranged in a serpentine bend within the mounting plate.

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