A hot air type tin spraying device for processing printed circuit boards

Abstract

The utility model relates to circuit board processing technical field, concretely discloses a hot gas formula tin -spraying device for printed circuit board processing, including processing bin, the left side of processing bin is provided with preheating subassembly, the inside of processing bin is provided with clamping subassembly, through the step -by -step heating of heating lamp inside preheating subassembly, to slow heating reduces the thermal stress of circuit board, cooperate infrared thermometer real -time detection heating temperature simultaneously, guarantee the stability of temperature, subsequently through clamping subassembly clamping circuit board, immerse tin liquid groove inside, after finishing, circuit board is placed in the surface of right side conveyer belt, through the operation of hot -blast even subassembly's hot -blast machine, the hot blast is guided into the inside of each fixed base in the bottom through first gas duct, subsequently through the inner nozzle and outer nozzle set up of fixed base bottom tin liquid on circuit board surface blows flat, guarantees the evenness of tin layer thickness, the hot blast that blows out simultaneously accesses the nitrogen gas in the nitrogen gas tank, reduces the oxidation and high temperature corrosion of circuit board.

Description

Technical Field

[0001] This utility model relates to the field of circuit board processing technology, specifically a hot air tin spraying device for printed circuit board processing. Background Technology

[0002] Circuit boards, also known as printed circuit boards, are treated with hot air soldering (HASL). HASL is a process for surface treatment of PCBs. It involves coating the PCB surface with a layer of molten tin-lead solder and then leveling (blowing) this solder layer with heated compressed air. This creates a coating that resists copper oxidation and provides good solderability. However, existing HASL techniques often suffer from insufficient preheating and rapid heating / cooling, leading to thermal stress concentration and PCB deformation. This affects the fluidity of the molten solder, resulting in uneven solder layer thickness and impacting the reliability of subsequent soldering. Therefore, we propose a hot air HASL device for PCB processing. Utility Model Content

[0003] The purpose of this invention is to provide a hot air tin spraying device for printed circuit board processing, so as to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a hot air tin spraying device for printed circuit board processing, comprising a processing chamber, a preheating component arranged on the left side of the processing chamber, a clamping component arranged inside the processing chamber, and a hot air uniform component arranged on the right side inside the processing chamber. The preheating component is used to preheat the circuit board, the clamping component is used to clamp and fix the circuit board for moving processing, and the hot air uniform component is used to blow the molten solder on the surface of the circuit board to ensure uniform solder layer thickness.

[0005] The hot air uniformity component includes a support frame, a hot air blower fixedly connected to the top rear side of the support frame, a first air guide pipe fixedly connected to the output end of the hot air blower, the other end of the first air guide pipe passing through the plate of the support frame and extending into the box, a nitrogen box fixedly connected to the top of the support frame, a second air guide pipe fixedly connected to the rear side of the nitrogen box, the other end of the second air guide pipe fixedly connected to the front side of the pipe body of the first air guide pipe, and several fixed seats fixedly connected to the bottom of the support frame, several external nozzles fixedly connected to the outer side of the bottom of each fixed seat, and several internal nozzles fixedly connected to the inner side of the bottom of each fixed seat.

[0006] The preheating component includes a preheating chamber, the interior of which is divided into multiple sections by partitions. Heating lamps are fixedly connected to the top inner wall of the preheating chamber, and infrared thermometers are installed on the inner side of each heating lamp. There are a total of three heating lamps and infrared thermometers.

[0007] The clamping assembly includes a movable frame, a limiting groove, a fixed shaft seat, and a shaped push plate. Two electric push rods are fixedly connected to the front of the movable frame. The rods of the electric push rods are connected to the shaped push plate. The shaped push plate is rotatably connected inside the fixed shaft seat. A sliding plate is rotatably connected to the top of the shaped push plate. The sliding plate is slidably connected inside the limiting groove. Several first L-shaped fixing rods are fixedly connected to the bottom left and right sides of the sliding plate. Several second L-shaped fixing rods are fixedly connected to the bottom of the limiting groove. The movable plate is rotatably connected to the outer sides of the first L-shaped fixing rods and the second L-shaped fixing rods.

[0008] The inner walls of both sides of the mobile frame are fixedly connected with several fixed plates, and the bottom inner sides of the fixed plates and the mobile plate are fixedly connected with anti-slip pads.

[0009] The right side of the processing chamber is fixedly connected to a motor, the output end of the motor is fixedly connected to a threaded rod, and the outer side of the threaded rod is threadedly connected to a threaded seat.

[0010] The bottom of the threaded seat is fixedly connected to a telescopic cylinder, and the bottom of the telescopic cylinder rod is connected to the moving frame.

[0011] The top inner wall of the processing chamber is fixedly connected to a sliding groove, and the threaded seat is slidably connected inside the sliding groove.

[0012] The bottom inner wall of the processing chamber is fixedly connected to a molten solder tank, and conveyor belts are installed on both the left and right sides of the molten solder tank. A viewing window is installed on the front side of the processing chamber.

[0013] This utility model has at least the following beneficial effects:

[0014] The circuit board is placed on the conveyor belt and passes through the interior of the left-side preheating component. The heating lamps inside the preheating component gradually heat the board, reducing thermal stress. An infrared thermometer monitors the heating temperature in real time to ensure stability. The circuit board is then held in place by a clamping component and immersed in the molten solder bath. Afterward, the circuit board is lifted and placed on the surface of the right-side conveyor belt. A hot air blower inside the hot air uniformity component directs hot air through the first air duct to the fixing seats at various points at the bottom. The inner and outer nozzles at the bottom of the fixing seats then blow the molten solder onto the circuit board surface, ensuring a uniform solder layer thickness. Simultaneously, the blown hot air is connected to nitrogen in a nitrogen tank to reduce oxidation and high-temperature corrosion of the circuit board. Attached Figure Description

[0015] Figure 1 This is a three-dimensional view of the structure of this utility model;

[0016] Figure 2 This is a side view of the structure of this utility model;

[0017] Figure 3 This is a cross-sectional view of the internal structure of this utility model;

[0018] Figure 4 This is a first sectional view of the internal structure of the clamping assembly of this utility model;

[0019] Figure 5 This is a second sectional view of the internal structure of the clamping assembly of this utility model;

[0020] Figure 6 This is a schematic diagram of the hot air uniformity component structure of this utility model;

[0021] Figure 7 This is a cross-sectional schematic diagram of the nozzle structure of the hot air uniformity component of this utility model.

[0022] In the diagram: 1. Preheating assembly; 101. Heating lamp; 102. Infrared thermometer; 103. Partition; 104. Preheating chamber; 2. Processing chamber; 3. Viewing window; 4. Motor; 5. Conveyor belt; 6. Telescopic cylinder; 7. Sliding groove; 8. Hot air uniform assembly; 801. Support frame; 802. Nitrogen tank; 803. First air guide pipe; 804. Hot air blower; 805. Second air guide pipe; 806. Fixing base; 807. Inner nozzle ; 808, External nozzle; 9, Solder bath; 10, Clamping assembly; 1001, Moving frame; 1002, Limiting groove; 1003, Sliding plate; 1004, Electric push rod; 1005, First L-shaped fixing rod; 1006, Second L-shaped fixing rod; 1007, Fixing plate; 1008, Anti-slip pad; 1009, Moving plate; 1010, Fixed shaft seat; 1011, Irregular push plate; 11, Threaded seat; 12, Threaded rod. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Example 1

[0025] Please see Figures 1 to 7 This utility model provides a technical solution: a hot air tin spraying device for printed circuit board processing, including a processing chamber 2, a preheating component 1 on the left side of the processing chamber 2, a clamping component 10 inside the processing chamber 2, and a hot air uniform component 8 inside the processing chamber 2. The preheating component 1 is used to preheat the circuit board, the clamping component 10 is used to clamp and fix the circuit board for moving processing, and the hot air uniform component 8 is used to blow the molten solder on the surface of the circuit board to ensure uniform solder layer thickness.

[0026] The hot air uniformity component 8 includes a support frame 801. A hot air blower 804 is fixedly connected to the top rear side of the support frame 801. A first air guide pipe 803 is fixedly connected to the output end of the hot air blower 804. The other end of the first air guide pipe 803 passes through the plate of the support frame 801 and extends into the box. A nitrogen box 802 is fixedly connected to the top of the support frame 801. A second air guide pipe 805 is fixedly connected to the rear side of the nitrogen box 802. The other end of the second air guide pipe 805 is fixedly connected to the front side of the pipe body of the first air guide pipe 803. Several fixed seats 806 are fixedly connected to the bottom of the support frame 801. Several external nozzles 808 are fixedly connected to the outer side of the bottom of each fixed seat 806. Several internal nozzles 807 are fixedly connected to the inner side of the bottom of each fixed seat 806.

[0027] The circuit board is placed on the conveyor belt 5 and passes through the interior of the left preheating component 1. It is heated step by step by the heating lamp 101 inside the preheating component 1, thereby slowly increasing the temperature and reducing the thermal stress on the circuit board. At the same time, the heating temperature is monitored in real time by the infrared thermometer 102 to ensure temperature stability. Then, the circuit board is clamped by the clamping component 10 and immersed in the solder bath 9. The circuit board is then lifted and placed on the surface of the right conveyor belt 5. The hot air blower 804 inside the hot air uniform component 8 runs and introduces hot air through the first air guide pipe 803 into the fixing seats 806 at various points at the bottom. Then, the inner nozzle 807 and the outer nozzle 808 set at the bottom of the fixing seat 806 blow the solder on the surface of the circuit board to ensure the uniformity of the solder layer thickness. At the same time, the blown hot air is connected to the nitrogen in the nitrogen box 802 to reduce the oxidation and high temperature corrosion of the circuit board.

[0028] The preheating component 1 includes a preheating chamber 104. The interior of the preheating chamber 104 is divided into multiple sections by partitions 103. Heating lamps 101 are fixedly connected to the top inner wall of the preheating chamber 104. Infrared thermometers 102 are installed on the inner side of each heating lamp 101. There are three heating lamps 101 and infrared thermometers 102 in total.

[0029] The clamping assembly 10 includes a movable frame 1001, a limiting groove 1002, a fixed shaft seat 1010, and a special-shaped push plate 1011. Two electric push rods 1004 are fixedly connected to the front side of the movable frame 1001. The rod body of the electric push rod 1004 is connected to the special-shaped push plate 1011. The special-shaped push plate 1011 is rotatably connected inside the fixed shaft seat 1010. A sliding plate 1003 is rotatably connected to the top of the special-shaped push plate 1011. The sliding plate 1003 is slidably connected inside the limiting groove 1002. Several first L-shaped fixing rods 1005 are fixedly connected to the left and right sides of the bottom of the sliding plate 1003. Several second L-shaped fixing rods 1006 are fixedly connected to the bottom of the limiting groove 1002. A movable plate 1009 is rotatably connected to the outer sides of the first L-shaped fixing rods 1005 and the second L-shaped fixing rods 1006.

[0030] The electric push rod 1004 drives the bottom of the irregular push plate 1011 to retract, thereby causing the top to shift outward. During the shift, the sliding plate 1003 moves to the shift side. During the movement, the sliding plate 1003 drives the first L-shaped fixing rod 1005 to move synchronously. At the same time, the second L-shaped fixing rod 1006 set at the bottom of the limiting groove 1002 cooperates with the first L-shaped fixing rod 1005. When the first L-shaped fixing rod 1005 moves and shifts, the second L-shaped fixing rod 1006 remains fixed, thereby causing the first L-shaped fixing rod 1005 to shift, which in turn causes the top of the outer moving plate 1009 to shift and the bottom to retract to the other side, thereby cooperating with the fixing plate 1007 to clamp the circuit board and ensure the stability of the circuit board during the processing.

[0031] Example 2

[0032] Several fixing plates 1007 are fixedly connected to the inner walls of both sides of the movable frame 1001. Anti-slip pads 1008 are fixedly connected to the bottom inner sides of the fixing plates 1007 and the movable plate 1009. The anti-slip pads 1008 are used to ensure that the circuit board will not slip when it is clamped.

[0033] A motor 4 is fixedly connected to the right side of the processing chamber 2. A threaded rod 12 is fixedly connected to the output end of the motor 4. A threaded seat 11 is threadedly connected to the outer side of the threaded rod 12. The motor 4 drives the threaded rod 12 to rotate. Then the threaded rod 12 pushes the threaded seat 11 to move, which in turn drives the telescopic cylinder 6 and the moving frame 1001 at the bottom, thereby moving the circuit board to facilitate subsequent processing.

[0034] A telescopic cylinder 6 is fixedly connected to the bottom of the threaded seat 11, and the bottom of the rod of the telescopic cylinder 6 is connected to the movable frame 1001.

[0035] The top inner wall of the processing chamber 2 is fixedly connected to a sliding groove 7, and the threaded seat 11 is slidably connected inside the sliding groove 7.

[0036] The bottom inner wall of the processing chamber 2 is fixedly connected to a molten solder tank 9. Conveyor belts 5 are provided on both the left and right sides of the molten solder tank 9. A viewing window 3 is provided on the front side of the processing chamber 2. The molten solder tank 9 is used to melt solder. At the same time, the circuit board is immersed in the molten solder tank 9, which can make the molten solder fully contact the circuit board. The viewing window 3 makes it easy to observe the processing situation inside the processing chamber 2.

[0037] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0038] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A hot air tin spraying device for printed circuit board processing, comprising: The processing chamber (2) is characterized in that: a preheating component (1) is provided on the left side of the processing chamber (2), a clamping component (10) is provided inside the processing chamber (2), and a hot air uniform component (8) is provided on the right side inside the processing chamber (2). The preheating component (1) is used to preheat the circuit board, the clamping component (10) is used to clamp and fix the circuit board, and the hot air uniform component (8) is used to blow the molten solder on the surface of the circuit board. The hot air uniform assembly (8) includes a support frame (801), a hot air blower (804) is fixedly connected to the top rear side of the support frame (801), a first air guide pipe (803) is fixedly connected to the output end of the hot air blower (804), the other end of the first air guide pipe (803) passes through the plate of the support frame (801) and extends into the box, a nitrogen box (802) is fixedly connected to the top of the support frame (801), a second air guide pipe (805) is fixedly connected to the rear side of the nitrogen box (802), the other end of the second air guide pipe (805) is fixedly connected to the front side of the pipe body of the first air guide pipe (803), a number of fixed seats (806) are fixedly connected to the bottom of the support frame (801), a number of external nozzles (808) are fixedly connected to the bottom outer side of the fixed seat (806), and a number of internal nozzles (807) are fixedly connected to the bottom inner side of the fixed seat (806).

2. The hot air tin spraying device for printed circuit board processing according to claim 1, characterized in that: The preheating component (1) includes a preheating chamber (104). The interior of the preheating chamber (104) is divided into multiple sections by partitions (103). A heating lamp (101) is fixedly connected to the top inner wall of the preheating chamber (104). An infrared thermometer (102) is installed on the inner side of each heating lamp (101). There are three heating lamps (101) and infrared thermometers (102).

3. The hot air tin spraying device for printed circuit board processing according to claim 1, characterized in that: The clamping assembly (10) includes a movable frame (1001), a limiting groove (1002), a fixed shaft seat (1010), and a shaped push plate (1011). Two electric push rods (1004) are fixedly connected to the front side of the movable frame (1001). The rods of the electric push rods (1004) are connected to the shaped push plate (1011). The shaped push plate (1011) is rotatably connected inside the fixed shaft seat (1010). The top of the shaped push plate (1011) rotates. A sliding plate (1003) is connected to the sliding plate (1003) which is slidably connected inside the limiting groove (1002). Several first L-shaped fixing rods (1005) are fixedly connected to the bottom left and right sides of the sliding plate (1003). Several second L-shaped fixing rods (1006) are fixedly connected to the bottom of the limiting groove (1002). A moving plate (1009) is rotatably connected to the outer side of the first L-shaped fixing rods (1005) and the second L-shaped fixing rods (1006).

4. The hot air tin spraying device for printed circuit board processing according to claim 3, characterized in that: Several fixing plates (1007) are fixedly connected to the inner walls of both sides of the movable frame (1001), and anti-slip pads (1008) are fixedly connected to the bottom inner sides of both the fixing plates (1007) and the movable plate (1009).

5. The hot air tin spraying device for printed circuit board processing according to claim 4, characterized in that: A motor (4) is fixedly connected to the right side of the processing chamber (2), and a threaded rod (12) is fixedly connected to the output end of the motor (4). A threaded seat (11) is threadedly connected to the outer side of the threaded rod (12).

6. The hot air tin spraying device for printed circuit board processing according to claim 5, characterized in that: The bottom of the threaded seat (11) is fixedly connected to a telescopic cylinder (6), and the bottom of the rod of the telescopic cylinder (6) is connected to the moving frame (1001).

7. The hot air tin spraying device for printed circuit board processing according to claim 6, characterized in that: The top inner wall of the processing chamber (2) is fixedly connected to a sliding groove (7), and the threaded seat (11) is slidably connected inside the sliding groove (7).

8. The hot air tin spraying device for printed circuit board processing according to claim 1, characterized in that: The bottom inner wall of the processing chamber (2) is fixedly connected to a tin bath (9), and conveyor belts (5) are provided on both the left and right sides of the tin bath (9). A viewing window (3) is provided on the front side of the processing chamber (2).

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