A new structure of inertial measurement unit considering thermal stability and cost

Abstract

The utility model discloses a novel structure of inertial measurement unit gives consideration to thermal stability and cost, including PCB board, outer plastic frame and metal sheet, metal sheet fixed mounting is in the inside of outer plastic frame, and the top of PCB board fixed mounting is in the top of metal sheet, and the edge department of PCB board is located the top of outer plastic frame, through with PCB board is placed in the top of metal sheet, and will install bolt screw thread connection in the inside of installation screw thread two holes, thereby will PCB board fixed in the top of metal sheet, adopts this structure the stress that PCB board suffered is based on the stress that metal sheet brought, because metal sheet adopts is made of metal, and metal thermal expansion coefficient is low, so the thermal expansion and contraction stress that PCB board suffered is lower, in addition, metal sheet is smaller, also need not to do electroplating and other appearance plating layer, thereby saved the material cost, equipment cost and manual cost needed of electroplating technology, reduced the overall manufacturing cost of product, has low thermal stress, low cost and many advantages.

Description

Technical Field

[0001] This utility model relates to the field of inertial measurement technology, specifically a novel structure for an inertial measurement unit that balances thermal stability and cost. Background Technology

[0002] Inertial measurement units (IMUs) are crucial measurement devices in modern technology, playing an indispensable role in numerous industries such as aerospace, automotive navigation, robotics control, and consumer electronics. They typically consist of core sensors such as accelerometers, gyroscopes, and magnetometers, enabling real-time measurement of motion parameters like linear acceleration and angular velocity, thus providing critical data support for system positioning, navigation, and control.

[0003] Plastic is inexpensive and suitable for use as the housing of inertial measurement units (IMUs). However, due to its relatively high coefficient of thermal expansion, the tension in plastic can cause tension on the PCB board fixed to the housing, leading to deformation. This slight deformation of the PCB board can cause slight deformation of the gyroscope base. Since IMUs are highly sensitive devices, this slight deformation can increase the measurement error of the sensor. Metal housings have a low coefficient of thermal expansion, but their higher cost makes them suitable only for high-end IMUs where cost is less of a concern. Utility Model Content

[0004] The purpose of this invention is to provide a novel structure for an inertial measurement unit that balances thermal stability and cost, in order to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a novel structure for an inertial measurement unit that balances thermal stability and cost, comprising a PCB board, an outer plastic frame, and a metal plate, wherein the metal plate is fixedly installed inside the outer plastic frame, the PCB board is fixedly installed on top of the metal plate, and the edge of the PCB board is located at the top of the outer plastic frame.

[0006] Preferably, the PCB board has two mounting threaded holes inside and at the four corners of the metal plate. The mounting threaded holes inside the PCB board and at the four corners of the metal plate have the same specifications and are positioned correspondingly. The internal threads of the mounting threaded holes are connected to mounting bolts.

[0007] Preferably, the metal plate has a second heat dissipation groove inside, and the second heat dissipation groove is located directly below the PCB board.

[0008] Preferably, a copper heat-conducting plate is installed inside the metal plate. There are two copper heat-conducting plates, and the two copper heat-conducting plates are symmetrically installed inside the metal plate. The tops of the two copper heat-conducting plates are in contact with the bottom of the PCB board.

[0009] Preferably, the outer plastic frame has a slot frame inside, and the slot frame is located directly below the PCB board.

[0010] Preferably, a heat dissipation groove is provided inside the slot frame.

[0011] Compared with the prior art, the beneficial effects of this utility model are as follows: by placing the PCB board on top of the metal plate and threading the mounting bolts into the two mounting thread holes, the PCB board is fixed on top of the metal plate. With this structure, the stress on the PCB board is based on the stress brought by the metal plate. Because the metal plate is made of metal, the coefficient of thermal expansion of metal is low, so the thermal expansion and contraction stress on the PCB board is low. In addition, the metal plate is small in size and does not need to be electroplated or other appearance coatings, thereby saving the material cost, equipment cost and labor cost required for the electroplating process, reducing the overall manufacturing cost of the product, and having many advantages such as low thermal stress and low cost. Attached Figure Description

[0012] Figure 1 This is a three-dimensional structural diagram of the present utility model.

[0013] Figure 2 This is a three-dimensional structural diagram of the present invention viewed from below.

[0014] Figure 3 This is a schematic diagram of the three-dimensional structure of the PCB board removed in this utility model.

[0015] In the diagram: 1. PCB board; 2. Outer plastic frame; 3. Mounting bolts; 4. Metal plate; 5. Two mounting threads; 6. Copper heat-conducting plate; 7. Slot frame; 8. Heat dissipation slot one; 9. Heat dissipation slot two. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] Please see Figures 1-3This utility model provides a technical solution: a novel structure for an inertial measurement unit that balances thermal stability and cost, comprising a PCB board 1, an outer plastic frame 2, and a metal plate 4. The metal plate 4 is fixedly installed inside the outer plastic frame 2, and the PCB board 1 is fixedly installed on top of the metal plate 4, with the edge of the PCB board 1 located at the top of the outer plastic frame 2. Two mounting threaded holes 5 are provided inside the PCB board 1 and at the four corners of the metal plate 4. The mounting threaded holes 5 inside the PCB board 1 and at the four corners of the metal plate 4 have the same specifications, and their positions correspond to each other. Mounting bolts 3 are threadedly connected to the inside of the mounting threaded holes 5.

[0018] The working principle of the above technical solution is as follows: PCB board 1 can be placed on top of metal plate 4, and mounting bolt 3 is threaded into the inside of mounting thread hole 5, thereby fixing PCB board 1 on top of metal plate 4. The stress on PCB board 1 using this structure is based on the stress brought by metal plate 4. Because metal plate 4 is made of metal, and metal has a low coefficient of thermal expansion, the thermal expansion and contraction stress on PCB board 1 is low. In addition, metal plate 4 is small in size and does not require electroplating or other appearance coatings, thereby saving the material cost, equipment cost and labor cost required for electroplating process, reducing the overall manufacturing cost of the product, and has many advantages such as low thermal stress and low cost.

[0019] In another implementation scheme, such as Figures 1-3 As shown, a heat dissipation slot 9 is provided inside the metal plate 4, and the heat dissipation slot 9 is located directly below the PCB board 1. A copper heat-conducting plate 6 is installed inside the metal plate 4. There are two copper heat-conducting plates 6, and the two copper heat-conducting plates 6 are symmetrically installed inside the metal plate 4. The tops of the two copper heat-conducting plates 6 are in contact with the bottom of the PCB board 1.

[0020] The two copper heat-conducting plates 6 can conduct heat from the PCB board 1 during operation, thereby dissipating heat from the PCB board 1. In addition, the heat dissipation slots 9 can dissipate heat from the PCB board 1 during operation, thereby cooling the PCB board 1 and ensuring the normal operation of the device.

[0021] In another implementation scheme, such as Figures 1-3 As shown, the outer plastic frame 2 has a slot frame 7 inside, and the slot frame 7 is located directly below the PCB board 1. The slot frame 7 has a heat dissipation slot 8 inside.

[0022] The groove frame 7 can be used to suspend the edge of the PCB board 1, reducing the contact area between the PCB board 1 and the outer plastic frame 2, and preventing the deformation stress of the outer plastic frame 2 from affecting the PCB board 1. In addition, the heat dissipation groove 8 can be used to dissipate the heat of the PCB board 1 during operation, improving the performance of the device.

[0023] Working principle: The PCB board 1 can be placed on top of the metal plate 4, and the mounting bolt 3 is threaded into the mounting threaded hole 5, thereby fixing the PCB board 1 on top of the metal plate 4. With this structure, the stress on the PCB board 1 is based on the stress from the metal plate 4. Because the metal plate 4 is made of metal, which has a low coefficient of thermal expansion, the thermal expansion and contraction stress on the PCB board 1 is low. Furthermore, the metal plate 4 is small in size and does not require electroplating or other surface coatings, thus saving on material, equipment, and labor costs associated with electroplating processes, reducing the overall manufacturing cost of the product. It features low thermal stress and low cost. With numerous advantages, the two copper heat-conducting plates 6 can conduct heat from the PCB board 1 during operation, thereby dissipating heat from the PCB board 1. In addition, the heat dissipation slot 9 can dissipate heat from the PCB board 1 during operation, cooling the PCB board 1 and ensuring normal operation of the device. The slot frame 7 can elevate the edge of the PCB board 1, reducing the contact area between the PCB board 1 and the outer plastic frame 2, preventing the deformation stress of the outer plastic frame 2 from affecting the PCB board 1. Furthermore, the heat dissipation slot 8 can conduct heat away from the PCB board 1 during operation, improving the performance of the device.

[0024] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A novel structure for an inertial measurement unit that balances thermal stability and cost, comprising a PCB board (1), an outer plastic frame (2), and a metal plate (4), characterized in that: The metal plate (4) is fixedly installed inside the outer plastic frame (2), and the PCB board (1) is fixedly installed on the top of the metal plate (4), with the edge of the PCB board (1) located on the top of the outer plastic frame (2).

2. The novel structure of an inertial measurement unit according to claim 1, which balances thermal stability and cost, is characterized in that: The PCB board (1) and the four corners of the metal plate (4) are provided with two mounting thread holes (5). The mounting thread holes (5) inside the PCB board (1) and the mounting thread holes (5) at the four corners of the metal plate (4) are of the same specification, and the mounting thread holes (5) inside the PCB board (1) and the mounting thread holes (5) at the four corners of the metal plate (4) are in corresponding positions. The mounting thread holes (5) are connected to mounting bolts (3) by internal threads.

3. The novel structure of an inertial measurement unit according to claim 2, which balances thermal stability and cost, is characterized in that: The metal plate (4) has a heat dissipation groove (9) inside, and the heat dissipation groove (9) is located directly below the PCB board (1).

4. The novel structure of an inertial measurement unit according to claim 3, which balances thermal stability and cost, is characterized in that: The metal plate (4) is equipped with a copper heat-conducting plate (6). There are two copper heat-conducting plates (6), and the two copper heat-conducting plates (6) are symmetrically installed inside the metal plate (4). The tops of the two copper heat-conducting plates (6) are in contact with the bottom of the PCB board (1).

5. A novel structure for an inertial measurement unit according to claim 4, which balances thermal stability and cost, characterized in that: The outer plastic frame (2) has a slot frame (7) inside, and the slot frame (7) is located directly below the PCB board (1).

6. A novel structure for an inertial measurement unit according to claim 5, which balances thermal stability and cost, characterized in that: The slot frame (7) has a heat dissipation slot (8) inside.

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