A split-board magnetic attraction type high-power device integrated assembly

Abstract

The utility model relates to a kind of board division magnetic attraction type high-power device integrated assembly, including circuit board, several power devices and radiator, and circuit board includes several circuit sub-boards, and same number of power devices is distributed to each circuit sub-board to construct power module unit;Power device is equipped with magnetic attraction material near the side of radiator;Each power module unit is magnetically attracted and connected on radiator by several power devices on its circuit sub-board.The utility model evenly distributes power device in multiple standardization circuit sub-boards, disperses thermal stress, reduces the risk of deformation of single circuit board;And using magnetic material realizes the automatic alignment and close fit of device and radiator, avoids the alignment error of traditional mechanical fixing, substantially improves assembly efficiency;Its standardization sub-board supports power flexible extension.Therefore, the board division magnetic attraction type high-power device integrated assembly of the utility model systematically solves the collaborative optimization problem of heat management, mechanical reliability and assembly efficiency in traditional high-power module.

Description

Technical Field

[0001] This utility model relates to the field of high-power electronic device integration technology, specifically to the design of high-power device integration components for scenarios such as photovoltaic energy storage and photovoltaics, and particularly to a split-board magnetic high-power device integration component. Background Technology

[0002] With the development of photovoltaic and energy storage technologies, the demand for high-power products to integrate a large number of power devices has increased significantly. However, in traditional solutions, power devices are densely arranged on a single circuit board (PCBA), resulting in excessively high local power density and causing severe thermal stress concentration. For example, the heat generated by SiC devices during high-frequency operation is difficult to dissipate evenly, which can easily cause thermal deformation of the circuit board, leading to reliability problems such as cracking of device solder joints and poor contact.

[0003] Furthermore, in the assembly of traditional high-power integrated components, SiC devices rely on screws or adhesives to align with heat sinks one by one, which is cumbersome and time-consuming. Moreover, human error can easily lead to loose contact between the device and the heat sink. Traditional integrated component assembly is not only inefficient but also affects the effectiveness of the heat dissipation path, making it difficult to meet the needs of mass production.

[0004] The above problems are worth solving. Utility Model Content

[0005] To address the issues of circuit board deformation and low assembly efficiency of integrated components caused by uneven distribution of multiple power devices in high-power modules, this invention provides a split-board magnetic high-power device integration component.

[0006] The technical solution of this utility model is as follows:

[0007] A modular magnetic high-power device integration assembly includes a circuit board, several power devices, and a heat sink. The power devices are mounted on the circuit board, and the heat sink is attached to the power devices. The circuit board includes several circuit sub-boards of equal size, and each circuit sub-board is allocated the same number of power devices to form a power module unit. The side of the power devices near the heat sink is provided with magnetic material. Each power module unit is magnetically connected to the heat sink through several power devices on its circuit sub-board, and adjacent circuit sub-boards are spliced ​​together at the edges for soldering.

[0008] As a preferred embodiment of this utility model, the heat sink is provided with an electromagnetic material, and the heat sink is connected to a power source that can be switched on and off. When the heat sink is powered on, the heat sink has a magnetic attraction force on the power device.

[0009] As a preferred embodiment of this invention, the surface of the heat sink is provided with a magnet, which is used to magnetically attract the power device.

[0010] As a preferred embodiment of this invention, the power device is a silicon carbide device.

[0011] Furthermore, the circuit board has pin holes for each silicon carbide device, and the pins of the silicon carbide devices are bent at 90° and inserted into the pin holes.

[0012] As a preferred embodiment of this utility model, the circuit board is provided with several detachable crystal covers, and each crystal cover is provided with at least one mounting groove for snapping the power device.

[0013] Furthermore, the crystal cap is provided with bolt holes and is fixedly mounted to the circuit board by bolts.

[0014] As a preferred embodiment of the present invention, the heat sink is provided with a plurality of ceramic plates, each of which corresponds to a plurality of power devices; and when the heat sink and the power devices are attached, the ceramic plates are sandwiched between the power devices and the heat sink.

[0015] Furthermore, the ceramic sheet is coated with thermally conductive silicone grease.

[0016] The advantages of this utility model based on the above solution are as follows:

[0017] This invention distributes power devices evenly across multiple standardized circuit sub-boards through a partitioned layout, avoiding the problem of localized thermal stress concentration caused by traditional centralized layouts, thus ensuring uniform stress distribution during PCBA operation. At the same time, the uniform layout makes heat distribution more even, avoiding excessive local temperature rise and significantly reducing thermal deformation, thereby improving the welding reliability of power devices and the long-term operational stability of the product.

[0018] Power devices are tightly attached to the heat sink using magnetic materials, ensuring efficient heat dissipation and rapid heat dissipation. This reduces device switching losses and improves the energy efficiency of high-power products. The magnetic fixing method enables quick alignment and automatic attachment of multiple power devices on the power module unit to the heat sink, eliminating the need to align screw holes one by one or apply adhesive, significantly reducing manual operation time.

[0019] It is evident that this invention systematically solves the problem of synergistic optimization of thermal management, mechanical reliability, and assembly efficiency in traditional high-power modules. Attached Figure Description

[0020] Figure 1 A front view of a single power module unit;

[0021] Figure 2 This is a schematic diagram of the back of a single power module unit;

[0022] Figure 3 This is a schematic diagram of the structure of multiple power module units;

[0023] Figure 4 This is a schematic diagram of the assembly of multiple power module units and heat sinks.

[0024] In the diagram,

[0025] 1. Power module unit; 11. Circuit board; 111. Pin holes; 12. Power devices; 13. Transistor cover; 131. Bolts;

[0026] 2. Radiator; 21. Ceramic plate. Detailed Implementation

[0027] To better understand the purpose, technical solution, and technical effects of this utility model, the following description, in conjunction with the accompanying drawings and embodiments, will provide further explanation. It should be noted that similar reference numerals and letters in the following drawings indicate similar items; therefore, once an item is defined in one drawing, it does not need further definition and explanation in subsequent drawings. It is also stated that the embodiments described below are only for explaining this utility model and are not intended to limit it.

[0028] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it can be directly on the other component or there may be an intermediate component. When a component is referred to as "connected to" another component, it can be directly connected to the other component or there may be an intermediate component.

[0029] The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use, or the orientation or positional relationship commonly understood by those skilled in the art, and is only for the convenience of describing this application and simplifying the description, and is not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. The terms "several" or "a plurality of" mean two or more, unless otherwise expressly and specifically defined.

[0030] like Figures 1 to 4As shown, a modular magnetic high-power device integration assembly includes a circuit board, several power devices 12, and a heat sink 2. The power devices 12 are mounted on the circuit board, and the heat sink 2 is attached to the power devices 12. The circuit board includes several circuit sub-boards 11 of equal size, each circuit sub-board 11 having the same number of power devices 12 to form a power module unit 1. Each power module unit 1 is magnetically connected to the heat sink 2 through several power devices 12 on its circuit sub-board 11, and adjacent circuit sub-boards 11 are joined at their edges. By disassembling a traditional single circuit board into several circuit sub-boards 11 of equal size, each sub-board carrying the same number of power devices 12 to form an independent power module unit 1, the overall thermal stress is distributed to each sub-board. Due to the smaller size of the sub-boards and the uniform distribution of the power devices 12, their coefficient of thermal expansion is easier to control, which can significantly suppress the overall deformation of the PCBA and solve the problem of local thermal stress concentration caused by traditional centralized layout.

[0031] In this solution, the side of the power device 12 closest to the heat sink 2 is provided with a magnetic material (such as a permanent magnet or a magnetically conductive material). The magnetic force is used to drive the device to automatically align and fit tightly with the heat sink 2. This eliminates the gap error caused by the traditional screw fixing method, without the need for manual alignment of holes or reliance on fixtures. This ensures efficient heat dissipation path conduction and improves assembly efficiency.

[0032] Taking SiC (silicon carbide) devices as an example, the number of power devices 12 is determined according to the power requirements during operation. Then, the number of circuit sub-boards 11 and the layout of SiC devices on each circuit sub-board 11 are planned. It can be seen that this technical solution can linearly increase the power capacity by increasing or decreasing the number of sub-boards without redesigning the entire circuit board, adapting to different power level requirements. For example, four circuit sub-boards 11, each with 12 SiC devices, constitute four power module units 1 with 12 SiC devices each. The side of the SiC device used to attach to the heat sink 2 is provided with magnetic material. All four power module units 1 can be quickly and accurately magnetically attached to the mounting surface of the heat sink 2 through the SiC devices. Adjacent circuit sub-boards 11 are spliced ​​together, which facilitates the soldering of the edges of the circuit sub-boards 11. Finally, all SiC devices are combined together to form a high-power device 12 integrated assembly with a complete power board.

[0033] In one optional embodiment, the heat sink 2 is provided with an electromagnetically conductive material, and the heat sink 2 is connected to a power source that can be switched on and off. When the heat sink 2 is energized, it exerts a magnetic attraction on the power device 12. In this embodiment, by integrating an electromagnetically conductive material (such as an electromagnetic coil) into the heat sink 2, the heat sink 2 generates a magnetic attraction force to adsorb the magnetically attracted material on the surface (heat dissipation surface) of the power device 12. The magnetically attracted material can be an iron-nickel alloy, ensuring a tight fit between the heat dissipation surface of the power device 12 and the heat sink 2. After the heat sink 2 is de-energized, the magnetic field disappears, and the power device 12 can be separated from the heat sink 2.

[0034] In another alternative embodiment, the surface of the heat sink 2 is provided with a magnet, which is used to magnetically attract the power device 12. The magnet on the surface of the heat sink 2 directly attracts the magnetic material on the surface of the power device 12. The magnetic material can be a ferrite sheet, which can maintain a tight fit without the need for electricity. The direction of the magnetic force is perpendicular to the mounting surface of the heat sink 2, ensuring that the power device 12 automatically aligns with the heat sink 2, reducing manual alignment errors and improving assembly consistency.

[0035] In both of the above embodiments, whether it is the electromagnetic attraction type or the strong magnetic attraction type, each power module unit 1 is quickly fixed to the heat sink 2 by magnetic force during installation, forming a modular structure that is "instantly attached and stable".

[0036] In this design, the circuit board 11 has pin holes 111 for each silicon carbide device. The pins of the silicon carbide devices are bent at 90° and inserted into the pin holes 111. The 90° bend of the pins into the pin holes 111 creates an L-shaped mechanical support structure between the silicon carbide device body and the circuit board 11. After the pins are inserted into the pin holes 111, they are fixed by reflow soldering, forming a dual connection of insertion and soldering, thus avoiding device failure caused by pad detachment during surface mount technology.

[0037] The circuit board 11 is provided with several removable crystal covers 13, each crystal cover 13 having at least one mounting groove for engaging the power device 12. The side wall of the mounting groove has a limiting protrusion, and the side of the housing of the power device 12 has a limiting slot, so that the power device 12 can be engaged into the mounting groove of the crystal cover 13.

[0038] The crystal cover 13 has bolt holes and is fixedly mounted to the circuit sub-board 11 by bolts 131. When installing the crystal cover 13, align the crystal cover 13 with the target area on the circuit sub-board 11, ensuring the bolt holes of the crystal cover 13 are fully aligned with the bolt holes of the circuit sub-board 11. Tighten the bolts 131 with a screwdriver to fix the crystal cover 13 to the circuit sub-board 11. After installing the crystal cover 13, insert the power device 12 into the mounting slot of the crystal cover 13.

[0039] The heat sink 2 is provided with a plurality of ceramic plates 21, each corresponding to one of the power devices 12; and when the heat sink 2 and the power devices 12 are attached, the ceramic plates 21 are sandwiched between the power devices 12 and the heat sink 2. The ceramic plates 21 can be aluminum nitride or aluminum oxide, which have a high thermal conductivity, and quickly conduct the heat generated by the power devices 12 to the heat sink 2, ensuring that the power devices 12 operate within a safe temperature range.

[0040] The ceramic plate 21 is coated with thermal grease, which can penetrate and fill the microscopic gaps between the heat sink 2 and the power device 12, reduce the contact thermal resistance, and further improve the speed at which the heat from the power device 12 is conducted to the heat sink 2.

[0041] In summary, this invention evenly distributes power devices across multiple standardized circuit sub-boards, dispersing thermal stress and reducing the risk of deformation on a single circuit board. Furthermore, it utilizes magnetic materials to achieve automatic alignment and tight bonding between the devices and the heat sink, avoiding the alignment errors of traditional mechanical fixing and significantly improving assembly efficiency. Its standardized sub-boards support flexible power expansion. Therefore, this invention's modular magnetic high-power device integration system systematically solves the problem of synergistic optimization of thermal management, mechanical reliability, and assembly efficiency in traditional high-power modules, demonstrating significant engineering application value.

[0042] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0043] The above embodiments only illustrate several implementation methods of this utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A split-board magnetic high-power device integrated assembly, comprising a circuit board, a plurality of power devices, and a heat sink, wherein the power devices are mounted on the circuit board, and the heat sink is attached to the power devices, characterized in that, The circuit board includes several circuit sub-boards of equal size, and each circuit sub-board is equipped with the same number of power devices to form a power module unit. The side of the power device closest to the heat sink is provided with magnetic material; each power module unit is magnetically connected to the heat sink through several power devices on its circuit sub-board, and the edges of two adjacent circuit sub-boards are spliced ​​together.

2. The integrated assembly of a split-board magnetic high-power device according to claim 1, characterized in that, The heat sink is made of an electromagnetic material and is connected to a power source that can be switched on and off. When the heat sink is powered on, it has a magnetic attraction to the power device.

3. The integrated assembly of a split-board magnetic high-power device according to claim 1, characterized in that, The surface of the heat sink is provided with magnets, which are used to magnetically attract the power device.

4. The modular magnetic high-power device integrated assembly according to claim 1, characterized in that, The power device is a silicon carbide device.

5. The integrated assembly of a split-board magnetic high-power device according to claim 4, characterized in that, The circuit board has pin holes for each silicon carbide device, and the pins of the silicon carbide devices are bent at 90° and inserted into the pin holes.

6. The modular magnetic high-power device integrated assembly according to claim 1, characterized in that, The circuit board is provided with several removable crystal covers, and each crystal cover is provided with at least one mounting slot for snapping the power device.

7. The integrated assembly of a split-board magnetic high-power device according to claim 6, characterized in that, The crystal cap is provided with bolt holes and is fixedly installed on the circuit board by bolts.

8. The integrated assembly of a split-board magnetic high-power device according to claim 1, characterized in that, The heat sink is provided with a plurality of ceramic plates, and each of the plurality of ceramic plates corresponds one-to-one with a plurality of the power devices; and when the heat sink and the power devices are attached, the ceramic plates are sandwiched between the power devices and the heat sink.

9. A split-board magnetic high-power device integrated assembly according to claim 8, characterized in that, The ceramic sheet is coated with thermally conductive silicone grease.

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