Thermally conductive pad mounting apparatus

Abstract

The utility model is suitable for the technical field of automation equipment, provides a kind of heat-conducting pad mounting equipment, above-mentioned heat-conducting pad mounting equipment includes workbench, feed arrangement, product feed mechanism and mounting mechanism. Through being provided with feed arrangement, product feed mechanism and mounting mechanism on the installation surface of workbench. Circuit board can be placed in sequence on product feed mechanism when mounting, product is transported along preset path by product feed mechanism, while heat-conducting pad is transported to pick-up position after being pretreated by feed arrangement, mounting mechanism transports and mounts heat-conducting pad located at pick-up position on circuit board when circuit board is located at mounting position, finally product feed mechanism continues along preset path and transports circuit board mounted with heat-conducting pad.Can improve the working efficiency of heat-conducting pad mounting, also can improve the precision of heat-conducting pad mounting, and then improve the quality of product production.

Description

Technical Field

[0001] This utility model belongs to the field of automation equipment technology, and in particular relates to a thermal pad mounting device. Background Technology

[0002] With societal development, the demand for electronic products is gradually increasing. Printed Circuit Boards (PCBs) are the core components of these products, primarily providing mechanical support and electrical connections for electronic components, essentially acting as the "skeleton" and "nervous system" of the electronic device. To ensure efficient heat dissipation and prevent overheating during operation, thermal pads are mounted on the PCB during the manufacturing process. However, most current thermal pad mounting is done manually, resulting in low efficiency and poor mounting accuracy. Utility Model Content

[0003] The purpose of this invention is to provide a thermal pad mounting device, which aims to solve the technical problems of low work efficiency and poor mounting accuracy in the existing PCB thermal pad mounting process.

[0004] This utility model is implemented as follows: it provides a thermal pad mounting device, comprising:

[0005] A workbench, the top of which has a mounting surface;

[0006] A feeding device, disposed on the mounting surface, is used to transport the thermal pad to the feeding position;

[0007] A product feeding mechanism, disposed on the worktable, is used to transport the circuit board along a preset path and to pass the mounting position during transportation; and

[0008] A mounting mechanism is disposed on the workbench. The mounting mechanism is used to transport the thermal pad and mount the thermal pad onto the circuit board located at the mounting position.

[0009] In one optional embodiment, the feeding device includes a peeling mechanism, a gantry feeding mechanism, and a buffer support mechanism. The peeling mechanism is used to peel off the protective film on the thermal pad. The buffer support mechanism is located in the area between the product feeding mechanism and the peeling mechanism, and the feeding position is set on the top surface of the buffer support mechanism. The gantry feeding mechanism is used to transport the thermal pad from the peeling mechanism to the top surface of the buffer support mechanism.

[0010] In an optional embodiment, the cache support mechanism includes a cache bracket, a support plate assembly, and an adsorption structure. The cache bracket is fixed to the mounting surface, the support plate assembly is disposed on the cache bracket, the support plate assembly is used to support the thermal pad, and the adsorption structure is disposed on the support plate assembly for adsorbing the thermal pad onto the support plate assembly.

[0011] In an optional embodiment, the adsorption structure includes a vacuum chamber and an adsorption hole group. The vacuum chamber is located inside the support plate group and is used to communicate with an external vacuum generating device pipeline. The adsorption hole group is disposed on the top surface of the support plate group and is used to connect the vacuum chamber to the outside of the support plate group.

[0012] In an optional embodiment, the feeding device further includes a pressing mechanism, which is disposed on the mounting surface. The pressing mechanism is used to press and fix other thermal pads when the gantry material handling mechanism takes the thermal pad from the stripping mechanism.

[0013] In one optional embodiment, the pressing mechanism includes a translation slider, a lifting drive unit, a clamping member, and a translation drive unit. The translation slider is slidably disposed on the mounting surface, and the translation drive unit is used to drive the translation slider to slide. The clamping member has a degree of freedom to move in the vertical direction relative to the translation slider. The lifting drive unit is disposed on the translation slider and is used to drive the clamping member to move in the vertical direction.

[0014] In one optional embodiment, the gantry material handling mechanism includes a gantry support, a first translation seat, a second translation seat, a vertical slider, and a first suction cup assembly. The gantry support is disposed on the worktable. The first translation seat is movably disposed on the gantry support and has a degree of freedom to move along a first direction relative to the worktable. The second translation seat is movably disposed on the first translation seat and has a degree of freedom to move along a second direction relative to the first translation seat. The first direction and the second direction are arranged at an angle. The vertical slider is movably disposed on the second translation seat and has a degree of freedom to move along a vertical direction relative to the second translation seat. The first suction cup assembly is disposed on the vertical slider and is used to adsorb a heat-conducting pad by vacuum.

[0015] In an optional embodiment, the mounting mechanism includes a robotic arm and a second suction cup assembly. The robotic arm is disposed on the worktable, and the second suction cup assembly is disposed at the movable end of the robotic arm for vacuum adsorption of the thermal pad.

[0016] In one optional embodiment, the second suction cup assembly includes a suction cup bracket, a suction cup body, a suction cup lifting unit, and a rotating unit. The suction cup body is disposed on the suction cup bracket and has a degree of freedom to rotate around a first axis. The rotating unit is disposed on the suction cup bracket and is used to drive the suction cup body to rotate. The suction cup lifting unit is connected between the suction cup bracket and the robotic arm and is used to drive the suction cup bracket to move along the first axis.

[0017] In one optional embodiment, the thermal pad mounting device includes a first camera unit and a second camera unit, wherein the first camera unit is used to acquire an image of the product, and the second camera unit is used to acquire an image of the thermal pad at the material pick-up position.

[0018] The technical advantages of this invention compared to existing technologies are as follows: By incorporating a feeding device, a product feeding mechanism, and a mounting mechanism on the mounting surface of the workbench, the circuit boards can be sequentially placed on the product feeding mechanism during board mounting. The product feeding mechanism transports the products along a preset path. Simultaneously, the feeding device pre-processes the thermal pads and transports them to the pick-up position. When the circuit board is located at the mounting position, the mounting mechanism transports and mounts the thermal pads from the pick-up position onto the circuit board. Finally, the product feeding mechanism continues to transport the circuit board with the thermal pads onto the preset path. Compared to the manual application of thermal pads in existing technologies, the coordinated use of the feeding device, product feeding mechanism, and mounting mechanism to mount the thermal pads onto the circuit board improves the efficiency and accuracy of thermal pad mounting, thereby enhancing the quality of product manufacturing. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the structure of the thermal pad mounting equipment provided in this embodiment of the utility model;

[0021] Figure 2 This is a schematic diagram of the feeding device used in the implementation of this utility model;

[0022] Figure 3 This is a schematic diagram of the cache support mechanism used in the implementation of this utility model;

[0023] Figure 4This is a cross-sectional structural schematic diagram of the cache support mechanism used in the implementation of this utility model;

[0024] Figure 5 This is a schematic diagram of the pressing mechanism used in the implementation of this utility model;

[0025] Figure 6 This is a schematic diagram of the gantry material handling mechanism used in the implementation of this utility model;

[0026] Figure 7 yes Figure 6 Enlarged structural diagram at point A;

[0027] Figure 8 This is a schematic diagram of the mounting mechanism used in the implementation of this utility model;

[0028] Figure 9 This is a schematic diagram of the structure of the second suction cup assembly used in the implementation of this utility model.

[0029] Explanation of reference numerals in the attached figures:

[0030] 1. Workbench; 11. Mounting surface; 12. Moving rollers; 2. Feeding device; 21. Stripping mechanism; 22. Gantry material handling mechanism; 221. Gantry support; 222. First translation seat; 223. Second translation seat; 224. Vertical slider; 225. First suction cup assembly; 23. Buffer support mechanism; 231. Buffer support; 232. Support plate assembly; 233. Adsorption structure; 2331. Vacuum chamber; 2332. 24. Adsorption hole assembly; 24. Pressing mechanism; 241. Translation slider; 242. Translation drive unit; 243. Clamping component; 244. Lifting drive unit; 3. Product feeding mechanism; 4. Mounting mechanism; 41. Robotic arm; 42. Second suction cup assembly; 421. Suction cup bracket; 422. Suction cup body; 423. Suction cup lifting unit; 424. Rotation unit; 5. First camera unit; 6. Second camera unit; 7. Circuit board. Detailed Implementation

[0031] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0032] In the description of this utility model, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0033] In this embodiment, according to Figure 1 The XYZ rectangular coordinate system established in the text is defined as follows: the side located in the positive direction of the X-axis is defined as front, and the side located in the negative direction of the X-axis is defined as back; the side located in the positive direction of the Y-axis is defined as left, and the side located in the negative direction of the Y-axis is defined as right; the side located in the positive direction of the Z-axis is defined as up, and the side located in the negative direction of the Z-axis is defined as down.

[0034] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0035] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0036] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments.

[0037] Please refer to Figures 1 to 4As shown in the embodiment of this utility model, a thermal pad mounting device is provided, including a worktable 1, a feeding device 2, a product feeding mechanism 3, and a mounting mechanism 4. The top of the worktable 1 has a mounting surface 11. The feeding device 2 is disposed on the mounting surface 11 and is used to transport the thermal pad to the picking position. The product feeding mechanism 3 is disposed on the worktable 1 and is used to transport the circuit board along a preset path, passing the mounting position during transportation. The mounting mechanism 4 is disposed on the worktable 1 and is used to transport the thermal pad and mount it onto the circuit board located at the mounting position.

[0038] Specifically, workbench 1 refers to a supporting component with a certain height. Workbench 1 can be welded from square steel, and cement is poured inside workbench 1 to increase weight and make workbench 1 more stable. Mounting surface 11 refers to a surface structure with a certain area. Mounting surface 11 can be a planar structure or a curved structure, and can be freely set according to production needs. Feeding device 2 refers to a device that can pre-process the thermal pad and transport the thermal pad to the picking position. Feeding device 2 can be composed of multiple mechanisms. Product feeding mechanism 3 refers to a component or assembly used to transport circuit boards along a preset path. Product feeding mechanism 3 can be a conveyor belt assembly, robotic arm 41 assembly, or conveyor slide, etc. Plating mechanism 4 refers to a transport mechanism or assembly used to press and mount the thermal pad onto the circuit board.

[0039] The thermal pad mounting equipment provided in this embodiment of the invention comprises a feeding device 2, a product feeding mechanism 3, and a mounting mechanism 4, all mounted on the mounting surface 11 of the workbench 1. During circuit board mounting, the circuit boards are sequentially placed on the product feeding mechanism 3, which transports the products along a preset path. Simultaneously, the feeding device 2 pre-processes the thermal pads and transports them to the pick-up position. When the circuit board is at the mounting position, the mounting mechanism 4 transports and mounts the thermal pads located at the pick-up position onto the circuit board. Finally, the product feeding mechanism 3 continues to transport the circuit board with the mounted thermal pads along the preset path. Compared to the existing method of manually pasting thermal pads, the coordinated use of the feeding device 2, product feeding mechanism 3, and mounting mechanism 4 to mount the thermal pads onto the circuit board improves the efficiency and accuracy of thermal pad mounting, thereby enhancing the quality of product manufacturing.

[0040] In an optional embodiment, please refer to Figure 1 Furthermore, a movable roller 12 can be provided on the bottom surface of the workbench 1, which can be used to move the workbench 1, so that the mounting equipment can be moved conveniently according to production needs, and the mounting equipment can work in multiple different production lines.

[0041] In one embodiment, see Figure 2 The feeding device 2 includes a peeling mechanism 21, a gantry feeding mechanism 22, and a buffer support mechanism 23. The peeling mechanism 21 is used to peel off the protective film on the heat-conducting pad. The buffer support mechanism 23 is located in the area between the product feeding mechanism 3 and the peeling mechanism 21, and the feeding position is set on the top surface of the buffer support mechanism 23. The gantry feeding mechanism 22 is used to transport the heat-conducting pad from the peeling mechanism 21 to the top surface of the buffer support mechanism 23.

[0042] Specifically, the peeling mechanism 21 refers to a mechanism or component used to separate the thermal pad from its carrier. The peeling mechanism 21 can be classified as a sheet peeler or a roll peeler, etc. It should be noted that the specific structure of the peeling mechanism 21 is a conventional technique well-known to those skilled in the art and will not be described in detail here. The gantry-type material handling mechanism 22 refers to a mechanism used to transport the thermal pad within space. The buffer support mechanism 23 refers to a support component with a certain height, and the top surface of the buffer support mechanism 23 usually has a support plane.

[0043] In this embodiment, the thermal pad is separated from the carrier by the stripping mechanism 21, and then transported to the buffer support mechanism 23 by the gantry material handling mechanism 22. This allows the mounting mechanism 4 to easily retrieve the thermal pad at any time, saving the mounting mechanism 4 waiting time and greatly reducing the material supply time.

[0044] In an optional embodiment, please refer to Figure 2 The number of stripping mechanisms 21 can be multiple, and the multiple stripping mechanisms 21 are different types of stripping mechanisms 21, such as sheet strippers or roll strippers, so that the type of stripping mechanism 21 can be freely selected according to the form of the raw material of the heat-conducting pad.

[0045] In addition, the stripping mechanism 21 can be disassembled and installed on the workbench 1, for example, by disassembling and installing it on the workbench 1 using a universally sized pad, and the appropriate stripping mechanism 21 can be quickly replaced at any time according to product needs.

[0046] In one embodiment, see Figure 3The buffer support mechanism 23 includes a buffer bracket 231, a support plate assembly 232, and an adsorption structure 233. The buffer bracket 231 is fixed to the mounting surface 11. The support plate assembly 232 is disposed on the buffer bracket 231 and is used to support the heat-conducting pad. The adsorption structure 233 is disposed on the support plate assembly 232 and is used to adsorb the heat-conducting pad onto the support plate assembly 232. Specifically, the buffer bracket 231 refers to a component with a certain height, and the buffer bracket 231 can be columnar, plate-shaped, or block-shaped. The support plate assembly 232 refers to a plate-shaped structure with a certain area, and the support plate assembly 232 can be connected to the buffer bracket 231 by welding, snap-fitting, or fastener connection. The adsorption structure 233 refers to a structure that adsorbs objects through negative pressure, and the adsorption structure 233 can be connected to a vacuum generator. In this embodiment, the gantry material handling mechanism 22 can place the heat-conducting pad on the support plate assembly 232 and adsorb the heat-conducting pad through the adsorption structure 233, so as to avoid the heat-conducting pad being deviated when the gantry material handling mechanism 22 detaches from the heat-conducting pad, and make the placement position of the heat-conducting pad more accurate.

[0047] In one embodiment, see Figure 4 The adsorption structure 233 includes a vacuum chamber 2331 and an adsorption hole group 2332. The vacuum chamber 2331 is located inside the support plate group 232 and is used to connect to an external vacuum generating device via piping. The adsorption hole group 2332 is disposed on the top surface of the support plate group 232 and is used to connect the vacuum chamber 2331 to the outside of the support plate group 232. Specifically, the vacuum chamber 2331 refers to a space with a certain volume, which can be connected to the vacuum generating device via piping. The adsorption hole group 2332 refers to a structure composed of multiple interconnecting holes arranged in a certain order. There can be multiple adsorption hole groups 2332, which are spaced apart from each other, so as to adsorb and fix multiple thermal pads. The interconnecting holes in each adsorption hole group 2332 can be arranged in a rectangular array. In this embodiment, a vacuum chamber 2331 is provided inside the support plate assembly 232, and an adsorption hole assembly 2332 is provided on the top surface of the support plate assembly 232. The vacuum chamber 2331 of the adsorption hole assembly 2332 is connected to the outside of the support plate assembly 232. A negative pressure can be generated on the top surface of the support plate assembly 232 under the action of a vacuum generator, thereby adsorbing the heat-conducting pad onto the top surface of the support plate assembly 232. Furthermore, the state of the adsorption structure 233 can be controlled by controlling the opening and closing of the pipeline or the start and stop of the vacuum generator, making the use of the adsorption structure 233 more convenient.

[0048] In an optional embodiment, please refer to Figure 4The support plate assembly 232 may include a base plate and a cover plate. The base plate is provided with a groove structure. The cover plate can be installed on the opening of the groove structure by means of fastener connection, snap-fit ​​or welding. The adsorption hole assembly 2332 can be set on the cover plate. When the cover plate is installed on the opening of the groove structure, the adsorption hole assembly 2332 is connected to the groove structure, making the processing of the support plate assembly 232 simpler.

[0049] In one embodiment, see Figure 2 The feeding device 2 also includes a pressing mechanism 24, which is disposed on the mounting surface 11. The pressing mechanism 24 is used to press and fix other heat-conducting pads when the gantry material handling mechanism 22 takes the heat-conducting pads from the stripping mechanism 21. Specifically, the pressing mechanism 24 refers to a component or assembly that can press objects together. In this embodiment, by providing a pressing mechanism 24 on the mounting surface 11 of the workbench 1, other heat-conducting pads can be pressed and fixed when the gantry material handling mechanism takes the heat-conducting pads from the stripping mechanism 21, preventing the position of other heat-conducting pads from being misaligned and affecting subsequent material handling, making the material handling of the gantry material handling mechanism 22 more convenient and accurate.

[0050] In one embodiment, see Figure 5 The pressing mechanism 24 includes a translation slider 241, a lifting drive unit 244, a clamping member 243, and a translation drive unit 242. The translation slider 241 is slidably mounted on the mounting surface 11. The translation drive unit 242 drives the translation slider 241 to slide. The clamping member 243 has a degree of freedom of movement in the vertical direction relative to the translation slider 241. The lifting drive unit 244 is mounted on the translation slider 241 and drives the clamping member 243 to move in the vertical direction. Specifically, the translation slider 241 refers to a component with a certain volume, which can be block-shaped, plate-shaped, or a combination of various shapes. The lifting drive unit 244 refers to a component or assembly that can drive an object to move in a straight line, and can be a cylinder, hydraulic cylinder, or electric push rod, etc. The clamping member 243 refers to a component with a certain length, which can be rod-shaped, strip-shaped, or plate-shaped, etc. The translation drive unit 242 refers to a component that can drive an object to move in a straight line. The translation drive unit 242 can be an electric push rod or an electric guide rail, etc. In this embodiment, the translation drive unit 242 drives the translation slider 241 to reciprocate along the material arrangement direction. The translation slider 241 is also provided with a lifting drive unit 244 and a pressing member 243. At least a part of the pressing member 243 can extend above the material and can move in a straight line under the action of the lifting drive unit 244. This allows the pressing member 243 to press the corresponding heat-conducting pad according to production needs, making the use of the pressing mechanism 24 more convenient.

[0051] In one embodiment, see Figure 6The gantry material handling mechanism 22 includes a gantry support 221, a first translation seat 222, a second translation seat 223, a vertical slider 224, and a first suction cup assembly 225. The gantry support 221 is mounted on the worktable 1. The first translation seat 222 is movably mounted on the gantry support 221 and has a degree of freedom to move along a first direction relative to the worktable 1. The second translation seat 223 is movably mounted on the first translation seat 222 and has a degree of freedom to move along a second direction relative to the first translation seat 222. The first and second directions are set at an angle. The vertical slider 224 is movably mounted on the second translation seat 223 and has a degree of freedom to move along a vertical direction relative to the second translation seat 223. The first suction cup assembly 225 is mounted on the vertical slider 224 and is used to vacuum-adsorb a heat-conducting pad. In this embodiment, the vertical slider 224 can be driven to move in the horizontal direction by the cooperation of the first translation seat 222 and the second translation seat 223. At the same time, the vertical slider 224 itself can also move in the vertical direction. At this time, the first suction cup assembly 225 is set on the vertical slider 224, so that the first suction cup assembly 225 can move arbitrarily in three-dimensional space, thereby making it more convenient for the gantry material handling mechanism 22 to grasp the heat-conducting pad.

[0052] To protect the material's balance and prevent deformation, please refer to [link / reference needed]. Figure 1 The first suction cup assembly 225 can be an elastic vacuum suction cup. The working end of the elastic vacuum suction cup can undergo a certain elastic deformation when it comes into contact with the heat-conducting pad, which can prevent the first suction cup assembly 225 from applying excessive pressure to the heat-conducting pad.

[0053] In an optional embodiment, please refer to Figure 7 The number of first suction cup assemblies 225 can be multiple, and multiple first suction cup assemblies 225 are arranged horizontally at intervals on the vertical slider 224. By providing multiple first suction cup assemblies 225 on the vertical slider 224, each first suction cup assembly 225 can work independently, allowing multiple heat-conducting pads to be picked up at once and then placed as a whole on the buffer support mechanism 23, saving feeding time.

[0054] In one embodiment, see Figure 8The mounting mechanism 4 includes a robotic arm 41 and a second suction cup assembly 42. The robotic arm 41 is mounted on the worktable 1, and the second suction cup assembly 42 is located at the movable end of the robotic arm 41 for vacuum adsorption of the thermal pad. Specifically, the robotic arm 41 is a component that can move according to a preset program. The second suction cup assembly 42 is a component that can adsorb objects using negative pressure. In this embodiment, by placing the second suction cup assembly 42 at the movable end of the robotic arm 41, the thermal pad can be adsorbed by the second suction cup assembly 42, and the robotic arm 41 drives the second suction cup assembly 42 to move, thereby achieving the purpose of transporting and installing the thermal pad, making the mounting of the thermal pad more convenient and precise.

[0055] In an optional embodiment, please refer to Figure 1 The number of second suction cup groups can be multiple, and a suction cup mounting part can also be provided on the movable end of the robotic arm 41. Multiple second suction cup assemblies 42 are all provided with suction cup mounting parts. In this embodiment, by providing multiple first suction cup assemblies 225, each of which can work independently, the application of the thermal pad can be made more flexible.

[0056] In one embodiment, see Figure 9The second suction cup assembly 42 includes a suction cup bracket 421, a suction cup body 422, a suction cup lifting unit 423, and a rotating unit 424. The suction cup body 422 is mounted on the suction cup bracket 421 and has the freedom to rotate around a first axis. The rotating unit 424 is mounted on the suction cup bracket 421 and is used to drive the suction cup body 422 to rotate. The suction cup lifting unit 423 is connected between the suction cup bracket 421 and the robotic arm 41 and is used to drive the suction cup bracket 421 to move along the first axis. Specifically, the suction cup bracket 421 refers to a component with a certain volume, which can be block-shaped, plate-shaped, or a combination of various shapes. The suction cup body 422 refers to an assembly that can adsorb other objects through negative pressure, and the suction cup body 422 can be connected to the vacuum generating device pipeline during operation. The suction cup lifting unit 423 refers to a component or assembly that can drive an object to move in a straight line, and the suction cup lifting unit 423 can be a cylinder, hydraulic cylinder, or electric push rod, etc. The rotating unit 424 refers to a component that can drive an object to rotate around an axis. The rotating unit 424 can be a motor, a hollow motor, or a hydraulic motor, etc. In this embodiment, the suction cup body 422 is rotatably mounted on the suction cup bracket 421, and the rotating unit 424 drives the suction cup body 422 to rotate around a first axis. Simultaneously, a suction cup lifting unit 423 is connected between the suction cup bracket 421 and the robotic arm 41. The suction cup lifting unit 423 can drive the suction cup bracket 421 and the suction cup body 422 to reciprocate along the first axis, pressing the thermal pad adsorbed by the suction cup body 422 to achieve the purpose of mounting. At the same time, the suction cup body 422 can also rotate under the action of the rotating unit 424, allowing for adjustment and compensation of the angle of the thermal pad, thereby improving the accuracy of the thermal pad mounting.

[0057] In one embodiment, see Figure 1 The thermal pad mounting equipment includes a first camera unit 5 and a second camera unit 6. The first camera unit 5 is used to acquire images of the product, and the second camera unit 6 is used to acquire images of the thermal pad at the picking position. Specifically, both the first camera unit 5 and the second camera unit 6 are components capable of acquiring images or views of a specified location. Both the first camera unit 5 and the second camera unit 6 can be electrically connected to a control unit. During operation, the first camera unit 5 acquires a first image of the product, and the second camera unit 6 acquires a second image of the thermal pad at the picking position. The control unit can adjust the mounting position and angle of the thermal pad based on the first and second images, resulting in higher accuracy in thermal pad mounting.

[0058] The above are merely preferred embodiments of the present utility model, and only specifically describe the technical principles of the present utility model. These descriptions are only for explaining the principles of the present utility model and should not be construed as limiting the scope of protection of the present utility model in any way. Based on this explanation, any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model, as well as other specific embodiments of the present utility model that can be conceived by those skilled in the art without creative effort, should be included within the scope of protection of the present utility model.

Claims

1. A thermal pad mounting device, characterized in that, include: A workbench, the top of which has a mounting surface; A feeding device, disposed on the mounting surface, is used to transport the thermal pad to the feeding position; A product feeding mechanism, disposed on the worktable, is used to transport the circuit board along a preset path and to pass the mounting position during transportation; and A mounting mechanism is disposed on the workbench. The mounting mechanism is used to transport the thermal pad and mount the thermal pad onto the circuit board located at the mounting position.

2. The thermal pad mounting equipment as described in claim 1, characterized in that, The feeding device includes a peeling mechanism, a gantry feeding mechanism, and a buffer support mechanism. The peeling mechanism is used to peel off the protective film on the thermal pad. The buffer support mechanism is located in the area between the product feeding mechanism and the peeling mechanism, and the feeding position is set on the top surface of the buffer support mechanism. The gantry feeding mechanism is used to transport the thermal pad from the peeling mechanism to the top surface of the buffer support mechanism.

3. The thermal pad mounting equipment as described in claim 2, characterized in that, The cache support mechanism includes a cache bracket, a support plate assembly, and an adsorption structure. The cache bracket is fixed to the mounting surface, the support plate assembly is disposed on the cache bracket, and the support plate assembly is used to support the thermal pad. The adsorption structure is disposed on the support plate assembly and is used to adsorb the thermal pad onto the support plate assembly.

4. The thermal pad mounting equipment as described in claim 3, characterized in that, The adsorption structure includes a vacuum chamber and an adsorption hole group. The vacuum chamber is located inside the support plate group and is used to connect with the external vacuum generating device pipeline. The adsorption hole group is disposed on the top surface of the support plate group and is used to connect the vacuum chamber to the outside of the support plate group.

5. The thermal pad mounting equipment as described in claim 2, characterized in that, The feeding device further includes a pressing mechanism, which is disposed on the mounting surface. The pressing mechanism is used to press and fix other thermal pads when the gantry material handling mechanism takes the thermal pad from the stripping mechanism.

6. The thermal pad mounting equipment as described in claim 5, characterized in that, The pressing mechanism includes a translation slider, a lifting drive unit, a clamping member, and a translation drive unit. The translation slider is slidably disposed on the mounting surface. The translation drive unit is used to drive the translation slider to slide. The clamping member has a degree of freedom to move in the vertical direction relative to the translation slider. The lifting drive unit is disposed on the translation slider and is used to drive the clamping member to move in the vertical direction.

7. The thermal pad mounting equipment as described in claim 2, characterized in that, The gantry material handling mechanism includes a gantry support, a first translation seat, a second translation seat, a vertical slider, and a first suction cup assembly. The gantry support is disposed on the worktable. The first translation seat is movably disposed on the gantry support and has a degree of freedom of movement along a first direction relative to the worktable. The second translation seat is movably disposed on the first translation seat and has a degree of freedom of movement along a second direction relative to the first translation seat. The first direction and the second direction are set at an angle. The vertical slider is movably disposed on the second translation seat and has a degree of freedom of movement along the vertical direction relative to the second translation seat. The first suction cup assembly is disposed on the vertical slider and is used to adsorb a heat-conducting pad through vacuum.

8. The thermal pad mounting equipment according to any one of claims 1 to 7, characterized in that, The mounting mechanism includes a robotic arm and a second suction cup assembly. The robotic arm is mounted on the worktable, and the second suction cup assembly is located at the movable end of the robotic arm for vacuum adsorption of the thermal pad.

9. The thermal pad mounting equipment as described in claim 8, characterized in that, The second suction cup assembly includes a suction cup bracket, a suction cup body, a suction cup lifting unit, and a rotating unit. The suction cup body is mounted on the suction cup bracket and has a degree of freedom to rotate around a first axis. The rotating unit is mounted on the suction cup bracket and is used to drive the suction cup body to rotate. The suction cup lifting unit is connected between the suction cup bracket and the robotic arm and is used to drive the suction cup bracket to move along the first axis.

10. The thermal pad mounting equipment according to any one of claims 1 to 7, characterized in that, The thermal pad mounting equipment includes a first camera unit and a second camera unit. The first camera unit is used to acquire an image of the product, and the second camera unit is used to acquire an image of the thermal pad at the material picking position.

Images