A packaging device and radio frequency signal receiving chain

CN224329904UActive Publication Date: 2026-06-05CHENGDU SHIDAI SUXIN TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
CHENGDU SHIDAI SUXIN TECH CO LTD
Filing Date
2025-05-08
Publication Date
2026-06-05

AI Technical Summary

Technical Problem

In the existing technology, the packaging method of multi-chip systems leads to complex wire layout, large chip system size, and easy interference between high-frequency components, making it difficult to achieve efficient isolation and connection.

Method used

By employing plastic board-level packaging technology and chip flip-chip technology, the first chip is packaged in a plastic casing, and the second chip is placed in the cavity of an HTCC ceramic casing and connected by gold wires. The multi-layer circuit board and wires of the HTCC ceramic casing are used to achieve flexible connection, reduce package size and ensure performance consistency.

Benefits of technology

It achieves effective isolation and connection between chips, reduces package size, improves the consistency and flexibility of signal transmission, avoids wire interference, and reduces layout complexity.

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Abstract

The utility model discloses a kind of packaging device and radio frequency signal receiving link, first chip is packaged using plastic plate level packaging technology and chip flip chip technology, each second chip is placed in each cavity of HTCC ceramic tube shell, realize the isolation between chip;Second chip is connected using the mode of gold wire and HTCC ceramic tube shell, facilitate later debugging;First chip is connected with the contact of the upper surface of HTCC ceramic tube shell by first solder ball, chip consistency is good, and it occupies smaller volume;Pin to Pin between same or different circuit board layers can be achieved using the flexibility of HTCC ceramic tube shell wiring, and contact position is more flexible;Plastic plate level packaging is smaller in size compared with other packaging materials, and the pin of first chip can be led out simultaneously, facilitate and HTCC ceramic tube shell connection, the hybrid packaging of two different technologies minimizes packaging size, while ensuring the performance consistency between different channels.
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