High-efficiency rectifier bridge mold
By designing a high-efficiency rectifier bridge mold and utilizing a combination of chip positioning templates and lead wire positioning templates, precise alignment and automated adjustment of leads and chips are achieved, solving the problems of easy errors in lead wire placement and low welding efficiency, and improving the quality and production efficiency of the rectifier bridge.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHEJIANG SHILING SEMICON CO LTD
- Filing Date
- 2025-06-24
- Publication Date
- 2026-06-09
AI Technical Summary
In the existing rectifier bridge welding process, the placement of the lead wires is prone to errors, resulting in poor quality and low welding efficiency, requiring multiple replacements of the lead wire mold.
Design a high-efficiency rectifier bridge mold, including a chip positioning template and a lead wire positioning template. It adopts multiple sets of neatly arranged chip slots and rotatable positioning components, combined with an adjustment bracket and an electric telescopic rod, to achieve precise alignment and automated adjustment of the lead wire and the chip.
It improves the alignment accuracy and welding efficiency of leads and chips, reduces human error, enhances the versatility and automation of molds, and improves the electrical performance and production quality of rectifier bridges.
Smart Images

Figure CN224333797U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of welding mold technology, specifically to a high-efficiency rectifier bridge mold. Background Technology
[0002] In the semiconductor product soldering field, when soldering a single rectifier bridge, the industry typically first pre-solders the solder pads and chips using a pre-soldering mold and tunnel oven. Then, different leads are manually placed into a soldering mold, and the pre-soldered chip is placed inside, followed by soldering in an assembly mold and tunnel oven to create a semi-finished product. This manual assembly method is inefficient, lacks reverse-engineering protection, and is prone to lead misuse due to human error. The manual placement of leads not only contaminates the lead surface plating, causing aesthetic defects, but also easily impacts the die, leading to poor testing after packaging and ultimately material scrap.
[0003] The prior art proposes a Chinese patent with publication number CN219684211U to solve the aforementioned technical problems. The technical solution disclosed in this patent document is as follows: a welding mold and mold assembly for a rectifier bridge, relating to the field of welding mold technology, its specific structure includes: a body; multiple welding grooves spaced apart on the body; multiple chip slots on the welding grooves; the welding grooves include: two first welding grooves spaced apart and parallel to each other on the body; two second welding grooves spaced apart and parallel to each other on the body, and the second welding grooves intersect with the first welding grooves. This utility model solves the technical problem that the lead placement of existing rectifier bridges is prone to errors, thus affecting the quality of the rectifier bridge. However, in actual welding operations, it requires multiple changes of the lead mold, resulting in low lead welding efficiency for the rectifier bridge. Utility Model Content
[0004] The purpose of this invention is to provide a high-efficiency rectifier bridge mold to solve the problems of the existing rectifier bridge where the lead wire placement is prone to errors, thus affecting the quality of the rectifier bridge, and the need to change the lead wire mold multiple times during actual welding operations, resulting in low welding efficiency of the rectifier bridge lead wires.
[0005] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows:
[0006] A high-efficiency rectifier bridge mold, comprising:
[0007] A chip positioning template, wherein multiple sets of neatly arranged chip slots are provided on the chip positioning template, and each set of chip slots includes four chip slots that are equidistantly distributed around the same center.
[0008] A lead wire positioning template is provided, on which multiple sets of positioning components are rotatably mounted, corresponding to the upper and lower parts of each set of chip slots. Each set of positioning components has a set of lead wire slots inside. The lead wire slots can be adjusted one by one to correspond to the multiple chip slots at the bottom by rotating around the central axis of the positioning component. An adjustment bracket is slidably installed inside the lead wire positioning template, which is used to control the synchronous rotation of all positioning components.
[0009] In the above technical solution, the chip positioning template serves as the basic component of the entire mold, used to fix and position the chip. Multiple neatly arranged chip slots on the template ensure the accurate position of the chip within the mold, facilitating subsequent packaging operations. The chip slots accommodate the chip; each group of four chip slots, equidistantly distributed in a circle around the same center, ensures that the chip arrangement within the mold matches the structure of the rectifier bridge. The lead positioning template fixes and positions the lead wires. Multiple rotatably mounted positioning components on the template correspond vertically to the chip slots, enabling precise alignment between the lead wires and the chip. These positioning components improve the flexibility and accuracy of lead wire and chip alignment, facilitating adaptation to different chip and lead wire specifications, and enhancing the mold's versatility and adaptability. The adjusting bracket further enhances the flexibility and accuracy of lead wire and chip alignment, facilitating adaptation to different chip and lead wire specifications, and enhancing the mold's versatility and adaptability.
[0010] A further improvement of this utility model is that the outer ring of the lead wire positioning template is integrally formed with an upward-folded flange, which is used to support the displacement of the adjustment bracket.
[0011] By adopting the above technical solution, the flange ensures the stability of the adjustment bracket during movement, improves the overall structural strength and reliability of the mold, and helps to improve the accuracy of lead wire and chip alignment.
[0012] A further improvement of the present invention is that the positioning component includes a ring rotatably connected to the lead wire positioning template, a circular plate with a lead wire groove fixedly installed at the bottom of the ring, and a toothed ring connected to the adjusting bracket fixedly installed on the outer ring of the ring.
[0013] The above technical solution features a rotating structure for the positioning component, providing mechanical support for adjusting the lead slot position and ensuring flexibility in lead and chip alignment. The circular plate ensures the accurate position of the lead in the mold, improving the connection accuracy between the lead and the chip and enhancing the electrical performance of the rectifier bridge. The gear ring enables power transmission between the adjustment bracket and the positioning component, ensuring the synchronization and accuracy of lead slot position adjustment and improving the ease of mold operation and production efficiency.
[0014] A further improvement of this utility model is that: the adjusting bracket includes multiple sets of racks that mesh with the toothed rings in the same row, and sliding rods with sliding through flanges are fixedly installed on both sides of the multiple sets of racks. A driving component is fixedly installed on the lead wire positioning template, and the driving component is used to drive the overall displacement of the adjusting bracket.
[0015] By adopting the above technical solution, the rack ensures the power transmission accuracy between the adjusting bracket and the positioning component, improves the accuracy and stability of the lead slot position adjustment, and facilitates the precise alignment of the lead and the chip. The slide bar improves the displacement accuracy and stability of the adjusting bracket, reduces errors in the adjustment process, and helps to improve the ease of mold operation and production efficiency. The drive component realizes the automatic displacement function of the adjusting bracket, improves the automation level of mold operation, reduces errors in manual operation, and improves production efficiency and product quality.
[0016] A further improvement of this utility model is that the same baffle is fixedly connected to one end of the slide rod extension on the same side and the outside of the lead wire positioning template.
[0017] By adopting the above technical solution, the baffle ensures the stability of the adjusting bracket during movement, prevents the adjusting bracket from dislodging, and improves the reliability and safety of the mold.
[0018] A further improvement of the present invention is that the driving component includes an electric telescopic rod fixedly installed on the lead wire positioning template, the output end of the electric telescopic rod extending to the outside of the lead wire positioning template and fixedly connected to one of the sets of baffles.
[0019] By adopting the above technical solution, the electric telescopic rod realizes the automatic displacement function of the adjustment bracket, improves the automation level of mold operation, reduces the error of manual operation, and improves production efficiency and product quality.
[0020] A further improvement of this utility model is that: a first positioning hole is provided at each of the four corners of the lead positioning template, and a second positioning hole is provided at each of the four corners of the chip positioning template, which corresponds vertically to the first positioning hole.
[0021] By adopting the above technical solution, the first positioning hole and the second positioning hole improve the alignment accuracy between the lead positioning template and the chip positioning template, ensure the accurate connection between the lead and the chip, and improve the packaging quality of the rectifier bridge.
[0022] Due to the adoption of the above technical solution, the technological progress achieved by this utility model compared to the prior art is as follows:
[0023] 1. This utility model provides a high-efficiency rectifier bridge mold. Through multiple sets of neatly arranged chip slots, the accurate position of the chip in the mold is ensured, improving the chip positioning accuracy and guaranteeing the quality and consistency of the rectifier bridge packaging. By rotating and installing multiple sets of positioning components, the precise alignment of the leads and chips is achieved, improving the connection accuracy between the leads and chips, reducing errors in the soldering process, and improving the electrical performance of the rectifier bridge. The first positioning hole and the second positioning hole on the lead positioning template and the chip positioning template improve the alignment accuracy between the two, ensuring the accurate connection between the leads and chips, and further improving the packaging quality of the rectifier bridge.
[0024] 2. This utility model provides a high-efficiency rectifier bridge mold. The lead slots of each group of positioning components can rotate around the central axis and be adjusted one by one to correspond with the multiple chip slots at the bottom. This improves the flexibility and accuracy of lead and chip alignment, facilitates the adaptation to chips and leads of different specifications, and enhances the versatility and adaptability of the mold. By adjusting the bracket to control the synchronous rotation of all positioning components, the flexibility and accuracy of lead and chip alignment are further improved, enhancing the versatility and adaptability of the mold and the efficiency of rectifier bridge component welding. The use of electric telescopic rod realizes the automatic displacement function of the adjusting bracket, improves the automation level of mold operation, reduces manual operation errors, and further improves production efficiency and product quality. Attached Figure Description
[0025] The present invention will be further described below with reference to the accompanying drawings.
[0026] Figure 1 This is a top view of the overall structure of this utility model;
[0027] Figure 2 This is a bottom view of the overall structure of this utility model;
[0028] Figure 3 This is a bottom view of the lead wire positioning template structure of this utility model;
[0029] Figure 4 This is a side view of the lead wire positioning template structure of this utility model;
[0030] Figure 5 This utility model Figure 1 Enlarged view of the structure of A in the middle;
[0031] Figure 6 This is a schematic diagram showing the correspondence between the lead groove and the bottom chip groove position after multiple rotations of the lead groove of this utility model;
[0032] Figure 7 This is a three-dimensional structural diagram of another alternative solution in Example 2;
[0033] Figure 8 for Figure 7 A top view of the overall structure;
[0034] Figure 9 for Figure 7 A bottom view of the overall structure.
[0035] In the diagram: 1. Chip positioning template; 2. Chip slot; 3. Lead wire positioning template; 4. Lead wire slot; 5. Flanged edge; 6. Ring; 7. Circular plate; 8. Gear ring; 9. Gear rack; 10. Slide rod; 11. Baffle; 12. Electric telescopic rod; 13. First positioning hole; 14. Second positioning hole; 15. Exhaust hole; 16. Rectifier bridge positioning block; 17. Isolation plate; 18. Liquid injection hole; 19. Outer shell. Detailed Implementation
[0036] The present invention will be further described in detail below with reference to embodiments:
[0037] Example 1
[0038] like Figures 1-6 As shown, this utility model provides a high-efficiency rectifier bridge mold, including a chip positioning template 1 and a lead wire positioning template 3. The chip positioning template 1 has multiple sets of neatly arranged chip slots 2. Each set of chip slots 2 includes four chip slots 2 distributed equidistantly around the same center. The lead wire positioning template 3 is rotatably mounted with multiple sets of positioning components that correspond to the upper and lower parts of each set of chip slots 2. Each set of positioning components has a set of lead wire slots 4 inside. The lead wire slots 4 can be adjusted one by one to correspond to the multiple chip slots 2 at the bottom by rotating around the central axis of the positioning component. An adjustment bracket is slidably installed inside the lead wire positioning template 3. The adjustment bracket is used to control the synchronous rotation of all positioning components.
[0039] In practical applications, the high-efficiency rectifier bridge mold involves placing the rectifier bridge components to be welded one by one into the chip slot 2. Then, the lead wire positioning template 3 is assembled directly above the chip positioning template 1. The lead wire slots 4 inside each positioning assembly correspond to the welding positions of the components within the chip slot 2. Finally, the lead wire is placed into the lead wire slot 4 to complete the assembly. The assembled components can be directly transported to the welding furnace for welding. During welding, the component positions will not shift, thus improving the accuracy of rectifier bridge component processing. Furthermore, the lead wire positioning template 3 is equipped with an adjustment bracket that controls the rotation of the positioning assembly. By using the adjustment bracket to control the positioning assembly to rotate 90 degrees multiple times, the lead wire slot 4 can be adjusted to other welding positions within the chip slot 2. Therefore, all welding operations can be completed without repeatedly replacing the lead wire positioning template 3, effectively improving the efficiency of rectifier bridge component processing.
[0040] Correspondingly, the outer ring of the lead positioning template 3 is integrally formed with an upward-folded flange 5, which is used to support the displacement of the adjustment bracket and can provide stable sliding support for the adjustment bracket.
[0041] like Figures 1-6 As shown, in this embodiment, preferably, the positioning component includes a ring 6 rotatably connected to the lead wire positioning template 3, a circular plate 7 with a lead wire groove 4 fixedly installed at the bottom of the ring 6, and a toothed ring 8 connected to the adjustment bracket fixedly installed on the outer ring of the ring 6.
[0042] Preferably, the adjusting bracket includes multiple sets of racks 9 that mesh with the same gear ring 8. Slide rods 10 that slide through the flange 5 are fixedly installed on both sides of the multiple sets of racks 9. A driving component is fixedly installed on the lead wire positioning template 3. The driving component is used to drive the overall displacement of the adjusting bracket. Furthermore, the same baffle 11 is fixedly connected to one end of the slide rod 10 on the same side extending to the outside of the lead wire positioning template 3. The driving component includes an electric telescopic rod 12 fixedly installed on the lead wire positioning template 3. The output end of the electric telescopic rod 12 extends to the outside of the lead wire positioning template 3 and is fixedly connected to one of the baffles 11.
[0043] The electric telescopic rod 12 is connected to an external control device. Activating the electric telescopic rod 12 can drive the baffle 11 connected to it to move. The baffle 11 drives multiple sets of sliding rods 10 connected to it to slide inside the flange 5. The sliding rods 10 drive the rack 9 to slide on the lead wire positioning template 3. The rack 9 can drive the gear ring 8 connected to it to rotate. The gear ring 8 drives the ring 6 and the circular plate 7 to rotate and adjust. The movement of the rack 9 can drive the sliding rod 10 and the baffle 11 on the other side to move. The sliding rods 10 and the baffle 11 on both sides can provide stable and strong sliding support for the movement of the rack 9.
[0044] In one embodiment, correspondingly, the lead positioning template 3 is provided with a first positioning hole 13 at each of its four corners, and the chip positioning template 1 is provided with a second positioning hole 14 at each of its four corners that corresponds vertically to the first positioning hole 13. The lead positioning template 3 and the chip positioning template 1 can be accurately positioned vertically by using external rods that pass through the first positioning hole 13 and the second positioning hole 14.
[0045] Example 2
[0046] like Figures 7-9 As shown, a high-efficiency rectifier bridge mold may further include venting holes 15, rectifier bridge positioning blocks 16, isolation plates 17, injection holes 18, and a housing 19. The housing 19 contains multiple mold spaces, each containing a rectifier bridge positioning block 16 to define the position and shape of the rectifier bridge. Adjacent mold spaces are separated by isolation plates 17 to prevent two rectifier bridges from sticking together and causing casting errors. Each isolation plate 17 has two injection holes 18 for injecting molten material into the rectifier bridge mold. Each mold space also has multiple venting holes 15 to ensure that the molten material can smoothly enter each mold space during injection, ensuring that multiple rectifier bridges can be successfully cast.
[0047] The present invention has been described in detail above. However, modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, any modifications or improvements that do not depart from the spirit of the present invention are within the protection scope of the present invention.
Claims
1. A high-efficiency rectifier bridge mold, characterized in that, include: A chip positioning template (1) is provided with multiple sets of neatly arranged chip slots (2), each set of chip slots (2) includes four chip slots (2) distributed equidistantly around the same center. The lead wire positioning template (3) has multiple sets of positioning components that correspond to the upper and lower parts of each set of chip slots (2) on it. Each set of positioning components has a set of lead wire slots (4) inside. The lead wire slots (4) can be adjusted one by one to correspond to the multiple chip slots (2) at the bottom by rotating around the central axis of the positioning component. An adjustment bracket is slidably installed inside the lead wire positioning template (3). The adjustment bracket is used to control all positioning components to rotate synchronously.
2. The high-efficiency rectifier bridge mold according to claim 1, characterized in that: The outer ring of the lead positioning template (3) is integrally formed with an upward-folded flange (5), which is used to support the displacement of the adjustment bracket.
3. The high-efficiency rectifier bridge mold according to claim 2, characterized in that: The positioning component includes a ring (6) rotatably connected to the lead wire positioning template (3), a circular plate (7) with a lead wire groove (4) fixedly installed at the bottom of the ring (6), and a toothed ring (8) connected to the adjustment bracket fixedly installed on the outer ring (6).
4. The high-efficiency rectifier bridge mold according to claim 3, characterized in that: The adjusting bracket includes multiple sets of racks (9) that mesh with the toothed ring (8) in the same row. Sliding rods (10) that slide through the flange (5) are fixedly installed on both sides of the multiple sets of racks (9). A driving component is fixedly installed on the lead wire positioning template (3). The driving component is used to drive the overall displacement of the adjusting bracket.
5. The high-efficiency rectifier bridge mold according to claim 4, characterized in that: The same baffle (11) is fixedly connected to one end of the slide bar (10) on the same side and the outside of the lead wire positioning template (3).
6. The high-efficiency rectifier bridge mold according to claim 5, characterized in that: The driving component includes an electric telescopic rod (12) fixedly installed on the lead wire positioning template (3), the output end of which extends to the outside of the lead wire positioning template (3) and is fixedly connected to one of the baffles (11).
7. The high-efficiency rectifier bridge mold according to claim 6, characterized in that: The lead positioning template (3) has a first positioning hole (13) at each of its four corners, and the chip positioning template (1) has a second positioning hole (14) at each of its four corners that corresponds to the first positioning hole (13) above and below.