A novel wafer chamfering machine

Abstract

The utility model relates to wafer processing technical field, concretely is a novel wafer chamfering machine, including frame, the top fixed mounting of frame control panel, the inside fixed mounting of frame one end has three -dimensional motion workstation, and the upper portion of this three -dimensional motion workstation is fixedly connected with the one end of cantilever, the top fixed connection of another end chuck assembly one end of cantilever, install the chuck on chuck assembly, the inside fixed mounting of frame middle part has water tank, and the inside of water tank is located chuck assembly, install the grinding wheel spindle assembly on the inside surface of frame middle part, and the novel wafer chamfering machine is compact, and the layout is reasonable, and the stability is high, and the grinding wheel rotation vibration is small, and the price is only a few to several tenths of imported chamfering machine, solve the imported chamfering machine expensive and certain domestic chamfering machine positioning accuracy difference, chamfering out of round, chamfering produces serious edge collapse, highlight, corrugation and product yield low etc.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, specifically a novel wafer chamfering machine. Background Technology

[0002] In the semiconductor manufacturing industry, the chamfering process of wafers (silicon wafers) is one of the key steps. Its purpose is to remove sharp corners and burrs on the edge of the wafer, improve the edge stress distribution, and avoid edge chipping, bright spots, fragments or defects in subsequent processes. Chamfering is also required in some subsequent processes.

[0003] Currently available wafer chamfering machines are either complex in structure, expensive, and have high maintenance costs, or their chamfering quality fails to meet process requirements. For example, imported wafer chamfering machines, while possessing excellent precision and meeting wafer chamfering needs, are prohibitively expensive, leading to high wafer chamfering costs. Domestic chamfering machines typically use a three-axis moving module to drive a grinding wheel to contact a fixed wafer for chamfering. Due to the weight of the grinding wheel, it is prone to vibration during rotation. Limited by the precision of the lead screw in the moving mechanism, this vibration is amplified. When the vibrating grinding wheel contacts the wafer edge during chamfering, it easily causes wafer chipping, resulting in a low wafer chamfering yield. Furthermore, the vibration of the grinding wheel also accelerates the wear of the three-dimensional motion stage, reducing precision and further causing wafer chipping, out-of-roundness, and other issues, leading to a significant drop in yield. Utility Model Content

[0004] In view of the problems existing in the prior art, this utility model discloses a novel wafer chamfering machine. The technical solution adopted is as follows: it includes a frame, a control panel is fixedly installed on the top of the frame, a three-dimensional motion worktable is fixedly installed inside one end of the frame, the upper part of the three-dimensional motion worktable is fixedly connected to one end of a cantilever, the other end of the cantilever is fixedly connected to the top of one end of a suction cup assembly, a suction cup is installed on the suction cup assembly, a water tank is fixedly installed inside the middle of the frame, the suction cup assembly is located inside the water tank, a grinding wheel spindle assembly is installed on the inner side of the middle of the frame, a cutting and chamfering module is fixedly installed on the side of the upper end of the frame through a second worktable, and a right positioning module is installed on the inner side of the end of the frame away from the control panel.

[0005] The suction cup assembly includes a support base, a suction cup, an air pipe, an air outlet, a rotating cylinder, a rotating motor, and an adsorption groove. The rotating motor is fixedly mounted on the support base, and the output shaft of the rotating motor is fixedly connected to the middle of the bottom of the suction cup. An adsorption groove is opened on the top of the suction cup, and the inside of the suction cup is hollow. The adsorption groove is connected to the inside of the suction cup through an air hole on the top of the suction cup. The inner side of the upper end of the rotating cylinder is rotatably connected to the bottom of the suction cup. An air outlet is opened on the bottom of the suction cup, connecting the inside of the suction cup and the inside of the rotating cylinder. The air outlet at the lower end of the rotating cylinder is connected to one end of the air pipe.

[0006] The grinding wheel spindle assembly includes a fixed base, which is fixedly installed on the inner side of the middle part of the frame. A grinding wheel is rotatably installed on the top of the fixed base. Several chamfered grooves are opened on the side of the grinding wheel. The edge of the grinding wheel is located inside the water tank. A chamfering motor is fixedly installed at the bottom of the fixed base. The output shaft of the chamfering motor is fixedly connected to the grinding wheel shaft through a coupling.

[0007] As a preferred embodiment of this utility model, the second workbench includes a mounting base, which is U-shaped in general. The opposite sides of the two ends of the mounting base are rotatably connected to the two ends of a lead screw. The lead screw passes through a threaded hole on the side of the slider. Two guide rails are fixedly mounted on the side of the middle part of the mounting base. The two guide rails are slidably connected to the slider. A moving motor is fixedly mounted on the side of the mounting base. The output shaft of the moving motor passes through the mounting base and is fixedly connected to one end of the lead screw through a coupling.

[0008] As a preferred technical solution of this utility model, the chamfering module includes a card holder, which is fixedly installed on the slider. A chamfering motor is fixedly installed inside the card holder, and the output shaft of the chamfering motor is fixedly connected to one end of the grinding head.

[0009] As a preferred technical solution of this utility model, the right positioning module includes a support frame, the support frame is L-shaped, the support frame is fixedly installed on the inner side of one end of the frame, the side of the support frame is fixedly connected to one end of the electric push rod, the other end of the electric push rod is fixedly connected to the side of the push block, the middle part of the electric push rod is fixed on the support frame by a U-shaped fixing plate, and a groove that cooperates with the push block is provided on the side of the water tank.

[0010] As a preferred embodiment of this utility model, a fixing rod is fixedly installed on the inner side of the middle part of the frame, and one end of the inner side of the fixing rod is fixedly connected to the side of the positioning block. The positioning block is located inside the water tank, and the positioning block cooperates with the push block to position the wafer.

[0011] As a preferred embodiment of this utility model, two fixing blocks are fixedly installed on the inner side of the water tank, and a water pipe is fixedly installed in the through hole on the side of the fixing block. The water pipe is a copper pipe.

[0012] The beneficial effects of this utility model are as follows: 1. This utility model uses a three-dimensional motion worktable to drive the cantilever and suction cup module to move, achieving precise movement and positioning of the wafer in three-dimensional space along the X, Y, and Z axes. A chamfering motor drives the grinding wheel to rotate, causing the three-dimensional motion worktable to move the wafer held by the suction cup module, bringing it into contact with the grinding wheel for chamfering. During this process, the grinding wheel and chamfering motor are fixed to the frame, resulting in minimal vibration. Given the small mass of the wafer, vibration during movement and rotation is also minimal, effectively preventing edge chipping and out-of-roundness during wafer chamfering, thus improving yield. The entire wafer chamfering machine has a compact structure, reasonable layout, high stability, and minimal grinding wheel rotation vibration, while its price is only a fraction of that of imported chamfering machines. It solves the problems of expensive imported chamfering machines and the poor positioning accuracy, out-of-roundness, severe edge chipping, bright spots, ripples, and low product yield of some domestic chamfering machines.

[0013] 2. The cutting motor and grinding head are moved up and down by the second worktable on the side of the frame to perform edge grinding on the wafer cut, so that one machine can simultaneously perform wafer chamfering and edge chamfering, thus improving the efficiency of wafer processing.

[0014] 3. The wafer is positioned by the fixed rod and positioning block in conjunction with the electric push rod and push block to ensure that the center of the wafer is aligned with the center of the suction cup, which facilitates accurate wafer fixation and ease of use. External water can be introduced into the water tank through the water pipe to cool the contact area between the grinding wheel and the wafer. The copper water pipe can be bent in any direction for easy adjustment. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall front view of the present invention;

[0016] Figure 2 This is a schematic diagram of the overall side view structure of this utility model;

[0017] Figure 3 This is a schematic diagram of the overall rear view structure of this utility model;

[0018] Figure 4 This is a schematic diagram of the wafer chamfering mechanism of this utility model;

[0019] Figure 5 This is a schematic diagram of the adjustment mechanism structure of this utility model;

[0020] Figure 6 This is a schematic diagram of the moving mechanism and the cutting mechanism of this utility model;

[0021] Figure 7 This is a schematic diagram of the overall structure of the suction cup of this utility model;

[0022] Figure 8This is a schematic diagram of the cross-sectional structure of the suction cup of this utility model.

[0023] In the diagram: 1. Frame, 2. Control panel, 3. 3D motion worktable, 4. Cantilever, 6. Suction cup assembly, 60. Support base, 61. Suction cup, 62. Air pipe, 63. Air outlet, 64. Rotary cylinder, 65. Rotary motor, 7. Water tank, 8. Grinding wheel spindle assembly, 81. Grinding wheel, 82. Chamfering groove, 83. Fixing base, 84. Chamfering motor, 9. Cutting and chamfering module, 91. Card holder, 92. Cutting motor, 93. Grinding head, 10. Right positioning module, 1001. Push block, 1002. Fixing plate, 1003. Electric push rod, 1004. Support frame, 11. Fixing rod, 12. Positioning block, 14. Fixing block, 15. Water pipe, 30. Second worktable, 301. Moving motor, 302. Mounting base, 303. Lead screw, 304. Slider, 305. Guide rail. Detailed Implementation

[0024] Example 1

[0025] like Figures 1 to 8As shown, this utility model discloses a novel wafer chamfering machine, including a frame 1. A control panel 2 is fixedly installed on the top of the frame 1. A three-dimensional motion worktable 3 is fixedly installed inside one end of the frame 1. The upper part of the three-dimensional motion worktable is fixedly connected to one end of a cantilever 4. The top of one end of a suction cup assembly 6 is fixedly connected to the other end of the cantilever 4. A suction cup 61 is installed on the suction cup assembly 6. A water tank 7 is fixedly installed inside the middle of the frame. Two fixing blocks 14 are fixedly installed on the inner side of the water tank 7. A water pipe 15 is fixedly installed in the through hole on the side of the fixing block 14. The water pipe 15 is a copper pipe. External water can be introduced into the water tank 7 through the water pipe 15 to cool the wafer during the chamfering process. The copper water pipe 15 can be bent in any direction for easy adjustment. The suction cup assembly 6 is located inside the water tank 7. A grinding wheel spindle assembly is installed on the inner side of the middle of the frame 1. 8. A chamfering module 9 is fixedly installed on the side of the upper end of the frame 1 via a second worktable 30. A right positioning module 10 is installed on the inner side of the frame 1 away from the control panel 2. The three-dimensional motion worktable 3 drives the cantilever 4 and the suction cup module 6 to move, realizing the precise movement and positioning of the wafer in the three-dimensional space of X, Y, and Z axes. The chamfering motor 84 drives the grinding wheel 81 to rotate, so that the three-dimensional motion worktable moves the wafer attracted by the suction cup module 6 to contact the grinding wheel 81 for chamfering. During this process, the grinding wheel 81 and the chamfering motor 84 are fixed on the frame 1, with small vibration amplitude. Since the wafer is small in mass, the vibration during movement and rotation is also small, which can effectively avoid edge chipping and out-of-roundness during wafer chamfering, and improve the yield. The entire wafer chamfering machine has a compact structure, reasonable layout, high stability, and small vibration of the grinding wheel rotation, while the price is only one-tenth to one-twentieth of that of imported chamfering machines. It solves the problems of expensive imported chamfering machines and poor positioning accuracy, out-of-roundness chamfering, severe edge chipping, bright spots, ripples and low product yield of some domestic chamfering machines;

[0026] The second workbench 30 includes a mounting base 302, which is U-shaped. The opposite sides of the two ends of the mounting base 302 are rotatably connected to the two ends of the lead screw 303. The lead screw 303 passes through the threaded hole on the side of the slider 304. Two guide rails 305 are fixedly mounted on the side of the middle part of the mounting base 302. The two guide rails 305 are slidably connected to the slider 304. A moving motor 301 is fixedly mounted on the side of the mounting base 302. The output shaft of the moving motor 301 passes through the mounting base 302 and is fixedly connected to one end of the lead screw 303 through a coupling.

[0027] The chamfering module 9 includes a mounting base 91, which is fixedly mounted on a slider 304. A chamfering motor 92 is fixedly mounted inside the mounting base 91. The output shaft of the chamfering motor 92 is fixedly connected to one end of a grinding head 93. The chamfering motor 92 and the grinding head 93 are moved up and down by the second chamfering worktable 30 on the side of the frame to perform edge grinding on the wafer chamfer. This allows one machine to simultaneously perform wafer chamfering and edge chamfering, improving the efficiency of wafer processing.

[0028] The suction cup assembly 6 includes a support base 60, a suction cup 61, an air pipe 62, an air outlet 63, a rotating cylinder 64, a rotating motor 65, and an adsorption groove 66. The rotating motor 65 is fixedly mounted on the support base of the suction cup assembly 6. The output shaft of the rotating motor 65 is fixedly connected to the middle of the bottom of the suction cup 61. The top of the suction cup 61 has interconnected adsorption grooves 66. The interior of the suction cup 61 is hollow. The adsorption grooves 66 are connected to the interior of the suction cup 61 through the air outlet at the top of the suction cup 61. The inner side of the upper end of the rotating cylinder 64 is rotatably connected to the bottom of the suction cup 61. The bottom of the suction cup 61... An air outlet 63 is provided, connecting the interior of the suction cup 61 and the interior of the rotating cylinder 64. The air outlet at the lower end of the rotating cylinder 64 is connected to one end of the air pipe 62. The grinding wheel spindle assembly 8 includes a fixed base 83, which is fixedly installed on the inner side of the middle part of the frame 1. A grinding wheel 81 is rotatably installed on the top of the fixed base 83. Several chamfered grooves 82 are provided on the side of the grinding wheel 81. The edge of the grinding wheel 81 is located inside the water tank 7. A chamfering motor 84 is fixedly installed at the bottom of the fixed base 83. The output shaft of the chamfering motor 84 is fixedly connected to the grinding wheel shaft 81 through a coupling.

[0029] The right positioning module 10 includes a support frame 1004, which is L-shaped and fixedly installed on the inner side of one end of the frame 1. The side of the support frame 1004 is fixedly connected to one end of the electric push rod 1003, and the other end of the electric push rod 1003 is fixedly connected to the side of the push block 1001. The middle part of the electric push rod 1003 is fixed to the support frame 1004 by a U-shaped fixing plate 1002. The side of the water tank 7 is provided with a groove that cooperates with the push block 1001. A fixing rod 11 is fixedly installed on the inner side of the middle part of the frame 1. One end of the fixing rod 11 is fixedly connected to the side of the positioning block 12. The positioning block 12 is located inside the water tank 7. The positioning block 12 cooperates with the push block 1001 to position the wafer. The fixing rod 11 and the positioning block 12 cooperate with the electric push rod 1003 and the push block 1001 to position the wafer, ensuring that the center position of the wafer is aligned with the center position of the suction cup 61, which facilitates accurate fixing of the wafer and makes it easy to use.

[0030] The working principle of this utility model is as follows: An external power source is connected, water pipe 15 is connected to an external water supply pipe, and air pipe 62 is connected to an external negative pressure air source (such as a vacuum pump in a production workshop). The wafer is placed on top of the suction cup 61. Based on the radius of the wafer, the three-dimensional motion worktable 3 is controlled via control panel 2 to move the suction cup to one side of the water tank 7, making the wafer easily contact the positioning block 12. Simultaneously, the electric push rod 1003 of the right positioning module 10 is controlled via control panel 2 to move the push block 1001, making the push block 1001 contact the wafer. When the wafer contacts the lateral side, the position of the suction cup 61 is adjusted using the three-dimensional motion stage 3 to align the center of the wafer with the center of the suction cup 61, ensuring the wafer completely covers the adsorption groove 66 area. The negative pressure air source is activated, and air is extracted from inside the suction cup 61 and between the adsorption groove 66 and the wafer via the air pipe 62, creating negative pressure in the adsorption groove 66 to firmly adsorb the wafer. The water pipe 15 is bent to direct cooling water towards the contact area between the grinding wheel 81 and the wafer. The Z-axis height of the support base 60 is adjusted using the three-dimensional motion stage 3 to align the wafer with the chamfered groove 82 of the grinding wheel 81. The three-dimensional motion stage 3 then moves the suction cup 61 and the wafer. The wafer edge notch is moved below the grinding head 93. The second worktable 30 on the frame 1 is controlled via control panel 2, causing the notch and chamfering module 9 to move downwards. Simultaneously, the notch motor 92 is controlled via control panel 2, causing the grinding head 93 to rotate. This, in conjunction with the moving mechanism 3, moves the notch mechanism 9 downwards, bringing the rotating grinding head 93 into contact with the wafer edge notch for grinding and chamfering. The notch motor 92 is then turned off. The rotary motor 65 is controlled via control panel 2, causing the chuck 61 and wafer to rotate. The chamfering motor 84 is then controlled via control panel 2. The process involves the chamfering motor 84 driving the grinding wheel 81 to rotate at high speed. The three-dimensional motion worktable drives the support base 6 to move towards the grinding wheel 81, causing the wafer edge to enter the chamfering groove 82 for grinding. This chamfers the edge of the wafer. After the chamfering is completed, the three-dimensional motion worktable drives the support base 60 to return to its initial position, the negative pressure air source is turned off, the wafer is released, and the chamfered wafer can be removed. Throughout the chamfering process, the wafer is kept in the water tank 7. When the water pipe 15 sprays water to cool it down, the cooled water flows into the water tank 7 for collection and is discharged through the drain pipe (not shown in the figure) at the bottom of the water tank 7.

[0031] The circuit connection involved in this utility model is a common method used by those skilled in the art, and technical inspiration can be obtained through a limited number of experiments. It belongs to the widely used prior art.

[0032] Components not described in detail in this article are existing technologies.

[0033] While the specific embodiments of this utility model have been described in detail above, this utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this utility model. Modifications or variations that do not involve creative labor are still within the protection scope of this utility model.

Claims

1. A novel wafer chamfering machine, characterized in that, Includes a frame (1), a control panel (2) is fixedly installed on the top of the frame (1), a three-dimensional motion worktable (3) is fixedly installed inside one end of the frame (1), the upper part of the three-dimensional motion worktable is fixedly connected to one end of the cantilever (4), the other end of the cantilever (4) is fixedly connected to the top of one end of the suction cup assembly (6), the suction cup assembly (6) is equipped with a suction cup (61), a water tank (7) is fixedly installed inside the middle of the frame, the suction cup assembly (6) is located inside the water tank (7), a grinding wheel spindle assembly (8) is installed on the inner side of the middle of the frame (1), a cutting and chamfering module (9) is fixedly installed on the side of the upper end of the frame (1) through a second worktable (30), and a right positioning module (10) is installed on the inner side of the end of the frame (1) away from the control panel (2); The suction cup assembly (6) includes a support base (60), a suction cup (61), an air pipe (62), an air outlet (63), a rotating cylinder (64), a rotating motor (65), and an adsorption groove (66). The rotating motor (65) is fixedly installed on the support base (60). The output shaft of the rotating motor (65) is fixedly connected to the middle of the bottom of the suction cup (61). The top of the suction cup (61) has an adsorption groove (66) that communicates with each other. The inside of the suction cup (61) is hollow. The adsorption groove (66) is connected to the inside of the suction cup (61) through the air hole at the top of the suction cup (61). The inner side of the upper end of the rotating cylinder (64) is rotatably connected to the bottom of the suction cup (61). The bottom of the suction cup (61) has an air outlet (63) that communicates with the inside of the suction cup (61) and the inside of the rotating cylinder (64). The air outlet at the lower end of the rotating cylinder (64) is connected to one end of the air pipe (62). The grinding wheel spindle assembly (8) includes a fixed seat (83), which is fixedly installed on the inner side of the middle part of the frame (1). A grinding wheel (81) is rotatably installed on the top of the fixed seat (83). Several chamfered grooves (82) are opened on the side of the grinding wheel (81). The edge of the grinding wheel (81) is located inside the water tank (7). A chamfering motor (84) is fixedly installed at the bottom of the fixed seat (83). The output shaft of the chamfering motor (84) is fixedly connected to the shaft of the grinding wheel (81) through a coupling.

2. The novel wafer chamfering machine according to claim 1, characterized in that: The second workbench (30) includes a mounting base (302), which is U-shaped. The opposite sides of the two ends of the mounting base (302) are rotatably connected to the two ends of the lead screw (303). The lead screw (303) passes through the thread hole on the side of the slider (304). Two guide rails (305) are fixedly installed on the side of the middle part of the mounting base (302). The two guide rails (305) are slidably connected to the slider (304). A moving motor (301) is fixedly installed on the side of the mounting base (302). The output shaft of the moving motor (301) passes through the mounting base (302) and is fixedly connected to one end of the lead screw (303) through a coupling.

3. A novel wafer chamfering machine according to claim 2, characterized in that: The chamfering module (9) includes a mounting base (91), which is fixedly mounted on the slider (304). A chamfering motor (92) is fixedly mounted inside the mounting base (91), and the output shaft of the chamfering motor (92) is fixedly connected to one end of the grinding head (93).

4. A novel wafer chamfering machine according to claim 1, characterized in that: The right positioning module (10) includes a support frame (1004), which is L-shaped. The support frame (1004) is fixedly installed on the inner side of one end of the frame (1). The side of the support frame (1004) is fixedly connected to one end of the electric push rod (1003). The other end of the electric push rod (1003) is fixedly connected to the side of the push block (1001). The middle part of the electric push rod (1003) is fixed on the support frame (1004) by a U-shaped fixing plate (1002). The side of the water tank (7) is provided with a groove that cooperates with the push block (1001).

5. A novel wafer chamfering machine according to claim 4, characterized in that: A fixing rod (11) is fixedly installed on the inner side of the middle part of the frame (1). One end of the fixing rod (11) is fixedly connected to the side of the positioning block (12). The positioning block (12) is located inside the water tank (7). The positioning block (12) cooperates with the push block (1001) to position the wafer.

6. A novel wafer chamfering machine according to claim 1, characterized in that: Two fixing blocks (14) are fixedly installed on the inner side of the water tank (7). A water pipe (15) is fixedly installed in the through hole on the side of the fixing block (14). The water pipe (15) is a copper pipe.

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