Conductive ring polishing apparatus

Abstract

The utility model discloses a kind of electrically conductive ring polishing devices, belong to the field of polishing equipment, including polishing table and the support seat of setting in polishing table one side, the polishing table includes rack, rack top is sequentially provided with first polishing assembly, second polishing assembly, third polishing assembly and fourth polishing assembly, rack top is also provided with collecting hopper, collecting hopper is located below first polishing assembly, second polishing assembly, third polishing assembly and fourth polishing assembly.Electrically conductive ring is placed on polishing table, it is convenient to operate, and the rotating power of electrically conductive ring comes from each polishing wheel, and transmission assembly does not need to be additionally arranged.For electrically conductive ring of larger radius, support seat provides support, electrically conductive ring is not easy to deform, movement is not jammed, and polishing assembly division of labor cooperates, and each surface of electrically conductive ring is polished and processed, to improve polishing efficiency.

Description

Technical Field

[0001] This utility model belongs to the field of polishing equipment technology, specifically a conductive ring polishing device. Background Technology

[0002] Conductive rings, also known as slip rings, current collector rings, etc., are mainly used to transmit power, electrical signals, and data signals between rotating and stationary parts. They solve the problem of 360° rotating winding, enabling the equipment to stably transmit various signals and energy during rotation and ensuring the normal operation of the equipment.

[0003] Good conductivity is a fundamental characteristic that conductive rings must possess. In the production of conductive rings, the surface of the conductive ring is usually polished in order to reduce contact resistance, improve wear resistance, improve conductivity, and enhance appearance quality.

[0004] Currently, the surface polishing of conductive rings mainly relies on manual labor, which is inefficient. There are also polishing devices, but the conductive ring needs to be suspended on rollers, which is inconvenient. The conductive ring is driven to rotate by rollers and then polished by polishing cloth. Under the action of gravity, the conductive ring is prone to slight deformation, and jamming is likely to occur during the polishing process. Utility Model Content

[0005] The purpose of this invention is to provide a conductive ring polishing device to solve at least one of the problems mentioned in the background art.

[0006] This utility model provides a conductive ring polishing device, including a polishing table and a support seat disposed on one side of the polishing table. The polishing table includes a frame, and a first polishing component, a second polishing component, a third polishing component and a fourth polishing component are sequentially disposed on the top of the frame. A material collection hopper is also disposed on the top of the frame, and the material collection hopper is located below the first polishing component, the second polishing component, the third polishing component and the fourth polishing component.

[0007] A further embodiment: The top of the frame is provided with a first support plate, a second support plate, a third support plate, a fourth support plate, and a fifth support plate in sequence. The second support plate has sliding grooves on both sides. The first and third support plates also have sliding grooves on the side closer to the second support plate. The fourth support plate has a sliding groove on the side away from the third support plate. The fifth support plate also has a sliding groove on the side closer to the fourth support plate. The first polishing component is assembled in the sliding grooves of the first and second support plates. The second polishing component is assembled in the sliding grooves of the second and third support plates. The third polishing component is mounted on the third and fourth support plates. The fourth polishing component is assembled in the sliding grooves of the fourth and fifth support plates.

[0008] A further solution: The fifth support plate is also provided with a first support roller.

[0009] A further embodiment: The first polishing assembly includes a first support frame, with second support rollers mounted on both sides of the first support frame, and a first mounting plate mounted in the middle of the first support frame. A first motor is fixedly mounted on the first mounting plate, and the output shaft of the first motor passes through the first mounting plate and is mounted on a first polishing wheel.

[0010] A further solution: A first support plate is also fixedly installed at one end of the first support frame. The first support plate is connected to a top plate via a top rod. The top plate abuts against the side of the first mounting plate. A spring is fitted on the top rod.

[0011] A further embodiment: The third polishing assembly includes a second support frame, with third support rollers on both sides of one end of the second support frame. A second mounting plate is also fixedly mounted on the second support frame, located between the two third support rollers. A second motor is fixed to the bottom of the second mounting plate, and the output shaft of the second motor passes through the second mounting plate and is mounted on a second polishing wheel. A first slide rail is provided on both sides of the other end of the second support frame, and a first slide block is mounted on each of the two first slide rails. A second support plate is mounted on each of the two first slide blocks. A third polishing wheel is mounted on the side of the second support plate facing the second polishing wheel, and an adjustment assembly is connected to the other side. The second polishing wheel and the third polishing wheel are arranged in parallel.

[0012] A further embodiment: The third polishing wheel is rotatably mounted on the polishing wheel support. The side wall of the polishing wheel support is connected to two parallel support shafts. The other end of the support shaft is connected to the second support plate. A spring is fitted on the support shaft.

[0013] A further embodiment: The fourth polishing assembly includes a third motor, a fourth polishing wheel, a fourth motor, and a fifth polishing wheel. The fourth polishing wheel is mounted on the output shaft of the third motor, the fifth polishing wheel is mounted on the output shaft of the fourth motor, and the fifth polishing wheel is located above the fourth polishing wheel.

[0014] A further solution: The third motor is mounted on the base plate via four rectangular support columns, each with a spring mounted on it. Screw holes are provided on both sides of the base plate, and bolts are fitted into the screw holes.

[0015] A further embodiment: The fourth motor is mounted on the third mounting plate via four rectangularly arranged suspension shafts. The third mounting plate is mounted on the third support plate via an adjusting pusher. The third support plate is mounted on the top of the third support frame. The bottom two sides of the third support frame are provided with second slide blocks. A base is provided below the third support frame. The base has second slide rails on both sides corresponding to the second slide blocks. A translation pusher is also provided on the base, and the translation pusher is connected to the third support frame.

[0016] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0017] Placing the conductive ring on the polishing table facilitates operation. The rotation of the conductive ring is powered by the polishing wheels, eliminating the need for a separate transmission assembly. For conductive rings with larger radii, a support base provides support, preventing deformation and ensuring smooth movement. The polishing components work collaboratively to polish each surface of the conductive ring, improving polishing efficiency.

[0018] The first and second polishing components perform single-sided polishing and can be adjusted in position over a large distance to accommodate conductive rings of different radii. The second and third polishing wheels in the third polishing component work together to polish both the inner and outer surfaces of the conductive ring. The position of the third polishing wheel is adjustable to accommodate conductive rings of different thicknesses. The fourth and fifth polishing wheels in the fourth polishing component work together to polish both sides of the conductive ring. The height of the fifth polishing wheel is adjustable to accommodate conductive rings of different widths. Both the fourth and fifth polishing wheels can be moved and adjusted to accommodate conductive rings of different radii. Attached Figure Description

[0019] To facilitate understanding by those skilled in the art, the present invention will be further described below with reference to the accompanying drawings.

[0020] Figure 1 This is a schematic diagram of the structure of a preferred embodiment of the present invention;

[0021] Figure 2 This is a schematic diagram of the polishing table in a preferred embodiment of the present invention;

[0022] Figure 3 This is a top view of the polishing table in a preferred embodiment of the present invention;

[0023] Figure 4 This is a schematic diagram of the structure of the first polishing component / second polishing component in a preferred embodiment of the present invention;

[0024] Figure 5 This is a schematic diagram of the structure of the third polishing component in a preferred embodiment of the present invention;

[0025] Figure 6 This is a schematic diagram of the structure of the fourth polishing component in a preferred embodiment of the present invention.

[0026] In the diagram: 1-Polishing table; 11-Frame; 12-First polishing assembly; 121-First support frame; 122-First support plate; 123-First mounting plate; 124-Second support roller; 125-First polishing wheel; 126-Top plate; 127-Top rod; 128-First motor; 13-Second polishing assembly; 14-Third polishing assembly; 141-Second support frame; 142-Second motor; 143-Third support roller; 144-Second mounting plate; 145-Second polishing wheel; 146-Third polishing wheel; 147-Polishing wheel support; 148-Support shaft; 149-Second support plate; 1410-Adjusting assembly; 1411-First slide rail; 141 2-First slide block; 15-Fourth polishing assembly; 151-Base plate; 152-Support column; 153-Third motor; 154-Fourth polishing wheel; 155-Fifth polishing wheel; 156-Third support frame; 157-Third support plate; 158-Guide column; 159-Adjusting pusher; 1510-Suspension shaft; 1511-Third mounting plate; 1512-Fourth motor; 1513-Transfer pusher; 1514-Base; 1515-Second slide rail; 1516-Second slide block; 16-Collection hopper; 17-First support roller; 18-First support plate; 19-Second support plate; 110-Third support plate; 111-Fourth support plate; 112-Fifth support plate; 2-Support seat. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present utility model or its application or use. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0028] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0029] In the description of this utility model, it should be understood that the use of terms such as "first" and "second" to define the components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore should not be construed as limiting the scope of protection of this utility model.

[0030] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0031] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0032] Please see Figures 1-3As shown, this embodiment provides a conductive ring polishing device, including a polishing table 1 and a support base 2 disposed on one side of the polishing table 1. The polishing table 1 includes a frame 11, and a first polishing component 12, a second polishing component 13, a third polishing component 14 and a fourth polishing component 15 are sequentially disposed on the top of the frame 11. A material collection hopper 16 is also disposed on the top of the frame 11, and the material collection hopper 16 is located below the first polishing component 12, the second polishing component 13, the third polishing component 14 and the fourth polishing component 15.

[0033] It should be noted that this application does not limit the number of support seats 2, nor does it fix the support seats 2. For example, when processing conductive rings with a small radius, support seats 2 may not be used. For conductive rings with a small radius, the first polishing assembly 12 may not be used. For conductive rings with an even smaller radius, both the first polishing assembly 12 and the second polishing assembly 13 may not be used. When processing some conductive rings with a relatively large radius, one support seat 2 can be used, placed relatively close to the polishing table 1. When processing conductive rings with an even larger radius, two support seats 2 can be used. When processing conductive rings with an even larger radius, three support seats 2 can be used, arranged in a triangle on one side of the polishing table 1.

[0034] The hopper 16 can collect the debris generated during the polishing process. A dust collection device can be connected to the bottom of the hopper 16 to create a negative pressure inside the hopper 16, preventing dust from spreading into the surrounding air. The dust collection device uses existing technology and will not be described in detail here.

[0035] The conductive ring is placed on polishing table 1, which is easy to operate. The rotation power of the conductive ring comes from each polishing wheel, and no separate transmission component is required. For conductive rings with larger radii, the support base provides support, making the conductive ring less prone to deformation and preventing jamming. The polishing components work together to polish each surface of the conductive ring, improving polishing efficiency.

[0036] In some embodiments, please refer to Figures 1-3As shown, the top of the platform 1 is provided with a first support plate 18, a second support plate 19, a third support plate 110, a fourth support plate 111, and a fifth support plate 112 in sequence. The second support plate 19 has sliding grooves on both sides. The first support plate 18 and the third support plate 110 also have sliding grooves on the side close to the second support plate 19. The fourth support plate 111 has a sliding groove on the side away from the third support plate 110. The fifth support plate 112 also has a sliding groove on the side close to the fourth support plate 111. The first polishing component 12 is assembled in the sliding grooves of the first support plate 18 and the second support plate 19. The second polishing component 13 is assembled in the sliding grooves of the second support plate 19 and the third support plate 110. The third polishing component 14 is mounted on the third support plate 110 and the fourth support plate 111. The fourth polishing component 15 is assembled in the sliding grooves of the fourth support plate 111 and the fifth support plate 112. The assembly positions of the first polishing component 12, the second polishing component 13, and the fourth polishing component 15 within the groove can be adjusted. The spacing between the polishing wheels in the third polishing component 14 and the fourth polishing component 15 can also be adjusted to accommodate the processing of conductive rings with different radii, thicknesses, and widths.

[0037] Preferably, the fifth support plate 112 is further provided with a first support roller 17, which is used to support the conductive ring and facilitates the rotation of the conductive ring.

[0038] In some embodiments, please refer to Figure 4 As shown, the first polishing assembly 12 includes a first support frame 121. The bottom of the first support frame 121 is fitted into the sliding grooves of the first support plate 18 and the second support plate 19. Specifically, the first support frame 121 can be fastened to the first support plate 18 and the second support plate 19 by bolts. Loosening the bolts can move the position of the first support frame 121, and tightening the bolts can fasten the first support frame 121 to the first support plate 18 and the second support plate 19 again. Second support rollers 124 are mounted on both sides of the first support frame 121, and a first mounting plate 123 is mounted in the middle of the first support frame 121. A first motor 128 is fixedly mounted on the first mounting plate 123, and the output shaft of the first motor 128 passes through the first mounting plate 123 and is mounted on the first polishing wheel 125. The first motor 128 drives the first polishing wheel 125 to rotate, which can polish the conductive ring on one side. By adjusting the fastening position of the first support frame 121 on the first support plate 18 and the second support plate 19, it can adapt to the polishing of conductive rings of different radii. The first polishing wheel 125 is usually used to polish the outer surface of the conductive ring.

[0039] Preferably, a first support plate 122 is fixedly installed at one end of the first support frame 121. The first support plate 122 is connected to a top plate 126 via a top rod 127. The top plate 126 abuts against the side of the first mounting plate 123. A spring is fitted on the top rod 127. The vibration generated during the operation of the first motor 128 will be transmitted to the first mounting plate 123. The spring on the top rod 127 can buffer and dampen the vibration, avoiding affecting the polishing accuracy.

[0040] Preferably, a lead screw seat can be provided on the side of the first support plate 122 facing away from the top rod 127. The lead screw seat is equipped with a lead screw, which can rotate within the lead screw seat but cannot move axially. A lead screw sleeve that mates with the lead screw is fixed to the top of the frame 1, and a handle is installed at the end of the lead screw. When the bolts of the first support frame 121 are in the loosened state, the position of the first polishing assembly 12 can be adjusted by shaking the handle, saving time and effort.

[0041] Preferably, the second polishing component 13 has the same structure as the first polishing component 12, and the second polishing component 13 is arranged in the opposite direction to the first polishing component 12. The second polishing component 13 is usually used to polish the inner surface of the conductive ring.

[0042] In some embodiments, please refer to Figure 5 As shown, the third polishing assembly 14 includes a second support frame 141. The bottom of the second support frame 141 is fitted into the sliding grooves of the second support plate 19 and the third support plate 110. Specifically, the second support frame 141 can be fastened to the second support plate 19 and the third support plate 110 by bolts. Loosening the bolts can move the position of the second support frame 141, and tightening the bolts can fasten the second support frame 141 to the second support plate 19 and the third support plate 110 again. The second support frame 141 has three support rollers 143 on both sides of one end. A second mounting plate 144 is also fixedly mounted on the second support frame 141. The second mounting plate 144 is located between the two third support rollers 143. A second motor 142 is fixed at the bottom of the second mounting plate 144. The output shaft of the second motor 142 passes through the second mounting plate 144 and is mounted on a second polishing wheel 145. The second support frame 141 has first slide rails 1411 on both sides of the other end. A first slide block 1412 is mounted on each of the two first slide rails 1411. A second support plate 149 is mounted on each of the two first slide blocks 1412. A third polishing wheel 146 is mounted on the side of the second support plate 149 facing the second polishing wheel 145. An adjustment component 1410 is connected to the other side. The second polishing wheel 145 and the third polishing wheel 146 are arranged in parallel and vertically, and are used to polish the inner and outer sides of the conductive ring.

[0043] The adjustment component 1410 adopts existing technology. Its fixed end is fixedly installed on the second support frame 141, and its movable end is connected to the second support plate 149. It is used to drive the second support plate 149 to move back and forth with the third polishing wheel 146 and stop at a suitable position to move closer to or away from the second polishing wheel 145, thereby adjusting the gap between the second polishing wheel 145 and the third polishing wheel 146 to accommodate conductive rings of different thicknesses. By adjusting the fastening position of the second support frame 141 on the second support plate 19 and the third support plate 110, it can accommodate the polishing of conductive rings of different radii.

[0044] Preferably, the third polishing wheel 146 is rotatably mounted on the polishing wheel support 147. Two parallel support shafts 148 are connected to the sidewall of the polishing wheel support 147, and the other end of each support shaft 148 is connected to the second support plate 149. A spring is fitted onto each support shaft 148. The polishing wheel support 147 has a U-shaped structure, and the two ends of the rotation shaft of the third polishing wheel 146 are rotatably connected to two opposite sidewalls of the U-shaped structure. The sidewall on which the support shafts 148 are mounted is the third sidewall.

[0045] When polishing the conductive ring, the second polishing wheel 145 contacts the inner wall of the conductive ring, and the third polishing wheel 146 contacts the outer wall of the conductive ring. At this time, the spring on the support shaft 148 is usually in a slightly compressed state so that the third polishing wheel 146 is in constant contact with the outer wall of the conductive ring to prevent affecting the polishing effect of the outer wall. The rotational power of the third polishing wheel 146 comes from the friction between the third polishing wheel 146 and the conductive ring, which can prevent the outer wall of the conductive ring from being over-polished.

[0046] In some embodiments, please refer to Figure 6 As shown, the fourth polishing assembly 15 includes a third motor 153, a fourth polishing wheel 154, a fourth motor 1512, and a fifth polishing wheel 155. The fourth polishing wheel 154 is mounted on the output shaft of the third motor 153, and the fifth polishing wheel 155 is mounted on the output shaft of the fourth motor 1512, with the fifth polishing wheel 155 positioned above the fourth polishing wheel 154. When processing the conductive ring, the fifth polishing wheel 155 must be positioned directly above the fourth polishing wheel 154, and the fifth polishing wheel 155 and the fourth polishing wheel 154 are used to polish the two sides of the conductive ring respectively.

[0047] Preferably, the third motor 153 is mounted on the base plate 151 via four rectangularly arranged support columns 152. Springs are fitted onto the support columns 152. Screw holes are provided on both sides of the base plate 151, and bolts are fitted into these holes. The other end of the bolts is fitted into a groove in the fourth or fifth support plate. Tightening the bolts fixes the base plate 151 to the fourth or fifth support plate 111 or 112. Loosening the bolts allows adjustment of the position of the base plate 151 on the fourth or fifth support plate 111 or 112 before re-fixing, accommodating the processing of conductive rings of different diameters.

[0048] Preferably, the fourth motor 1512 is mounted on the third mounting plate 1511 via four rectangularly arranged suspension shafts 1510. Springs are fitted around the suspension shafts 1510. The third mounting plate 1511 is mounted on the third support plate 157 via an adjusting pusher 159. The third mounting plate 1511 is also provided with a guide post 158. The third support plate 157 is mounted on the top of the third support frame 156. The bottom two sides of the third support frame 156 are provided with second slide blocks 1516. A base 1514 is provided below the third support frame 156. The base 1514 is provided with second slide rails 1515 on both sides corresponding to the second slide blocks 1516. A translation pusher 1513 is also provided on the base 1514. The translation pusher 1513 is connected to the third support frame 156.

[0049] The adjusting pusher 159 uses existing technology to drive the third mounting plate 1511 to approach or move away from the third support plate 157 and stop at a suitable position, thereby adjusting the height of the fourth motor 1512, and thus adjusting the distance between the fifth polishing wheel 155 and the fourth polishing wheel 154 to accommodate the processing of conductive rings of different widths.

[0050] The translation pusher 1513 uses existing technology to drive the third support frame 156 to slide on the second slide rail 1515 and stop at a suitable position, so as to coordinate with the movement of the fourth polishing wheel 154 and adjust the fifth polishing wheel 155 to be located directly above the fourth polishing wheel 154.

[0051] The first polishing assembly 12 and the second polishing assembly 13 perform single-sided polishing and can be adjusted in position over a large distance to accommodate conductive rings of different radii. The second polishing wheel 145 and the third polishing wheel 146 in the third polishing assembly 14 work together to polish both the inner and outer surfaces of the conductive ring. The position of the third polishing wheel 146 can be adjusted to accommodate conductive rings of different thicknesses. The fourth polishing wheel 154 and the fifth polishing wheel 155 in the fourth polishing assembly 15 work together to polish both sides of the conductive ring. The height of the fifth polishing wheel 155 is adjustable to accommodate conductive rings of different widths. Both the fourth and fifth polishing wheels can be moved and adjusted to accommodate conductive rings of different radii.

[0052] The power lines of the first motor 128, the second motor 142, the third motor 153, and the fourth motor 1512 are connected to the electrical control box. The electrical control box is connected to the power supply, and the power supply to the first motor 128, the second motor 142, the third motor 153, and the fourth motor 1512 can be controlled individually through the electrical control box. The electrical control box is existing technology and will not be described in detail again.

[0053] The above description is merely an example and illustration of the structure of this utility model. Those skilled in the art can make various modifications or additions to the specific embodiments described or use similar methods to replace them, as long as they do not deviate from the structure of the utility model or exceed the scope defined in the claims, they should all fall within the protection scope of this utility model.

Claims

1. A conductive ring polishing device, characterized in that, The device includes a polishing table and a support base disposed on one side of the polishing table. The polishing table includes a frame, and a first polishing component, a second polishing component, a third polishing component and a fourth polishing component are sequentially disposed on the top of the frame. A material collection hopper is also disposed on the top of the frame, and the material collection hopper is located below the first polishing component, the second polishing component, the third polishing component and the fourth polishing component.

2. The conductive ring polishing device according to claim 1, characterized in that, The top of the platform is provided with a first support plate, a second support plate, a third support plate, a fourth support plate, and a fifth support plate in sequence. The second support plate has sliding grooves on both sides. The first and third support plates also have sliding grooves on the side closer to the second support plate. The fourth support plate has a sliding groove on the side away from the third support plate. The fifth support plate also has a sliding groove on the side closer to the fourth support plate. The first polishing component is assembled in the sliding grooves of the first and second support plates. The second polishing component is assembled in the sliding grooves of the second and third support plates. The third polishing component is mounted on the third and fourth support plates. The fourth polishing component is assembled in the sliding grooves of the fourth and fifth support plates.

3. The conductive ring polishing device according to claim 2, characterized in that, The fifth support plate is also equipped with a first support roller.

4. A conductive ring polishing apparatus according to any one of claims 1-3, characterized in that, The first polishing assembly includes a first support frame, with second support rollers mounted on both sides of the first support frame, and a first mounting plate mounted in the middle of the first support frame. A first motor is fixedly mounted on the first mounting plate, and the output shaft of the first motor passes through the first mounting plate and is mounted on a first polishing wheel.

5. A conductive ring polishing device according to claim 4, characterized in that, A first support plate is also fixedly installed at one end of the first support frame. The first support plate is connected to a top plate through a top rod. The top plate abuts against the side of the first mounting plate. A spring is fitted on the top rod.

6. A conductive ring polishing apparatus according to any one of claims 1-3, characterized in that, The third polishing assembly includes a second support frame, with third support rollers on both sides of one end of the second support frame. A second mounting plate is also fixedly mounted on the second support frame, located between the two third support rollers. A second motor is fixed to the bottom of the second mounting plate, and the output shaft of the second motor passes through the second mounting plate and is mounted on a second polishing wheel. A first slide rail is provided on both sides of the other end of the second support frame, and a first slide block is mounted on each of the two first slide rails. A second support plate is mounted on each of the two first slide blocks. A third polishing wheel is mounted on the side of the second support plate facing the second polishing wheel, and an adjustment assembly is connected to the other side. The second polishing wheel and the third polishing wheel are arranged in parallel.

7. A conductive ring polishing device according to claim 6, characterized in that, The third polishing wheel is rotatably mounted on the polishing wheel support. The side wall of the polishing wheel support is connected to two parallel support shafts. The other end of the support shaft is connected to the second support plate, and a spring is fitted on the support shaft.

8. A conductive ring polishing apparatus according to any one of claims 1-3, characterized in that, The fourth polishing assembly includes a third motor, a fourth polishing wheel, a fourth motor, and a fifth polishing wheel. The fourth polishing wheel is mounted on the output shaft of the third motor, and the fifth polishing wheel is mounted on the output shaft of the fourth motor. The fifth polishing wheel is located above the fourth polishing wheel.

9. A conductive ring polishing device according to claim 8, characterized in that, The third motor is mounted on the base plate via four rectangular support columns. Springs are fitted onto the support columns, and screw holes are provided on both sides of the base plate, with bolts installed in the screw holes.

10. A conductive ring polishing device according to claim 8, characterized in that, The fourth motor is mounted on the third mounting plate via four rectangularly arranged suspension shafts. The third mounting plate is mounted on the third support plate via an adjusting pusher. The third support plate is mounted on the top of the third support frame. The bottom two sides of the third support frame are provided with second slide blocks. A base is provided below the third support frame. The base has second slide rails on both sides corresponding to the second slide blocks. A translation pusher is also provided on the base, and the translation pusher is connected to the third support frame.

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