Ultrasonic peeling apparatus

Abstract

This utility model discloses an ultrasonic peeling device, including a stage, an ultrasonic focuser, and a drive mechanism. The stage carries the workpiece and rotates around a preset point; the ultrasonic focuser emits ultrasonic waves and focuses them on the modified zone inside the workpiece; the drive mechanism drives the ultrasonic focuser or the stage to move. During processing, the drive mechanism can drive the ultrasonic focuser or the stage to move, causing the focus of the ultrasonic waves to move relative to the workpiece. Combined with the stage rotating the workpiece, the ultrasonic waves are focused on different positions in the modified zone of the workpiece. Under the combined action of the shock wave generated by the direct action of the ultrasonic waves, the radiation force generated by the original ultrasonic waves, and the radiation force of the subharmonic waves generated by the original ultrasonic waves, the cracks in the modified zone can be significantly expanded. Ultrasonic processing can essentially complete the crack expansion in the modified zone in one pass, effectively improving processing efficiency.

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