A paper laying device for PCB board hole
By designing a padding paper laying device for PCB board via plugging, the automatic laying and adjustment of padding paper is achieved, solving the problem of low automation in the via plugging process and improving the automation and efficiency of the via plugging process.
CN224336737UActive Publication Date: 2026-06-09HUNAN SANXING PRECISION IND CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HUNAN SANXING PRECISION IND CO LTD
- Filing Date
- 2025-07-09
- Publication Date
- 2026-06-09
Smart Images

Figure CN224336737U_ABST
Abstract
The application provides a kind of paper laying device for PCB board hole, be provided in PCB board hole equipment, hole equipment includes workbench;The two sides of workbench are provided with first unwinding mechanism for releasing first paper and first winding mechanism for winding first paper, and first paper is used to lay in workbench to isolate PCB board and workbench.Thereby, solve the problem that the current solder mask ink hole plugging process is low in degree of automation.
Need to check novelty before this filing date? Find Prior Art