Laser processing apparatus

Abstract

This application belongs to the field of laser processing and provides a laser processing device, including: a worktable, a stage, a support frame, a first laser head, and a second laser head; the stage is disposed on the worktable; the support frame is disposed on the worktable; the support frame and the stage are correspondingly disposed; the adjustment device includes a first adjustment mechanism and a second adjustment mechanism, the first adjustment mechanism is disposed on the support frame, and the second adjustment mechanism is disposed on the first adjustment mechanism; the first laser head is disposed on the first adjustment mechanism; the second laser head is disposed on the second adjustment mechanism and distributed along a first direction with the first laser head. During processing, the distance between the second laser head and the first laser head is adjusted along the first direction by the second adjustment mechanism, so that the first laser head and the second laser head are respectively aligned with the target processing area of ​​the glass substrate, thereby adapting to glass substrates of different sizes or different processing task requirements, and improving the versatility of the equipment.

Description

Technical Field

[0001] This application belongs to the field of laser processing technology, and more specifically, relates to a laser processing device. Background Technology

[0002] With the booming development of high-tech industries such as electronics, new energy, and optics, glass substrates, as a key basic material, are finding increasingly wide applications and growing importance. Existing laser processing equipment typically employs a one-to-one processing mode between the stage and the laser head when processing glass substrates. This mode allows for the completion of processing tasks on small or medium-sized glass substrates in a relatively short time, while also ensuring processing accuracy and efficiency.

[0003] However, as the glass substrate manufacturing industry continues to develop towards larger sizes and higher efficiency, the market demand for large-size glass substrates is increasing. Large-size glass substrates are characterized by their large size and wide processing area. If the one-to-one stage and laser head configuration is continued, the processing efficiency will be significantly reduced. If multiple stages and multiple laser heads are used to process large-size glass substrates, it will result in a large number of required equipment, a larger overall size and weight, a larger footprint, higher operating costs, and the spacing between laser heads cannot be adjusted adaptively. Utility Model Content

[0004] In order to overcome the problems existing in the prior art, the main objective of this application is to provide a laser processing device.

[0005] To achieve the above objectives, this application specifically adopts the following technical solution:

[0006] A laser processing device, comprising:

[0007] Workbench;

[0008] A stage, which is disposed on the worktable;

[0009] A support frame is provided on the workbench; the position of the support frame corresponds to that of the loading platform.

[0010] An adjustment device, comprising a first adjustment mechanism and a second adjustment mechanism, wherein the first adjustment mechanism is disposed on the support frame and the second adjustment mechanism is disposed on the first adjustment mechanism;

[0011] A first laser head, wherein the first laser head is mounted on the first adjustment mechanism; and

[0012] The second laser head is disposed on the second adjustment mechanism and is distributed along the first laser head in the first direction;

[0013] The second adjustment mechanism is used to adjust the distance between the second laser head and the first laser head along the first direction, and the first adjustment mechanism is used to adjust the distance between the first laser head and the second laser head and the stage along the second direction, wherein the second direction is not collinear with the first direction.

[0014] The first possibility is that both the first laser head and the second laser head are Bezier cutting heads.

[0015] The first possible scenario is that the first adjustment mechanism includes a fixed plate, a first drive assembly, a guide rail, and a first movable plate. The fixed plate is disposed on the support frame. The first drive assembly and the guide rail are both disposed on the fixed plate. The length direction of the guide rail is consistent with the second direction. The first movable plate is connected to the first drive assembly and slides with the guide rail along the second direction. The second adjustment mechanism and the first laser head are both disposed on the first movable plate.

[0016] The first possible scenario is that the second adjustment mechanism includes a second drive component and a second moving plate, the second drive component is disposed on the first adjustment mechanism, the second moving plate is disposed on the second drive component, and the second laser head is disposed on the second moving plate.

[0017] One possible scenario is that the laser processing equipment further includes a vision inspection component, which is mounted on the first adjustment mechanism.

[0018] The first possibility is that the laser processing equipment further includes a shifting device, which includes a first moving mechanism and a second moving mechanism. The first moving mechanism is disposed on the worktable, the second moving mechanism is disposed on the first moving mechanism, and the stage is disposed on the second moving mechanism. The first moving mechanism is used to drive the second moving mechanism and the stage to reciprocate along a third direction, which is perpendicular to the first direction and the second direction. The second moving mechanism is used to drive the stage to reciprocate along the first direction.

[0019] The first possibility is that the support frame is a gantry frame.

[0020] The first possibility is that the support frame includes two columns and a crossbeam. The two columns are arranged at intervals relative to each other along the first direction. The two ends of the crossbeam are respectively connected to the tops of the two columns. The crossbeam is a marble crossbeam. The first adjustment mechanism is arranged on the crossbeam.

[0021] The first possibility is that the workbench includes a frame and a base plate, the base plate being a marble slab and mounted on the frame, and the loading platform and the support frame both mounted on the base plate.

[0022] The first possibility is that the stage is a vacuum adsorption stage.

[0023] The beneficial effects of the laser processing equipment provided in this application are as follows: Compared with the prior art, the stage of the laser processing equipment of this application is used to support the glass substrate to be processed. During processing, the first laser head and the second laser head simultaneously perform laser processing on different processing areas of the glass substrate. This parallel processing mode significantly shortens the overall processing time of the glass substrate, greatly improves the processing efficiency and production capacity of large-size glass substrates, and enables the simultaneous processing of multiple processing areas through a single device, reducing the number of devices and the floor space, shrinking the overall volume and reducing the overall weight, thereby reducing the equipment procurement and maintenance costs. In addition, the distance between the second laser head and the first laser head is adjusted along the first direction by the second adjustment mechanism, and the distance between the first laser head and the second laser head and the stage is adjusted along the second direction by the first adjustment mechanism, so that the first laser head and the second laser head are respectively aligned with the target processing area of ​​the glass substrate, so as to adapt to glass substrates of different sizes or different processing task requirements, thereby improving the versatility of the equipment. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a three-dimensional structural diagram of a laser processing device provided in one embodiment of this application;

[0026] Figure 2 A partial three-dimensional structural diagram of a laser processing device provided in one embodiment of this application. Figure 1 ;

[0027] Figure 3 A partial three-dimensional structural diagram of a laser processing device provided in one embodiment of this application. Figure 2 .

[0028] Explanation of key figure labels:

[0029] 10. Workbench; 11. Frame; 12. Base plate;

[0030] 20. Stage;

[0031] 30. Support frame; 31. Column; 32. Horizontal beam;

[0032] 40. Adjustment device; 41. First adjustment mechanism; 411. Fixed plate; 412. First drive assembly; 413. Guide rail; 414. First moving plate; 42. Second adjustment mechanism; 421. Second drive assembly; 422. Second moving plate;

[0033] 50. First laser head;

[0034] 60. Second laser head;

[0035] 70. Visual inspection components;

[0036] 80. Shifting device; 81. First moving mechanism; 82. Second moving mechanism; Y, first direction; Z, second direction; X, third direction. Detailed Implementation

[0037] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0038] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0039] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0040] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0041] Please refer to the following: Figures 1 to 3 The laser processing equipment provided in the embodiments of this application will now be described. The laser processing equipment is used to process glass substrates. The equipment includes a worktable 10, a stage 20, a support frame 30, an adjustment device 40, a first laser head 50, and a second laser head 60. The stage 20 is mounted on the worktable 10. The support frame 30 is mounted on the worktable 10 and is correspondingly positioned to the stage 20. The adjustment device 40 includes a first adjustment mechanism 41 and a second adjustment mechanism 42. The first adjustment mechanism 41 is mounted on the support frame 30, and the second adjustment mechanism 42 is mounted on the first adjustment mechanism 41. The first laser head 50 is mounted on the first adjustment mechanism 41. The second laser head 60 is mounted on the second adjustment mechanism 42 and is distributed along a first direction Y with the first laser head 50. The second adjustment mechanism 42 is used to adjust the distance between the second laser head 60 and the first laser head 50 along the first direction Y, and the first adjustment mechanism 41 is used to adjust the distance between the first laser head 50, the second laser head 60, and the stage 20 along a second direction Z. The second direction Z is not collinear with the first direction Y.

[0042] Optionally, the second direction Z is perpendicular to the first direction Y. For example, the first direction Y is the length or width direction of the glass substrate, the second direction Z is the direction perpendicular to the surface of the stage 20, and the first laser head 50 and the second laser head 60 are both located above the stage 20.

[0043] Compared with the prior art, the laser processing equipment provided in this application has a stage 20 used to support the glass substrate to be processed. During processing, the first laser head 50 and the second laser head 60 simultaneously perform laser processing on different processing areas of the glass substrate. This parallel processing mode significantly shortens the overall processing time of the glass substrate, greatly improves the processing efficiency and production capacity of large-size glass substrates, and enables the simultaneous processing of multiple processing areas with a single device, reducing the number of devices and the floor space, shrinking the overall volume and reducing the overall weight, thus lowering the equipment procurement and maintenance costs. In addition, the second adjustment mechanism 42 adjusts the distance between the second laser head 60 and the first laser head 50 along the first direction Y, and the first adjustment mechanism 41 adjusts the distance between the first laser head 50 and the second laser head 60 and the stage 20 along the second direction Z, so that the first laser head 50 and the second laser head 60 are respectively aligned with the target processing area of ​​the glass substrate, so as to adapt to glass substrates of different sizes or different processing task requirements, thereby improving the versatility of the equipment.

[0044] For example, when the sizes of the two glass substrates are different, or when the processing areas of the two glass substrates are divided in different ways, the distance between the first laser head 50 and the second laser head 60 will also differ. Therefore, after processing the first glass substrate, the first laser head 50 is kept stationary, and the position of the second laser head 60 in the first direction Y is adjusted by the second adjustment mechanism 42, so that the distance between the second laser head 60 and the first laser head 50 in the first direction Y reaches the target distance. When the thicknesses of the two glass substrates are different, or the processing tasks are different, the distance between the first laser head 50 and the second laser head 60 and the stage 20 is adjusted by the first adjustment mechanism 41 along the second direction Z, so that the distance between the first laser head 50 and the second laser head 60 and the stage 20 in the second direction Z reaches the target distance.

[0045] It should be noted that large-size glass substrates mainly refer to glass substrates with a size greater than or equal to 24 inches. Furthermore, the processing requirements for multiple processing areas on the glass substrate are consistent, such as the location, number, and size of the processing points. The optical parameters of the first laser head 50 and the second laser head 60 are identical. In addition, the laser processing equipment of this application is also used for laser processing of sheet metal parts, plastic parts, and other products.

[0046] It is understood that the laser processing equipment also includes a control system, a laser, and a beam splitting assembly. The control system is signal-connected to the laser, the first moving mechanism 81, and the second moving mechanism 82. Exemplarily, there is one first laser head 50 and one second laser head 60. During processing, the control system controls the laser to emit laser light. The laser light emitted by the laser is split by the beam splitting assembly to form two laser beams. The two laser beams are focused by the first laser head 50 and the second laser head 60 onto processing points in two processing areas of the glass substrate on the stage 20, respectively. The laser can be a femtosecond infrared laser, a carbon dioxide laser, or a fiber laser. Of course, there can also be multiple first laser heads 50, and similarly, there can also be multiple second laser heads 60.

[0047] Combined with appendix Figure 1 and Figure 2 It is understandable that both the first laser head 50 and the second laser head 60 are Bezier cutting heads. Bezier cutting heads achieve non-contact processing by focusing a high-energy laser beam, significantly reducing the risk of glass substrate breakage, edge chipping, or micro-cracks during processing, thus improving the yield rate of glass substrates.

[0048] Combined with appendix Figure 2 It is understood that the first adjustment mechanism 41 includes a fixed plate 411, a first drive assembly 412, a guide rail 413, and a first moving plate 414. The fixed plate 411 is mounted on the support frame 30. The first drive assembly 412 and the guide rail 413 are both mounted on the fixed plate 411. The length direction of the guide rail 413 is consistent with the second direction Z. The first moving plate 414 is connected to the first drive assembly 412 and slides with the guide rail 413 along the second direction Z. The second adjustment mechanism 42 and the first laser head 50 are both mounted on the first moving plate 414.

[0049] Specifically, the first drive assembly 412 is connected to the control system signal. The first drive assembly 412 is used to drive the first moving plate 414 to reciprocate along the second direction Z. In turn, the first moving plate 414 drives the second adjustment mechanism 42, the first laser head 50 and the second laser head 60 to reciprocate along the second direction Z, so as to adjust the distance between the first laser head 50 and the second laser head 60 and the stage 20. The guide rail 413 is used to guide the movement of the first moving plate 414.

[0050] In the above technical solution, the first adjustment mechanism 41 drives the first moving plate 414 to reciprocate along the first direction Y through the first driving component 412. Combined with the guiding effect of the third guide rail 413, it realizes automatic adjustment of the distance between the first laser head 50 and the second laser head 60 and the glass substrate. The adjustment accuracy is high and the operation is convenient.

[0051] Optionally, the first drive assembly 412 may be, but is not limited to, a servo electric cylinder or a coreless linear motor. Alternatively, the first adjustment mechanism 41 may also be a manual adjustment mechanism or a pneumatic adjustment mechanism.

[0052] Optionally, there are two guide rails 413. The two guide rails 413 are respectively disposed on opposite sides of the first drive assembly 412 along the first direction Y. The movement of the first moving plate 414 is guided by the cooperation of the two guide rails 413, which helps to improve the stability of the first moving plate 414 during movement.

[0053] Combined with appendix Figure 2 and Figure 3 It is understood that the second adjustment mechanism 42 includes a second drive assembly 421 and a second moving plate 422. The second drive assembly 421 is disposed on the first adjustment mechanism 41, the second moving plate 422 is disposed on the second drive assembly 421, and the second laser head 60 is disposed on the second moving plate 422.

[0054] Specifically, the second driving component 421 is disposed on the first moving plate 414. The second driving component 421 is used to drive the second moving plate 422 to reciprocate along the first direction Y, and the second moving plate 422 drives the second laser head 60 to reciprocate along the first direction Y.

[0055] The above technical solution uses the second driving component 421 to drive the second moving plate 422 and the second laser head 60 to reciprocate along the first direction Y, thereby achieving automatic adjustment of the distance between the second laser head 60 and the first laser head 50 along the first direction Y. The adjustment accuracy is high and the operation is convenient.

[0056] Optionally, the second drive assembly 421 may be, but is not limited to, a servo electric cylinder or a coreless linear motor. Alternatively, the second adjustment mechanism 42 may also be a manual adjustment mechanism or a pneumatic adjustment mechanism.

[0057] Combined with appendix Figure 2 It is understood that the laser processing equipment also includes a vision inspection component 70, which is mounted on the first adjustment mechanism 41. Specifically, the vision inspection component 70 is mounted on the first moving plate 414 and is signal-connected to the control system. The vision inspection component 70 is used to inspect the glass substrate on the stage 20 and feeds the inspection data back to the control system. The control system determines the position of the glass substrate based on the inspection data, which helps to improve processing accuracy. In addition, by mounting the vision inspection component 70 on the first adjustment mechanism 41, the positions of the vision inspection component 70, the first laser head 50, and the second laser head 60 in the second direction Z are relatively fixed, effectively ensuring the consistency between the inspection position and the processing position.

[0058] Optionally, the vision inspection component 70 may be, but is not limited to, a charge-coupled device (CCD) component, a complementary metal-oxide-semiconductor (CMOS) component, or an infrared vision inspection component 70. For example, the vision inspection component 70 is a CCD component, which takes pictures of the glass substrate on the stage 20. Image recognition technology is used to detect the actual position, edge contour, or marker points of the glass substrate. After comparing these with preset processing coordinates, a position compensation signal is generated. The control system uses the compensation signal to achieve precise positioning of the glass substrate, effectively ensuring the accuracy and efficiency of the glass substrate processing.

[0059] Combined with appendix Figure 1 It is understood that the laser processing equipment also includes a shifting device 80, which is set on the worktable 10. The shifting device 80 includes a first moving mechanism 81 and a second moving mechanism 82. The first moving mechanism 81 is set on the worktable 10, the second moving mechanism 82 is set on the first moving mechanism 81, and the stage 20 is set on the second moving mechanism 82. The first moving mechanism 81 is used to drive the second moving mechanism 82 and the stage 20 to reciprocate along a third direction X. The third direction X is perpendicular to the first direction Y and the second direction Z. The second moving mechanism 82 is used to drive the stage 20 to reciprocate along the first direction Y.

[0060] Specifically, both the first moving mechanism 81 and the second moving mechanism 82 are connected to the control system signal.

[0061] For example, the first direction Y is the length direction of the glass substrate, and the third direction X is the width direction of the glass substrate. Alternatively, the first direction Y is the width direction of the glass substrate, and the third direction X is the length direction of the glass substrate.

[0062] During the processing, according to the preset processing path and parameters, the first moving mechanism 81 drives the second moving mechanism 82 and the stage 20 carrying the glass substrate to move in the third direction X or the opposite direction to the third direction X. The second moving mechanism 82 drives the stage 20 carrying the glass substrate to move in the first direction Y or the opposite direction to the first direction Y, so that the first laser head 50 and the second laser head 60 complete the processing task of the glass substrate processing area as required. After the processing of the glass substrate is completed, the first moving mechanism 81, the second moving mechanism 82, the first laser head 50 and the second laser head 60 stop working, the stage 20 stops moving, and the processed glass substrate is removed from the stage 20.

[0063] The above technical solution, through the precise control of the stage 20 by the first moving mechanism 81 and the second moving mechanism 82, can accurately move the processing area of ​​the glass substrate to the processing position of the first laser head 50 and the second laser head 60 according to the preset processing path and parameters, ensuring the accuracy of laser processing, reducing processing errors, and improving the processing quality of the glass substrate. Furthermore, during processing, the shifting device 80 can automatically move the stage 20 according to the preset program, enabling the first laser head 50 and the second laser head 60 to continuously and efficiently complete the processing tasks of the glass substrate processing area, eliminating the need for frequent manual adjustments to the glass substrate position, saving processing time, and improving overall processing efficiency. In addition, combined with the adjustment functions of the first adjustment mechanism 41 and the second adjustment mechanism 42 in the second direction Z and the first direction Y respectively, it can meet the requirements of complex and diverse processing paths, greatly improving the flexibility and adaptability of processing.

[0064] Combined with appendix Figure 1 It is understandable that the support frame 30 is a gantry frame. Using a gantry frame for the support frame 30 provides a more stable structure that can effectively resist vibrations and deformations generated during processing. This makes the relative positional relationship between the first laser head 50 and the second laser head 60 and the stage 20 more fixed and precise, which helps to improve the accuracy of laser processing.

[0065] Combined with appendix Figure 1 It is understood that the support frame 30 includes two uprights 31 and a crossbeam 32. The two uprights 31 are arranged at intervals relative to each other along the first direction Y. The two ends of the crossbeam 32 are connected to the tops of the two uprights 31 respectively. The crossbeam 32 is a marble crossbeam 32, and the first adjustment mechanism 41 is set on the crossbeam 32. Specifically, the fixing plate 411 is installed in the middle of the crossbeam 32. By using marble as the material for the crossbeam 32, the crossbeam 32 has high rigidity and stability, providing stable support for the adjustment device 40, the first laser head 50, and the second laser head 60. This helps to reduce errors caused by vibration or deformation during processing. In addition, marble is hard and wear-resistant, and can resist wear and scratches during long-term use.

[0066] Combined with appendix Figure 1 It is understood that the workbench 10 includes a frame 11 and a base plate 12. The base plate 12 is made of marble and is mounted on the frame 11. The platform 20 and the support frame 30 are both mounted on the base plate 12. By using marble as the base plate 12, the high surface flatness of the marble base plate 12 provides a more stable installation benchmark for the platform 20 and the support frame 30, effectively avoiding processing deviations caused by unevenness of the base plate 12. Furthermore, marble has high hardness and good wear resistance, making it less prone to wear or scratches over long-term use, which helps reduce equipment maintenance frequency and costs.

[0067] Combined with appendix Figure 1It is understandable that the stage 20 is a vacuum adsorption stage. The vacuum adsorption stage is connected to an external vacuum pump. When loading a glass substrate, the glass substrate is placed on the vacuum adsorption stage, and the external vacuum pump evacuates the stage, causing it to adsorb the glass substrate and fix it in place. By setting the stage 20 as a vacuum adsorption stage, the glass substrate can be firmly fixed on it, avoiding processing deviations caused by substrate movement or shaking, thus improving processing accuracy. Furthermore, simply turning the vacuum pump on or off allows for rapid fixing and release of the glass substrate, reducing loading and unloading time and improving production efficiency. In addition, vacuum adsorption is less likely to cause mechanical damage to the surface of the glass substrate, effectively ensuring its quality.

[0068] Optionally, the stage 20 has an adsorption area with uniformly distributed vacuum adsorption holes, through which the glass substrate is simultaneously adsorbed. Alternatively, the stage 20 is provided with clamping members, so that when loading the glass substrate, the glass substrate is placed on the stage 20 and clamped on the stage 20 by the clamping members.

[0069] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A laser processing device, characterized in that, include: Workbench; A stage, which is disposed on the worktable; A support frame is provided on the workbench; the position of the support frame corresponds to that of the loading platform. An adjustment device, comprising a first adjustment mechanism and a second adjustment mechanism, wherein the first adjustment mechanism is disposed on the support frame and the second adjustment mechanism is disposed on the first adjustment mechanism; A first laser head is mounted on the first adjustment mechanism; as well as The second laser head is disposed on the second adjustment mechanism and is distributed along the first laser head in the first direction; The second adjustment mechanism is used to adjust the distance between the second laser head and the first laser head along the first direction, and the first adjustment mechanism is used to adjust the distance between the first laser head and the second laser head and the stage along the second direction, wherein the second direction is not collinear with the first direction.

2. The laser processing equipment as described in claim 1, characterized in that: Both the first laser head and the second laser head are Bezier cutting heads.

3. The laser processing equipment as described in claim 1, characterized in that: The first adjustment mechanism includes a fixed plate, a first drive assembly, a guide rail, and a first movable plate. The fixed plate is disposed on the support frame. The first drive assembly and the guide rail are both disposed on the fixed plate. The length direction of the guide rail is consistent with the second direction. The first movable plate is connected to the first drive assembly and slides with the guide rail along the second direction. The second adjustment mechanism and the first laser head are both disposed on the first movable plate.

4. The laser processing equipment as described in claim 1, characterized in that: The second adjustment mechanism includes a second drive component and a second moving plate. The second drive component is disposed on the first adjustment mechanism, the second moving plate is disposed on the second drive component, and the second laser head is disposed on the second moving plate.

5. The laser processing equipment as described in claim 1, characterized in that: The laser processing equipment also includes a vision inspection component, which is mounted on the first adjustment mechanism.

6. The laser processing equipment as described in claim 1, characterized in that: The laser processing equipment further includes a shifting device, which includes a first moving mechanism and a second moving mechanism. The first moving mechanism is disposed on the worktable, the second moving mechanism is disposed on the first moving mechanism, and the worktable is disposed on the second moving mechanism. The first moving mechanism is used to drive the second moving mechanism and the worktable to reciprocate along a third direction, which is perpendicular to the first direction and the second direction. The second moving mechanism is used to drive the worktable to reciprocate along the first direction.

7. The laser processing equipment according to any one of claims 1-6, characterized in that: The support frame is a gantry frame.

8. The laser processing equipment as described in claim 7, characterized in that: The support frame includes two columns and a crossbeam. The two columns are arranged at intervals relative to each other along the first direction. The two ends of the crossbeam are respectively connected to the tops of the two columns. The crossbeam is a marble crossbeam. The first adjustment mechanism is arranged on the crossbeam.

9. The laser processing equipment according to any one of claims 1-6, characterized in that: The workbench includes a frame and a base plate. The base plate is a marble slab and is mounted on the frame. The loading platform and the support frame are both mounted on the base plate.

10. The laser processing equipment according to any one of claims 1-6, characterized in that: The stage is a vacuum adsorption stage.

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