Chip packaging machine with damping structure
By setting a shock-absorbing tray and an elastic buffer structure under the packaging turntable, combined with the support ball limiter, the problems of imbalance and offset vibration after the packaging turntable carries materials are solved, achieving higher stability and precision, and improving the quality of chip packaging and equipment life.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN PAISIDI POWER SEMICON CO LTD
- Filing Date
- 2025-05-29
- Publication Date
- 2026-06-09
AI Technical Summary
Packaging turntables are prone to imbalance and offset vibration after carrying materials, which affects chip packaging accuracy and equipment lifespan, increases maintenance costs, and reduces production efficiency.
It adopts a shock-absorbing tray and elastic buffer structure, combined with support balls and ball limit plates, to prevent the encapsulation turntable from shifting due to uneven gravity, absorb vibration potential energy, and improve stability and precision.
It effectively prevents vibration of the packaging turntable, improves the durability of the device and the packaging precision, reduces equipment wear, lowers maintenance costs, and increases production efficiency.
Smart Images
Figure CN224339408U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of chip packaging technology, specifically a chip packaging machine with a shock-absorbing structure. Background Technology
[0002] In today's chip manufacturing industry, chip packaging is a crucial step, directly affecting the chip's performance, reliability, and lifespan. With the rapid development of technology, electronic devices are constantly moving towards miniaturization and higher performance, which places higher demands on the precision and quality of chip packaging.
[0003] In the chip packaging process, the packaging turntable plays an indispensable role as a crucial component for carrying and transporting materials. It typically follows a pre-programmed sequence to transport the packing board containing the chips to be packaged to various packaging stations, achieving efficient and automated packaging operations. However, in actual operation, the packaging turntable is prone to imbalance after loading materials, leading to offset and vibration.
[0004] On the one hand, the weight distribution of the chips to be packaged may vary, and their placement on the mounting plate is not absolutely precise. This results in uneven weight distribution across different parts of the packaging turntable during rotation. When this imbalance reaches a certain level, it causes an imbalance in centrifugal force during rotation, leading to misalignment and vibration. On the other hand, prolonged high-intensity use may cause slight deformations in the structure of the packaging turntable itself, which will also disrupt its rotational balance and increase the risk of misalignment and vibration.
[0005] This kind of offset vibration has many adverse effects on chip packaging operations. First, it reduces packaging precision. In high-precision chip packaging, even extremely small vibrations can cause the chip's position to deviate during the packaging process, affecting the connection quality between the chip and the packaging material, and reducing chip performance and reliability. Second, frequent offset vibrations accelerate the wear and tear of packaging equipment, shorten its lifespan, and increase maintenance and replacement costs for companies. Furthermore, to address the problems caused by vibration, companies may need to spend more time and effort on equipment debugging and maintenance, which undoubtedly reduces production efficiency and impacts their market competitiveness. Therefore, solving the problem of imbalance and offset vibration after the packaging turntable carries materials has become a crucial issue that the chip packaging industry urgently needs to address. Utility Model Content
[0006] (a) Technical problems to be solved
[0007] To address the shortcomings of existing technologies, this invention provides a chip packaging machine with a shock-absorbing structure, which solves the problems mentioned in the background art, such as the imbalance and easy displacement vibration of the packaging turntable after carrying materials.
[0008] (II) Technical Solution
[0009] To achieve the above-mentioned objectives, the present invention provides the following technical solution: a chip packaging machine with a shock-absorbing structure, including a packaging turntable, the edge of which is provided with multiple sets of placement plates, a rotating shaft coaxially connected below the packaging turntable, a shock-absorbing tray below the packaging turntable, and an elastic buffer structure provided inside the shock-absorbing tray.
[0010] Preferably, the shock-absorbing tray is provided with multiple sets of supporting balls, and the shock-absorbing tray is provided with ball grooves corresponding to the supporting balls. The bottom of the encapsulation turntable is provided with ball contact grooves corresponding to the supporting balls. Multiple sets of supporting balls are placed in the ball grooves, and the tops of the supporting balls abut against the ball contact grooves. A ball limiting plate is also provided between the shelf and the shock-absorbing tray.
[0011] Preferably, the ball bearing limiting plate has ball bearing limiting holes corresponding to multiple sets of supporting balls on its upper surface. Each set of supporting balls is placed in the corresponding ball bearing limiting hole. The ball bearing limiting plate has multiple sets of fixing bolt holes. The ball bearing limiting plate is fixedly installed on the shock-absorbing tray by bolts.
[0012] Preferably, the elastic buffer structure includes a structural block, a shock-absorbing buffer cavity, and an elastic arc ring. The structural block is provided below the shock-absorbing tray, and a retaining ring is provided at the lower end of the shock-absorbing tray. The shock-absorbing buffer cavity is formed inside the structural block, and a limiting ring is provided at the upper end of the structural block. The limiting ring is sleeved on the shock-absorbing tray, and the retaining ring is placed inside the shock-absorbing buffer cavity. An elastic arc ring is provided inside the shock-absorbing buffer cavity, with one end of the elastic arc ring abutting against the bottom surface of the shock-absorbing buffer cavity and the other end of the elastic arc ring abutting against the bottom surface of the shock-absorbing tray.
[0013] Preferably, multiple sets of support rods are provided below the structural block, and a support platform is provided at the other end of the support rods, with the support platform placed on the encapsulation fixing platform.
[0014] (III) Beneficial Effects
[0015] Compared with the prior art, this utility model provides a chip packaging machine with a shock-absorbing structure, which has the following beneficial effects:
[0016] 1. This chip packaging machine with a shock-absorbing structure is equipped with a shock-absorbing tray and an elastic buffer structure, which can support the packaging turntable without affecting it, prevent it from vibrating, absorb vibration potential energy, reduce the impact of vibration on the device, and greatly improve the durability and precision of the device.
[0017] 2. Multiple sets of support balls are provided. The use of balls to support the packaging turntable can prevent the packaging turntable from being displaced due to uneven gravity, which would cause vibration. In addition, the balls are spherical, and the contact area with the packaging turntable is small when supporting it, which does not affect its rotation. This makes the device more stable and improves its durability.
[0018] 3. It is equipped with an elastic buffer structure. The buffer cavity can serve as a motion buffer space, and the elastic arc ring can absorb the vibration potential energy. The combination of the two can prevent vibration from causing the packaging turntable to shake, reduce the impact of vibration on the device, and improve the packaging precision and packaging effect. Attached Figure Description
[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0020] Figure 2 This is an exploded view of the overall structure of this utility model;
[0021] Figure 3 This is an exploded view of the overall structure of this utility model;
[0022] Figure 4 This is a schematic diagram of the elastic buffer structure of this utility model.
[0023] In the diagram: 1. Encapsulation turntable; 2. Shelf plate; 3. Rotating shaft; 4. Shock-absorbing tray; 5. Supporting ball bearings; 6. Ball bearing contact groove; 7. Ball bearing groove; 8. Ball bearing limiting plate; 9. Ball bearing limiting hole; 10. Fixing bolt hole; 11. Structural block; 12. Snap ring; 13. Limiting ring; 14. Shock-absorbing buffer cavity; 15. Elastic arc ring; 16. Support rod; 17. Support platform. Detailed Implementation
[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0025] Please see Figure 1-4 This utility model provides a technical solution:
[0026] A chip packaging machine with a shock-absorbing structure includes a packaging turntable 1. Multiple sets of placement plates 2 are arranged along the edge of the packaging turntable 1. A rotating shaft 3 is coaxially connected below the packaging turntable 1. A shock-absorbing tray 4 is located below the packaging turntable 1, and an elastic buffer structure is provided inside the shock-absorbing tray 4. The packaging turntable 1 is one of the core components of the entire chip packaging operation, and the multiple sets of placement plates 2 along its edge are used to support the chips to be packaged. During the packaging process, the packaging turntable 1 rotates as driven by the rotating shaft 3, thereby sequentially transferring the chips placed on the placement plates 2 to different packaging stations, realizing continuous chip packaging operations.
[0027] Furthermore, the shock-absorbing tray 4 is provided with multiple sets of supporting balls 5, and the shock-absorbing tray 4 has ball grooves 7 corresponding to the supporting balls 5. The bottom of the encapsulation turntable 1 has ball contact grooves 6 corresponding to the supporting balls 5. The multiple sets of supporting balls 5 are placed in the ball grooves 7, and the tops of the supporting balls 5 abut against the ball contact grooves 6. A ball limiting plate 8 is also provided between the placement plate 2 and the shock-absorbing tray 4. The shock-absorbing tray 4 is located below the encapsulation turntable 1 and plays a key role in shock absorption and support. The multiple sets of supporting balls 5 provided on it are important components to ensure the stable rotation of the encapsulation turntable 1. The supporting balls 5 are placed in the ball grooves 7, and their tops are tightly abut against the ball contact grooves 6 at the bottom of the encapsulation turntable 1. Since the balls are spherical, the contact area with the encapsulation turntable 1 is small, so while providing support for the encapsulation turntable 1, it hardly affects its rotation. This support method can effectively prevent the encapsulation turntable 1 from shifting due to uneven gravity, thereby avoiding the vibration caused by it, making the device more stable during operation and improving the overall durability.
[0028] Furthermore, the ball bearing limiting plate 8 has ball bearing limiting holes 9 corresponding to multiple sets of support balls 5. Each set of support balls 5 is placed in its corresponding ball bearing limiting hole 9. The ball bearing limiting plate 8 also has multiple sets of fixing bolt holes 10. The ball bearing limiting plate 8 is fixedly mounted on the shock-absorbing tray 4 with bolts. In addition, the ball bearing limiting plate 8 further positions and constrains the support balls 5. The ball bearing limiting holes 9 on the ball bearing limiting plate 8 correspond one-to-one with multiple sets of support balls 5, and each set of support balls 5 is placed in its corresponding ball bearing limiting hole 9. By fixing the ball bearing limiting plate 8 to the shock-absorbing tray 4 with bolts, it is ensured that the support balls 5 always remain in the correct position during operation and will not shift, thereby stably supporting the encapsulation turntable 1.
[0029] Furthermore, the elastic buffer structure includes a structural block 11, a shock-absorbing buffer cavity 14, and an elastic arc ring 15. The structural block 11 is located below the shock-absorbing tray 4, and a retaining ring 12 is located at the lower end of the shock-absorbing tray 4. The shock-absorbing buffer cavity 14 is formed within the structural block 11, and a limiting ring 13 is located at the upper end of the structural block 11. The limiting ring 13 is fitted onto the shock-absorbing tray 4, and the retaining ring 12 is placed within the shock-absorbing buffer cavity 14. An elastic arc ring 15 is located within the shock-absorbing buffer cavity 14, with one end of the elastic arc ring 15 abutting against the bottom surface of the shock-absorbing buffer cavity 14 and the other end abutting against the bottom surface of the shock-absorbing tray 4. When the packaging machine is subjected to vibration during operation, the vibration is transmitted to the shock-absorbing tray 4. At this time, the elastic buffer structure begins to function. The shock-absorbing buffer cavity 14 provides buffer space for the movement of the shock-absorbing tray 4, while the elastic arc ring 15 located within the shock-absorbing buffer cavity 14 undertakes the important task of absorbing the potential energy of the vibration. One end of the elastic arc ring 15 is tightly pressed against the bottom surface of the shock-absorbing buffer cavity 14, and the other end is pressed against the bottom surface of the shock-absorbing tray 4. When vibration occurs, the elastic arc ring 15 will undergo elastic deformation, converting the energy generated by the vibration into its own elastic potential energy, thereby effectively reducing the impact of vibration on the packaging turntable 1, preventing the packaging turntable 1 from shaking due to vibration, and greatly improving the precision and effect of packaging.
[0030] Furthermore, multiple sets of support rods 16 are provided below the structural block 11, and a support platform 17 is provided at the other end of the support rods 16. The support platform 17 is placed on the packaging fixing platform. The support rods 16 and the support platform 17 together constitute the support system of the entire packaging machine, providing a stable support foundation for the packaging turntable 1, the shock-absorbing tray 4, and other related components. They evenly distribute the weight of the packaging machine onto the packaging fixing platform, ensuring that the entire device will not shake or shift due to its own weight or external vibration during operation, thus ensuring that the packaging machine can work continuously and stably.
[0031] Working Principle: When using this device, the packaging turntable 1 has multiple sets of placement plates 2 along its edge. During chip packaging, the placement plates 2 are used to place the chips to be packaged. A rotating shaft 3 is coaxially connected below the packaging turntable 1, providing it with rotational power. The shock-absorbing tray 4 plays a crucial role in shock absorption and support. Its internal elastic buffer structure includes a structural block 11, a shock-absorbing buffer cavity 14, and an elastic arc ring 15. When vibration occurs during the operation of the packaging machine, the shock-absorbing tray 4 will be affected by the vibration. At this time, the elastic buffer structure comes into play. The shock-absorbing buffer cavity 14 provides buffer space for movement, and one end of the elastic arc ring 15 abuts against the bottom surface of the shock-absorbing buffer cavity 14, while the other end abuts against the bottom surface of the shock-absorbing tray 4. This effectively absorbs the potential energy generated by the vibration, preventing the vibration from being transmitted to the packaging turntable 1, thereby reducing the impact of vibration on the device and improving the precision and effect of packaging. The multiple sets of support balls 5 on the shock-absorbing tray 4 also play an important role. The support balls 5 are placed in the ball grooves 7, with their tops abutting against the ball contact grooves 6 at the bottom of the packaging turntable 1. The balls support the packaging turntable 1, preventing it from shifting and vibrating due to uneven gravity. Because the balls are spherical, the contact area with the packaging turntable 1 is small, ensuring stable operation without affecting its rotation. Furthermore, the ball limiting holes 9 above the ball limiting plate 8 place each set of support balls 5 in its corresponding position, and the ball limiting plate 8 is then fixed to the shock-absorbing tray 4 with bolts, further ensuring the stability of the support balls 5. Multiple support rods 16 and a support platform 17 below the structural block 11 stably place the entire device on the packaging platform, providing a solid foundation for the entire packaging machine. In summary, this chip packaging machine, through the synergistic effect of the shock-absorbing tray 4, the elastic buffer structure, and the support balls 5, effectively prevents vibration from affecting the packaging turntable 1, significantly improving the durability and precision of the device and ensuring high-quality chip packaging.
[0032] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A chip packaging machine having a damping structure, comprising a packaging carousel (1), characterized in that: The edge of the encapsulation turntable (1) is provided with multiple sets of placement plates (2), and a rotating shaft (3) is coaxially connected below the encapsulation turntable (1). A shock-absorbing tray (4) is provided below the encapsulation turntable (1), and an elastic buffer structure is provided inside the shock-absorbing tray (4).
2. A chip packaging machine with a shock-absorbing structure according to claim 1, characterized in that: The shock-absorbing tray (4) is provided with multiple sets of supporting balls (5), and the shock-absorbing tray (4) is provided with ball grooves (7) corresponding to the supporting balls (5). The bottom of the encapsulation turntable (1) is provided with ball contact grooves (6) corresponding to the supporting balls (5). Multiple sets of supporting balls (5) are placed in the ball grooves (7), and the top of the supporting balls (5) abuts against the ball contact grooves (6). A ball limiting plate (8) is also provided between the shelf (2) and the shock-absorbing tray (4).
3. A chip packaging machine with a shock-absorbing structure according to claim 2, characterized in that: The ball limit plate (8) has ball limit holes (9) corresponding to multiple sets of support balls (5) on its upper part. Each set of support balls (5) is placed in the corresponding ball limit hole (9). The ball limit plate (8) has multiple sets of fixing bolt holes (10). The ball limit plate (8) is fixedly installed on the shock absorber tray (4) by bolts.
4. A chip packaging machine with a shock-absorbing structure according to claim 3, characterized in that: The elastic buffer structure includes a structural block (11), a shock-absorbing buffer cavity (14), and an elastic arc ring (15). The structural block (11) is provided below the shock-absorbing tray (4), and a retaining ring (12) is provided at the lower end of the shock-absorbing tray (4). The shock-absorbing buffer cavity (14) is opened inside the structural block (11), and a limiting ring (13) is provided at the upper end of the structural block (11). The limiting ring (13) is sleeved on the shock-absorbing tray (4). The retaining ring (12) is placed inside the shock-absorbing buffer cavity (14). An elastic arc ring (15) is provided inside the shock-absorbing buffer cavity (14). One end of the elastic arc ring (15) abuts against the bottom surface of the shock-absorbing buffer cavity (14), and the other end of the elastic arc ring (15) abuts against the bottom surface of the shock-absorbing tray (4).
5. A chip packaging machine with a shock-absorbing structure according to claim 4, characterized in that: Multiple sets of support rods (16) are provided below the structural block (11), and a support platform (17) is provided at the other end of the support rod (16). The support platform (17) is placed on the encapsulation fixing platform.