Electronic device

Abstract

An electronic device includes first and second modules stacked with each other along a stacking direction. The first module has a pixel substrate and an opposite substrate disposed opposite the pixel substrate; the pixel substrate defines a plurality of display pixels. The second module is located at a side of the first module (abutting the opposite substrate and away from the pixel substrate); the second module has a plurality of micro-opto-electric units and a protective layer; each of the micro-opto-electric units does not obscure one of the display pixels along the stacking direction; each of the micro-opto-electric units includes a micro-opto-electric component, and the micro-opto-electric component of one of the micro-opto-electric units is a sensing component; the protective layer is located at a side away from the first module.

Description

Technical Field

[0001] This invention relates to an electronic device, and to an electronic device that can be widely used in various electronic devices based on micro-optoelectronic components. Background Technology

[0002] Biometric identification uses each person's unique physiological characteristics to identify the user. Fingerprints, for example, are highly accurate and have become a crucial technology for information security. Furthermore, parameters such as pulse and blood oxygen saturation provide numerous physiological parameters related to cardiovascular health. The ability to measure these parameters in real-time, or to connect them remotely or to the cloud, would significantly aid in the prevention of cardiovascular diseases and in life-saving efforts. Summary of the Invention

[0003] This invention provides an electronic device that can be widely used in various electronic devices that primarily use micro-optoelectronic components.

[0004] This invention provides an electronic device that can provide a high accuracy detection rate.

[0005] This invention provides an electronic device comprising a first module and a second module connected to and stacked with the first module along a stacking direction. The first module has a pixel substrate and a pair of opposing substrates disposed opposite to the pixel substrate; the pixel substrate defines a plurality of display pixels. The second module is located on one side of the first module (adjacent to the opposing substrate and away from the pixel substrate); the second module has a plurality of micro-optoelectronic units and a protective layer; each micro-optoelectronic unit of the second module does not obscure one of the display pixels of the first module along the stacking direction; each micro-optoelectronic unit includes a micro-optoelectronic component, and the micro-optoelectronic component of one of the micro-optoelectronic units is a sensing component; the protective layer protects these micro-optoelectronic units and is located on the side away from the first module.

[0006] In some embodiments, the first module further includes: a plurality of light-shielding units disposed on a pixel substrate or disposed on a counter substrate facing the pixel substrate; in the first module, each light-shielding unit is disposed around each display pixel along a plane perpendicular to the stacking direction; each of the micro-photoelectric units of the second module is aligned with one of the light-shielding units of the first module along the stacking direction.

[0007] In some embodiments, the first module further includes: a plurality of filter units disposed on a pixel substrate or disposed on an opposing substrate facing the pixel substrate; in the first module, each filter unit is aligned with each display pixel along the stacking direction.

[0008] In some embodiments, the first module further includes a display medium disposed between a pixel substrate and an opposing substrate.

[0009] In some embodiments, the electronic device further includes a polarizer disposed on a pixel substrate or on a second module.

[0010] In some embodiments, the polarizer disposed in the second module is located between these micro-optoelectronic units and the protective layer of the second module.

[0011] In some embodiments, the polarizer disposed in the second module is located between these micro-optoelectronic units of the second module and the first module.

[0012] In some embodiments, the electronic device further includes: a polarizer disposed on the first module, wherein the polarizer disposed on the side of the first module away from the second module.

[0013] In some embodiments, the electronic device further includes a backlight module disposed on the side of the first module away from the second module.

[0014] In some embodiments, the display medium is a liquid crystal material or an organic self-emissive material.

[0015] In some embodiments, the display medium is a liquid crystal material.

[0016] In some embodiments, the sensing component operates by applying a given reverse bias voltage.

[0017] In some embodiments, the sensing component becomes a light-emitting component by emitting light when given a forward bias voltage.

[0018] In some embodiments, each micro-photovoltaic unit includes multiple micro-photovoltaic components, one of which is the sensing component, and another of which is the light-emitting component.

[0019] In some embodiments, a plurality of adjacent micro-photoelectric units constitute a micro-photoelectric unit group; in each micro-photoelectric unit group, a micro-photoelectric component in one micro-photoelectric unit senses the light emission of a micro-photoelectric component in another micro-photoelectric unit.

[0020] In some embodiments, two adjacent micro-photoelectric units are spaced one unit apart, and the unit distance between two adjacent micro-photoelectric units is defined as at least one positive integer display pixel; the sensing range of one micro-photoelectric component emitting light is M units; in the same group of micro-photoelectric units, the micro-photoelectric component of one micro-photoelectric unit emits light, and the micro-photoelectric component of another micro-photoelectric unit spaced N units apart senses it; M and N are positive integers or zero; M is greater than N.

[0021] In some embodiments, two adjacent micro-photovoltaic unit groups are spaced M+N+1 units apart.

[0022] In some embodiments, the micro-photoelectric units in each micro-photoelectric unit group emit light sequentially.

[0023] In some embodiments, the micro-optoelectronic components in a portion of these micro-optoelectronic units include sensing components; the micro-optoelectronic components in another portion of these micro-optoelectronic units include light-emitting components.

[0024] In some embodiments, the micro-optoelectronic components in a portion of these micro-optoelectronic units include a sensing component; the micro-optoelectronic components in another portion of these micro-optoelectronic units include another sensing component.

[0025] In some embodiments, the micro-photoelectric component in a portion of these micro-photoelectric units includes a light-emitting component; the micro-photoelectric component in another portion of these micro-photoelectric units includes another light-emitting component. Attached Figure Description

[0026] Figure 1 This is an application diagram of one embodiment of the electronic device of the present invention;

[0027] Figure 1A for Figure 1 A partially enlarged structural schematic diagram;

[0028] Figure 1B for Figure 1A Another structural diagram;

[0029] Figure 2 This is a schematic diagram of another embodiment of the electronic device of the present invention;

[0030] Figures 3A to 3G This is an operational schematic diagram of another embodiment of the electronic device of the present invention; and

[0031] Figures 4A to 4G For each corresponding Figures 3A to 3G A schematic diagram of radio waves. Detailed Implementation

[0032] The electronic device according to the present invention will be described below with reference to the accompanying drawings, wherein the same components will be described using the same reference numerals. All illustrations of the embodiments of the present invention are for illustrative purposes only and do not represent actual dimensions or proportions. Furthermore, the terms "above," "below," and "on" in the following embodiments are used only to indicate relative positional relationships. Moreover, the formation of one component "above," "on top of," "below," or "under" another component may include one component being in direct contact with another component in the embodiments, or it may include the presence of additional components between one component and another component, preventing direct contact between the aforementioned one component and another component. Furthermore, the "electronic device" described in the following embodiments can be applied to the technical fields of sensing devices (e.g., fingerprint, palmprint recognition devices), touch devices, display devices, micro-projectors, or lighting devices. The display device may be, for example, a virtual reality (VR) head-mounted display or an augmented reality (AR) head-mounted display; the present invention does not impose any limitations on this.

[0033] Please refer to Figure 1 and Figure 1A As shown, Figure 1 This is a schematic diagram illustrating the application of the electronic device 1 of the present invention in performing biometric identification or parameter measurement, according to one embodiment. Figure 1A for Figure 1 A partially enlarged structural diagram.

[0034] like Figure 1 Finger 2 touches the electronic device 1 of the present invention, such as Figure 1AThe system includes a first module 11 and a second module 12 stacked on top of the first module 11. The first module 11 has a pixel substrate 111 and a pair of opposing substrates 112 disposed opposite to the pixel substrate 111; the pixel substrate 111 defines a plurality of display pixels PL; the display pixels PL in this document can be a matrix arrangement of at least one row / column. The second module 12 is located on one side of the first module 11 (adjacent to the opposing substrate 112 and away from the pixel substrate 111); the second module 12 has a plurality of micro-photoelectric units 121 and a protective layer 122, the micro-photoelectric units 121 in this document can be a matrix arrangement of at least one row / column. Each micro-photoelectric unit 121 of the second module 12 does not obscure each display pixel P of the first module 11 along the stacking direction Ds of the first and second modules 11 and 12. The phrase "does not obscure along the stacking direction Ds" in this document means that the two components along the stacking direction Ds are not aligned with each other, but present a partially misaligned or completely misaligned spatial configuration. Each micro-optoelectronic unit 121 includes at least one micro-optoelectronic component, which may be a sensing component or a light-emitting component; wherein, the micro-optoelectronic component defining at least a portion of the micro-optoelectronic unit 121 includes a sensing component. The phrase "comprising at least one micro-optoelectronic component" as used herein encompasses different numbers (e.g., one or more), different functions (e.g., sensing components or light-emitting components), different types (e.g., charge-coupled devices (CCD), CMOS sensors (CIS), or infrared sensors), or any combination thereof, or other configurations that do not depart from the meaning of this document; the phrase "at least some micro-optoelectronic units" as used herein may encompass one, a portion, or all of them; the configuration of the micro-optoelectronic units 121 will be described in detail later. The protective layer 122 covers and protects these micro-optoelectronic units 121 and is located on the side away from the first module 11. Because the fingerprint 21 has uneven ridges and grooves, it can detect different intensities of light generated by reflection, diffusion, refraction, or diffraction of external or internal light sources by the sensing components defined in at least some of the micro-optoelectronic units 121 and generate corresponding sensing signals. The electronic device 1 can further identify the fingerprint based on the acquired sensing signals.

[0035] like Figure 1AIn the illustrated electronic device 1, the first module 11 further includes, along the stacking direction Ds, a display medium DM located between a pixel substrate 111 (display pixel PL) and a counter substrate 112, a shared electrode layer 113 stacked on the display medium DM, a plurality of light-shielding units 114 and a plurality of light-filtering units 115 located between the shared electrode layer 113 and the counter substrate 112 and arranged alternately, and a driving circuit 116 disposed on the pixel substrate 111. The driving circuit 116 shown in this embodiment can be disposed on the pixel substrate 111, while the adjacently stacked display medium DM and shared electrode layer 113 are located between the pixel substrate 111 and the counter substrate 112. The light-shielding units 114 and the light-filtering units 115 can be disposed on either the pixel substrate 111 or the counter substrate 112. In this embodiment, the light-shielding units 114 and the light-filtering units 115 are disposed on the opposing substrate 112. In the first module 11, the light-shielding units 114 are disposed on the side of the opposing substrate 112 away from the second module 12 and facing the pixel substrate 111. The light-shielding units 114 constitute a black matrix layer. Each light-shielding unit 114 is disposed around each display pixel PL along the plane of the vertical stacking direction Ds, so that the light emitted by the display pixel PL is not blocked by each light-shielding unit 114 and can be further defined by each light-shielding unit 114. The micro-photoelectric units 121 of the second module 12 are respectively corresponding to at least a portion of the light-shielding units 114 in the first module 11 along the stacking direction Ds, and are respectively aligned with the corresponding at least a portion of the light-shielding units 114. In other words, in this embodiment, each micro-photoelectric unit 121 of the second module 12 is aligned with each light-shielding unit 114 in the first module 11 along the stacking direction Ds, which is a one-to-one arrangement; however, not all light-shielding units 14 will be equipped with micro-photoelectric units 121, and more than one micro-photoelectric unit 121 may be equipped on the light-shielding unit 14 where micro-photoelectric units 121 are provided; therefore, regardless of how the corresponding number of micro-photoelectric units 121 and light-shielding units 14 are configured, each micro-photoelectric unit 121 of the second module 12 can be aligned with one of the light-shielding units 14 of the first module 11 along the stacking direction Ds. The filter units 115 formed on the side of the opposing substrate 112 away from the second module and facing the pixel substrate 111 are almost coplanar with the light-shielding units 114, or may be non-coplanar. These filter units 115 constitute a color filter layer. The filter units 115 are aligned with each display pixel PL along the stacking direction Ds. The term "aligned along the stacking direction Ds" as used herein means that the two components are aligned with each other along the stacking direction Ds, and the common center lines of the two components are aligned with each other, or the boundary of one component is covered by the boundary of the other component, or the boundaries of the two components are partially or completely aligned in a spatial configuration.In the above-described case (e.g., each light-shielding unit 114 is disposed around each display pixel PL along the plane of the vertical stacking direction Ds, each light-filtering unit 115 is aligned with each display pixel PL along the stacking direction Ds, and each micro-photoelectric unit 121 of the second module 12 is aligned with one of the light-shielding units 114 of the first module 11 along the stacking direction Ds), each micro-photoelectric unit 121 of the second module 12 may not block one of the display pixels PL of the first module 11 along the stacking direction Ds. The driving circuit 116 comprises a circuit layer including multiple driving units 116D corresponding to the display pixels PL. The driving circuit 116 (driving units 116D) and the display pixels PL may be arranged on the same plane or on different planes. Each driving unit 116D includes at least a thin-film transistor (TFT) to individually drive each micro-photoelectric unit 121. In one embodiment of the invention, each light-shielding unit 114 extends along the plane of the vertical stacking direction Ds, in addition to surrounding each display pixel PL, to each driving unit 116D, so that each light-shielding unit 114 can further shield each driving unit 116D. Furthermore, the protective layer 122 may be a rigid substrate, a flexible substrate, or a protective film, covering these micro-photoelectric units 121.

[0036] In this invention, the display medium DM is determined by the type of display module the first module 11 is used for, such as a liquid crystal module or an organic light-emitting diode (OLED) module, and thus the display medium DM can be selected as either a liquid crystal material or an organic self-emissive material. Figure 1A The electronic device uses liquid crystal material as the display medium (DM).

[0037] Returning to this embodiment, the second module 12, along the stacking direction Ds, also includes a matrix circuit 123 connecting the first module 11 and located between these micro-optoelectronic units 121 and the first module 11, and a filling layer 124 filling the spaces between these micro-optoelectronic units 121. The matrix circuit 123 includes at least one circuit unit corresponding to each micro-optoelectronic unit 121, and is disposed on the opposing substrate 112 of the first module 112 and electrically connected to the electrodes of these micro-optoelectronic components 121. The aforementioned circuit units may be composed solely of simple circuits, or may further include driving components other than circuits. The filling layer 124 may be made of a material with or without adhesiveness, and may be made of a transparent material. The refractive index of the filling layer 124 may be equal to or between the refractive index of the protective layer and the refractive index of the micro-optoelectronic components. In this embodiment, the matrix circuit 123 and the filling layer 124 are located between the protective layer 122 of the second module 12 and the opposing substrate 112 of the first module 11.

[0038] In this embodiment, when the display medium DM of the electronic device 1 is a liquid crystal material, it can be as follows: Figure 1A The illustration further includes a polarizer unit 13 and a backlight module 14. The polarizer unit 13 includes a first polarizer 131 disposed in the first module 11 and a second polarizer 132 disposed in the second module 12. The backlight module 14 is disposed on the side of the first module 11 away from the second module 12; the first polarizer 131, similar to the backlight module 14, is disposed on the side of the first module 11 away from the second module 12, and the first polarizer 131 may be further disposed between the pixel substrate 111 of the first module 11 and the backlight module 14; the second polarizer 132 is simultaneously disposed and located between these micro-optoelectronic units 121 and the protective layer 122 of the second module 12. In this embodiment, the first and second polarizers 131 and 132 can be attached to their corresponding components using the same or different adhesive materials; the second polarizer 132 can be connected to the micro-optoelectronic components in these micro-optoelectronic units 121 using adhesive materials, and the adhesive materials may be the same material as the filler layer 124.

[0039] In another embodiment where the display medium DM of electronic device 1 is made of liquid crystal material, the shared electrode layer 113 stacked on the display medium DM may be omitted from electronic device 1.

[0040] In one embodiment of the present invention, when the display medium DM of the electronic device 1 is an organic light-emitting material, it can be as follows: Figure 1B The example only includes the polarizer unit 13 which has only the second polarizer 132 (and does not include the backlight module 14).

[0041] In another embodiment where the display medium DM of electronic device 1 is an organic light-emitting material, the second polarizer 132 may be omitted from electronic device 1.

[0042] In another embodiment where the display medium DM of electronic device 1 is an organic light-emitting material, the color filter layer composed of these color filter units 115 may be omitted from electronic device 1. In this case, these light-shielding units 114 may be optionally disposed on the pixel substrate 111.

[0043] Since this invention provides at least one micro-photoelectric unit 121 in the BM region of the display pixel P without obscuring it, and regardless of the number of micro-photoelectric units 121, at least one micro-photoelectric component in one of the micro-photoelectric units 121 is a sensing component, a detection function can be achieved. Furthermore, one characteristic of the micro-photoelectric component is that its function can be changed between a sensing component and a light-emitting component depending on the voltage supplied. This invention allows for selection of light extraction methods from the outside, from the inside, or partially from the inside and partially from the outside, and allows for different configurations of the number, function, and type of micro-photoelectric components in these micro-photoelectric units 121. For example, when selecting external light extraction, only sensing components can be arranged in all micro-photoelectric units 121; and one or more sensing components of the same or different types can be selected. When internal light extraction or partial internal light extraction is selected, one, at least a portion, or all of the micro-photoelectric units 121 can be equipped with light-emitting components, and one or more light-emitting components of the same or different types (e.g., infrared light, ultraviolet light, or visible light, etc., different wavelengths) can be selectively arranged; the light-emitting components are not limited to being arranged simultaneously with the sensing components in the same micro-photoelectric unit 121, and the light-emitting components can be further arranged and combined with the aforementioned photosensitive components. Furthermore, considering that the aforementioned micro-photoelectric components can switch between sensing and light-emitting functions by changing the voltage direction, to avoid confusion, the function of a micro-photoelectric component as a sensing component or a light-emitting component is determined by the point in time after the voltage conversion; for example, when a forward bias is given to the micro-photoelectric component, the micro-photoelectric component functions as a light-emitting component, and when a reverse bias is given to the micro-photoelectric component, the micro-photoelectric component functions as a sensing component. In other words, the sensing component and the light-emitting component of the present invention can be further described in the following ways (but are not limited thereto):

[0044] In one embodiment of the present invention, at least a portion of the micro-photovoltaic unit 121 includes a micro-photovoltaic component; the plurality of micro-photovoltaic components of at least a portion of the micro-photovoltaic unit 121 are light-emitting components or sensing components of the same structure / type; or the plurality of micro-photovoltaic components of at least a portion of the micro-photovoltaic unit 121 are of the same structure / type, and act as light-emitting components or sensing components respectively by giving each micro-photovoltaic component a forward bias or a reverse bias.

[0045] In one embodiment of the present invention, at least a portion of the micro-photoelectric unit 121 may contain one or more sensing components.

[0046] In one embodiment of the present invention, at least a portion of the micro-photovoltaic unit 121 may contain one or more sensing components or light-emitting components.

[0047] In one embodiment of the present invention, the micro-photoelectric components of a portion of the micro-photoelectric unit 121 may include one or more sensing components; the micro-photoelectric components of another portion of the micro-photoelectric unit 121 may include one or more light-emitting components. The quantities of the two portions may be the same or different.

[0048] In one embodiment of the present invention, the micro-optoelectronic components of a portion of the micro-optoelectronic unit 121 may include one or more sensing components; the micro-optoelectronic components of another portion of the micro-optoelectronic unit 121 may include one or more sensing components. The types of sensing components in the two portions may be the same or partially the same.

[0049] In one embodiment of the present invention, a portion of the micro-optoelectronic unit 121 may contain one or more light-emitting components; another portion of the micro-optoelectronic unit 121 may contain one or more light-emitting components. The types of light-emitting components in the two portions may be the same or partially the same. It is worth noting that the aforementioned light-emitting components, sensing components, or light-emitting components and sensing components may be different types of micro-optoelectronic components; or, they may be formed by applying corresponding forward or reverse bias voltages to each micro-optoelectronic component, which will be described in detail later.

[0050] Each micro-photovoltaic unit 121 may contain at least one micro-photovoltaic component. For example, if each micro-photovoltaic unit 121 contains two micro-photovoltaic components, one of which is a sensing component and the other is a light-emitting component, then the sensing component is located within the reflection range covered by the emission angle θ of the light-emitting component. In this embodiment, multiple micro-photovoltaic units 121 arranged continuously along one of the vertical stacking directions Ds and Dx can constitute a micro-photovoltaic unit group. The light emitted by the light-emitting component in one of the micro-photovoltaic units 121 in each micro-photovoltaic unit group covers the sensing range after reflection. Therefore, within this sensing range, the light can be simultaneously detected by the sensing component in the same micro-photovoltaic unit 121 and the sensing components in adjacent micro-photovoltaic units 121 located around the light-emitting component, thereby forming a light-emitting-sensing relationship within the unit group or a light-emitting-sensing relationship across unit groups. In addition to the emission angle θ of the light-emitting component, factors that can affect the sensing range include the distance between pairs of micro-photoelectric components (e.g., pixel pitch, or how many pixels apart), the surface roughness of reflective objects (e.g., a finger or a flat reflector), and since each group of micro-photoelectric units can have a cross-unit group emission-sensing relationship, by determining the number of micro-photoelectric unit groups, micro-photoelectric units, and the number of micro-photoelectric components in each micro-photoelectric unit paired with each other, the selected sensing component can receive the emission from the light-emitting component on a specific side during sensing, rather than receiving the emission from multiple light-emitting components simultaneously.

[0051] Similarly, when each micro-photovoltaic unit 121 contains a single micro-photovoltaic component, it can be used to emit light by applying a corresponding forward bias voltage or to sense by applying a reverse bias voltage, so that at least a light-emitting-sensing relationship is formed within the unit group: in each micro-photovoltaic unit group, the micro-photovoltaic component in one micro-photovoltaic unit 121 (acting as a sensing component) senses the light emission of the micro-photovoltaic component in another micro-photovoltaic unit 121 (acting as a light-emitting component).

[0052] In some embodiments, the light-emitting component emits light in the stacking direction Ds, and the light-emitting range of the light-emitting component covers the area swept by the light-emitting angle θ with the stacking direction Ds as the axis, and the range covered by the reflection through the light-emitting range is the sensing range; the same principle can be applied when the light-emitting component emits light in a non-stacking direction Ds.

[0053] The aforementioned micro-optoelectronic unit 121 and / or micro-optoelectronic unit group 12G may define (including but not limited to) a plane formed by one of the directions Dx along the vertical stacking direction Ds, or one of the directions D and a direction Dy along the vertical stacking direction Ds.

[0054] In the electronic device 1 of the present invention, the sensing component is located within the sensing range covered by the emission angle θ of the light-emitting component. By flexibly configuring the number of light-emitting components and sensing components in each micro-photoelectric unit 121, it is beneficial to improve the accuracy and efficiency of the detection rate.

[0055] In the electronic device 1 of the present invention, the sensing component is located within the sensing range covered by the emission angle θ of the light-emitting component, which is beneficial to the electrical detection of the light-emitting component and the sensing component and their detection efficiency; for example, it can be detected if either the light-emitting component or the sensing component fails to achieve a predetermined function (e.g., it cannot emit light or cannot be detected).

[0056] It is understood that in this embodiment, even if the number of micro-optoelectronic components is greater than one and there are light-emitting components and sensing components at the same time, they can be formed by applying a forward bias voltage or a reverse bias voltage respectively.

[0057] In the electronic device 1 of the present invention, since each micro-photoelectric unit 121 of the second module 12 does not obscure each display pixel PL of the first module 11 along the stacking direction Ds; that is, from the direction of the finger 2 toward the viewing direction of the electronic device 1, each micro-photoelectric unit 121 can be aligned with the corresponding light-shielding unit 114 due to its arrangement, thus filling the gap between two adjacent display pixels PL without hindering the display function of each display pixel PL. In this embodiment, the sensing component in each micro-photoelectric unit 121 generates different photocurrents (sensing signals) according to the detection results. The aforementioned sensing signals can be read by the matrix circuit 123 and compared with the sensing signals pre-stored inside the electronic device 1 (corresponding to the pre-stored fingerprint, which is set in advance before detection); when the detected sensing signals are the same as the pre-stored signals, the electronic device 1 can perform subsequent actions such as unlocking or data access to achieve the purpose of biometric identification through the electronic device 1.

[0058] In this embodiment, if the electronic device 1 is used to measure parameters such as heart rate or blood oxygen concentration, each micro-photoelectric unit 121 may simultaneously include a light-emitting component or a sensing component. The light-emitting component emits light towards the skin (e.g., ...). Figure 1 (If finger 2 is replaced with skin from other parts of the body), the different photocurrents (sensing signals) after reflection, diffusion, refraction, or diffraction through the skin can also be received by the sensing components in each micro-photoelectric unit 121. The sensing signal received by the sensing components in each micro-photoelectric unit 121 is a photoplethysmography (PPG) signal, which is read out by the matrix circuit 123. When a human pulse is generated, the blood flow in the body's blood vessels also changes, indicating that the content of heme and deoxyheme in the blood vessels also changes. Heme and deoxyheme are highly sensitive to light of specific wavelengths (e.g., red and infrared light). Therefore, if light (e.g., red, infrared, or green light) is emitted by the light-emitting components in each micro-photoelectric unit 121 and directed towards the tissues and blood vessels under the skin, and then the sensing components in each micro-photoelectric unit 121 receive the reflected or penetrated light, the changes in blood flow within the blood vessels can be obtained by analyzing the intensity of the received light. This change is called a photoplethysmography signal. PPG is a physical quantity generated by the circulatory system. When the heart contracts and relaxes, the blood flow per unit area within the blood vessels causes periodic changes. Since the PPG signal changes are caused by the heartbeat, the level of reflected, diffused, refracted, or diffracted light energy received by the sensing components in each micro-photoelectric unit 121 corresponds to the pulse. Therefore, through the sensing components in each micro-photoelectric unit 121, changes in the human pulse and blood oxygen concentration, as well as other related physiological information, can also be measured.

[0059] The sensing component in this invention, being closer to the finger (i.e. the object to be detected), can avoid interference and has a more accurate detection rate or recognition rate; as mentioned herein, being closer to the object to be detected refers to the fact that the sensing component is mounted on the first module 11 or on the side of the first module 11 that is away from the second module 12.

[0060] Please refer to Figure 2 The diagram shown is a partially enlarged structural schematic of another embodiment of the electronic device 1 of the present invention.

[0061] The driving circuit 116 shown in this embodiment is disposed on the pixel substrate 11. The light-shielding units 114 and the filter units 115 are disposed on the opposing substrate 112. The display medium DM and the shared electrode layer 113 are located between the pixel substrate 111 and the opposing substrate 112. The filling layer 124' fills the spaces between the micro-optoelectronic components 121'. The polarizer unit 13' includes a first polarizer 131 disposed in the first module 11 and a second polarizer 132' disposed in the second module 12. The first polarizer 131 is located between the pixel substrate 111 and the backlight module 14 of the first module 11, and the second polarizer 132' is disposed on the opposing substrate 112 of the first module 11. Figure 1A The difference is that in this embodiment, these micro-optoelectronic components 121' are inverted. The matrix circuit 123' and the filling layer 124' of the second module 12' are located between the protective layer 122 of the second module 12 and the opposing substrate 112 of the first module 11. The matrix circuit 123' is disposed on the side of the protective layer 122 facing the first module 11 and is located between the protective layer 122 and these micro-optoelectronic components 121'. The matrix circuit 123' is electrically connected to the electrodes of these micro-optoelectronic components 121'. The filling layer 124' is located between the matrix circuit 123' on the protective layer 112 and the second polarizer 132 disposed on the opposing substrate 112 of the first module 11.

[0062] In one embodiment of the present invention, such as Figure 2 These micro-optoelectronic components 121' are inverted, and various embodiments derived from this invention can also be applied.

[0063] Please see Figures 3A to 3G This is an operational schematic diagram of another embodiment of the electronic device of the present invention, and is accompanied by... Figures 4A to 4G The corresponding waveform diagram is one embodiment of sensing or emitting light by applying a corresponding forward or reverse bias voltage to the micro-optoelectronic component. For example... Figure 3AAs shown, each micro-photoelectric unit 121 is illustrated with one micro-photoelectric component. Multiple adjacent micro-photoelectric units 121' constitute a micro-photoelectric unit group 12G'. Two adjacent micro-photoelectric units 121' are spaced one unit apart, which can be defined as at least one positive integer display pixel. When the micro-photoelectric component is a light-emitting component 121a, its light-emitting sensing range is M units. Within the same micro-photoelectric unit group 12G, when one of the micro-photoelectric components 121a in one of the micro-photoelectric units 121' emits light, a micro-photoelectric component in that micro-photoelectric unit 121' located N units away from it is selected as a sensing component 121b. Here, M and N are positive integers or zero, and M is greater than N.

[0064] In this embodiment, the micro-photoelectric components in micro-photoelectric unit 121' of micro-photoelectric unit group 12G emit light, and the micro-photoelectric components in another micro-photoelectric unit 121' of the same micro-photoelectric unit group 12G', which is N units away, are used for sensing. The distance between two adjacent micro-photoelectric unit groups 12G' is M+N+1 units; where M+N+1 can be calculated from (2M)-(MN)+1. In this embodiment, the distance between two adjacent micro-photoelectric unit groups 12G' is maintained at M+N+1 units per time frame, such as per mini second, but this is not limited to this.

[0065] In this embodiment, the unit between two adjacent micro-photoelectric units 121 can be defined as a pixel, and the distance between two adjacent micro-photoelectric unit groups 12G' is M+N+1 pixels. It is worth noting that when the sensing range of the light-emitting component 121a is wide enough, or the display pixels are small enough, the unit between two adjacent micro-photoelectric units 121' can also be defined as multiple pixels.

[0066] The following explanation assumes M equals 4 and N equals 2. Each micro-photoelectric unit group 12G' includes 7 (M+N+1) pixels. These micro-photoelectric units 121' are sequentially given a forward bias voltage starting from one side, causing the micro-photoelectric components in each micro-photoelectric unit 121' to function as light-emitting components 121a. The sensing range of the light-emitting component 121a is four pixels extending outwards from the center of the aforementioned light-emitting component 121a. Simultaneously, in this embodiment, along axis Dx, a micro-photoelectric component located two pixels away from the aforementioned light-emitting component 121a is selected from the four pixels on one side and given a reverse bias voltage to function as a sensing component 121b. Other micro-photoelectric components (represented by the numeral 121c) are not given voltage, ensuring the light-emitting-sensing sequence is as follows: Figures 3A to 3G As shown. In Figure 3A In the middle, the forward bias-reverse bias relationship is as follows: Figure 4ATo apply forward, zero, reverse, zero, zero, zero, and zero bias voltages, such as Figure 4B To apply zero, forward, zero, reverse, zero, zero, and zero bias voltage, and so on up to Figure 4G As shown. It is worth noting that, Figures 3A to 3E , Figures 4A to 4E This represents the light-emitting and sensing relationship within the unit group; Figures 3F to 3G , Figures 4F to 4G This represents the light emission-sensing relationship across unit groups.

[0067] It is worth noting that in this embodiment, when the selected reflective object Ob is an object with uniform surface roughness, then Figures 3A to 3G , Figures 4A to 4G The process can be used to detect whether the micro-optoelectronic components are functional and whether they meet the requirements.

[0068] It is worth noting that these micro-optoelectronic components are applied forward bias voltage sequentially (or / and individually) to function as light-emitting components. These micro-optoelectronic components are applied reverse bias voltage to function as sensing components, which can be adjacent to the aforementioned light-emitting components (e.g., unidirectional / unilateral), and their number can be one or more, where M and N are positive integers greater than zero. Furthermore, when each micro-optoelectronic unit 121' contains multiple micro-optoelectronic components, M and N can both be zero.

[0069] It is worth noting that the specific voltages for these micro-optoelectronic components in this embodiment are given sequentially, but they can also be given out of sequence.

[0070] In this embodiment, the flexible configuration of the number of light-emitting components 121a and sensing components 121b in each micro-photoelectric unit 121' is beneficial to improving the accuracy and efficiency of the detection rate. In addition, the sensing component 121b is located within the sensing range of the light-emitting component 121a, which is beneficial to the electrical detection of the light-emitting component 121a and the sensing component 121b and their detection efficiency.

[0071] In the foregoing embodiments, the matrix circuit 123 (123') is electrically connected to these micro-optoelectronic units 121 (121'). The electronic device 1 (1') of the present invention may further include a control component (not shown), such as an integrated circuit component, directly or indirectly electrically connected to one of the matrix circuit 123 (123'), controlling these micro-optoelectronic units 121 (121') and / or the driving circuit 116 (and its driving unit 116D). The implementation of the control component being electrically connected to the matrix circuit 123 (123') is not limited. For example, the control component may be directly disposed on the pixel substrate 111 of the first module 11 and electrically connected to the matrix circuit 123 (123') through a conductive design; the control component may also be disposed on a driving circuit board (stacked parallel to the pixel substrate 111) and electrically connected to the pixel substrate 111 through a flexible substrate; or the control component may be disposed on the aforementioned flexible substrate.

[0072] In summary, the electronic device of the present invention can be widely applied to various electronic devices based on micro-optoelectronic components, providing a high detection rate. The advantages of the electronic device of the present invention are: the micro-optoelectronic units of the second module are staggered along the stacking direction from the corresponding display pixels of the first module without obscuring the aforementioned display pixels, allowing each micro-optoelectronic unit to precisely fill the gap between two adjacent display pixels, thus not hindering the display function of each display pixel, nor the light emission or detection / identification function of each micro-optoelectronic unit. Furthermore, the flexible configuration of the number of micro-optoelectronic unit groups, micro-optoelectronic units, and micro-optoelectronic components is beneficial for improving the accuracy and efficiency of the detection rate; the sensing component is located within the sensing range of the light-emitting component, which is beneficial for the electrical detection of the micro-optoelectronic components and its detection efficiency.

[0073] The above description is merely illustrative and not restrictive. Any equivalent modifications or alterations made without departing from the spirit and scope of this invention should be included in the appended claims.

Claims

1. An electronic device comprising: The first module includes a pixel substrate and a facing substrate disposed opposite to the pixel substrate; wherein the pixel substrate defines a plurality of display pixels; and The second module is connected to and stacked with the first module along the stacking direction. The second module is located on the side of the first module where the opposing substrate is connected and away from the pixel substrate. The second module has multiple micro-photoelectric units and a protective layer. Each micro-photoelectric unit of the second module does not obscure one of the display pixels of the first module along the stacking direction. Each micro-photoelectric unit includes a micro-photoelectric component, and the micro-photoelectric component of one of the micro-photoelectric units is a sensing component. The protective layer protects the micro-photoelectric units and is located on the side away from the first module. The first module further includes: a plurality of light-shielding units disposed on the pixel substrate or on the opposing substrate facing the pixel substrate; in the first module, each of the light-shielding units is disposed around each of the display pixels along a plane perpendicular to the stacking direction.

2. The electronic device according to claim 1, wherein, Each of the micro-photoelectric units in the second module is aligned with one of the light-shielding units in the first module along the stacking direction.

3. The electronic device according to claim 2, wherein, The first module further includes: a plurality of filter units disposed on the pixel substrate or disposed on the opposing substrate facing the pixel substrate; in the first module, each filter unit is aligned with each display pixel along the stacking direction.

4. The electronic device according to claim 1, wherein, The first module further includes a display medium disposed between the pixel substrate and the opposing substrate.

5. The electronic device according to claim 4, further comprising: The polarizer is located in the second module.

6. The electronic device according to claim 5, wherein, The polarizer is located between the micro-photoelectric unit and the protective layer of the second module.

7. The electronic device according to claim 5, wherein, The polarizer is located between the micro-photoelectric unit of the second module and the first module.

8. The electronic device according to claim 5, further comprising: The polarizer is located in the first module, and the polarizer is located on the side of the first module away from the second module.

9. The electronic device according to claim 8, further comprising: A backlight module, wherein the backlight module is connected to the side of the first module away from the second module.

10. The electronic device according to claim 4, wherein, The display medium is a liquid crystal material or an organic self-emissive material.

11. The electronic device according to claim 8, wherein, The display medium is liquid crystal material.

12. The electronic device according to claim 1, wherein, The sensing component operates by applying a given reverse bias voltage.

13. The electronic device according to claim 12, wherein, The sensing component is converted into a light-emitting component by emitting light when a given forward bias voltage is applied.

14. The electronic device according to claim 1, wherein, Each of the micro-photoelectric units contains multiple micro-photoelectric components, one of which is the sensing component, and the other is the light-emitting component.

15. The electronic device according to claim 13 or 14, wherein, Adjacent micro-photoelectric units constitute a micro-photoelectric unit group; in each micro-photoelectric unit group, the micro-photoelectric component in one micro-photoelectric unit senses the light emission of the micro-photoelectric component in another micro-photoelectric unit.

16. The electronic device according to claim 15, wherein, Two adjacent micro-photoelectric units are spaced one unit apart, and the unit between two adjacent micro-photoelectric units is defined as at least one positive integer display pixel; the sensing range of the light emitted by one of the micro-photoelectric components is M units; In the same micro-photovoltaic unit group, the micro-photovoltaic component of one of the micro-photovoltaic units emits light, and the micro-photovoltaic component of another micro-photovoltaic unit located N units away senses the light; M and N are positive integers or zero; M is greater than N.

17. The electronic device according to claim 16, wherein, The distance between two adjacent micro-photoelectric unit groups is M+N+1 units.

18. The electronic device according to claim 15, wherein, In each of the micro-photoelectric unit groups, the micro-photoelectric units emit light sequentially.

19. The electronic device according to claim 1, wherein, In one part of the micro-photovoltaic unit, the micro-photovoltaic component includes the sensing component; in another part of the micro-photovoltaic unit, the micro-photovoltaic component includes the light-emitting component.

20. The electronic device according to claim 1, wherein, The micro-photovoltaic components in one part of the micro-photovoltaic unit include a sensing component; the micro-photovoltaic components in another part of the micro-photovoltaic unit include another sensing component.

21. The electronic device according to claim 1, wherein, The micro-photovoltaic components in one part of the micro-photovoltaic unit include a light-emitting component; the micro-photovoltaic components in another part of the micro-photovoltaic unit include another light-emitting component.

22. The electronic device according to claim 1, further comprising: A matrix circuit electrically connected to the micro-photovoltaic unit, and a control component electrically connected to the matrix circuit.

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