A cooling device for integrated circuit semiconductor processing

Abstract

This utility model belongs to the field of semiconductor cooling, specifically a cooling device for integrated circuit semiconductor processing. It includes a conveying device, a cooling box fixedly connected to the top of the conveying device, a cooling mechanism on one side of the cooling box, and a filtering mechanism on one side of the cooling mechanism. The cooling mechanism includes a fan located on one side of the cooling box, and a first connecting pipe fixedly connected to one side of the cooling box. A cooling coil is installed on the inner wall of the first connecting pipe. The filtering mechanism includes a second connecting pipe located at the air inlet of the fan, and a connecting shell on one side of the second connecting pipe. A filter is fixedly connected to the inner wall of the connecting shell. By setting up the cooling mechanism, the condensate flowing within the cooling coil cools the air blown out by the fan, rapidly removing heat from the semiconductor surface and accelerating the cooling process.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor cooling, specifically a cooling device for integrated circuit semiconductor processing. Background Technology

[0002] Integrated circuits are miniature circuits containing numerous transistors, diodes, resistors, and capacitors, fabricated on a small semiconductor substrate through a series of manufacturing processes. Semiconductors are materials between conductors and insulators, and their conductivity can be controlled by adding impurities, changing temperature, or irradiating light. Integrated circuit semiconductors are widely used in various electronic products.

[0003] Semiconductors need to be cooled after high-temperature processing. During the cooling process, dust particles in the air are blown out with the cold air. Larger or harder particles can easily scratch the surface of the semiconductor under the action of high-speed airflow. These damages can affect the integrity of the semiconductor surface and even cause interlayer short circuits. Utility Model Content

[0004] To overcome the shortcomings of existing technologies, semiconductors need to be cooled after high-temperature processing. During the cooling process, dust particles in the air are blown out with the cold air. Larger or harder particles can easily scratch the surface of the semiconductor under the action of high-speed airflow. These damages can affect the integrity of the semiconductor surface and even cause interlayer short circuits. This utility model proposes a cooling device for integrated circuit semiconductor processing.

[0005] The technical solution adopted by this utility model to solve its technical problem is: a cooling device for integrated circuit semiconductor processing, including a conveying device, a cooling box fixedly connected to the top of the conveying device, a cooling mechanism provided on one side of the cooling box, and a filtering mechanism provided on one side of the cooling mechanism.

[0006] The cooling mechanism includes a fan, which is disposed on one side of the cooling box. A first connecting pipe is fixedly connected to one side of the cooling box. One end of the first connecting pipe is fixedly connected to the air outlet of the fan. A diversion pipe is fixedly connected to one end of the first connecting pipe. The diversion pipe is fixedly connected to the inner wall of the cooling box. A nozzle is fixedly connected to one end of the diversion pipe. A cooling coil is disposed on the inner wall of the first connecting pipe. Both ends of the cooling coil extend to the outside of the first connecting pipe. A water storage tank is fixedly connected to one side of the first connecting pipe. A water pump is fixedly connected to the top of the water storage tank. A water pump inlet is fixedly connected to a water suction pipe. One end of the water suction pipe extends to the inner wall of the water storage tank. One end of the cooling coil is fixedly connected to the outlet of the water pump. The other end of the cooling coil extends to the inner wall of the water storage tank.

[0007] The filtration mechanism includes a second connecting pipe, which is located at the air inlet of the fan. A connecting shell is provided on one side of the second connecting pipe, and a filter is fixedly connected to the inner wall of the connecting shell. The filter is used in conjunction with the fan.

[0008] Preferably, a support frame is fixedly connected to one side of the cooling box, and the bottom of both the fan and the water tank are fixedly connected to the top of the support frame.

[0009] Preferably, the top of the water storage tank is fixedly connected to a water inlet pipe, the top of the water inlet pipe is threadedly connected to a sealing cap, and one side of the water storage tank is fixedly connected to a drain pipe, the inner wall of the drain pipe being rotatably connected to a valve.

[0010] Preferably, a fixing block is fixedly connected to the inner wall of the first connecting pipe, and the number of fixing blocks is several. The cooling coil is fixedly connected to the inner wall of the fixing block.

[0011] Preferably, two locking blocks are fixedly connected to one side of the connecting shell, and the top of each locking block is provided with a locking groove. Two limiting grooves are provided on the inner wall of the second connecting pipe. The surface of the locking block contacts the inner wall of the limiting groove. The connecting shell is movably connected to the inner wall of the second connecting pipe through the locking blocks and the limiting grooves.

[0012] Preferably, a first spring is fixedly connected to the inner wall of each of the two limiting grooves, and a positioning block is fixedly connected to one end of the first spring. The positioning block is slidably connected to the inner wall of the limiting groove, and an inclined groove is opened on the top of each of the two positioning blocks. One end of the positioning block is in contact with one end of the locking block.

[0013] Preferably, the inner wall of the second connecting tube is provided with two positioning rods, one end of each positioning rod penetrating the inner wall of the second connecting tube, and a second spring is sleeved on the surface of each positioning rod. One end of the second spring is fixedly connected to the surface of the positioning rod, and the other end of the second spring is fixedly connected to the surface of the second connecting tube. One end of the positioning rod contacts the inner wall of the inclined groove, and the positioning rod is used in conjunction with the slot.

[0014] The advantages of this utility model are:

[0015] 1. This utility model uses a cooling mechanism to cool the air blown out by the fan by the flow of condensate in the cooling coil. The cooled air then acts directly on the processed semiconductor surface through the split pipe and nozzle, which can quickly remove the heat from the semiconductor surface and accelerate the cooling process.

[0016] 2. By setting up a filtration mechanism, this utility model can effectively remove dust, particulate matter and other impurities from the air, thereby ensuring the cleanliness of the cold air blown out by the cooling mechanism. The filtered clean air will not cause pollution or physical damage to the semiconductor surface, thus ensuring the safety of the cooling process. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0019] Figure 2 This is a partial structural schematic diagram of the present invention;

[0020] Figure 3 This is a partial structural schematic diagram of the cooling mechanism of this utility model;

[0021] Figure 4 This is a partial structural diagram of the filtration mechanism of this utility model.

[0022] In the diagram: 1. Conveying device; 2. Cooling box; 3. Cooling mechanism; 301. Fan; 302. First connecting pipe; 303. Diverter pipe; 304. Nozzle; 305. Water storage tank; 306. Water pump; 307. Pumping pipe; 308. Cooling coil; 4. Filtering mechanism; 401. Second connecting pipe; 402. Connecting shell; 403. Filter; 5. Support frame; 6. Inlet pipe; 7. Sealing cover; 8. Drain pipe; 9. Valve; 10. Fixing block; 11. Locking block; 12. Locking groove; 13. Limiting groove; 14. Positioning block; 15. First spring; 16. Inclined groove; 17. Positioning rod; 18. Second spring. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0024] The following is in conjunction with the appendix Figure 1-4 This application will be described in further detail.

[0025] This application discloses a cooling device for integrated circuit semiconductor processing. (Refer to...) Figure 1 , Figure 2 , Figure 3 and Figure 4 A cooling device for integrated circuit semiconductor processing includes a conveying device 1, a cooling box 2 fixedly connected to the top of the conveying device 1, a cooling mechanism 3 provided on one side of the cooling box 2, and a filtering mechanism 4 provided on one side of the cooling mechanism 3.

[0026] The cooling mechanism 3 includes a fan 301, which is disposed on one side of the cooling box 2. A first connecting pipe 302 is fixedly connected to one side of the cooling box 2. One end of the first connecting pipe 302 is fixedly connected to the air outlet of the fan 301, and another end of the first connecting pipe 302 is fixedly connected to a branch pipe 303. The branch pipe 303 is fixedly connected to the inner wall of the cooling box 2, and one end of the branch pipe 303 is fixedly connected to a nozzle 304. A cooling coil 308 is disposed on the inner wall of the first connecting pipe 302, and both ends of the cooling coil 308 extend to the outside of the first connecting pipe 302. A water storage tank 305 is fixedly connected to one side of the first connecting pipe 302. A water pump 306 is fixedly connected to the top of the water storage tank 305. The inlet of the water pump 306 is fixedly connected to a water suction pipe 307. One end of the water suction pipe 307 passes through the inner wall of the water storage tank 305. One end of the cooling coil 308 is fixedly connected to the outlet of the water pump 306. The other end of the cooling coil 308 passes through the inner wall of the water storage tank 305. By setting the cooling mechanism 3, the condensate flows in the cooling coil 308 to cool the air blown out by the fan 301. The cooled air acts directly on the processed semiconductor surface through the split pipe 303 and the nozzle 304, which can quickly remove the heat from the semiconductor surface and accelerate the cooling process.

[0027] The filtration mechanism 4 includes a second connecting pipe 401, which is located at the air inlet of the fan 301. A connecting shell 402 is provided on one side of the second connecting pipe 401, and a filter 403 is fixedly connected to the inner wall of the connecting shell 402. The filter 403 works in conjunction with the fan 301. By setting up the filtration mechanism 4, dust, particulate matter and other impurities in the air can be effectively removed, thereby ensuring the cleanliness of the cold air blown out by the cooling mechanism 3. The filtered clean air will not cause pollution or physical damage to the semiconductor surface, thus ensuring the safety of the cooling process.

[0028] Reference Figure 1 A support frame 5 is fixedly connected to one side of the cooling box 2. The bottom of the fan 301 and the water tank 305 are fixedly connected to the top of the support frame 5. By setting the support frame 5, the fan 301 and the water tank 305 can be provided with support force to ensure the stability of the fan 301 and the water tank 305 and avoid shaking.

[0029] Reference Figure 3 The top of the water tank 305 is fixedly connected to a water inlet pipe 6, and the top of the water inlet pipe 6 is threadedly connected to a sealing cap 7. The side of the water tank 305 is fixedly connected to a drain pipe 8, and the inner wall of the drain pipe 8 is rotatably connected to a valve 9. By setting the water inlet pipe 6, it is easy to add coolant into the water tank 305. The sealing cap 7 prevents external dust from entering the water tank 305. The drain pipe 8 and the valve 9 make it easy to replace the coolant in the water tank 305.

[0030] Reference Figure 3 The inner wall of the first connecting pipe 302 is fixedly connected with a fixing block 10. There are several fixing blocks 10. The cooling coil 308 is fixedly connected to the inner wall of the fixing block 10. By setting the fixing block 10, the cooling coil 308 can be fixed inside the first connecting pipe 302 to prevent the cooling coil 308 from becoming loose and to ensure the stability of the cooling coil 308.

[0031] Reference Figure 4 Two locking blocks 11 are fixedly connected to one side of the connecting shell 402. Each locking block 11 has a locking groove 12 on its top. Two limiting grooves 13 are opened on the inner wall of the second connecting pipe 401. The surface of the locking block 11 contacts the inner wall of the limiting groove 13. The connecting shell 402 is movably connected to the inner wall of the second connecting pipe 401 through the locking blocks 11 and the limiting grooves 13. By setting the locking blocks 11 and the locking grooves 12, the connecting shell 402 can be guided to ensure that the connecting shell 402 can be accurately inserted into the interior of the second connecting pipe 401.

[0032] Reference Figure 4 The inner walls of the two limiting grooves 13 are fixedly connected with a first spring 15. One end of the first spring 15 is fixedly connected with a positioning block 14. The positioning block 14 is slidably connected to the inner wall of the limiting groove 13. The top of the two positioning blocks 14 is provided with an inclined groove 16. One end of the positioning block 14 is in contact with one end of the locking block 11. By setting the first spring 15, elastic potential energy can be provided to the positioning block 14, ensuring that the positioning block 14 can return to its original position after being squeezed, thus ensuring the stability of the positioning block 14.

[0033] Reference Figure 4 The inner wall of the second connecting pipe 401 is provided with two positioning rods 17. One end of each positioning rod 17 extends through the inner wall of the second connecting pipe 401. A second spring 18 is sleeved on the surface of each positioning rod 17. One end of the second spring 18 is fixedly connected to the surface of the positioning rod 17, and the other end of the second spring 18 is fixedly connected to the surface of the second connecting pipe 401. One end of the positioning rod 17 contacts the inner wall of the inclined groove 16. The positioning rod 17 cooperates with the slot 12. By setting the positioning rod 17 and the second spring 18, the locking block 11 can be locked to ensure the stability of the connecting shell 402 after insertion and to prevent the connecting shell 402 from falling off.

[0034] Working Principle: When the surface temperature of the processed semiconductor is too high, cooling is required. The user can start the conveyor device 1 via an external control switch. The conveyor device 1 is powered by an external power supply and transports the processed semiconductor to the cooling box 2 via a mesh conveyor belt. The user can also start the fan 301 via an external control switch. The fan 301 is powered by an external power supply. The air intake of the fan 301 draws in and filters air through the second connecting pipe 401. When the outside air passes through the filter 403, dust and particles in the air are filtered out. The filtered air then enters the first connecting pipe 302 through the air outlet of the fan 301. The user can also start the water pump 306 via an external control switch. The water pump 306's inlet draws coolant from the water tank 305 through the water suction pipe 307. The drawn coolant enters the cooling coil 308 through the water pump 306's outlet. The spiral cooling coil 308 increases the flow path of the coolant. Driven by the fan 301... As air flows through the outer wall of the cooling coil 308, it is gradually cooled, resulting in a decrease in air temperature. The cooled air is then ejected through the splitter pipe 303 and the nozzle 304, thereby cooling the surface of the semiconductor. When the filter 403 needs to be replaced, the user manually pulls out the positioning rod 17, disengaging it from the slot 12 of the locking block 11, thus releasing the lock on the connecting shell 402. After replacing the filter 403, the user inserts the locking block 11 into the limiting groove 13. At this time, the limiting groove 1... The positioning block 14 inside 3 will be squeezed, thereby compressing the first spring 15. The positioning rod 17 will be pushed out through the inclined groove 16. The pushed-out positioning rod 17 will stretch the second spring 18. When the locking block 11 moves into the limiting groove 13, the locking groove 12 on the locking block 11 will provide a springback space for the pushed-out positioning rod 17. When the locking groove 12 moves to the bottom of the positioning rod 17, the second spring 18 will spring back, thereby driving the positioning rod 17 to return to its original position and locking the replaced filter 403.

[0035] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. A cooling device for integrated circuit semiconductor processing, characterized in that: It includes a conveying device (1), a cooling box (2) is fixedly connected to the top of the conveying device (1), a cooling mechanism (3) is provided on one side of the cooling box (2), and a filtering mechanism (4) is provided on one side of the cooling mechanism (3). The cooling mechanism (3) includes a fan (301), which is disposed on one side of the cooling box (2). A first connecting pipe (302) is fixedly connected to one side of the cooling box (2). One end of the first connecting pipe (302) is fixedly connected to the air outlet of the fan (301). A diversion pipe (303) is fixedly connected to one end of the first connecting pipe (302). The diversion pipe (303) is fixedly connected to the inner wall of the cooling box (2). A nozzle (304) is fixedly connected to one end of the diversion pipe (303). A cooling coil (304) is provided on the inner wall of the first connecting pipe (302). 8) Both ends of the cooling coil (308) extend to the outside of the first connecting pipe (302). A water storage tank (305) is fixedly connected to one side of the first connecting pipe (302). A water pump (306) is fixedly connected to the top of the water storage tank (305). A water pump (307) is fixedly connected to the inlet of the water pump (306). One end of the water pump (307) extends to the inner wall of the water storage tank (305). One end of the cooling coil (308) is fixedly connected to the outlet of the water pump (306). The other end of the cooling coil (308) extends to the inner wall of the water storage tank (305). The filtration mechanism (4) includes a second connecting pipe (401), which is located at the air inlet of the fan (301). A connecting shell (402) is provided on one side of the second connecting pipe (401), and a filter (403) is fixedly connected to the inner wall of the connecting shell (402). The filter (403) is used in conjunction with the fan (301).

2. The cooling device for integrated circuit semiconductor processing according to claim 1, characterized in that: A support frame (5) is fixedly connected to one side of the cooling box (2), and the bottom of the fan (301) and the water tank (305) are fixedly connected to the top of the support frame (5).

3. The cooling device for integrated circuit semiconductor processing according to claim 1, characterized in that: The top of the water storage tank (305) is fixedly connected to a water inlet pipe (6), and the top of the water inlet pipe (6) is threadedly connected to a sealing cap (7). The side of the water storage tank (305) is fixedly connected to a drain pipe (8), and the inner wall of the drain pipe (8) is rotatably connected to a valve (9).

4. The cooling device for integrated circuit semiconductor processing according to claim 1, characterized in that: The inner wall of the first connecting pipe (302) is fixedly connected to a fixing block (10), and there are several fixing blocks (10). The cooling coil (308) is fixedly connected to the inner wall of the fixing block (10).

5. A cooling device for integrated circuit semiconductor processing according to claim 1, characterized in that: Two locking blocks (11) are fixedly connected to one side of the connecting shell (402). Each of the two locking blocks (11) has a locking groove (12) on its top. The inner wall of the second connecting pipe (401) has two limiting grooves (13). The surface of the locking block (11) contacts the inner wall of the limiting groove (13). The connecting shell (402) is movably connected to the inner wall of the second connecting pipe (401) through the locking blocks (11) and the limiting grooves (13).

6. A cooling device for integrated circuit semiconductor processing according to claim 5, characterized in that: The inner walls of the two limiting grooves (13) are fixedly connected with a first spring (15), and one end of the first spring (15) is fixedly connected with a positioning block (14). The positioning block (14) is slidably connected to the inner wall of the limiting groove (13). The top of the two positioning blocks (14) is provided with an inclined groove (16), and one end of the positioning block (14) is in contact with one end of the locking block (11).

7. A cooling device for integrated circuit semiconductor processing according to claim 1, characterized in that: The inner wall of the second connecting pipe (401) is provided with two positioning rods (17). One end of each positioning rod (17) extends through the inner wall of the second connecting pipe (401). A second spring (18) is sleeved on the surface of each positioning rod (17). One end of the second spring (18) is fixedly connected to the surface of the positioning rod (17), and the other end of the second spring (18) is fixedly connected to the surface of the second connecting pipe (401). One end of the positioning rod (17) contacts the inner wall of the inclined groove (16). The positioning rod (17) is used in conjunction with the slot (12).

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