Semiconductor heat exchange device and positive electrode material calcining system

Abstract

The utility model provides a kind of semiconductor heat exchange device, including cooling pipeline, temperature rising pipeline and several semiconductor refrigeration pieces;The temperature rising pipeline is spaced apart with the cooling pipeline;Several the semiconductor refrigeration piece is embedded between the cooling pipeline and the temperature rising pipeline, the cold end of the semiconductor refrigeration piece is attached with the cooling pipeline, the hot end of the semiconductor refrigeration piece is attached with the temperature rising pipeline;The utility model further provides a kind of positive electrode material calcining system;In the utility model, semiconductor refrigeration piece is provided, the cold end of the semiconductor refrigeration piece is attached with the cooling pipeline, the hot end of the semiconductor refrigeration piece is attached with the temperature rising pipeline, the cold quantity and heat of semiconductor refrigeration piece are fully utilized, semiconductor refrigeration piece does not use refrigerant, so there is no leakage, no pollution, clean and sanitary;Device has no mechanical transmission component, so there is no wear, no noise, no vibration, maintenance quantity is less, long in service life, high reliability.

Description

Technical Field

[0001] This utility model relates to the field of lithium-ion battery manufacturing technology, and in particular to a semiconductor heat exchange device and a positive electrode material calcination system. Background Technology

[0002] In the lithium-ion battery market, lithium iron phosphate batteries are widely used in electric vehicles, energy storage power stations, and other fields due to their outstanding safety performance, excellent cycle life, and good environmental friendliness. As one of the core components of lithium-ion batteries, the stability of the production process and the precise control of each step in the lithium iron phosphate cathode material have a decisive impact on the material's overall performance and lifespan.

[0003] Currently, the mainstream synthesis processes for lithium iron phosphate cathode materials include the high-temperature solid-state method and the liquid-phase method. In the more widely used high-temperature solid-state method, the lithium iron phosphate cathode material needs to be cooled after sintering. The current method is a vapor compression refrigeration cycle, which achieves heat transfer through the phase change cycle of the refrigerant in the compressor, condenser, expander, and evaporator.

[0004] The above cooling solution has the following problems: high energy consumption, complex equipment, and high cost. Utility Model Content

[0005] In view of this, it is necessary to provide a semiconductor heat exchange device and a cathode material calcination system that can reduce cooling costs.

[0006] This utility model provides a semiconductor heat exchange device, comprising:

[0007] Cooling pipes;

[0008] The heating pipes are spaced apart from the cooling pipes;

[0009] And a number of semiconductor cooling chips are embedded between the cooling pipe and the heating pipe, with the cold end of the semiconductor cooling chip in contact with the cooling pipe and the hot end of the semiconductor cooling chip in contact with the heating pipe.

[0010] In other embodiments, the cooling pipe includes a cooling input pipe, a plurality of cooling secondary pipes and a cooling output pipe, wherein the cooling secondary pipes are arranged at intervals, and both ends of the cooling secondary pipes are respectively connected and fixed to the cooling input pipe and the cooling output pipe.

[0011] In other embodiments, the heating pipe includes a heating input pipe, a plurality of heating secondary pipes and a heating output pipe, wherein the heating secondary pipes are spaced apart from each other, and both ends of the heating secondary pipes are respectively connected and fixed to the heating input pipe and the heating output pipe, and the heating secondary pipes and the cooling secondary pipes are arranged alternately.

[0012] In other embodiments, the thermoelectric cooler is embedded between the heating sub-pipe and the cooling sub-pipe, with the cold end of the thermoelectric cooler in contact with the cooling sub-pipe and the hot end of the thermoelectric cooler in contact with the heating sub-pipe.

[0013] In other embodiments, the semiconductor cooling chip includes a semiconductor, a metal conductor sheet, and an insulating ceramic sheet. The metal conductor sheet is attached to both sides of the semiconductor, and the insulating ceramic sheet is sleeved on the semiconductor and the metal conductor sheet and is in contact with the cooling secondary pipe and the heating secondary pipe.

[0014] In other embodiments, a pre-heat exchange section is also included, which includes a pre-heat exchange heating component and a pre-heat exchange cooling component. The pre-heat exchange heating component is connected to the heating pipe, and the pre-heat exchange cooling component is connected to the cooling pipe. The pre-heat exchange cooling component and the pre-heat exchange heating component are alternately attached to each other so that the pre-heat exchange heating component and the pre-heat exchange cooling component can exchange heat.

[0015] In other embodiments, the preheating and heating assembly includes a preheating and heating input pipe, a plurality of preheating and heating auxiliary pipes, and a preheating and heating output pipe. The preheating and heating auxiliary pipes are spaced apart from each other, and their two ends are respectively connected and fixed to the preheating and heating input pipe and the preheating and heating output pipe.

[0016] In other embodiments, the preheating and cooling assembly includes a preheating and cooling input pipe, a plurality of preheating and cooling secondary pipes, and a preheating and cooling output pipe. The preheating and cooling secondary pipes are spaced apart from each other, and both ends of the preheating and cooling secondary pipes are respectively connected and fixed to the preheating and cooling input pipe and the preheating and cooling output pipe. The preheating and cooling secondary pipes and the preheating and heating secondary pipes are staggered and fitted together.

[0017] This utility model also provides a positive electrode material calcination system, including the above-mentioned semiconductor heat exchange device, calcination furnace, heat absorption coil and nitrogen supply tank. The heat absorption coil is disposed in the calcination furnace, and the heat absorption coil and the nitrogen supply tank are connected to the semiconductor heat exchange device.

[0018] In other embodiments, the nitrogen supply tank is connected to the preheating and heating input pipeline, the heating output pipeline is connected to the calcining furnace, the heat absorption coil is fixed to the tail of the calcining furnace, and the two ends of the heat absorption coil are respectively connected to the cooling output pipeline and the preheating and cooling input pipeline.

[0019] The beneficial effects of this utility model are as follows:

[0020] This utility model includes a cooling pipe, a heating pipe, and several thermoelectric coolers. The heating pipe and the cooling pipe are spaced apart. The thermoelectric coolers are embedded between the cooling pipe and the heating pipe, with the cold end of the thermoelectric cooler in contact with the cooling pipe and the hot end in contact with the heating pipe. In this utility model, the thermoelectric coolers are used, with the cold end in contact with the cooling pipe and the hot end in contact with the heating pipe. This fully utilizes the cooling and heating capacity of the thermoelectric coolers. Since the thermoelectric coolers do not use refrigerant, there is no leakage, no pollution, and the device is clean and hygienic. The device has no mechanical transmission parts, therefore there is no wear, no noise, no vibration, low maintenance, long service life, and high reliability. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the semiconductor heat exchange device in this utility model;

[0023] Figure 2 for Figure 1 A schematic diagram of the structure of a semiconductor refrigeration chip;

[0024] Figure 3 This is a schematic diagram of the cathode material calcination system in this utility model;

[0025] Wherein: 1-cooling pipe, 11-cooling input pipe, 12-cooling auxiliary pipe, 13-cooling output pipe;

[0026] 2-Heating pipe, 21-Heating input pipe, 22-Heating auxiliary pipe, 23-Heating output pipe;

[0027] 3-Semiconductor cooling chip, 31-Semiconductor, 32-Metal conductor sheet, 33-Insulating ceramic sheet;

[0028] 4-Preheat exchange section, 41-Preheat exchange heating component, 411-Preheat exchange heating input pipe, 412-Preheat exchange heating secondary pipe, 413-Preheat exchange heating output pipe, 42-Preheat exchange cooling component, 421-Preheat exchange cooling input pipe, 422-Preheat exchange cooling secondary pipe, 423-Preheat exchange cooling output pipe;

[0029] 100 - Cathode material calcination system, 200 - calcination furnace, 300 - nitrogen supply tank. Detailed Implementation

[0030] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, which constitute a part of this application and are used together with the embodiments of the present invention to illustrate the principles of the present invention, but are not intended to limit the scope of the present invention.

[0031] like Figure 1-3 As shown, an embodiment of the present invention provides a semiconductor heat exchange device, which includes: a cooling pipe 1, a heating pipe 2, and a plurality of semiconductor cooling chips 3. The heating pipe 2 and the cooling pipe 1 are spaced apart. The semiconductor cooling chips 3 are embedded between the cooling pipe 1 and the heating pipe 2. The cold end of the semiconductor cooling chip 3 is in contact with the cooling pipe 1, and the hot end of the semiconductor cooling chip 3 is in contact with the heating pipe 2.

[0032] In this invention, a semiconductor cooling chip 3 is provided. The cold end of the semiconductor cooling chip 3 is attached to the cooling pipe 1, and the hot end of the semiconductor cooling chip 3 is attached to the heating pipe 2. The cooling and heating capacity of the semiconductor cooling chip are fully utilized. The semiconductor cooling chip does not use refrigerant, so there is no leakage, no pollution, and it is clean and hygienic. The device has no mechanical transmission parts, so there is no wear, no noise, no vibration, low maintenance, long service life, and high reliability.

[0033] Specifically, the cooling pipe 1 includes a cooling input pipe 11, a plurality of cooling secondary pipes 12 and a cooling output pipe 13. The cooling secondary pipes 12 are arranged at intervals, and the two ends of the cooling secondary pipes 12 are respectively connected and fixed to the cooling input pipe 11 and the cooling output pipe 13.

[0034] Specifically, the heating pipe 2 includes a heating input pipe 21, a plurality of heating secondary pipes 22 and a heating output pipe 23. The heating secondary pipes 22 are arranged at intervals, and the two ends of the heating secondary pipes 22 are respectively connected and fixed to the heating input pipe 21 and the heating output pipe 23. The heating secondary pipes 22 and the cooling secondary pipes 12 are arranged alternately.

[0035] Specifically, the thermoelectric cooler 3 is embedded between the heating sub-pipe 22 and the cooling sub-pipe 12, with the cold end of the thermoelectric cooler 3 in contact with the cooling sub-pipe 12 and the hot end of the thermoelectric cooler 3 in contact with the heating sub-pipe 22.

[0036] Furthermore, the semiconductor cooling chip 3 includes a semiconductor 31, a metal conductor sheet 32, and an insulating ceramic sheet 33. The metal conductor sheet 32 ​​is attached to both sides of the semiconductor 31, and the insulating ceramic sheet 33 is sleeved on the semiconductor 31 and the metal conductor sheet 32 ​​and is in contact with the cooling sub-pipe 12 and the heating sub-pipe 22.

[0037] Furthermore, the present invention also includes a preheating section 4, which includes a preheating component 41 and a cooling component 42. The preheating component 41 is connected to the heating pipe 2, and the cooling component 42 is connected to the cooling pipe 1. The preheating component 42 and the preheating component 41 are alternately attached to each other so that the preheating component 41 and the preheating component 42 can exchange heat.

[0038] Furthermore, the preheating and heating assembly 41 includes a preheating and heating input pipe 411, a plurality of preheating and heating auxiliary pipes 412, and a preheating and heating output pipe 413. The preheating and heating auxiliary pipes 412 are arranged at intervals, and the two ends of the preheating and heating auxiliary pipes 412 are respectively connected and fixed to the preheating and heating input pipe 411 and the preheating and heating output pipe 413.

[0039] Furthermore, the preheating and cooling assembly 421 includes a preheating and cooling input pipe 421, a plurality of preheating and cooling secondary pipes 422, and a preheating and cooling output pipe 423. The preheating and cooling secondary pipes 422 are spaced apart from each other, and their two ends are respectively connected and fixed to the preheating and cooling input pipe 421 and the preheating and cooling output pipe 423. The preheating and cooling secondary pipes 422 and the preheating and heating secondary pipes 412 are staggered and fitted together. The fluid in the preheating and cooling secondary pipes 422 and the fluid in the preheating and heating secondary pipes 412 undergo preheating exchange.

[0040] This utility model also provides a positive electrode material calcination system 100, which includes the semiconductor heat exchange device, calcination furnace 200, heat absorption coil and nitrogen supply tank 300. The heat absorption coil is disposed in the calcination furnace 200, and the heat absorption coil and nitrogen supply tank 300 are connected to the semiconductor heat exchange device.

[0041] Furthermore, the nitrogen supply tank 300 is connected to the preheating and heating input pipe 411, the heating output pipe 23 is connected to the calcining furnace 200, the heat absorption coil is fixed to the tail of the calcining furnace 200, and the two ends of the heat absorption coil are respectively connected to the cooling output pipe 13 and the preheating and cooling input pipe 421. In use, the nitrogen supply tank 300 supplies low-temperature nitrogen to the pre-heat exchange heating input pipe 411. The liquid in the heat-absorbing coil, having absorbed heat, flows to the pre-heat exchange cooling input pipe 421 to exchange heat with the low-temperature nitrogen. After heat exchange, the low-temperature nitrogen forms a lower-temperature nitrogen and flows to the heating pipe 2. The liquid in the pre-heat exchange cooling input pipe 421 is cooled and flows to the cooling pipe 1. The hot end of the semiconductor refrigeration chip 3 heats the heating pipe 2 and the lower-temperature nitrogen, while the cold end of the semiconductor refrigeration chip 3 cools the cooling pipe 1 and the liquid in the cooling pipe 1. The cooled liquid flows back to the heat-absorbing coil to cool the material at the end of the calcining furnace 200, while the heated nitrogen is introduced into the calcining furnace 200 to purge the air inside the calcining furnace 200.

[0042] The beneficial effects of this utility model are:

[0043] This utility model includes a cooling pipe, a heating pipe, and several thermoelectric coolers. The heating pipe and the cooling pipe are spaced apart. The thermoelectric coolers are embedded between the cooling pipe and the heating pipe, with the cold end of the thermoelectric cooler in contact with the cooling pipe and the hot end in contact with the heating pipe. In this utility model, the thermoelectric coolers are used, with the cold end in contact with the cooling pipe and the hot end in contact with the heating pipe. This fully utilizes the cooling and heating capacity of the thermoelectric coolers. Since the thermoelectric coolers do not use refrigerant, there is no leakage, no pollution, and the device is clean and hygienic. The device has no mechanical transmission parts, therefore there is no wear, no noise, no vibration, low maintenance, long service life, and high reliability.

[0044] In the description of this application, it should be noted that the terms "upper" and "lower," etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0045] It should be noted that in this application, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0046] The specific embodiments of this utility model described above do not constitute a limitation on the scope of protection of this utility model. Any other corresponding changes and modifications made based on the technical concept of this utility model should be included within the scope of protection of the claims of this utility model.

Claims

1. A semiconductor heat exchange device, characterized in that, include: Cooling pipes; The heating pipes are spaced apart from the cooling pipes; And a number of semiconductor cooling chips are embedded between the cooling pipe and the heating pipe, with the cold end of the semiconductor cooling chip in contact with the cooling pipe and the hot end of the semiconductor cooling chip in contact with the heating pipe.

2. The semiconductor heat exchanger as described in claim 1, characterized in that, The cooling pipeline includes a cooling input pipeline, several cooling secondary pipelines, and a cooling output pipeline. The cooling secondary pipelines are arranged at intervals, and their two ends are respectively connected and fixed to the cooling input pipeline and the cooling output pipeline.

3. The semiconductor heat exchanger as described in claim 2, characterized in that, The heating pipeline includes a heating input pipeline, several heating secondary pipelines, and a heating output pipeline. The heating secondary pipelines are arranged at intervals, and both ends of the heating secondary pipelines are respectively connected and fixed to the heating input pipeline and the heating output pipeline. The heating secondary pipelines and the cooling secondary pipelines are arranged alternately.

4. The semiconductor heat exchanger as described in claim 3, characterized in that, The thermoelectric cooler is embedded between the heating sub-pipe and the cooling sub-pipe, with the cold end of the thermoelectric cooler in contact with the cooling sub-pipe and the hot end of the thermoelectric cooler in contact with the heating sub-pipe.

5. The semiconductor heat exchanger as described in claim 4, characterized in that, The semiconductor cooling chip includes a semiconductor, a metal conductor sheet, and an insulating ceramic sheet. The metal conductor sheet is attached to both sides of the semiconductor, and the insulating ceramic sheet is sleeved on the semiconductor and the metal conductor sheet and is in contact with the cooling secondary pipe and the heating secondary pipe.

6. The semiconductor heat exchanger as described in claim 3, characterized in that, It also includes a preheating section, which includes a preheating component and a cooling component. The preheating component is connected to the heating pipe, and the cooling component is connected to the cooling pipe. The preheating component and the cooling component are alternately attached to each other so that the preheating component and the cooling component can exchange heat.

7. The semiconductor heat exchanger as described in claim 6, characterized in that, The preheating and heating assembly includes a preheating and heating input pipe, several preheating and heating auxiliary pipes, and a preheating and heating output pipe. The preheating and heating auxiliary pipes are spaced apart from each other, and their two ends are respectively connected and fixed to the preheating and heating input pipe and the preheating and heating output pipe.

8. The semiconductor heat exchanger as described in claim 7, characterized in that, The preheating and cooling assembly includes a preheating and cooling input pipe, several preheating and cooling secondary pipes, and a preheating and cooling output pipe. The preheating and cooling secondary pipes are spaced apart from each other. Both ends of the preheating and cooling secondary pipes are respectively connected and fixed to the preheating and cooling input pipe and the preheating and cooling output pipe. The preheating and cooling secondary pipes are staggered and fitted with the preheating and heating secondary pipes.

9. A cathode material calcination system, characterized in that, It includes the semiconductor heat exchanger, calcining furnace, heat absorption coil, and nitrogen supply tank as described in claim 8, wherein the heat absorption coil is disposed in the calcining furnace, and the heat absorption coil and the nitrogen supply tank are connected to the semiconductor heat exchanger.

10. The cathode material calcination system as described in claim 9, characterized in that, The nitrogen supply tank is connected to the preheating and heating input pipeline, the heating output pipeline is connected to the calcining furnace, the heat absorption coil is fixed to the tail of the calcining furnace, and the two ends of the heat absorption coil are respectively connected to the cooling output pipeline and the preheating and cooling input pipeline.

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