A device for temperature detection

Abstract

The utility model discloses a device for temperature detection relates to new energy automobile technical field has solved the problem that temperature sensor is wrapped by epoxy resin in prior art and causes the poor temperature detection precision, the utility model discloses a circuit board and heat conduction block, heat conduction block installs on the circuit board and cooperates with the power terminal of setting on the circuit board, and heat conduction block is provided with thermistor between the circuit board, and thermistor is connected with the pin of setting on the circuit board. The utility model discloses power terminal heat transfer to heat conduction block, and thermistor measures heat conduction block temperature change, and through the pin on the circuit board, the signal is delivered, and the temperature detection of power's terminal is completed, and the structure is simple, and the manufacturing cost is low, and the heat conduction efficiency is high, and the use temperature detection precision of matched circuit board is high, and the volume is small, and the installation is convenient.

Description

Technical Field

[0001] This utility model relates to the field of new energy vehicle technology, and in particular to a device for temperature detection. Background Technology

[0002] During the charging process of new energy vehicles, the detection of charging temperature is crucial to vehicle safety, and the heat transfer between the thermistor used for temperature detection and the power terminals of the heating unit is even more critical. Existing heat transfer solutions suffer from problems such as low heat transfer efficiency, large size, complex manufacturing processes, and high costs. Temperature sensors encapsulated in epoxy resin and placed near the terminals have poor overall pressure resistance, and the low heat transfer efficiency of epoxy resin easily leads to poor temperature detection accuracy. Using a metal insulating shell to transfer temperature offers excellent heat transfer efficiency, but the metal insulating shell is bulky, has poor installation accuracy, and is expensive. Injecting insulating thermally conductive adhesive between the terminals and the thermistor is a complex process requiring specialized dispensing equipment, resulting in high equipment investment costs.

[0003] Existing technology includes a contact terminal temperature detection device and a charging socket disclosed in Chinese Patent Publication No. CN210071161U. This device includes a circuit board, at least one heat-conducting part, and at least one thermal sensor. The heat-conducting part is disposed in the interlayer of the circuit board and extends to the inner wall of at least one heat-conducting through-hole. The heat-conducting part is configured to conduct heat with the contact terminal and transfer heat to the surface of the circuit board. The thermal sensor is disposed on the surface of the circuit board and is configured to sense the temperature on the circuit board. Although this patent can detect the temperature of the contact terminal by using a thermal sensor in conjunction with the circuit board and measuring the temperature on the circuit board, the use of a metal casing for temperature transmission still results in inaccurate temperature detection. Utility Model Content

[0004] In view of the shortcomings in the above-mentioned background technology, this utility model proposes a device for temperature detection, which solves the problem of poor temperature detection accuracy caused by the epoxy resin encapsulation of temperature sensors in the prior art.

[0005] The technical solution of this utility model is implemented as follows: a device for temperature detection includes a circuit board and a heat-conducting block. The heat-conducting block is mounted on the circuit board and cooperates with power terminals set on the circuit board. A thermistor is set between the heat-conducting block and the circuit board. The thermistor is connected to pin headers set on the circuit board.

[0006] More preferably, the heat-conducting block is an insulating heat-conducting block with thermal conductivity.

[0007] More preferably, one side of the heat-conducting block is provided with a fixing groove that mates with the circuit board, and the other side of the heat-conducting block is provided with an arc-shaped groove that mates with the power terminal.

[0008] More preferably, the heat-conducting block is further provided with two grooves that cooperate with the circuit board. The two grooves are located on both sides of the fixing groove. When the heat-conducting block cooperates with the circuit board, the contact surface three at the bottom of the fixing groove and the contact surface five on the groove are both in close contact with the circuit board. The distance between the contact surface four on the groove and the circuit board is a, where a is 0.5mm to 1mm.

[0009] More preferably, the upper part of the fixing groove is provided with a second contact surface that cooperates with the thermistor and a second assembly guide surface for installation guidance.

[0010] More preferably, the arc-shaped groove is provided with a first contact surface that mates with the power terminal, and the heat-conducting block is provided with a first assembly guide surface for transitional mating with the first contact surface.

[0011] More preferably, the lower part of the heat-conducting block is provided with an anti-retraction protrusion.

[0012] More preferably, the thermistor is a surface-mount thermistor or a leaded thermistor.

[0013] More preferably, the circuit board is provided with a temperature detection station that cooperates with the heat-conducting block.

[0014] More preferably, the temperature detection stage is provided with a mounting groove that mates with a leaded thermistor.

[0015] The beneficial effects of this invention are as follows: The heat from the power terminals is transferred to the heat-conducting block, and the thermistor measures the temperature change of the heat-conducting block. The signal is transmitted through pin headers on the circuit board, completing the temperature detection of the power terminals. It features a simple structure, low manufacturing cost, high thermal conductivity, and high temperature detection accuracy when used with the matching circuit board. It is also small in size and easy to install. The heat-conducting block uses an insulating heat-conducting block with high thermal conductivity, which conducts heat while simultaneously insulating the thermistor. The heat-conducting block also has good pressure resistance. Attached Figure Description

[0016] To more clearly illustrate the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the heat-conducting block.

[0019] Figure 3This is a cross-sectional view of the heat-conducting block;

[0020] Figure 4 This is a schematic diagram of the installation of a surface-mount thermistor;

[0021] Figure 5 This is a schematic diagram of the installation of a leaded thermistor.

[0022] Figure 6 This is a side view of the leaded thermistor during mounting.

[0023] In the diagram: 100, power terminal; 101, terminal heat-conducting surface; 200, circuit board; 201, surface mount thermistor; 202, temperature detection platform; 203, pin header; 204, mounting slot; 205, leaded thermistor; 300, heat-conducting block; 301, bonding surface one; 302, assembly guide surface one; 303, assembly guide surface two; 304, bonding surface two; 305, anti-retraction boss; 306, bonding surface three; 307, bonding surface four; 308, bonding surface five; 309, arc groove; 310, fixing groove; 311, groove. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] like Figure 1 and Figure 2 As shown in Embodiment 1, a device for temperature detection includes a circuit board 200 and a heat-conducting block 300. The heat-conducting block 300 is mounted on the circuit board 200 and mates with a power terminal 100 disposed on the circuit board 200. A thermistor is disposed between the heat-conducting block 300 and the circuit board 200, and the thermistor is connected to a pin header 203 disposed on the circuit board 200. The pin header 203 is electrically connected to the thermistor for transmitting the thermistor signal. A through hole is provided in the middle of the circuit board 200 to mate with the power terminal 100. The heat-conducting block 300 is mounted on the circuit board 200 through the through hole, and the power terminal 100 passes through the through hole and is tightly fitted to the heat-conducting block 300. Heat from the power terminal 100 is transferred to the heat-conducting block 300. The thermistor measures the temperature change of the heat-conducting block 300 and transmits the signal through the pin header 203 on the circuit board 200, thus completing the temperature detection of the power terminal.

[0026] In this embodiment, the heat-conducting block 300 is an insulating heat-conducting block with thermal conductivity. It conducts heat while simultaneously insulating the thermistor; the heat-conducting block 300 also has good pressure resistance.

[0027] like Figures 3-5 As shown in Embodiment 2, a device for temperature detection differs from the technical solution of Embodiment 1 in that the heat-conducting block 300 has a fixing groove 310 on one side that mates with the circuit board 200, and an arc-shaped groove 309 on the other side that mates with the power terminal 100. The heat-conducting block 300 is mounted on the circuit board 200 through the fixing groove 310. The arc-shaped groove 309 of the heat-conducting block 300 mates with the power terminal 100, ensuring that the power terminal 100 is fixed on the circuit board 200 when mounted, resulting in more stable installation, reduced clearance, and improved heat transfer efficiency.

[0028] In this embodiment, the heat-conducting block 300 has two grooves 311 on one side of the fixing groove 310 that mate with the circuit board 200. The two grooves 311 are located on both sides of the fixing groove 310. When the heat-conducting block 300 mates with the circuit board 200, the contact surface 306 at the bottom of the fixing groove 310 and the contact surface 308 on the groove 311 are in close contact with the circuit board 200. The distance between the contact surface 307 on the groove 311 and the circuit board 200 is 'a', which is 0.5mm to 2mm, preferably 1mm. The close contact between the contact surface 306 and the contact surface 308 of the heat-conducting block 300 and the circuit board 200 can prevent the heat-conducting block 300 from undergoing permanent deformation after being squeezed. The contact surface 307 has a certain gap with the circuit board 200, which can reduce the insertion force of the terminals during production and assembly, and improve assembly efficiency.

[0029] In this embodiment, the upper part of the fixing groove 310 is provided with a second contact surface 304 for cooperating with the thermistor and a second assembly guide surface 303 for installation guidance. The second contact surface 304 of the heat-conducting block 300 can be tightly fitted with the surface of the thermistor, reducing the fitting gap and improving heat transfer efficiency. The second assembly guide surface 303 of the heat-conducting block 300 is an arc surface, which can reduce the squeezing of the surface-mount thermistor 201 during the assembly of the heat-conducting block 300 and the circuit board 200, and prevent the thermistor from desoldering.

[0030] In this embodiment, the arc-shaped groove 309 has a mating surface 301 that mates with the power terminal 100, and the heat-conducting block 300 has an assembly guide surface 302 for transitional mating with the mating surface 301. The upper part of the heat-conducting block 300 near the assembly guide surface 302 has a rectangular groove to improve deformation. After assembly, the mating surface 301 of the heat-conducting block 300 and the terminal heat-conducting surface 101 of the power terminal 100 can fit tightly together. Above the mating surface 301 of the heat-conducting block 300 is the assembly guide surface 302, which is an inclined surface that guides the assembly of the power terminal 100, reducing the difficulty of assembling the power terminal 100 and preventing damage to the heat-conducting block 300 during terminal assembly.

[0031] In this embodiment, the lower part of the heat-conducting block 300 is provided with an anti-retraction protrusion 305. The power terminal 100 is provided with an annular protrusion, which is located above the heat-conducting block 300. The anti-retraction protrusion 305 at the bottom of the heat-conducting block 300 cooperates with the charging socket housing to prevent the heat-conducting block 300 from falling off.

[0032] All other structures are the same as in Example 1.

[0033] like Figures 3-6 As shown in Embodiment 3, a device for temperature detection differs from Embodiment 2 in that the thermistor is either a surface-mount thermistor 201 or a leaded thermistor 205. The circuit board 200 has a temperature detection platform 202 that cooperates with the heat-conducting block 300. The temperature detection platform 202 cooperates with the fixing groove 310 on the heat-conducting block 300, and the thermistor is mounted on the temperature detection platform 202 for temperature detection. Using a surface-mount thermistor, which is soldered above the temperature detection platform 202, results in a high degree of automation in production. The temperature detection platform 202 has a mounting groove 204 that cooperates with the leaded thermistor 205. When using a leaded thermistor 205, the leaded thermistor 205 is fixed within the mounting groove 204, resulting in more accurate temperature detection and smaller errors.

[0034] All other structures are the same as in Example 2.

[0035] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A device for temperature detection, characterized in that: It includes a circuit board (200) and a heat-conducting block (300). The heat-conducting block (300) is mounted on the circuit board (200) and cooperates with the power terminal (100) provided on the circuit board (200). A thermistor is provided between the heat-conducting block (300) and the circuit board (200). The thermistor is connected to the pin header (203) provided on the circuit board (200).

2. The device for temperature detection according to claim 1, characterized in that: The heat-conducting block (300) is an insulating heat-conducting block with thermal conductivity.

3. The device for temperature detection according to claim 1 or 2, characterized in that: The heat-conducting block (300) has a fixing groove (310) on one side that mates with the circuit board (200), and an arc-shaped groove (309) on the other side that mates with the power terminal (100).

4. The device for temperature detection according to claim 3, characterized in that: The heat-conducting block (300) is also provided with two grooves (311) that cooperate with the circuit board (200). The two grooves (311) are located on both sides of the fixing groove (310). When the heat-conducting block (300) cooperates with the circuit board (200), the contact surface three (306) at the bottom of the fixing groove (310) and the contact surface five (308) on the groove (311) are tightly fitted with the circuit board (200). The distance between the contact surface four (307) on the groove (311) and the circuit board (200) is a, where a is 0.5mm to 2mm.

5. The device for temperature detection according to claim 4, characterized in that: The upper part of the fixing groove (310) is provided with a second contact surface (304) that cooperates with the thermistor and a second assembly guide surface (303) for installation guidance.

6. The device for temperature detection according to claim 5, characterized in that: The arc-shaped groove (309) is provided with a first contact surface (301) that mates with the power terminal (100), and the heat-conducting block (300) is provided with a first assembly guide surface (302) for transitional mating with the first contact surface (301).

7. The device for temperature detection according to any one of claims 1, 2, 4 to 6, characterized in that: The lower part of the heat-conducting block (300) is provided with an anti-retraction boss (305).

8. The device for temperature detection according to claim 7, characterized in that: The thermistor is a surface mount thermistor (201) or a leaded thermistor (205).

9. The device for temperature detection according to claim 8, characterized in that: The circuit board (200) is provided with a temperature detection station (202) that cooperates with the heat-conducting block (300).

10. The device for temperature detection according to claim 9, characterized in that: The temperature detection station (202) is provided with a mounting slot (204) that cooperates with the leaded thermistor (205).

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