A photoetching machine for chip production
By optimizing the wafer loading and unloading process with rodless cylinders and flipping mechanisms, the problems of low efficiency and wafer damage in existing lithography machines have been solved, achieving efficient and safe wafer processing.
CN224341775UActive Publication Date: 2026-06-09SNAIL DIGITAL (XIAN) TECHNOLOGY CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SNAIL DIGITAL (XIAN) TECHNOLOGY CO LTD
- Filing Date
- 2025-05-12
- Publication Date
- 2026-06-09
AI Technical Summary
Technical Problem
Existing lithography machines affect production efficiency during wafer loading and unloading, and vacuum chucks may damage the lithography circuitry on the front side of the wafer.
Method used
A rodless cylinder is used to drive the sliding platform and the flipping mechanism. The rodless cylinder drives the sliding platform to slide back and forth to adjust the position of the bracket. Combined with the rocker arm and the flipping motor, the wafer can be flipped and its position adjusted, avoiding direct contact between the vacuum chuck and the wafer.
Benefits of technology
It improves the efficiency of wafer loading and unloading, protects the wafer photolithography circuit from damage, and enhances the overall efficiency of chip production.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN224341775U_ABST
Abstract
This utility model discloses a lithography machine for chip manufacturing, relating to the field of lithography machine technology. The lithography machine includes a lithography machine with a conveying mechanism fixedly installed inside for transporting wafers. Flipping mechanisms are installed on the front and rear sides of the lithography machine for flipping the lithographically processed wafers. The conveying mechanism includes a rodless cylinder fixedly installed inside the lithography machine. A slide rail is fixedly installed above the sliding platform, and a bracket is fitted above the slide rail. When the slider of the rodless cylinder moves to the leftmost end, the bracket at the right end of the slide rail is directly below the working area of the lithography machine, and the bracket at the left end of the slide rail is located outside the lithography machine for loading and unloading operations. This method allows for the removal of lithographically processed wafers and the placement of unprocessed wafers outside the lithography machine during the wafer lithography process, avoiding the time spent on loading and unloading that affects chip production efficiency.
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