A computer self-cooling case

Abstract

This utility model relates to the field of chassis technology, specifically to a self-cooling computer chassis, including a chassis body, a top cover mounted on the top of the chassis body, a side cover mounted on the left side of the chassis body, an assembly base provided at the bottom of the chassis body, a dustproof mesh embedded in the bottom of the inner cavity of the chassis body, and first through-holes on both sides of the assembly base. A first mounting bracket is installed in the inner cavity of the first through-hole, and a first fan is installed in the inner cavity of the first mounting bracket. This utility model, by setting up components such as the first through-holes, the first mounting bracket, and the first fan, and through the cooperative relationship between the bottom assembly base, the dustproof mesh component, and the side air duct structure component, enables the airflow circulation system component to direct the hot air inside the chassis through forced air intake at the bottom and negative pressure exhaust at the top. This achieves the effect of cooling the high-heat areas in the chassis body through multi-stage coordinated ventilation and cooling.

Description

Technical Field

[0001] This utility model relates to the field of chassis technology, specifically to a self-cooling computer chassis. Background Technology

[0002] The computer case is the outer shell that houses and protects the core hardware of a computer. It is usually made of metal and plastic and is one of the key components in assembling a desktop computer. It not only affects the appearance and expandability of the computer, but also relates to its performance in terms of heat dissipation, dust prevention and noise control.

[0003] Regarding the relevant technology, the following defects were found: Although the computer case has many ventilation holes, the internal airflow is not smooth, resulting in poor cooling performance of the case. This can easily cause the internal integrated circuit board to short-circuit due to heat, reducing the lifespan of the computer. Utility Model Content

[0004] In view of the above-mentioned shortcomings of the existing technology, the present invention provides a self-cooling computer chassis, which can effectively solve the problem that although the computer chassis has many heat dissipation holes, the internal airflow is not smooth, resulting in poor cooling performance of the chassis, which can easily cause the internal integrated circuit board to short circuit due to heat and reduce the life of the computer.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] This utility model provides a self-cooling computer chassis, including a chassis body, a top cover installed on the top of the chassis body, a side cover installed on the left side of the chassis body, an assembly base provided at the bottom of the chassis body, a dustproof mesh embedded in the bottom of the inner cavity of the chassis body, and a first through-hole on both sides of the assembly base. A first mounting bracket is installed in the inner cavity of the first through-hole, and a first fan is installed in the inner cavity of the first mounting bracket.

[0007] Furthermore, a first fixing frame is installed on the outside of the first mounting frame, and a first dust-blocking net is installed inside the first fixing frame.

[0008] Furthermore, a partition is installed on the inner wall of the assembly base, and a semiconductor cooling chip is embedded on the top of the partition.

[0009] Furthermore, a number of heat dissipation fins are installed at the bottom of the semiconductor cooling chip, and these heat dissipation fins are distributed at equal intervals.

[0010] Furthermore, a second mounting bracket is embedded in the bottom of the assembly base, and a second fan is installed in the inner cavity of the second mounting bracket. The second fan is located at the bottom of the semiconductor cooling chip.

[0011] Furthermore, a second fixing frame is installed at the bottom of the second mounting frame, and a second dust filter is installed in the inner cavity of the second fixing frame.

[0012] Furthermore, support frames are installed at the four corners of the bottom of the chassis body, and through holes are provided on the surface of the support frames.

[0013] Furthermore, mounting plates are installed at the four corners of the assembly base surface. The mounting plates have mounting holes on their surfaces, which extend into the inner cavity of the assembly base. Mounting bolts are provided on the outer side of the mounting plates, and the mounting bolts pass through the mounting holes and extend to the inner side of the through holes.

[0014] The technical solution provided by this utility model has the following advantages compared with the known prior art:

[0015] I. This utility model, by setting up components such as a first through-hole, a first mounting bracket, and a first fan, and through the cooperation between the bottom assembly base, the dustproof net component, and the side air duct structure component, enables the airflow circulation system component to direct the hot air inside the chassis body through forced air intake at the bottom and negative pressure exhaust at the top. This achieves the effect of ventilating and cooling the high-heat areas in the chassis body through multi-stage coordinated ventilation and cooling.

[0016] II. By setting up components such as a semiconductor cooling chip, heat dissipation fins, and a second fan, and through the cooperation between the active cooling module and the bottom air cooling system components, the upper part of the semiconductor cooling chip component is cooled, and the air drawn into the assembly base is cooled. At the same time, the heat dissipation fins and the second fan are used to force heat dissipation from the hot end of the semiconductor cooling chip. Thus, the device can achieve the effect of cooling down the electrical components in the main body of the chassis through a hybrid cooling strategy. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the overall three-dimensional structure of this utility model;

[0019] Figure 2 This is a three-dimensional structural diagram of the assembly base of this utility model;

[0020] Figure 3 This is a three-dimensional cross-sectional view of the assembly base of this utility model;

[0021] Figure 4 For the present utility model Figure 2 Enlarged structural diagram at point A in the middle.

[0022] Reference numerals in the attached drawings: 1. Chassis body; 2. Top cover; 3. Side cover; 4. Assembly base; 5. Dustproof net; 6. First through-hole; 7. First mounting bracket; 8. First fan; 9. First fixing bracket; 10. First dustproof net; 11. Partition plate; 12. Semiconductor cooling chip; 13. Heat dissipation fins; 14. Second mounting bracket; 15. Second fan; 16. Second fixing bracket; 17. Second dustproof net; 18. Support frame; 19. Through hole; 20. Mounting plate; 21. Mounting hole; 22. Mounting bolt. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0024] The present invention will be further described below with reference to the embodiments.

[0025] See attached document Figures 1-4 A self-cooling computer chassis includes a chassis body 1, a top cover 2 installed on the top of the chassis body 1, a side cover 3 installed on the left side of the chassis body 1, an assembly base 4 provided at the bottom of the chassis body 1, a dustproof mesh 5 embedded in the bottom of the inner cavity of the chassis body 1, and first through openings 6 on both sides of the assembly base 4. A first mounting bracket 7 is installed in the inner cavity of the first through opening 6, and a first fan 8 is installed in the inner cavity of the first mounting bracket 7. The first fan 8 can draw in air, and when the airflow passes over the operating hardware that is heating up, it will be heated and rise, and then be discharged through the top cover 2 or the rear fan to form a vertical air duct, thereby facilitating the cooling of the hardware in the chassis body 1. The dustproof mesh 5 and the first through opening 6 are designed to balance the dustproof requirements and facilitate the cooling of the hardware in the chassis body 1.

[0026] In addition, a first fixing frame 9 is installed on the outside of the first mounting frame 7, and a first dust filter 10 is installed inside the first fixing frame 9. The first fixing frame 9 can install the first dust filter 10, which can filter the air at the first fan 8 and prevent dust and impurities from being sucked into the chassis body 1.

[0027] See attached document Figures 1-3The inner wall of the assembly base 4 is equipped with a partition 11. A thermoelectric cooler 12 is embedded in the top of the partition 11. A heat dissipation fin 13 is installed at the bottom of the thermoelectric cooler 12. Several heat dissipation fins 13 are provided and are distributed at equal distances. The partition 11 is installed on the inner wall of the assembly base 4 to fix and support the thermoelectric cooler 12, ensuring that the thermoelectric cooler 12 is in effective contact with the internal environment of the assembly base 4. The thermoelectric cooler 12 can directly and actively cool the air entering the assembly base 4. The heat dissipation fins 13 can accelerate heat dissipation by increasing the surface area.

[0028] See attached document Figures 1-3 The bottom of the assembly base 4 is inlaid with a second mounting bracket 14, and a second fan 15 is installed in the inner cavity of the second mounting bracket 14. The second fan 15 is located at the bottom of the semiconductor cooling chip 12. A second fixing bracket 16 is installed at the bottom of the second mounting bracket 14, and a second dust filter 17 is installed in the inner cavity of the second fixing bracket 16. The second mounting bracket 14 is used to install the second fan 15 and the second fixing bracket 16. The second fan 15 is located at the bottom of the semiconductor cooling chip 12 and actively enhances the airflow exchange of the heat dissipation fins 13 to prevent the heating surface of the semiconductor cooling chip 12 from overheating and improve the cooling efficiency. The second dust filter 17 covers the air inlet side of the second fan 15 and filters external dust.

[0029] See attached document Figures 1-4 Support brackets 18 are installed at the four corners of the bottom of the chassis body 1. Through holes 19 are opened on the surface of the support brackets 18. Mounting plates 20 are installed at the four corners of the surface of the assembly base 4. Mounting holes 21 are opened on the surface of the mounting plates 20 and extend into the inner cavity of the assembly base 4. Mounting bolts 22 are provided on the outer side of the mounting plates 20. The mounting bolts 22 pass through the mounting holes 21 and extend into the inner side of the through holes 19. The support brackets 18 can provide bottom support for the chassis body 1 to ensure a certain distance from the ground or desktop. Through the through holes 19 and the mounting bolts 22, a stable connection with the assembly base 4 is achieved. The inner cavity of the mounting holes 21 has threaded grooves, which can be used to connect the support brackets 18 and the assembly base 4 after the mounting bolts 22 are installed.

[0030] Working principle: The assembly base 4 is placed on the placement position of the chassis body 1, and then the chassis body 1 is placed on the assembly base 4, so that the through hole 19 on the surface of the support frame 18 is aligned with the mounting hole 21. After the mounting bolt 22 is installed into the mounting hole 21, the mounting bolt 22 passes through the through hole 19, and the mounting bolt 22 can be used to install and restrict the support frame 18. When the hardware devices in the chassis body 1 are cooled down, the first fan 8, the second fan 15 and the thermoelectric cooler 12 are energized, so that the first fan 8 and the second fan 15 start to deliver air to the assembly base 4. When the thermoelectric cooler 12 is energized, the upper part of the thermoelectric cooler 12 absorbs heat, thereby achieving cooling. The air drawn in by the first fan 8 can blow towards the thermoelectric cooler 12, so that the thermoelectric cooler... After the air is cooled by the 12th airflow, the airflow can flow upwards. The cooled air enters the inner cavity of the chassis body 1 through the bottom of the chassis body 1, so that the cooled air can cool the hardware inside the chassis body 1. The air is then exhausted through the openings on the top and sides of the chassis body 1, which improves the cooling effect on the hardware inside the chassis body 1. When the second fan 15 is started, the airflow blown out by the second fan 15 can remove the heat from the surface of the heat dissipation fins 13, thereby cooling the heat dissipation part at the bottom of the thermoelectric cooler 12. This facilitates heat absorption and cooling of the upper part of the thermoelectric cooler 12, improving the cooling effect of the thermoelectric cooler 12, thus assisting in the cooling of the hardware inside the chassis body 1.

[0031] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of this utility model.

Claims

1. A self-cooling computer chassis, comprising a chassis body (1), characterized in that: The top of the chassis body (1) is equipped with a top cover (2), the left side of the chassis body (1) is equipped with a side cover (3), the bottom of the chassis body (1) is provided with an assembly base (4), the bottom of the inner cavity of the chassis body (1) is inlaid with a dustproof net (5), the two sides of the assembly base (4) are provided with a first through opening (6), the inner cavity of the first through opening (6) is equipped with a first mounting bracket (7), and the inner cavity of the first mounting bracket (7) is equipped with a first fan (8).

2. A self-cooling computer chassis according to claim 1, characterized in that, A first fixing frame (9) is installed on the outside of the first mounting frame (7), and a first dust-blocking net (10) is installed inside the first fixing frame (9).

3. A self-cooling computer chassis according to claim 1, characterized in that, The inner wall of the assembly base (4) is fitted with a partition (11), and a semiconductor cooling chip (12) is embedded on the top of the partition (11).

4. A self-cooling computer chassis according to claim 3, characterized in that, The bottom of the semiconductor cooling chip (12) is equipped with heat dissipation fins (13), and there are several heat dissipation fins (13) arranged at equal distances.

5. A self-cooling computer chassis according to claim 3, characterized in that, The bottom of the assembly base (4) is inlaid with a second mounting bracket (14), and a second fan (15) is installed in the inner cavity of the second mounting bracket (14). The second fan (15) is located at the bottom of the semiconductor cooling chip (12).

6. A self-cooling computer chassis according to claim 5, characterized in that, The bottom of the second mounting bracket (14) is equipped with a second fixing bracket (16), and the inner cavity of the second fixing bracket (16) is equipped with a second dust filter net (17).

7. A self-cooling computer chassis according to claim 1, characterized in that, The chassis body (1) has four support frames (18) installed at the bottom corners, and the surface of the support frame (18) has through holes (19).

8. A self-cooling computer chassis according to claim 7, characterized in that, Mounting plates (20) are installed at the four corners of the surface of the assembly base (4). Mounting holes (21) are opened on the surface of the mounting plate (20) and the mounting holes (21) extend into the inner cavity of the assembly base (4). Mounting bolts (22) are provided on the outer side of the mounting plate (20). The mounting bolts (22) pass through the mounting holes (21) and extend to the inner side of the through holes (19).

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