A laser and a packaging structure thereof
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 天津新智感知科技有限公司
- Filing Date
- 2025-07-07
- Publication Date
- 2026-06-09
Smart Images
Figure CN224342733U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of laser technology, and in particular to a laser and its packaging structure. Background Technology
[0002] Laser chips require specific temperature conditions to operate stably. Therefore, during laser packaging, an insulation structure is needed to protect the laser chip and reduce heat loss. Current technology typically uses a glass sheet with low thermal conductivity to insulate the laser chip, thereby minimizing heat loss. However, this packaging structure is complex to manufacture and incurs high costs. Utility Model Content
[0003] This invention provides a laser and its packaging structure to solve the problems of large heat loss, complex packaging process and high cost of laser chips.
[0004] According to one aspect of the present invention, a laser packaging structure is provided, comprising:
[0005] A conductive support socket is provided, and the external pins of the conductive support socket are electrically connected to the chip control module.
[0006] A ceramic substrate is disposed on one side of the supporting conductive tube base; a groove is provided at the center of the surface of the ceramic substrate, and the groove is disposed on the side of the ceramic substrate close to the supporting conductive tube base.
[0007] A laser chip is disposed on the side of the ceramic substrate away from the supporting conductive tube socket. The control pin of the supporting conductive tube socket is electrically connected to the controlled pin of the laser chip. The chip control module is used to provide current to the laser chip through the supporting conductive tube socket, so that the laser chip emits laser light.
[0008] Optionally, the maximum depth of the groove in the ceramic substrate is less than 80% of the height of the ceramic substrate;
[0009] The volume of the groove in the ceramic substrate is less than 80% of the volume of the ceramic substrate without the groove.
[0010] Optionally, the ceramic substrate includes: at least one support column, one end of the support column being disposed inside the groove on the side away from the support conductive tube seat, and the other end of the support column being connected to the support conductive tube seat.
[0011] Optionally, the support column is integrally formed with the ceramic substrate; the shape of the support column includes: rectangular column, cylindrical column, U-shaped column or ring column.
[0012] Optionally, the packaging structure of the laser further includes:
[0013] A temperature detection module is disposed on the ceramic substrate and on the same layer as the laser chip. The temperature detection module is electrically connected to the detection pin of the supporting conductive tube socket. The temperature detection module is used to detect the temperature of the laser chip and generate a temperature signal.
[0014] Optionally, the packaging structure of the laser further includes:
[0015] A heating module is integrated with the laser chip. The chip control module is used to control the current input to the laser chip according to the temperature signal, thereby adjusting the heat output of the heating module.
[0016] Optionally, the heating module is disposed on the ceramic substrate and on the same layer as the laser chip; the heating module is electrically connected to the feedback pin of the supporting conductive tube socket;
[0017] The chip control module is used to adjust the heat output of the heating module according to the temperature signal.
[0018] Optionally, the laser chip is welded to the ceramic substrate via a eutectic process, and the ceramic substrate is welded to the supporting conductive tube socket via a eutectic process.
[0019] The laser chip is simultaneously welded to the ceramic substrate, and the ceramic substrate is simultaneously welded to the supporting conductive tube base.
[0020] Optionally, the laser chip includes: an indium phosphide chip;
[0021] The ceramic substrate includes: an aluminum nitride ceramic substrate or an aluminum oxide ceramic substrate.
[0022] According to another aspect of the present invention, a laser is provided, comprising: the packaging structure of the laser provided in any embodiment of the present invention.
[0023] The technical solution provided by this embodiment of the invention reduces the contact area between the ceramic substrate and the supporting conductive tube by setting a ceramic substrate with grooves. This allows a greater amount of heat absorbed by the laser chip from the ceramic substrate to be retained within the substrate, significantly reducing heat loss from the laser chip. Furthermore, the smaller the contact area between the ceramic substrate and the supporting conductive tube, the better the thermal insulation effect of the ceramic substrate. This invention has a simpler structure, eliminating the need for additional glass sheets for heat retention, thereby simplifying the packaging process and resulting in lower material costs.
[0024] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this utility model, nor is it intended to limit the scope of this utility model. Other features of this utility model will become readily apparent from the following description. Attached Figure Description
[0025] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0026] Figure 1 This is a cross-sectional view of a laser packaging structure provided according to an embodiment of the present utility model;
[0027] Figure 2 This is a cross-sectional view of another laser packaging structure provided according to an embodiment of the present utility model;
[0028] Figure 3 This is a cross-sectional view along the AA′ direction of a laser packaging structure according to an embodiment of the present invention;
[0029] Figure 4 This is a cross-sectional view of a ceramic substrate along the thickness direction according to an embodiment of the present utility model;
[0030] Figure 5 This is a cross-sectional view along the thickness direction of another ceramic substrate provided according to an embodiment of the present utility model;
[0031] Figure 6 This is a cross-sectional view along the thickness direction of another ceramic substrate provided according to an embodiment of the present utility model;
[0032] Figure 7 This is a cross-sectional view of another laser packaging structure provided according to an embodiment of the present utility model;
[0033] Figure 8 This is a cross-sectional view of another laser packaging structure provided according to an embodiment of the present utility model. Detailed Implementation
[0034] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.
[0035] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the utility model described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.
[0036] This utility model provides a packaging structure for a laser. Figure 1 This is a cross-sectional view of a laser packaging structure provided in an embodiment of the present invention. (Reference) Figure 1 The laser's packaging structure includes: a supporting conductive socket 1, a ceramic substrate 2, and a laser chip 3. The external pins of the supporting conductive socket 1 are electrically connected to a chip control module. The ceramic substrate 2 is disposed on one side of the supporting conductive socket 1; a groove is provided at the center of the surface of the ceramic substrate 2, located on the side of the ceramic substrate 2 closest to the supporting conductive socket 1. The laser chip 3 is disposed on the side of the ceramic substrate 2 furthest from the supporting conductive socket 3, and the control pins of the supporting conductive socket 1 are electrically connected to the controlled pins of the laser chip 3. The chip control module is used to provide current to the laser chip 3 through the supporting conductive socket 1, causing the laser chip 3 to emit laser light.
[0037] During operation, laser chip 3 requires maintaining certain temperature conditions; for example, its operating temperature needs to be above 25 degrees Celsius. Therefore, to ensure stable operation of laser chip 3, it is necessary to minimize its heat loss.
[0038] Existing technologies typically isolate heat by adding a glass sheet with low thermal conductivity between the laser chip 3 and the supporting conductive socket 1. When encapsulating a laser with a glass sheet, to ensure the reliability of the glass sheet encapsulation, two separate die-bonding processes are required after encapsulating the laser chip 3 to bond the glass sheet. The die-bonding process uses adhesives such as epoxy resin glue or conductive silver paste. Therefore, existing technologies have a relatively complex process flow and increase the material input of epoxy resin glue, conductive silver paste, and glass sheets, resulting in higher costs.
[0039] This embodiment of the invention innovatively provides a novel ceramic substrate 2. A laser chip 3 is disposed on one side of the ceramic substrate 2, and the heat from the laser chip 3 can be directly transferred to the ceramic substrate 2. Since a groove is provided in the central area of the other side of the ceramic substrate 2, the ceramic substrate 2 does not directly contact the supporting conductive tube seat 1 in the groove area. Because air has a low thermal conductivity, the heat of the ceramic substrate 2 is mainly dissipated through the connection position between the outside of the groove and the supporting conductive tube seat 1.
[0040] Refer to the basic formula for heat conduction: Q=(k×A×ΔT) / d.
[0041] Where Q is the heat flux, k is the thermal conductivity, A is the contact area, ΔT is the temperature difference, and d is the thickness. Therefore, changes in the contact area directly affect changes in the heat flux, and the contact area is positively correlated with the heat flux. By appropriately adjusting the contact area, the heat dissipation capacity can be effectively adjusted.
[0042] Since the ceramic substrate 2 provided by this utility model has a groove in the center area, only the area outside the groove of the ceramic substrate 2 can directly contact the supporting conductive tube seat 1. This utility model is equivalent to reducing the contact area between the ceramic substrate 2 and the supporting conductive tube seat 1, thereby reducing the heat loss of the laser chip 3.
[0043] The technical solution provided by this embodiment of the invention reduces the contact area between the ceramic substrate and the supporting conductive tube by setting a ceramic substrate with grooves. This allows a greater amount of heat absorbed by the laser chip from the ceramic substrate to be retained within the substrate, significantly reducing heat loss from the laser chip. Furthermore, the smaller the contact area between the ceramic substrate and the supporting conductive tube, the better the thermal insulation effect of the ceramic substrate. This invention has a simpler structure, eliminating the need for additional glass sheets for heat retention, thereby simplifying the packaging process and resulting in lower material costs.
[0044] Continue to refer to Figure 1Based on the above embodiments, optionally, the maximum depth of the groove in the ceramic substrate 2 is less than 80% of the height of the ceramic substrate 2. The volume of the groove in the ceramic substrate 2 is less than 80% of the volume of the ceramic substrate 2 without the groove.
[0045] To ensure the mechanical strength of the ceramic substrate 2, the volume of the groove needs to be limited. Specifically, the internal height of the groove needs to be less than 80% of the height of the ceramic substrate 2. This design can prevent the ceramic substrate 2 at the groove from collapsing due to its thinness.
[0046] To ensure the overall rigidity of the ceramic substrate 2, the volume of the groove in the ceramic substrate 2 must be less than 80% of the volume of the ceramic substrate 2 without the groove. This arrangement reduces the risk of structural damage to the ceramic substrate 2, allowing it to maintain high reliability.
[0047] Therefore, by setting a ceramic substrate with grooves, this utility model can still ensure the strength and rigidity of the ceramic substrate, thus maintaining its good support.
[0048] Figure 2 A cross-sectional view of another laser packaging structure provided in an embodiment of this utility model. (See reference) Figure 2 Based on the above embodiments, optionally, the ceramic substrate 2 includes: at least one support column 21, one end of the support column 21 is disposed inside the groove on the side away from the support conductive tube seat 1, and the other end of the support column 21 is connected to the support conductive tube seat 1.
[0049] In order to prevent the ceramic substrate 2 from losing its central support performance due to the groove, the support capacity of the ceramic substrate 2 can be improved by adding a support column 21.
[0050] Because the contact area between the support column 21 and the support conductive tube seat 1 is small, the ceramic substrate 2 can still maintain good heat insulation after the support column 21 is installed.
[0051] Figure 3 This is a cross-sectional view along the AA′ direction of a laser packaging structure provided in an embodiment of the present invention. Figure 4 This is a cross-sectional view of a ceramic substrate along the thickness direction provided in an embodiment of the present invention. Figure 5 A cross-sectional view along the thickness direction of another ceramic substrate provided in an embodiment of this utility model. Figure 6 This is a cross-sectional view along the thickness direction of another ceramic substrate provided in an embodiment of the present invention. (In conjunction with...) Figures 4-6Based on the above embodiments, optionally, the support column 21 and the ceramic substrate 2 are integrally formed. The shape of the support column 21 includes: rectangular column 211, cylindrical column 212, U-shaped column 213 or ring column 214.
[0052] in, Figure 3 An exemplary structure is shown where the supporting column 21 is a rectangular column 211. Figure 4 An exemplary structure is shown where the supporting column 21 is a cylindrical column 212. Figure 5 An exemplary structure is shown where the supporting column 21 is a U-shaped column 213. Figure 6 An exemplary structure is shown where the supporting column 21 is a ring-shaped column 214.
[0053] Specifically, in the actual manufacturing process of the ceramic substrate 2, the structure of the supporting columns 21 can be configured with different structural forms according to specific requirements. When the ceramic substrate 2 has higher strength requirements, the number of supporting columns 21 can be increased accordingly, or a more stable structural form can be selected. For example, the support strength of using two rectangular columns 211 is greater than that of using one rectangular column 211, and the support strength of the annular column 214 is greater than that of the cylindrical column 212.
[0054] The ceramic substrate 2 can also be manufactured simultaneously with the support column 21 through an integrated processing method. Therefore, the ceramic substrate 2 and the support column 21 are an integrated structure. This arrangement allows the ceramic substrate 2 to have a tight connection with the support column 21, improving the stability of the support column 21.
[0055] Figure 7 This is a cross-sectional view of another laser packaging structure provided in an embodiment of the present invention. (See reference) Figure 7 Based on the above embodiments, optionally, the laser packaging structure further includes: a temperature detection module 4, which is disposed on the ceramic substrate 2 and on the same layer as the laser chip 3. The temperature detection module 4 is electrically connected to the detection pin of the supporting conductive tube seat 1. The temperature detection module 4 is used to detect the temperature of the laser chip 3 and generate a temperature signal.
[0056] Optionally, the laser's packaging structure also includes a heating module 5, which is integrated with the laser chip 3. The chip control module is used to control the current input to the laser chip 3 according to the temperature signal, thereby adjusting the heat output of the heating module 5.
[0057] The temperature detection module 4, connected to the supporting conductive tube socket 1, transmits the temperature signal to the chip control module via the socket 1, enabling the chip control module to detect the real-time temperature of the laser chip 3. For example, the temperature detection module 4 may include an NTC (Negative Temperature Coefficient) thermistor.
[0058] When the chip control module detects that the temperature of the laser chip 3 is lower than the stable operating condition of the laser chip 3, the chip control module can increase the current input to the laser chip 3. Because the control heating module 5 is integrated into the laser chip 3, the control heating module 5 and the laser chip 3 are of a single integrated structure. When the current input to the laser chip 3 increases, the input current of the heating module 5 will also increase simultaneously, thereby increasing the heat generation of the heating module 5.
[0059] This invention also reduces heat loss from the laser chip by using a ceramic substrate with grooves, resulting in a better heating effect and improved heating efficiency of the heating module. Therefore, the chip control module can achieve better heating with less current, resulting in lower power consumption.
[0060] Figure 8 This is a cross-sectional view of another laser packaging structure provided in an embodiment of the present invention. (See reference) Figure 8 Based on the above embodiments, optionally, the heating module 5 is disposed on the ceramic substrate 2 and on the same layer as the laser chip 3; the heating module 5 is electrically connected to the feedback pin of the supporting conductive tube seat 1. The chip control module is used to adjust the heat output of the heating module 5 according to the temperature signal.
[0061] When the laser chip 3 does not integrate the heating module 5, the heating module 5 can be separately mounted on the ceramic substrate 2 and positioned close to the laser chip 3. When the chip control module detects that the temperature of the laser chip 3 is lower than the operating conditions for stable operation of the laser chip 3, the chip control module can control the heating module 5 to heat the laser chip 3 externally, thereby ensuring that the laser chip 3 can always be at a suitable operating temperature.
[0062] Based on the above embodiments, optionally, the laser chip and the ceramic substrate are welded together using a eutectic bonding process, and the ceramic substrate and the supporting conductive socket are welded together using a eutectic bonding process. Welding is performed simultaneously between the laser chip and the ceramic substrate, and between the ceramic substrate and the supporting conductive socket.
[0063] Eutectic welding is a welding technology that utilizes the property of eutectic alloys to directly transform from solid to liquid at a specific temperature, thereby achieving material connection. It has advantages such as high connection strength and good reliability.
[0064] In this embodiment of the invention, during packaging, the laser chip and the ceramic substrate can be welded simultaneously in a single eutectic process, while the ceramic substrate can also be welded to the supporting conductive socket. This further optimizes the packaging process and improves packaging efficiency.
[0065] Based on the above embodiments, optionally, the laser chip includes an indium phosphide chip. The ceramic substrate includes an aluminum nitride ceramic substrate or an aluminum oxide ceramic substrate.
[0066] Because the Young's moduli of indium phosphide and aluminum nitride, and between indium phosphide and aluminum oxide, are matched, their stress and strain capabilities are similar when welded using a eutectic process. This prevents excessive deformation during welding, which could lead to insufficient weld stiffness.
[0067] Furthermore, the coefficients of thermal expansion of indium phosphide and aluminum nitride, as well as between indium phosphide and aluminum oxide, are similar. Therefore, during the welding process, the difference in the coefficients of thermal expansion will not cause expansion cracking.
[0068] This utility model also provides a laser. The laser includes the packaging structure of the laser provided in any embodiment of this utility model, which has similar beneficial effects to the packaging structure of the laser, and will not be described in detail here.
[0069] It should be understood that the various forms of the process shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this utility model can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this utility model can be achieved, and this is not limited herein.
[0070] The specific embodiments described above do not constitute a limitation on the scope of protection of this utility model. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.
Claims
1. A packaging structure for a laser, characterized in that, include: A conductive support socket is provided, and the external pins of the conductive support socket are electrically connected to the chip control module. A ceramic substrate is disposed on one side of the supporting conductive tube base; a groove is provided at the center of the surface of the ceramic substrate, and the groove is disposed on the side of the ceramic substrate close to the supporting conductive tube base. A laser chip is disposed on the side of the ceramic substrate away from the supporting conductive tube socket. The control pin of the supporting conductive tube socket is electrically connected to the controlled pin of the laser chip. The chip control module is used to provide current to the laser chip through the supporting conductive tube socket, so that the laser chip emits laser light.
2. The laser packaging structure according to claim 1, characterized in that, The maximum depth of the groove in the ceramic substrate is less than 80% of the height of the ceramic substrate; The volume of the groove in the ceramic substrate is less than 80% of the volume of the ceramic substrate without the groove.
3. The laser packaging structure according to claim 1, characterized in that, The ceramic substrate includes at least one support column, one end of which is disposed inside the groove on the side away from the support conductive tube seat, and the other end of which is connected to the support conductive tube seat.
4. The laser packaging structure according to claim 3, characterized in that, The supporting column is integrally formed with the ceramic substrate; the shape of the supporting column includes: rectangular column, cylindrical column, U-shaped column or ring column.
5. The laser packaging structure according to claim 1, characterized in that, The packaging structure of the laser also includes: A temperature detection module is disposed on the ceramic substrate and on the same layer as the laser chip. The temperature detection module is electrically connected to the detection pin of the supporting conductive tube socket. The temperature detection module is used to detect the temperature of the laser chip and generate a temperature signal.
6. The laser packaging structure according to claim 5, characterized in that, The packaging structure of the laser also includes: A heating module is integrated with the laser chip. The chip control module is used to control the current input to the laser chip according to the temperature signal, thereby adjusting the heat output of the heating module.
7. The laser packaging structure according to claim 6, characterized in that, The heating module is disposed on the ceramic substrate and is disposed on the same layer as the laser chip; the heating module is electrically connected to the feedback pin of the supporting conductive tube seat; The chip control module is used to adjust the heat output of the heating module according to the temperature signal.
8. The laser packaging structure according to claim 1, characterized in that, The laser chip is welded to the ceramic substrate via a eutectic process, and the ceramic substrate is welded to the supporting conductive tube socket via a eutectic process. The laser chip is simultaneously welded to the ceramic substrate, and the ceramic substrate is simultaneously welded to the supporting conductive tube base.
9. The laser packaging structure according to claim 1, characterized in that, The laser chip includes: an indium phosphide chip; The ceramic substrate includes: an aluminum nitride ceramic substrate or an aluminum oxide ceramic substrate.
10. A laser, characterized in that, include: The packaging structure of the laser according to any one of claims 1-9.