A power module and a vehicle
By using surface mount technology and thermal conductive gel, the problem of poor heat dissipation of the power module was solved, achieving higher heat dissipation efficiency and longer service life, while reducing costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-26
- Publication Date
- 2026-06-09
AI Technical Summary
The existing power modules have poor heat dissipation, resulting in a decrease in power output.
Surface mount technology is used to connect power devices to circuit boards. Thermal conductive gel is used as a thermal conductive component, and heat sinks and isolation layers are set to improve heat dissipation efficiency and connection stability, and optimize electrical performance.
It improves the heat dissipation performance and integration of the power module, extends its service life, enhances the reliability of electrical connections and environmental adaptability, and reduces costs.
Smart Images
Figure CN224343081U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of battery technology, and in particular to a power module and a vehicle. Background Technology
[0002] Power devices (such as IGBTs and MOSFETs) control power conversion through high-frequency switching, achieving high efficiency and small size designs, and are widely used in the power module field. However, the heat dissipation of power modules in the industry is currently poor, leading to a decrease in power output. Utility Model Content
[0003] This application provides a power module and a vehicle to improve the heat dissipation effect of the power module.
[0004] This application provides a power module, which includes a housing, a circuit board, multiple power devices, a heat sink, and a heat-conducting component.
[0005] The circuit board is mounted on the housing; the power device is located in the inner cavity of the housing and is attached to the circuit board; the heat sink has a heat dissipation channel; one end of the heat-conducting component is connected to the power device and the other end is connected to the heat sink.
[0006] In this design, the power module housing provides ample space for the installation of the circuit board and power devices. The power devices are connected to the circuit board using surface mount technology, resulting in higher integration and better heat dissipation. This reduces manufacturing steps by 30% and facilitates power module maintenance. Heat sinks are incorporated for thermal management within the power module, quickly dissipating heat generated by the power devices and improving the module's operating efficiency.
[0007] Optionally, the thermally conductive element is a thermally conductive gel.
[0008] In this solution, the thermal conductive gel has high and stable thermal conductivity, and can still work stably at high temperatures; the thermal conductive gel has good adhesion, which improves the connection stability between power devices and heat sinks; compared with traditional thermal conductive materials, the thermal conductive gel is more durable, has lower cost throughout the entire life cycle of the power module, and extends the service life of the power module.
[0009] Optionally, the thickness of the heat-conducting element is W, where 60μm≤W≤110μm.
[0010] In this solution, when the thickness W of the heat-conducting component satisfies 60μm≤W≤110μm, it can improve the heat dissipation efficiency between the power device and the heat sink while reducing the waste of heat-conducting component material in terms of manufacturing cost.
[0011] Optionally, the thermal conductivity of the heat-conducting element is K, K≥6W / mk, and / or the flame retardant performance rating of the heat-conducting element is FV-0.
[0012] In this solution, when the thermal conductivity K of the heat-conducting component is greater than or equal to 6 W / mk and the flame retardant rating of the heat-conducting component is FV-0, the heat dissipation efficiency of the heat-conducting component is improved, and the safety of the power module is also improved. This enables the power module to adapt to extreme environments and ensures that the heat-conducting component will not cause the thermal runaway to worsen when the power module experiences thermal runaway.
[0013] Optionally, the thermal conductive element covers the surface of the power device opposite to the circuit board.
[0014] In this solution, the heat-conducting component only covers the side of the power device closest to the heat sink. This reduces the cost of the heat-conducting component while achieving connection and heat conduction between the power device and the heat sink, and prevents the power device from being affected by the normal operation of the power device when the heat-conducting component covers other surfaces of the power device.
[0015] Optionally, the power device includes a body and pins, the pins being electrically connected to the circuit board. An isolation layer exists between the body and the circuit board.
[0016] In this solution, compared with through-hole packaging, surface-mount power devices have the advantages of small size and high integration, and are more adaptable to high-density circuit board layouts. The electrical connection between the pins and the circuit board can improve heat dissipation efficiency, enhance soldering reliability, and reduce the risk of cold solder joints.
[0017] In addition, an isolation layer is set between the power device and the circuit board to protect the connection between the power device and the circuit board, avoid damage to the circuit board caused by thermal runaway due to local overheating of the power device, and improve the electrical connection efficiency between the power device and the circuit board.
[0018] Optionally, a protective layer is provided between the isolation layer and the circuit board, and between the isolation layer and the main body.
[0019] In this design, protective layers on both sides of the isolation layer not only protect the power module but also optimize its electrical performance. On one hand, the protective layers are moisture-proof, waterproof, dustproof, stain-proof, and mold-resistant, reducing the impact of the external environment on the normal operation of the power devices and increasing the environmental adaptability of the power module. On the other hand, the protective layers also have insulating, leakage-proof, and corrosion-resistant properties, which can improve the connection reliability during the electrical connection between the power devices and the circuit board.
[0020] Optionally, the power device and the circuit board are connected to form a receiving cavity, and the isolation layer and the protective layer are located inside the receiving cavity.
[0021] In this solution, the cavity formed by the connection between the power device and the circuit board provides space for the isolation layer and the protective layer, improving the space utilization of the power module. Furthermore, the isolation layer and the protective layer located in the cavity can provide isolation and protection for the main body of the power device, further improving the service life of the power device.
[0022] Optionally, the plurality of power devices are arranged uniformly along the length of the power module, and / or each power device includes at least two packaged MOSFETs.
[0023] In this design, multiple power devices are evenly arranged on the heat sink along the length of the power module, ensuring uniform heat dissipation. Each power device integrates two power MOSFETs in a package, resulting in shorter power lines and a smaller, shorter power loop area, which is beneficial for EMC and electrical stability.
[0024] This application also provides a vehicle, which includes a vehicle body and at least one power module as described in any one of the above embodiments.
[0025] It should be understood that the above general description and the following detailed description are merely exemplary and do not limit this application. Attached Figure Description
[0026] Figure 1 This is a schematic diagram of the power module structure in an embodiment of this application;
[0027] Figure 2 This is a schematic diagram of the power module in an embodiment of this application, wherein the circuit board has been removed;
[0028] Figure 3 This is a schematic diagram of the structural fit of the power module in the embodiments of this application;
[0029] Figure 4 This is a schematic diagram of the power module's structure and configuration in another embodiment.
[0030] Explanation of reference numerals in the attached figures:
[0031] 1- Shell;
[0032] 2- Circuit board;
[0033] 3- Power devices;
[0034] 31-Ontology part;
[0035] 32-pin;
[0036] 4- Heat sink;
[0037] 41-Heat dissipation channel;
[0038] 5- Thermal conductive components
[0039] 6- Isolation layer;
[0040] 7- Protective layer.
[0041] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. Detailed Implementation
[0042] To better understand the technical solution of this application, the embodiments of this application will be described in detail below with reference to the accompanying drawings.
[0043] It should be understood that the described embodiments are merely some, not all, of the embodiments in this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.
[0044] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.
[0045] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.
[0046] This application provides a vehicle comprising a vehicle body and a power module. The vehicle body provides space for the power module, and the power module provides energy output to the vehicle body. The vehicle can be a gasoline-powered vehicle, a natural gas-powered vehicle, or a new energy vehicle. New energy vehicles can be pure electric vehicles, hybrid electric vehicles, or range-extended electric vehicles, etc. This application does not specifically limit the type of vehicle.
[0047] In one specific embodiment, this application provides a power module, such as... Figures 1-3 As shown, the power module includes a housing 1, a circuit board 2, multiple power devices 3, a heat sink 4, and a heat-conducting component 5.
[0048] The circuit board 2 is mounted on the housing 1; the power device 3 is located in the inner cavity of the housing 1 and is attached to the circuit board 2; the heat sink 4 has a heat dissipation channel 41; one end of the heat conductor 5 is connected to the power device 3 and the other end is connected to the heat sink 4.
[0049] The power device 3 is a core component of the power module, directly affecting power conversion efficiency, power density, and reliability. Specifically, the power device 3 can be a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor), providing precise control signals to the power module, ensuring rapid switching of the power device 3, reducing switching losses, and also providing protection circuitry and thermal management functions. In other embodiments, the power device 3 can also be an IGBT (Insulated Gate Bipolar Transistor), a silicon carbide (SiC) power device 3, etc. This application does not limit the specific type of the power device 3.
[0050] The following description uses the example of power device 3 being a MOSFET and circuit board 2 being a PCB board.
[0051] In this embodiment, the housing 1 of the power module provides ample space for the installation of the circuit board 2 and the power device 3. Compared with the traditional plug-in connection, the power device 3 and the circuit board 2 are connected using surface mount technology, which has higher integration and better heat dissipation performance, reduces the manufacturing process by 30%, and facilitates the maintenance of the power module.
[0052] The heat sink 4 is used for thermal management in the power module, quickly removing the heat generated by the power device 3 and improving the operating efficiency of the power module. Specifically, the heat sink 4 can be a cooling circulation device, and the heat dissipation channel 41 of the heat sink 4 can be a water channel in the cooling circulation system. Coolant flows in from the inlet, absorbs heat from the power device 3 through the water channel, and then exits from the outlet. In other embodiments, the heat sink 4 can also be other heat dissipation structural components, such as air-cooled system components. This application does not limit the specific structure of the heat sink 4.
[0053] The following description uses heat dissipation channel 41 as an example of the water channel in the cabinet.
[0054] When the power device 3 is directly connected to the heat sink 4, local overheating of the power device 3 during static heat dissipation will lead to performance degradation. In this embodiment, a heat-conducting component 5 is provided between the heat sink 4 and the power device 3, which can quickly transfer the heat generated by the power device 3 during operation to the heat sink 4, improve heat dissipation efficiency, and the heat-conducting component 5 can also achieve temperature homogenization of the power device 3 during heat dissipation, avoiding thermal runaway caused by local overheating.
[0055] In some embodiments, such as Figure 3 As shown, the thermal conductive component 5 can specifically be a thermally conductive gel.
[0056] Thermally conductive gels used in batteries are composite materials made of polymers (such as silicone and polyurethane) and thermally conductive fillers (such as alumina, boron nitride, and carbon fiber). They have high thermal conductivity, good adhesion and flexibility, as well as good high temperature resistance and insulation.
[0057] In this embodiment, the thermally conductive gel has high and stable thermal conductivity, and can still work stably at high temperatures; the thermally conductive gel has good adhesion, which improves the connection stability between the power device 3 and the heat sink 4; compared with traditional thermally conductive materials, the thermally conductive gel is more durable, has lower cost throughout the entire life cycle of the power module, and extends the service life of the power module.
[0058] In other embodiments, provided that the characteristics of the power module for the heat-conducting component 5 are met, the heat-conducting component 5 may also be other structures, such as heat-conducting pads. This application does not limit the specific structure of the heat-conducting component 5.
[0059] The following description uses thermal conductive gel as an example for thermal conductive component 5.
[0060] In some embodiments, such as Figure 3 As shown, the thickness of the heat-conducting component 5 is W, 60μm≤W≤110μm. For example, the thickness W of the heat-conducting component 5 can be 60μm, 70μm, 80μm, 90μm, 100μm, 110μm, etc.
[0061] When the thickness W of the heat-conducting component 5 is too small, the thickness of the thermally conductive gel is too small, making it impossible to quickly transfer the heat generated by the power device 3 during operation to the heat sink 4, affecting the heat dissipation efficiency between the power device 3 and the heat sink 4, and failing to effectively alleviate the thermal runaway problem caused by local overheating of the power device 3 during heat dissipation. When the thickness W of the heat-conducting component 5 is too large, the thickness of the thermally conductive gel is too large, and the heat in the power device 3 cannot be transferred to the heat sink 4, affecting the heat dissipation efficiency between the power device 3 and the heat sink 4, and causing a waste of material cost for the heat-conducting component 5. In the embodiments of this application, when the thickness W of the heat-conducting component 5 satisfies 60μm≤W≤110μm, it can improve the heat dissipation efficiency between the power device 3 and the heat sink 4 while reducing the waste of material cost in the manufacturing of the heat-conducting component 5.
[0062] In some embodiments, such as Figure 3 As shown, the thermal conductivity of the heat-conducting component 5 is K, where K ≥ 6 W / mk, and / or the flame retardant rating of the heat-conducting component 5 is FV-0. For example, the thermal conductivity of the heat-conducting component 5 can be: 6 W / mk, 6.5 W / mk, 7 W / mk, 7.5 W / mk, 8 W / mk, 8.5 W / mk, 9 W / mk, etc.
[0063] When the thermal conductivity of the heat-conducting component 5 is too low, it cannot cope with the high current and high heat generation working environment in the power module. In this embodiment, when K≥6W / mk, the heat-conducting component 5 can quickly transfer the heat generated in the power device 3 to the heat sink 4, avoiding the problem of heat accumulation caused by local high temperature in the power device 3. Moreover, the higher the thermal conductivity, the more effectively it can suppress the risk of thermal runaway inside the battery, reduce the damage of high temperature to the power module materials, and extend the battery life.
[0064] In this embodiment, the FV-0 rating of the thermally conductive gel is a rating of the material's flame retardancy, representing the highest flame retardancy level in the UL94 standard. It is primarily used to assess the material's fire-resistant properties. Power modules generally require a UL94-V0 flame retardancy rating, meaning the flame extinguishes within 10 seconds without dripping during a vertical burning test. New energy vehicle battery systems are mandated to use V0-rated materials to reduce the risk of thermal runaway.
[0065] In addition, to avoid pursuing high thermal conductivity at the expense of flame retardancy and to prevent materials from fueling combustion in high-temperature environments, the material of the heat-conducting component 5 must be selected in a balanced manner between thermal conductivity and flame retardancy.
[0066] In this embodiment, when the thermal conductivity K of the heat-conducting component 5 is ≥6W / mk and the flame retardant performance level of the heat-conducting component 5 is FV-0, the heat dissipation efficiency of the heat-conducting component 5 is improved, and the safety of the power module is also improved, so that the power module has the ability to adapt to extreme environments. When the power module experiences thermal runaway, it can ensure that the heat-conducting component 5 will not cause the thermal runaway to worsen further.
[0067] In the above embodiments, such as Figure 2 and Figure 3 As shown, the heat-conducting component 5 covers the surface of the power device 3 on the side opposite to the circuit board 2.
[0068] In this embodiment, the heat-conducting component 5 only covers the side of the power device 3 closest to the heat sink 4. While achieving connection and heat conduction between the power device 3 and the heat sink 4, the cost of the heat-conducting component 5 is reduced, and the normal operation of the power device 3 is prevented from being affected when the other surfaces of the power device 3 are covered by the heat-conducting component 5.
[0069] In one specific embodiment, the heat-conducting component 5 can be applied to the surface of the heat sink 4 by dot coating, so that the connection between the power device 3 and the heat sink 4 is discontinuous. Dot coating is more conducive to subsequent maintenance and replacement than continuous coating.
[0070] In the above embodiments, such as Figure 3 As shown, the power device 3 includes a body 31 and pins 32, with pins 32 electrically connected to the circuit board 2. An isolation layer 6 is provided between the body 31 and the circuit board 2.
[0071] In this embodiment, specifically, unlike the through-hole MOSFET where the pins 32 pass through the mounting holes of the PCB for soldering, the surface-mount MOSFET has its pins 32 directly soldered onto the PCB surface. Compared to through-hole packages, surface-mount power devices 3 have the advantages of small size and high integration, and are better suited to the layout of high-density circuit boards 2. The electrical connection between the pins 32 and the circuit board 2 can improve heat dissipation efficiency, enhance soldering reliability, and reduce the risk of cold solder joints.
[0072] An isolation layer 6 is provided between the power device 3 and the circuit board 2 to protect the connection between the power device 3 and the circuit board 2, avoid damage to the circuit board 2 caused by thermal runaway due to local overheating of the power device 3, and improve the electrical connection efficiency between the power device 3 and the circuit board 2.
[0073] In some embodiments, such as Figure 3 As shown, protective layers 7 are provided between the isolation layer 6 and the circuit board 2, and between the isolation layer 6 and the main body 31.
[0074] In this embodiment, the protective layers 7 on both sides of the isolation layer 6 not only protect the power module but also optimize its electrical performance. On the one hand, the protective layers 7 are moisture-proof, waterproof, dustproof, stain-proof, and mold-proof, reducing the impact of the external environment on the normal operation of the power device 3 and increasing the environmental adaptability of the power module. On the other hand, the protective layers 7 also have the characteristics of insulation, leakage prevention, and corrosion resistance, which can improve the connection reliability during the electrical connection process between the power device 3 and the circuit board 2.
[0075] In this embodiment, conformal coating can be used as the material for the protective layer 7 because it combines insulation and heat dissipation requirements, effectively preventing heat dissipation issues affecting the power device 3 (such as a MOSFET). In other embodiments, other suitable materials can be selected for the protective layer 7. This application does not limit the specific type of material used for the protective layer 7.
[0076] In some embodiments, such as Figure 3 As shown, the power device 3 and the circuit board 2 are connected to form a cavity, and the isolation layer 6 and the protective layer 7 are located inside the cavity.
[0077] In this embodiment, the cavity formed by the connection between the power device 3 and the circuit board 2 provides space for the isolation layer 6 and the protective layer 7, thereby improving the space utilization of the power module. Furthermore, the isolation layer 6 and the protective layer 7 located in the cavity can provide isolation and protection for the body 31 of the power device 3, further improving the service life of the power device 3.
[0078] In the above embodiments, such as Figure 1 and Figure 2As shown, multiple power devices 3 can be evenly arranged along the length of the power module, and multiple power devices 3 are evenly arranged on the heat sink 4 along the length of the power module, ensuring uniform heat dissipation.
[0079] In addition, each power device 3 includes at least two packaged MOSFETs. The integration of two power MOSFET packages in each power device 3 makes its power lines shorter and its power loop area smaller and shorter, which is beneficial to EMC and electrical stability.
[0080] In another embodiment, the case where two MOS transistors are connected to circuit board 2 can also be as follows: Figure 4 The connection shown is that the bodies 31 of the two MOSFETs are stacked, and the pins 32 of the two MOSFETs are electrically connected to the circuit board 2, which improves the space utilization in the power module.
[0081] The above descriptions are merely specific implementations of the embodiments of this application, but the protection scope of the embodiments of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the embodiments of this application should be covered within the protection scope of the embodiments of this application. Therefore, the protection scope of the embodiments of this application should be determined by the protection scope of the claims.
Claims
1. A power module, characterized by The power module includes: Shell (1); Circuit board (2), said circuit board (2) is mounted on the housing (1); Multiple power devices (3) are located in the inner cavity of the housing (1) and are mounted on the circuit board (2); Heat sink (4), the heat sink (4) has heat dissipation channel (41); The power module also includes a heat-conducting component (5), one end of which is connected to the power device (3) and the other end of which is connected to the heat sink (4).
2. The power module of claim 1, wherein, The thermally conductive component (5) is a thermally conductive gel.
3. The power module of claim 2, wherein, The thickness of the heat-conducting component (5) is W, 60μm≤W≤110μm.
4. The power module of claim 3, wherein, The thermal conductivity of the heat-conducting component (5) is K, K≥6W / mk, and / or the flame retardant performance level of the heat-conducting component (5) is FV-0.
5. The power module of claim 4, wherein, The heat-conducting component (5) covers the surface of the power device (3) on the side opposite to the circuit board (2).
6. The power module according to claim 1, characterized in that, The power device (3) includes a body (31) and pins (32), the pins (32) being electrically connected to the circuit board (2); An isolation layer (6) is provided between the body part (31) and the circuit board (2).
7. The power module according to claim 6, characterized in that, A protective layer (7) is provided between the isolation layer (6) and the circuit board (2), and between the isolation layer (6) and the main body (31).
8. The power module according to claim 7, characterized in that, The power device (3) is connected to the circuit board (2) to form a cavity, and the isolation layer (6) and the protective layer (7) are located inside the cavity.
9. The power module according to any one of claims 1-8, characterized in that, The power devices (3) are evenly arranged along the length of the power module, and / or each power device (3) includes at least two packaged MOS transistors.
10. A vehicle, characterized in that, The vehicle includes a vehicle body and a power module, wherein the power module is the power module according to any one of claims 1-9.