Miniaturized CB vehicle-mounted station

By optimizing the RF power amplifier circuit through MOSFET and dual-transistor combining circuit design and PCB board setup, the problem of large size of CB vehicle-mounted radio was solved, and a miniaturized CB vehicle-mounted radio design was realized.

CN224343186UActive Publication Date: 2026-06-09QUANZHOU XINWEI ELECTRONICS

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
QUANZHOU XINWEI ELECTRONICS
Filing Date
2025-05-16
Publication Date
2026-06-09

AI Technical Summary

Technical Problem

Traditional CB mobile radios are large in size due to their internal structure design, especially when they have high-power transmission capabilities, the space occupied by heat dissipation components increases, resulting in a larger overall size.

Method used

The design employs MOSFETs and dual-transistor combined circuits, combined with the separate board setup of the PCB motherboard and functional boards, and connects them via FPC cables. This optimizes the RF power amplifier circuit and hides the MOSFETs, reducing the chassis size.

Benefits of technology

While improving transmission power and signal quality, the overall miniaturization of the CB vehicle-mounted radio was achieved, reducing the size of the RF power amplifier circuit.

✦ Generated by Eureka AI based on patent content.

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Abstract

This utility model discloses a miniaturized CB vehicle-mounted radio, including a circuit unit with a built-in radio frequency (RF) power amplifier circuit. The RF power amplifier circuit includes MOSFETs Q1, Q2, and Q3, and inductors L1 and L2. The gates of MOSFETs Q1 and Q2 are connected, and the sources of MOSFETs Q1, Q2, and Q3 are all grounded. The drains of MOSFETs Q1 and Q2 are connected to the first terminals of inductors L1 and L2, respectively. The second terminal of inductor L1 is connected to the VCC terminal, and the second terminal of inductor L2 is connected to an antenna. The drain of MOSFET Q3 is connected to the gates of MOSFETs Q1 and Q2. A carrier signal is applied to the gate of MOSFET Q3, and an AM modulation signal is applied to the drain of MOSFET Q3. This reduces the overall size of the RF power amplifier circuit, thus miniaturizing the overall size of this utility model.
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Description

Technical Field

[0001] This utility model relates to a CB vehicle-mounted platform, and more specifically to a miniaturized CB vehicle-mounted platform. Background Technology

[0002] CB (Carrier-Based Radio) is a short-range wireless communication device widely used in trucks, off-road vehicles, and other vehicles. However, traditional CB CBs are generally large in size due to their internal structural design limitations. Moreover, traditional CB CBs have multiple functions, such as audio transmission and reception, recording and noise reduction, voice-activated transmission (VOX), sub-audio and high-power transmission, etc. The modules corresponding to each function are integrated into the PCB board. To ensure cost control, the size of the CB CB will be large. In particular, if the CB CB has the function of high-power transmission, the built-in RF amplifier power module requires additional space for its heat dissipation components when the power is increased to 10W or more, resulting in a larger overall size of the CB CB.

[0003] In view of this, this application has conducted in-depth research on this basis, resulting in this case. Utility Model Content

[0004] The purpose of this invention is to provide a compact, miniaturized CB vehicle-mounted platform.

[0005] To achieve the above objectives, the solution of this utility model is:

[0006] A miniaturized CB vehicle-mounted radio includes a circuit unit comprising a carrier circuit for generating a carrier signal, a modulation circuit for generating an AM modulation signal, and a built-in radio frequency power amplifier circuit. The radio frequency power amplifier circuit includes a MOSFET assembly and a dual-transistor combining circuit. The MOSFET assembly includes MOSFETs Q1, Q2, and Q3. The dual-transistor combining circuit includes inductors L1 and L2. The gates of MOSFETs Q1 and Q2 are connected, and the sources of MOSFETs Q1 and Q2 are grounded. The drains of MOSFET Q1 and Q2 are respectively connected to the first terminals of inductors L1 and L2. The second terminal of inductor L1 is connected to the VCC terminal of the CB vehicle radio. The second terminal of inductor L2 is connected to the antenna through a low-pass filter circuit. The drain of MOSFET Q3 is connected to the connection line between the gates of MOSFET Q1 and Q2. The source of MOSFET Q3 is grounded. The gate of MOSFET Q3 is connected to the signal output terminal of the carrier circuit. The signal output terminal of the modulation circuit is connected to the drain of MOSFET Q3.

[0007] It also includes a chassis, in which a PCB motherboard and a PCB functional board are mounted. A first space is formed between the PCB functional board and the inner bottom surface of the chassis. The PCB functional board is located below the PCB motherboard, and the PCB motherboard and the PCB functional board have reserved space for wiring.

[0008] Both the PCB motherboard and the PCB functional board are square boards.

[0009] The upper inner sidewall of the chassis is integrally connected with a first mounting post at each of the four corners of the PCB functional board. The first mounting post is provided with a mounting hole 1. The four corners of the PCB functional board are provided with mounting holes 2. Each mounting hole 1 and each mounting hole 2 corresponds to one another. Each corresponding mounting hole 1 and mounting hole 2 is equipped with a locking device.

[0010] The upper inner sidewall of the chassis is integrally connected with several partitions, and the partitions are sequentially and integrally connected together. The upper inner sidewall of the chassis forms several cavities through the partitions. Each partition has a second mounting post integrally connected to its corner and / or middle position. Each second mounting post has a mounting hole three. The non-circuit portion of the PCB motherboard has several mounting holes four. Each corresponding mounting hole three and mounting hole four are fitted with a locking fastener.

[0011] The antenna, the modulation circuit, and the radio frequency power amplifier circuit are all integrated on the PCB motherboard, and the PCB functional board integrates several functional modules.

[0012] Each of the aforementioned functional modules corresponds to a recording noise reduction module, a voice-controlled transmission module, and a sub-sound module, respectively.

[0013] The chassis includes a cover, a front cover, and a bottom plate. The front cover is installed on the front side of the cover, and the bottom plate is installed on the lower side of the cover. The bottom plate is installed together with the front cover, and the cover, the front cover, and the bottom plate together form an enclosed square chassis.

[0014] With the above structure, this utility model has the following beneficial effects: In the RF power amplifier circuit, this utility model uses MOSFETs and a dual-transistor combining circuit. The carrier signal is loaded onto the gate of MOSFET Q3, amplified by MOSFET Q3, and the AM modulation signal is loaded onto the drain of MOSFET Q3 to form a modulation wave signal. This modulation wave signal passes through MOSFETs Q1 and Q2, and then is combined in inductor L2, thereby increasing the transmission power. The amplified modulation wave signal is transmitted to the antenna through a low-pass filter circuit. Compared with the prior art, this utility model improves RF power while ensuring transmission power and signal quality. By simplifying and optimizing the RF power amplifier circuit, the overall size of the RF power amplifier circuit is reduced while improving the transmission power. Moreover, MOSFETs Q1, Q2, and Q3 are arranged in a hidden manner, thereby reducing the size of this utility model.

[0015] 2. This utility model adopts a separate board setup of PCB motherboard and PCB functional board. The PCB motherboard is located on the upper side of the PCB functional board, and the two are connected by FPC ribbon cable or connector. The FPC ribbon cable or connector is located in the reserved space of the circuit, thereby reducing the size of the chassis and realizing the miniaturization of this utility model. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the CB vehicle-mounted platform of this utility model.

[0017] Figure 2 This utility model's CB vehicle-mounted platform internal structure diagram (base plate omitted).

[0018] Figure 3 This is a schematic diagram of the structure of the CB vehicle-mounted console cover of this utility model.

[0019] Figure 4 This is a schematic block diagram of the radio frequency power amplifier circuit in the CB vehicle-mounted radio of this utility model.

[0020] Figure 5 This is a circuit diagram of the radio frequency power amplifier circuit in the CB vehicle-mounted radio of this utility model.

[0021] In the picture:

[0022] 1-Casing; 2-Case cover; 21-Third mounting post; 22-Locking fastener three;

[0023] 3-Front cover; 31-Front abutment part; 32-Side abutment part; 4-Bottom plate;

[0024] 51-PCB mainboard; 52-PCB functional board;

[0025] 61-First mounting post; 62-Locking component one;

[0026] 71-Partition plate; 72-Second mounting post; 73-Second locking device. Detailed Implementation

[0027] To further explain the technical solution of this utility model, the following detailed description is provided through specific embodiments.

[0028] A miniaturized CB vehicle-mounted radio is provided, which is an improvement on the conventional CB vehicle-mounted radio. In this embodiment, the CB vehicle-mounted radio has the same functions as the conventional CB vehicle-mounted radio, such as audio transmission and reception, recording and noise reduction, weather forecast, voice-activated transmission (VOX), sub-audio and high-power transmission, etc. That is to say, the conventional CB vehicle-mounted radio includes an antenna and a circuit unit. The circuit unit includes an audio transmission and reception module, a recording and noise reduction module, a weather forecast playback module, a voice-activated transmission module, a sub-audio module, and an RF power amplification module. The functional modules of the CB vehicle-mounted radio mentioned above are for illustrative purposes and are not limited to the above functional modules. The specific uses and quantities of functional modules are arranged according to the actual situation.

[0029] Furthermore, a conventional CB mobile radio also includes an antenna, and the circuit unit includes a carrier circuit and a modulation circuit. The carrier circuit is used to generate a carrier signal, and the modulation circuit is used to generate an AM modulated signal. In this embodiment, the carrier circuit adopts the carrier circuit already used in conventional CB mobile radios, that is, the carrier circuit is an existing conventional carrier circuit; the modulation circuit adopts the modulation circuit already used in conventional CB mobile radios. For example, the modulation unit includes a low-pass filter and a microphone. The microphone is electrically connected to the signal input terminal of the low-pass filter. The voice signal transmitted by the microphone is amplified by conventional audio and then filtered by the low-pass filter (LPF) to form an AM modulated signal (i.e., a voice signal).

[0030] For ease of description, the orientation of this utility model when it is installed inside a vehicle is taken as the reference direction of this utility model, and the side facing the user is taken as the front side.

[0031] like Figures 1-5 As shown, the present invention also includes a chassis 1, which is a square box. Preferably, the chassis 1 is a cast aluminum chassis. The chassis 1 includes a cover 2, a front cover 3, and a bottom plate 4. The front cover 3 is installed on the front side of the cover 2, and the bottom plate 4 is installed on the lower side of the cover 2. The bottom plate 4 and the front cover 3 are installed on each other. The cover 2, the front cover 3, and the bottom plate 4 together enclose the interior to make the enclosed interior a hollow structure. Preferably, the cover 2 is a cover with an opening on the front and top sides.

[0032] The chassis 1 described above has two PCB boards inside, preferably both of which are square boards. In this embodiment, the two PCB boards correspond to the PCB motherboard 51 and the PCB function board 52, respectively. The antenna, modulation circuit, RF power amplifier circuit, transceiver audio circuit, weather forecast playback module, and MCU circuit of conventional CB vehicle platform are all integrated on the PCB motherboard 51. The recording noise reduction module, voice-activated transmission module (VOX), and sub-audio module are all integrated on the PCB function board 52. The PCB motherboard 51 is located on the upper side of the PCB function board 52, and a reserved space for wiring is formed between the PCB motherboard 51 and the PCB function board 52. This reserved space is used for the placement of conventional FPC cables or connectors. The FPC cables or connectors are used to connect the circuits on the PCB motherboard 51 to the circuits on the PCB function board 52. Furthermore, a first space is formed between the PCB function board 52 and the inner bottom surface of the base plate 4. This first space is used for heat dissipation and wiring. It should be noted that the functional modules integrated on the PCB motherboard 51 and the PCB functional board 52 are defined according to the actual circuit layout and wiring conditions, and are not limited to the above-mentioned definitions.

[0033] Furthermore, the mounting structure of the aforementioned PCB functional board 52 is as follows: the inner upper sidewall of the cover 1 is integrally connected to the four corners of the PCB functional board 52 with first mounting posts 61. The four first mounting posts 61 are arranged vertically, that is, the upper end of each first mounting post 61 is integrally connected to the inner upper sidewall of the cover 1, and the lower end of each first mounting post 61 extends toward the base plate 4. The lower end of each first mounting post 61 is provided with a mounting hole 1, and the four corners of the PCB functional board 52 are provided with mounting holes 2. Each mounting hole 1 and each mounting hole 2 corresponds to each other, and each corresponding mounting hole 1 and mounting hole 2 is provided with a locking fastener 1 62. In this embodiment, the locking fastener 1 can be a self-tapping screw, bolt or rivet, so as to fix it to the corresponding mounting hole 1 and mounting hole 2 by the locking fastener 1 62, thereby fixing the PCB functional board 52 inside the chassis 1.

[0034] Furthermore, the mounting structure of the aforementioned PCB motherboard 51 is as follows: several partitions 71 are integrally connected to the inner upper sidewall of the cover 2 in a conventional manner. Each partition 71 is vertically arranged and sequentially connected together. The inner upper side of the cover 2 is divided into multiple cavities by the partitions 71. Each cavity can be used for cable routing and / or heat dissipation. A second mounting post 72 is integrally connected to the corners and / or middle positions of each partition 71. The arrangement of each second mounting post 72 is determined according to the size of the PCB motherboard 51 and the actual circuit wiring. Furthermore, each of the second mounting posts 72 is arranged vertically, and each of the second mounting posts 72 has a mounting hole 3 at its lower end. The non-circuit portion of the PCB motherboard 51 has several mounting holes 4, and each mounting hole 3 and each mounting hole 4 corresponds to one another. Each mounting hole 3 and mounting hole 4 is equipped with a locking fastener 2 73. In this embodiment, the locking fastener 2 73 can be a self-tapping screw, bolt, or rivet, so as to fix it to the corresponding mounting holes 3 and mounting holes 4, thereby fixing the PCB motherboard 51 inside the chassis 1.

[0035] Furthermore, the aforementioned cover 2 and base plate 4 are installed together using a conventional installation structure. For example, several third mounting posts 21 are integrally connected to the inner upper side wall of the cover 2. Each third mounting post 21 is arranged vertically, meaning that the upper end of each third mounting post 21 is integrally connected to the inner upper side wall of the cover 21, and the lower end of each third mounting post 21 extends towards the base plate 4. Each lower end of the third mounting post 21 has a mounting hole. In this embodiment, each third mounting post 21 is distributed at the four corners of the base plate 4 and at the middle position of each side. The base plate 4 has... There are several mounting holes six, and each mounting hole five and each mounting hole six correspond one-to-one. Each corresponding mounting hole five and mounting hole six is ​​locked with a locking fastener three 22. The locking fastener three 22 can be a rivet, a self-tapping screw, or a bolt, etc. In this way, each locking fastener three 22 is fixed in the corresponding mounting hole five and mounting hole six, thereby installing the box cover 2 and the bottom plate 4 together. In addition, the mounting structure between the box cover 2 and the front cover 3 adopts the existing conventional mounting structure, that is, both can be installed using the above-mentioned mounting structure, so it will not be described in detail.

[0036] In this embodiment, the installation structure between the front cover 3 and the bottom plate 4 is as follows: the rear side of the front cover 3 has a front abutment 31 and two oppositely arranged side abutment 32. During installation, the front side of the bottom plate 4 overlaps the front abutment 31, and the two opposite sides of the bottom plate 4 (excluding the front side) overlap the corresponding side abutment 32. Then, the bottom plate 4 is fixedly installed on the box cover 2, thereby realizing the fixed installation of the front cover 3 and the bottom plate 4.

[0037] like Figures 4-5As shown, the aforementioned RF power amplifier module is a built-in type. This RF power amplifier module includes a MOSFET assembly and a dual-transistor combining circuit. The MOSFET assembly includes MOSFETs Q1, Q2, and Q3. The dual-transistor combining circuit includes inductors L1 and L2. The gates of MOSFETs Q1 and Q2 are connected. The sources of MOSFETs Q1 and Q2 are grounded. The drains of MOSFETs Q1 and Q2 are connected to the first terminals of inductors L1 and L2, respectively. The second terminal of L1 is connected to the VCC terminal of the CB vehicle radio. The VCC terminal refers to the positive power supply terminal in the circuit unit, RF power amplifier module, or MCU circuit. The second terminal of inductor L2 is connected to the antenna through a low-pass filter circuit (LPF). The drain of MOSFET Q3 is connected to the connection line between the gate of MOSFET Q1 and the gate of MOSFET Q2. The source of MOSFET Q3 is grounded. The gate of MOSFET Q3 is connected to the signal output terminal of the carrier circuit. The signal output terminal of the modulation circuit is connected to the drain of MOSFET Q3.

[0038] Furthermore, all of the aforementioned MOSFETs are N-channel MOSFETs.

[0039] Furthermore, the aforementioned low-pass filter circuit is a conventional low-pass filter circuit. In this embodiment, the following is used: Figure 5 The low-pass filter circuit shown.

[0040] This embodiment describes a miniaturized CB vehicle-mounted radio. The operation of its RF power amplifier module is as follows: the carrier circuit generates a carrier signal and loads the carrier signal onto the gate of MOSFET Q3. After the carrier signal is amplified by MOSFET Q3, an AM modulation signal is loaded onto the drain of MOSFET Q3 to form a modulation wave signal. This modulation wave signal passes through MOSFETs Q1 and Q2 and then converges into inductor L2, thereby increasing the transmission power. The amplified RF signal is transmitted to the antenna through a low-pass filter circuit. The circuit is simple.

[0041] The above description is only a preferred embodiment of this invention. All equivalent changes and modifications made within the scope of the claims of this utility model shall fall within the scope of the claims of this utility model.

Claims

1. A miniaturized CB vehicle-mounted radio, comprising a circuit unit, said circuit unit including a carrier circuit for generating a carrier signal, a modulation circuit for generating an AM modulation signal, and a built-in radio frequency power amplifier circuit; characterized in that: The RF power amplifier circuit includes a MOSFET assembly and a dual-transistor combining circuit. The MOSFET assembly includes MOSFETs Q1, Q2, and Q3. The dual-transistor combining circuit includes inductors L1 and L2. The gates of MOSFETs Q1 and Q2 are connected. The sources of MOSFETs Q1 and Q2 are grounded. The drains of MOSFETs Q1 and Q2 are connected to the first terminals of inductors L1 and L2, respectively. The second terminal of inductor L1 is connected to the VCC terminal of the CB vehicle-mounted radio. The second terminal of inductor L2 is connected to the antenna through a low-pass filter circuit. The drain of MOSFET Q3 is connected to the connection line between the gates of MOSFETs Q1 and Q2. The source of MOSFET Q3 is grounded. The gate of MOSFET Q3 is connected to the signal output terminal of the carrier circuit. The signal output terminal of the modulation circuit is connected to the drain of MOSFET Q3.

2. The miniaturized CB vehicle-mounted platform according to claim 1, characterized in that: It also includes a chassis, in which a PCB motherboard and a PCB functional board are mounted. A first space is formed between the PCB functional board and the inner bottom surface of the chassis. The PCB functional board is located below the PCB motherboard, and the PCB motherboard and the PCB functional board have reserved space for wiring.

3. The miniaturized CB vehicle-mounted platform according to claim 2, characterized in that: Both the PCB motherboard and the PCB functional board are square boards.

4. A miniaturized CB vehicle-mounted platform according to claim 3, characterized in that: The upper inner sidewall of the chassis is integrally connected with a first mounting post at each of the four corners of the PCB functional board. The first mounting post is provided with a mounting hole 1. The four corners of the PCB functional board are provided with mounting holes 2. Each mounting hole 1 and each mounting hole 2 corresponds to one another. Each corresponding mounting hole 1 and mounting hole 2 is equipped with a locking device.

5. A miniaturized CB vehicle-mounted platform according to claim 3, characterized in that: The upper inner sidewall of the chassis is integrally connected with several partitions, and the partitions are sequentially and integrally connected together. The upper inner sidewall of the chassis forms several cavities through the partitions. Each partition has a second mounting post integrally connected to its corner and / or middle position. Each second mounting post has a mounting hole three. The non-circuit portion of the PCB motherboard has several mounting holes four. Each corresponding mounting hole three and mounting hole four are fitted with a locking fastener.

6. A miniaturized CB vehicle-mounted platform according to any one of claims 2-5, characterized in that: The antenna, the modulation circuit, and the radio frequency power amplifier circuit are all integrated on the PCB motherboard, and the PCB functional board integrates several functional modules.

7. A miniaturized CB vehicle-mounted platform according to claim 6, characterized in that: Each of the aforementioned functional modules corresponds to a recording noise reduction module, a voice-controlled transmission module, and a sub-sound module, respectively.

8. A miniaturized CB vehicle-mounted platform according to any one of claims 2-5, characterized in that: The chassis includes a cover, a front cover, and a bottom plate. The front cover is installed on the front side of the cover, and the bottom plate is installed on the lower side of the cover. The bottom plate is installed together with the front cover, and the cover, the front cover, and the bottom plate together form an enclosed square chassis.