Pcb board for preventing soldering

Abstract

The utility model provides a prevent the pcb board of tin, including core layer, isolation support layer, protection layer, function layer, character layer and prevent tin group, both sides of core layer are connected with isolation support layer in compound, the side of two isolation support layers is connected with protection layer in compound away from core layer, the side of two protection layers is connected with function layer in compound away from isolation support layer, the side of two function layers is connected with character layer in compound away from protection layer, two character layers are provided with prevent tin group away from function layer's side. The utility model discloses utilize the character resistance soldering strip of increasing on the pcb board, and cooperate prevent tin groove, can avoid when welding, solder tin flows to the adjacent soldering pad or solder foot place, leads to the emergence of tin situation, prevents the influence pcb board's performance, reliability and safety, and the size of pcb board's soldering foot and soldering pad is invariable, will not affect the quality of welding, is more convenient for the use of pcb board.

Description

Technical Field

[0001] This utility model relates to the field of PCB boards, and more particularly to a PCB board that prevents solder bridging. Background Technology

[0002] PCBs are crucial electronic components, serving as the support for electronic components and the carrier for their electrical interconnection. They are core components in electronic devices, providing electrical connections, signal transmission, and mechanical support. By laminating conductive lines and insulating substrates according to a pre-designed scheme, PCBs achieve the interconnection and fixation of electronic components. Composed of an insulating base plate, connecting wires, and solder pads for assembling and soldering electronic components, PCBs serve the dual function of conductive lines and an insulating base. They can replace complex wiring, realizing electrical connections between components in a circuit. This not only simplifies the assembly and soldering of electronic products, reducing the amount of wiring work required by traditional methods and significantly alleviating the labor intensity of workers, but also reduces the overall size of the device, lowers product costs, and improves the quality and reliability of electronic equipment. PCBs offer good product consistency, allowing for standardized designs that facilitate mechanization and automation in the production process. Furthermore, a fully assembled and debugged PCB can serve as an independent spare part, facilitating interchangeability and maintenance of the entire product.

[0003] During PCB soldering, solder may accidentally bridging between adjacent pads or pins, a phenomenon known as solder bridging. Solder bridging can cause short circuits or signal interference, significantly affecting the performance, reliability, and safety of the PCB. In the Chinese utility model patent "Announcement No.: CN204031581U, Title: A PCB Structure to Prevent Solder Bridging Between Adjacent Pads", the original circular shape of the pads was changed to a racetrack shape. This design can reduce the width of the pads (horizontally) and effectively increase the distance between adjacent pads, thereby reducing the possibility of solder bridging. However, the aforementioned application reduces the width of the pads, resulting in a smaller soldering area, which affects the quality of the soldering. Furthermore, the increase in the distance between adjacent pads is limited, making the treatment of solder bridging relatively ineffective. Utility Model Content

[0004] The technical problem to be solved by this utility model is to overcome the defect of the prior art in that it is difficult to prevent solder bridging, and to provide a PCB board that prevents solder bridging.

[0005] The present invention solves the above-mentioned technical problems through the following technical solution:

[0006] This utility model provides a PCB board for preventing solder bridging, including a core layer, an isolation support layer, a protective layer, a functional layer, a character layer, and an anti-solder bridging assembly. The core layer is compositely connected to the upper and lower sides with isolation support layers. The core layer is used for signal and power transmission, and the isolation support layers are used for supporting the PCB board.

[0007] A protective layer is compositely connected to the side of the two isolation support layers away from the core layer, and a functional layer is compositely connected to the side of the two protective layers away from the isolation support layers. The protective layer and the functional layer are used to protect the PCB board.

[0008] A character layer is compositely connected to the side of the two functional layers away from the protective layer, and an anti-solder bridging group is provided on the side of the two character layers away from the functional layers. The character layer is used for PCB board identification, and the anti-solder bridging group is used to prevent solder bridging from occurring on the PCB board.

[0009] In this technical solution, by adding a character solder mask to the PCB board and using an anti-solder bridging groove, solder can be prevented from flowing to adjacent pads or leads during soldering, thus preventing bridging and affecting the performance, reliability, and safety of the PCB board. Furthermore, the size of the PCB board's leads and pads remains unchanged, so the soldering quality is not affected, and the PCB board is easier to use.

[0010] Preferably, the anti-bridging solder mask group includes a character solder mask and an anti-bridging solder groove, and the character solder mask is compositely connected around the pads of the PCB board.

[0011] In this technical solution, the anti-solder bridging group can prevent solder bridging during PCB soldering.

[0012] Preferably, the PCB board has an anti-soldering groove located inside the character solder mask, and the anti-soldering groove surrounds the solder pads of the PCB board.

[0013] In this technical solution, the anti-solder bridging groove can guide the direction of solder flow and prevent solder from connecting with the solder of adjacent solder pads.

[0014] Preferably, the core layer includes a signal layer, a power layer, and a ground layer, which are sequentially and interconnected.

[0015] In this technical solution, the core layer is used for signal and power transmission on the PCB board.

[0016] Preferably, the signal layer includes a top layer, a bottom layer, and an internal signal layer, wherein the internal signal layer is connected to the top layer and the bottom layer through vias or blind vias.

[0017] In this technical solution, the signal layer can be used to transmit electrical signals, including analog signals, digital signals, high-frequency signals, etc.

[0018] Preferably, the isolation support layer includes an insulating layer, a semi-cured sheet layer, and a pressure-resistant layer, wherein the insulating layer, the semi-cured sheet layer, and the pressure-resistant layer are sequentially composited and connected.

[0019] In this technical solution, the isolation support layer can be used to provide electrical isolation and support for the PCB board, thereby increasing the PCB board's compressive strength and stability.

[0020] Preferably, the protective layer includes a heat dissipation layer and an electromagnetic shielding layer, which are compositely connected.

[0021] In this technical solution, the protective layer enables the PCB board to have better heat dissipation and electromagnetic shielding performance.

[0022] Preferably, the functional layer includes a protective layer and a green solder resist layer, and the protective layer and the green solder resist layer are compositely connected.

[0023] In this technical solution, the functional layer can be used to protect the PCB board and further increase the solder resist performance of the PCB board.

[0024] Preferably, the protective layer includes an anti-corrosion coating and an abrasion-resistant coating.

[0025] In this technical solution, the protective layer can be used to increase the protective performance of the PCB board.

[0026] Preferably, the compression-resistant layer is composed of a bubble rubber sheet and a carbon fiber mesh, with the bubble rubber sheet covered with carbon fiber mesh on both sides.

[0027] In this technical solution, the compressive strength of the PCB board can be increased by using a compressive layer.

[0028] Based on common knowledge in the field, the above-mentioned preferred conditions can be combined arbitrarily to obtain various preferred embodiments of this utility model.

[0029] The positive and progressive effects of this utility model are as follows:

[0030] This invention utilizes a character solder mask strip added to the PCB board, along with an anti-solder bridging groove, to prevent solder from flowing to adjacent pads or leads during soldering, thus avoiding bridging and affecting the performance, reliability, and safety of the PCB board. Furthermore, the size of the PCB board's leads and pads remains unchanged, so the soldering quality is not affected, making the PCB board easier to use.

[0031] Meanwhile, the placement component can stably place the PCB board and drain any water that may be present during placement, facilitating the placement and transportation of the PCB board. The angle of the placement component is adjustable, thus adapting to PCB boards of different sizes, which facilitates the placement and drainage of the PCB board, as well as the processing and transportation of the PCB board. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of the PCB board structure for preventing solder bridging according to an embodiment of the present invention.

[0033] Figure 2 for Figure 1 The diagram shows a magnified view of part A of the PCB board used to prevent solder bridging.

[0034] Figure 3 for Figure 1 The diagram shows the overall internal structure of the PCB board to prevent solder bridging.

[0035] Figure 4 for Figure 3 The diagram shows a magnified view of the structure at point B of the PCB board used to prevent solder bridging.

[0036] Figure 5 for Figure 1 The diagram shows a three-dimensional structure of a PCB board placement rack to prevent PCB bridging.

[0037] Figure 6 for Figure 5 The diagram shows a front cross-sectional view of the PCB board placement rack for preventing PCB bridging.

[0038] Figure 7 for Figure 5 The diagram shows a side cross-sectional view of the PCB board placement rack for preventing PCB bridging.

[0039] Figure 8 for Figure 6 The diagram shows a magnified view of the structure at point C of the PCB board used to prevent solder bridging.

[0040] Explanation of reference numerals in the attached figures

[0041] 1. Core Layer; 11. Signal Layer; 12. Power Layer; 13. Ground Layer;

[0042] 2. Isolation support layer; 21. Insulation layer; 22. Prepreg layer; 23. Compression-resistant layer;

[0043] 3. Protective layer; 31. Heat dissipation layer; 32. Electromagnetic shielding layer;

[0044] 4. Functional layer; 41. Protective layer; 42. Solder resist layer;

[0045] 5. Character layer;

[0046] 6. Anti-soldering solder mask; 61. Character solder mask; 62. Anti-soldering solder groove;

[0047] 7. Place the strips;

[0048] 8. Placement components; 81. Left placement plate; 82. Right placement plate; 83. Fixed shaft; 84. Fixed plate; 85. Divider plate;

[0049] 9. Support component; 91. Support base; 92. First connecting column; 93. Second connecting column; 94. Mounting strip; 95. Third connecting column; 96. Reinforcing side plate; 97. Supporting side plate;

[0050] 10. Adjustment component; 101. Threaded shaft; 102. Anti-detachment bracket; 103. Threaded sleeve. Detailed Implementation

[0051] The present invention will be further illustrated by way of embodiments below, but the present invention is not limited to the scope of the embodiments described herein.

[0052] Figures 1 to 8 The diagram shown is a structural schematic of an embodiment of the PCB board for preventing solder bridging according to this utility model. The PCB board for preventing solder bridging includes a core layer 1, an isolation support layer 2, a protective layer 3, a functional layer 4, a character layer 5, and an anti-solder bridging assembly 6. The core layer 1 is reinforced with isolation support layers 2 on both its upper and lower sides. The core layer 1 is used for signal and power transmission, and the isolation support layers 2 are used for supporting the PCB board.

[0053] A protective layer 3 is compositely connected to the side of the two isolation support layers 2 away from the core layer 1, and a functional layer 4 is compositely connected to the side of the two protective layers 3 away from the isolation support layers 2. The protective layer 3 and the functional layer 4 are used to protect the PCB board.

[0054] A character layer 5 is compositely connected to the side of the two functional layers 4 away from the protective layer 3. A solder joint 6 is provided on the side of the two character layers 5 away from the functional layers 4. The character layers 5 are used for PCB board marking, and the solder joint 6 is used to prevent solder bridging on the PCB board.

[0055] Character layer 5 is used to label component numbers, polarity, test points, and other information to assist in assembly and maintenance.

[0056] In this technical solution, by adding a character solder mask 61 to the PCB board and using an anti-solder bridging groove 62, solder can be prevented from flowing to adjacent pads or solder feet during soldering, thus preventing bridging and affecting the performance, reliability, and safety of the PCB board. Furthermore, the size of the solder feet and pads on the PCB board remains unchanged, so the soldering quality is not affected, and the PCB board is easier to use.

[0057] The anti-bridging solder mask group 6 includes a character solder mask 61 and an anti-bridging solder groove 62, and the character solder mask 61 is compositely connected around the solder pads of the PCB board.

[0058] In this technical solution, the anti-solder bridging group 6 can prevent solder bridging during PCB soldering.

[0059] The PCB board has an anti-solder bridging groove 62 located inside the character solder resist 61, and the anti-solder bridging groove 62 surrounds the solder pads of the PCB board.

[0060] In this technical solution, the anti-solder bridging groove 62 can guide the direction of solder flow and prevent the solder from connecting with the solder of adjacent solder pads.

[0061] The core layer 1 includes a signal layer 11, a power layer 12, and a ground layer 13, which are sequentially connected in a composite manner.

[0062] In this technical solution, the core layer 1 is used for signal and power transmission on the PCB board.

[0063] The signal layer 11 includes a top layer, a bottom layer, and an internal signal layer. The internal signal layer is connected to the top layer and the bottom layer through vias or blind vias.

[0064] In this technical solution, electrical signals, including analog signals, digital signals, and high-frequency signals, can be transmitted using signal layer 11.

[0065] Power layer 12 provides a stable DC power supply to the PCB board and distributes current to each component.

[0066] Ground layer 13 can establish a reference potential for the PCB board, shield electromagnetic interference (EMI), and provide a signal return path.

[0067] The isolation support layer 2 includes an insulating layer 21, a semi-cured sheet layer 22, and a pressure-resistant layer 23, which are sequentially connected in composite.

[0068] In this technical solution, the isolation support layer 2 can be used to electrically isolate and support the PCB board, thereby increasing the PCB board's compressive strength and stability.

[0069] The protective layer 3 includes a heat dissipation layer 31 and an electromagnetic shielding layer 32, which are compositely connected.

[0070] In this technical solution, the protective layer 3 enables the PCB board to have better heat dissipation and electromagnetic shielding performance.

[0071] The heat dissipation layer 31 can conduct heat from the components to the external environment, preventing the PCB board from overheating and failing.

[0072] The heat dissipation layer 31 can be implemented by designing through holes under the component and filling them with copper or silver paste to improve thermal conductivity;

[0073] This allows for the integration of micro heat pipes into the PCB board.

[0074] Electromagnetic interference can be suppressed by using electromagnetic shielding layer 32;

[0075] The electromagnetic shielding layer 32 can be implemented by spraying silver or copper conductive paint onto the PCB board to form a shielding layer.

[0076] One approach is to design a metallized mesh within the inner layers of the PCB to reduce its impact on the signal layers.

[0077] The functional layer 4 includes a protective layer 41 and a green solder resist layer 42, which are compositely connected.

[0078] In this technical solution, functional layer 4 can be used to protect the PCB board and further increase the solder resist performance of the PCB board.

[0079] The protective layer 41 includes an anti-corrosion coating and a wear-resistant coating.

[0080] In this technical solution, the protective layer 41 can be used to increase the protective performance of the PCB board.

[0081] The compressive layer 23 is composed of a bubble rubber sheet and a carbon fiber mesh, with the bubble rubber sheet covered with carbon fiber mesh on both sides.

[0082] In this technical solution, the compressive strength of the PCB board can be increased by using the compressive layer 23.

[0083] During the production process, PCB boards are often placed on racks. However, the surface of the PCB boards is often treated in electroplating solutions, and due to their porosity, they absorb a certain amount of solution and water. Therefore, PCB boards cannot be directly stacked. Any water that may be present needs to be drained during the placement process. During the transportation of PCB boards, it is necessary to ensure that the racks can stably load the PCB boards to prevent damage during transportation.

[0084] The placement rack includes a placement strip 7, with placement components 8 rotatably connected to both sides of the placement strip 7. The ends of the placement components 8 on both sides away from the placement strip 7 are rotatably connected to a support component 9. The two sides of the placement strip 7 are respectively connected to an adjustment component 10, and the top of the adjustment component 10 is connected to the support component 9.

[0085] The placement assembly 8 includes a left placement plate 81, a right placement plate 82, and a fixing shaft 83. The left placement plate 81 and the right placement plate 82 are respectively disposed on both sides of the placement strip 7. The left placement plate 81 and the right placement plate 82 are each provided with a fixing shaft 83 on both sides of the placement strip 7. The two fixing shafts 83 are respectively rotatably connected to one end of the corresponding left placement plate 81 or right placement plate 82. The two ends of the fixing shaft 83 are connected to fixing plates 84. One side of the fixing plate 84 is connected to the side of the placement strip 7.

[0086] Multiple partition plates 85 are connected to the opposite sides of the left placement plate 81 and the right placement plate 82.

[0087] The support component 9 includes a support base 91, with two symmetrically distributed first connecting columns 92 arranged above the support base 91, a second connecting column 93 arranged above each of the two first connecting columns 92, an mounting strip 94 arranged above each of the two second connecting columns 93, and a third connecting column 95 arranged on the side of the two mounting strips 94 that are close to each other.

[0088] The first connecting column 92, the second connecting column 93 and the third connecting column 95 are all connected to both ends of a reinforcing side plate 96. The reinforcing side plate 96 at the first connecting column 92 is connected to the top of the support base 91, the reinforcing side plate 96 at the second connecting column 93 is connected to the bottom of the mounting strip 94, and the reinforcing side plate 96 at the third connecting column 95 is connected to the side of the mounting strip 94.

[0089] The surfaces of the first connecting post 92 and the second connecting post 93 are rotatably connected to both ends of the supporting side plate 97, and the surfaces of the two third connecting posts 95 are rotatably connected to one end of the left placement plate 81 and the right placement plate 82, respectively.

[0090] The placement strip 7, the left placement plate 81, the right placement plate 82, and the supporting side plate 97 are all provided with multiple drainage outlets.

[0091] The control component 10 includes a threaded shaft 101, the bottom end of which is connected to the top of the support base 91, the top end of which is connected to the inner wall of the top surface of the anti-detachment frame 102, and the bottom of which is connected to the top of the support base 91.

[0092] The threaded shaft 101 is threadedly connected to a threaded sleeve 103, and the surface of the threaded sleeve 103 is rotatably connected to the placement strip 7.

[0093] The cross-section of the threaded sleeve 103 is in the shape of an "I".

[0094] When in use, the PCB board can be placed directly between the left placement plate 81 and the right placement plate 82. At this time, the PCB board is between two adjacent partition plates 85. The left placement plate 81, the right placement plate 82 and the partition plates 85 are used to stably place the PCB board. Water that may be present during the placement process can be drained, which facilitates the placement, transportation and other operations of the PCB board.

[0095] Meanwhile, to accommodate different PCB board models, the threaded sleeves 103 on both sides can be rotated, allowing the threaded sleeves 103 to move along the threaded shaft 101. At this time, the threaded sleeves 103 can drive the placement strips 7 to move in the same direction. When the placement strips 7 move, they can respectively drive the left placement plate 81 and the right placement plate 82 to rotate around the fixed shaft 83 and the third connecting column 95, thereby causing the mounting strip 94 to rotate around the second connecting column 93 and the third connecting column 95, which in turn drives the support side plate 97 to rotate around the first connecting column 92 and the second connecting column 93, thereby adjusting the angle between the left placement plate 81 and the right placement plate 82 to accommodate different PCB board models, expand the applicability of the placement rack, and increase the flexibility of the placement rack during use.

[0096] While specific embodiments of this utility model have been described above, those skilled in the art should understand that these are merely illustrative examples, and the scope of protection of this utility model is defined by the appended claims. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principles and essence of this utility model, but all such changes and modifications fall within the scope of protection of this utility model.

Claims

1. A PCB board for preventing solder bridging, characterized in that: It includes a core layer (1), an isolation support layer (2), a protective layer (3), a functional layer (4), a character layer (5), and an anti-tin bridging group (6). The core layer (1) is connected to the isolation support layer (2) on both the top and bottom sides. The core layer (1) is used for signal and power transmission, and the isolation support layer (2) is used for the support of the PCB board. The two isolation support layers (2) are connected to a protective layer (3) on the side away from the core layer (1), and the two protective layers (3) are connected to a functional layer (4) on the side away from the isolation support layer (2). The protective layer (3) and the functional layer (4) are used to protect the PCB board. A character layer (5) is compositely connected to the side of the two functional layers (4) away from the protective layer (3). A solder joint (6) is provided on the side of the two character layers (5) away from the functional layer (4). The character layer (5) is used for the identification of the PCB board, and the solder joint (6) is used to prevent solder bridging on the PCB board.

2. The PCB board for preventing solder bridging as described in claim 1, characterized in that: The anti-tin bridging group (6) includes a character solder mask (61) and an anti-tin bridging groove (62), and the character solder mask (61) is compositely connected around the pads of the PCB board.

3. The PCB board for preventing solder bridging as described in claim 2, characterized in that: The PCB board has an anti-soldering groove (62) located inside the character solder resist (61), and the anti-soldering groove (62) surrounds the solder pads of the PCB board.

4. The PCB board for preventing solder bridging as described in claim 1, characterized in that: The core layer (1) includes a signal layer (11), a power layer (12) and a ground layer (13), which are sequentially connected in a composite manner.

5. The PCB board for preventing solder bridging as described in claim 4, characterized in that: The signal layer (11) includes a top layer, a bottom layer and an internal signal layer, and the internal signal layer is connected to the top layer and the bottom layer through vias or blind vias.

6. The PCB board for preventing solder bridging as described in claim 1, characterized in that: The isolation support layer (2) includes an insulating layer (21), a semi-cured sheet layer (22) and a pressure-resistant layer (23), which are sequentially connected in composite.

7. The PCB board for preventing solder bridging as described in claim 1, characterized in that: The protective layer (3) includes a heat dissipation layer (31) and an electromagnetic shielding layer (32), which are compositely connected.

8. The PCB board for preventing solder bridging as described in claim 1, characterized in that: The functional layer (4) includes a protective layer (41) and a green solder resist layer (42), which are compositely connected.

9. The PCB board for preventing solder bridging as described in claim 8, characterized in that: The protective layer (41) includes an anti-corrosion coating and an abrasion-resistant coating.

10. The PCB board for preventing solder bridging as described in claim 6, characterized in that: The compressive layer (23) is composed of a bubble rubber sheet and a carbon fiber mesh, with the bubble rubber sheet covered with carbon fiber mesh on both sides.

Images