Temperature control device for semiconductor production

Abstract

This utility model relates to a temperature control device for semiconductor production, belonging to the technical field of temperature control equipment. It includes an installation box with an infrared temperature sensor inside. A placement box containing coolant is located on one side of the installation box, and a semiconductor cooling rod is located inside the placement box. A vacuum cleaner is mounted on the upper surface of the installation box, and a heat-dissipating cleaning component is connected to the vacuum cleaner. A blower is located on one side of the installation box and below the placement box. A cooling component is located on the inner wall of the installation box, and a control panel is located on the surface of the installation box. This utility model uses the cooling component, the semiconductor cooling rod, and the blower to push air through a threaded tube, extending the time the air stays inside the placement box and improving the cooling efficiency. The blower head delivers cold air into the installation box, effectively reducing the internal temperature. Through the cleaning component and the vacuum cleaner, the cooling fan drives the cleaning brush to rotate and clean dust. The suction power of the vacuum head removes accumulated dust from the heat dissipation holes, preventing blockage and affecting heat dissipation efficiency.

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