A power module heat sink
CN224343598UActive Publication Date: 2026-06-09YANGZHOU LEJUN ELECTRONIC TECH CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- YANGZHOU LEJUN ELECTRONIC TECH CO LTD
- Filing Date
- 2025-05-27
- Publication Date
- 2026-06-09
AI Technical Summary
Technical Problem
Existing liquid cooling modules suffer from heat accumulation under high-power conditions, resulting in poor heat dissipation.
Method used
It adopts a multi-layer S-shaped flow channel structure, combined with an air-cooling module. Heat dissipation channels are set between the S-shaped flow channels, and heat sinks and flow-slowing baffles are inserted in the flow channels to optimize heat transfer.
Benefits of technology
It improves heat dissipation by combining air cooling and water cooling to quickly remove heat and enhance the cooling effect.
✦ Generated by Eureka AI based on patent content.
Smart Images

Figure CN224343598U_ABST
Abstract
The utility model belongs to power module technical field, concretely relates to a power module heat abstractor. It includes the casing, and the casing inside part is at least two layers, and each layer is provided with S type runner in the casing inside, and the adjacent layer S type runner is overlapped up and down, and the head and tail are connected to form the cooling runner, and the cooling runner both ends are formed with the liquid inlet and the liquid outlet on the casing respectively, the heat dissipation channel is set up between S type runner, and the heat dissipation channel is connected with the casing outside, and the air cooling module is set up in the casing bottom surface or top surface, is used for improving the air flow rate in the heat dissipation channel. The utility model is used to solve the problem of the poor heat dissipation effect of power module. The S type runner is set to be separated in the middle, forms the heat dissipation channel, uses the air cooling module to blow to the heat dissipation channel, drives the air flow rate in the heat dissipation channel, avoids the heat dissipation of the close continuous runner to be unable to paste position, and the S type runner is set to be multilayer, and the head and tail are communicated to form a complete cooling runner, so that the heat dissipation effect of the casing is better.
Need to check novelty before this filing date? Find Prior Art