An even heat conduction device and liquid cooling radiator

Abstract

The utility model discloses a kind of uniform heat conduction devices, it is related to the field heat dissipation technical field, the heat of several heat dissipation columns heat conduction fixed on the surface of heat dissipation base plate can be conducted to heat dissipation column, heat dissipation column and heat dissipation base plate simultaneously spread heat to heat dissipation medium;The size of the heat dissipation column of the utility model is not completely equal, along the flow direction of cooling medium, the heat dissipation area of unit area in heat dissipation column gradually increases from inlet end to outlet end, the temperature difference of cooling medium and heat dissipation base plate at inlet end is larger, but heat conduction area is small;The temperature difference of cooling medium and heat dissipation base plate at outlet end is smaller, but heat conduction area is large;Make heat conduction more uniform, keep relatively uniform heat dissipation cooling performance from each position of inlet end to outlet end, guarantee that the electronic components of each position obtain more consistent cooling effect.In an alternative embodiment, the cross section of the heat dissipation column adopts a water droplet shape, which has a smaller flow resistance to the cooling medium and improves the overall heat conduction capacity.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, and more specifically to a uniform heat conduction device. This utility model also relates to a liquid-cooled radiator. Background Technology

[0002] Currently, liquid cooling is the most common method for heat dissipation of IGBT (Insulated Gate Bipolar Transistor) power modules. The main functional component of a liquid cooling heat sink is the heat dissipation substrate, which consists of a heat dissipation base plate and multiple heat dissipation pillars distributed on the heat dissipation base plate. It is usually molded as a single piece.

[0003] Electronic components are soldered to one side of the heat sink using DBC (Direct Bonded Copper) technology (the structure of DBC is as follows). Figure 9 As shown in the diagram, the heat sink column is located on the other side of the heat sink base plate. During the operation of the heat sink, the heat generated by the electronic components is transferred to the heat sink base plate and then to the heat sink column via the DBC. A circulating coolant is injected into the heat sink, contacting the heat sink column and the heat sink base plate, and carrying away the heat from the heat sink base.

[0004] In the existing structure, combined Figure 10 As shown, the heat dissipation columns are evenly and regularly distributed on the heat dissipation base plate, and most of the heat dissipation columns are cylindrical.

[0005] In existing power module heat sink structures, because the coolant flows in one direction, the temperature difference between the coolant and the heat sink substrate is large at the inlet, resulting in a higher heat transfer coefficient and greater heat removal at that location. Conversely, less heat is removed at the outlet. This leads to inconsistent temperatures among the multiple electronic components distributed on the heat sink, with the outlet components being the first to be damaged and fail during use, thus affecting the overall lifespan of the power module.

[0006] For those skilled in the art, how to make heat conduction more uniform is a technical problem that needs to be solved. Utility Model Content

[0007] The core of this invention is to provide a uniform heat conduction device that utilizes the variation in heat dissipation area of ​​the heat dissipation column to make heat conduction more uniform, maintaining relatively uniform heat dissipation and cooling performance at all positions from the inlet end to the outlet end. The specific solution is as follows:

[0008] A uniform heat conduction device includes a heat dissipation base plate and heat dissipation columns, wherein a plurality of heat dissipation columns are thermally fixed to the surface of the heat dissipation base plate, and the heat of the heat dissipation base plate can be conducted to the heat dissipation columns.

[0009] Along the flow direction of the cooling medium, the heat dissipation area of ​​the heat dissipation column per unit area gradually increases from the inlet end to the outlet end.

[0010] Optionally, the cross-section of the heat dissipation column can be one of the following shapes with a smooth transition at the corner: teardrop, circle, trapezoid, triangle, ellipse, rhombus, peanut, or dumbbell.

[0011] Optionally, the heat dissipation columns are staggered along the line connecting the inlet end to the outlet end.

[0012] Optionally, the midlines of the widths of the heat dissipation columns in every other row are collinear;

[0013] The midlines of the lengths of the heat dissipation columns in each row are collinear.

[0014] Optionally, the heat dissipation column has a teardrop-shaped cross-section, with an elliptical arc on the side near the inlet end and an angle formed by two straight lines on the side near the outlet end.

[0015] Optionally, the dimensions of two adjacent rows of heat dissipation columns are equal; the two staggered rows of heat dissipation columns are tangent in the length direction.

[0016] The dimensional relationships of the heat dissipation columns are as follows:

[0017] ;

[0018] ;

[0019] ;

[0020] ;

[0021] ;

[0022] Where, 'a' is the center-to-line distance between the lengths of two adjacent rows of heat dissipation columns of equal size, 'b' is the center-to-line distance between the widths of two staggered heat dissipation columns in two adjacent rows, 'c' is the actual length of the heat dissipation column after chamfering, 'd1' is the width of the heat dissipation column, 'd2' is the length of the heat dissipation column before chamfering, 'D1' is the center-to-line distance between the widths of two adjacent heat dissipation columns in the same row, and 'D2' is the center-to-line distance between the lengths of the heat dissipation columns separated by one row. , , , The parameters are set; The minimum is 2.3mm, and b ≥ 2mm.

[0023] Optionally, the cross-section of the heat dissipation column is a teardrop shape with a smooth transition at the corner, and the two rows of heat dissipation columns distributed in an alternating manner are tangent in the length direction;

[0024] The dimensional relationships of the heat dissipation columns are as follows:

[0025] ;

[0026] ;

[0027] ;

[0028] Where c is the actual length of the heat sink after chamfering, d1 is the width of the heat sink, d2 is the length of the heat sink without chamfering, and D2 is the center-line spacing between a row of heat sinks. , , , The parameters are set; The minimum is 2.3mm, and b ≥ 4mm.

[0029] Optionally, the height of the heat dissipation column is increased from the inlet end to the outlet end.

[0030] This utility model also provides a liquid-cooled radiator, including the uniform heat conduction device described in any of the above claims. The liquid-cooled radiator further includes a heat dissipation shell for sealing assembly with the heat dissipation base plate, and the heat dissipation shell is provided with a coolant inlet and a coolant outlet.

[0031] The core of this invention is to provide a uniform heat conduction device, including a heat dissipation base plate and heat dissipation columns. Several heat dissipation columns are thermally fixed to the surface of the heat dissipation base plate. Heat from the base plate can be conducted to the columns, which then dissipate heat to the heat dissipation medium. The heat dissipation columns are not all of equal size; along the flow direction of the cooling medium, the heat dissipation area per unit area gradually increases from the inlet end to the outlet end. At the inlet end, the temperature difference between the cooling medium and the base plate is larger, but the heat conduction area is smaller; at the outlet end, the temperature difference is smaller, but the heat conduction area is larger. This makes heat conduction more uniform, maintaining relatively uniform heat dissipation and cooling performance from the inlet end to the outlet end, ensuring that electronic components at each location receive a more consistent cooling effect. In an optional embodiment, the cross-section of the heat dissipation column adopts a teardrop shape, which reduces the flow resistance to the cooling medium, increases the fluid flow rate, and improves the overall heat conduction capacity. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1A A front view of the heat dissipation base plate and the teardrop-shaped heat dissipation column in combination;

[0034] Figure 1B A front view of the heat dissipation base plate and the diamond-shaped heat dissipation columns in combination;

[0035] Figure 1C This is a front view of the heat dissipation base plate and the triangular heat dissipation column in combination;

[0036] Figure 1D A front view of the heat dissipation base plate and the trapezoidal heat dissipation column in combination;

[0037] Figure 1E A front view of the heat dissipation base plate and the peanut-shaped heat dissipation columns in combination;

[0038] Figure 1F A front view showing the combination of the heat dissipation base plate and the dumbbell-shaped heat dissipation column;

[0039] Figure 1G A front view of the heat dissipation base plate and the circular heat dissipation column in combination;

[0040] Figure 1H A front view of the heat dissipation base plate and the elliptical heat dissipation column in combination;

[0041] Figure 2 A diagram showing the relative relationships of eight heat dissipation columns surrounding a single heat dissipation column;

[0042] Figure 3 These are diagrams showing six different cross-sectional shapes for heat dissipation columns;

[0043] Figure 4A This is a diagram showing the relative dimensions of the heat dissipation pillars in the first embodiment;

[0044] Figure 4B This is a diagram showing the dimensional relationships of the heat dissipation column in the first embodiment;

[0045] Figure 5A This is a diagram showing the relative dimensions of the heat dissipation pillars in the second embodiment;

[0046] Figure 5B This is a diagram showing the dimensional relationships of the heat dissipation column in the second embodiment;

[0047] Figure 6 This is a schematic diagram of the heat sink casing.

[0048] Figure 7 Here is a flowchart of the genetic algorithm;

[0049] Figure 8 This is a flowchart of the orthogonal experimental design method.

[0050] Figure 9 DBC structure diagram;

[0051] Figure 10 This is a diagram of the existing heat dissipation column layout.

[0052] The image includes:

[0053] Heat dissipation base plate 10, heat dissipation column 20, heat dissipation shell 30, coolant inlet 301, coolant outlet 302. Detailed Implementation

[0054] To enable those skilled in the art to better understand the technical solution of this utility model, the uniform heat conduction device of this utility model will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0055] This invention provides a uniform heat conduction device that can be applied to liquid cooling devices or to heat conduction in other fluid media.

[0056] The uniform heat conduction device of this utility model includes a heat dissipation base plate 10 and a heat dissipation column 20. The heat dissipation base plate 10 and the heat dissipation column 20 are made of a high thermal conductivity material, and the heat dissipation base plate 10 and the heat dissipation column 20 can be made of the same material. The heat dissipation base plate 10 is a flat plate structure, which is used to support the heat dissipation column 20 and keep the heat dissipation column 20 in a set position.

[0057] Combination Figures 1A to 1H As shown, several heat dissipation pillars 20 are thermally fixed to the surface of the heat dissipation base plate 10. The heat dissipation pillars 20 protrude vertically from the surface of the heat dissipation base plate 10, and are spaced apart, creating spaces for the flow of cooling medium. When the cooling medium contacts the heat dissipation pillars 20, the heat from the heat dissipation pillars 20 is conducted into the cooling medium. The heat dissipation base plate 10 absorbs the heat emitted by the heat-generating components, and this heat can be conducted to the heat dissipation pillars 20, and then from the heat dissipation pillars 20 to the cooling medium. The heat dissipation base plate 10 also comes into contact with the cooling medium. Both the heat dissipation base plate 10 and the heat dissipation pillars 20 can dissipate heat into the cooling medium, and both simultaneously conduct heat to the cooling medium. The heat dissipation pillars 20 effectively increase the heat dissipation area of ​​the heat dissipation base plate 10, allowing heat to be conducted to the cooling medium more quickly.

[0058] The cooling medium flows from the inlet to the outlet. During its flow, the cooling medium absorbs heat by passing through each heat dissipation column 20. It should be noted that the flow direction of the cooling medium can be either straight or includes detours. Figures 1A to 1H The arrows indicate the flow direction of the cooling medium, which flows in a straight line from left to right.

[0059] Along the flow direction of the cooling medium, the heat dissipation area of ​​the heat dissipation column 20 per unit area gradually increases from the inlet end to the outlet end. That is, the heat dissipation area of ​​the heat dissipation column 20 near the inlet end is smaller per unit area, while the heat dissipation area of ​​the heat dissipation column 20 near the outlet end is larger per unit area. Figures 1A to 1H The two dashed boxes on the left and right sides of each other are of equal size. Given that the two dashed boxes have equal areas, the total heat dissipation area of ​​the heat dissipation column 20 within the left dashed box is smaller than the total heat dissipation area of ​​the heat dissipation column 20 within the right dashed box. The larger the heat dissipation area, the higher the heat dissipation efficiency.

[0060] The cooling medium enters at a lower temperature at the inlet and continuously absorbs heat during its flow, resulting in a temperature increase as it exits at the outlet. If the heat dissipation area per unit area of ​​the heat dissipation columns is equal at all locations, the temperature difference at the inlet will be larger than that at the outlet, inevitably leading to a greater heat transfer efficiency at the inlet than at the outlet. Consequently, the cooling effect at the inlet will be more significant, while the cooling capacity at the outlet will be less effective.

[0061] The main factors affecting heat conduction are temperature difference, contact area, and thermal conductivity, with thermal conductivity being a constant. This application modifies the heat conduction area of ​​the heat sink 20, resulting in a larger temperature difference and smaller heat dissipation area at the inlet end, and a smaller temperature difference and larger heat dissipation area at the outlet end. This keeps the total heat conduction at the inlet end and the total heat conduction at the outlet end approximately equal. Throughout the entire flow of the cooling medium, the heat conduction at each location remains roughly balanced, ensuring a more consistent cooling effect for the electronic components at each location.

[0062] Based on the above scheme, along the direction of the line connecting the inlet end to the outlet end ( Figures 1A to 1H (Central X-axis), the heat dissipation columns 20 are arranged in an interlaced pattern, combined with Figures 1A to 1H As shown, the cooling medium flows along the X-axis, and the heat dissipation columns 20 are arranged along the Y-axis. Each row contains multiple heat dissipation columns 20. Adjacent rows of heat dissipation columns 20 are not directly opposite each other in the X-axis direction, but are staggered. Two rows of heat dissipation columns 20 with a row in between are directly opposite each other. Figure 1A For example, the first and third rows of heat dissipation columns 20 are aligned one-to-one along the X-axis, and the second and fourth rows of heat dissipation columns 20 are aligned one-to-one along the X-axis. The cooling medium flowing out from the gap between two adjacent heat dissipation columns 20 in the first row along the Y-axis impacts the next row of heat dissipation columns 20 and is blocked by the heat dissipation columns 20, splitting into two flows.

[0063] Combination Figure 2 As shown, in the staggered arrangement of heat dissipation columns 20, except for the edge positions, each heat dissipation column 20 has 8 adjacent heat dissipation columns 20, and the central heat dissipation column 20 (numbered 0) is surrounded by 8 other heat dissipation columns 20 (numbered 1-8).

[0064] The width midlines of every alternate row of heat dissipation columns 20 are collinear; the length midlines of every row of heat dissipation columns 20 are collinear. (Combined) Figures 1A to 1H As shown, the length direction of the heat dissipation column 20 is parallel to the line connecting the inlet end and the outlet end. Dashed line A represents the width midline of the heat dissipation column 20, and dashed line B represents the length midline of the heat dissipation column 20. The width midlines of the odd-numbered rows of heat dissipation columns 20 are collinear, and the width midlines of the even-numbered rows are collinear. The length midlines of all heat dissipation columns 20 within each row are collinear.

[0065] The heat dissipation column 20 in this utility model has a columnar structure, and the cross-section of the heat dissipation column 20 can adopt different structural designs. Combined with... Figure 3 As shown, the cross-section of the heat dissipation column 20 is one of the following shapes: teardrop, circle, trapezoid, triangle, ellipse, rhombus, peanut, or dumbbell, with a smooth transition at the corner. The outer surface is smooth, and the corner is rounded.

[0066] Figure 1A The structure of the teardrop-shaped heat dissipation column was demonstrated. Figure 1B The structure of the diamond-shaped heat dissipation column is shown; Figure 1C The structure of the triangular heat dissipation column is shown; Figure 1D The structure of the trapezoidal heat dissipation column was shown; Figure 1E The structure of the peanut-shaped heat dissipation column is shown. The peanut shape has two concave parts in the middle and elliptical expansion at both ends. Figure 1F The structure of the dumbbell-shaped heat sink is shown. The dumbbell shape has a concave section in the middle and rhomboid expansion at both ends. Figure 1G The structure of the circular heat dissipation column was shown; Figure 1H The structure of an elliptical heat dissipation column is shown. Regardless of the shape of the heat dissipation column, its size changes from the inlet end to the outlet end, increasing the heat dissipation area per unit area.

[0067] The heat dissipation column 20 of this utility model has a teardrop-shaped cross-section. The teardrop shape helps to reduce the resistance to the cooling medium. Compared with the cylindrical shape, it allows the cooling medium to flow more smoothly. The reduced resistance helps to increase the flow speed of the cooling medium, allowing more cooling medium to flow per unit time, which helps to increase the overall heat dissipation per unit time.

[0068] Combination Figure 4A and Figure 5A As shown, the teardrop shape of this utility model is an elliptical arc on the side near the inlet end and an angle formed by two straight lines on the side near the outlet end. The angle is a rounded corner with a smooth transition. The transition between the elliptical arc and the straight lines is also rounded.

[0069] This utility model provides two specific size designs for the heat dissipation column 20:

[0070] 1) The dimensions of two adjacent rows of heat dissipation columns 20 are equal. For example, the dimensions of the first and second rows of heat dissipation columns 20 are equal, and the dimensions of the third and fourth rows of heat dissipation columns 20 are equal. This includes both the equal external dimensions of the heat dissipation columns 20 themselves and the equal spacing between adjacent heat dissipation columns 20.

[0071] Two rows of staggered heat dissipation columns 20 are tangent in the length direction, combined with Figure 4A , Figure 4B As shown, the rounded corner at the right end of the first row of heat dissipation columns 20 is tangent to the elliptical arc at the left end of the second row of heat dissipation columns 20.

[0072] The dimensional relationships of the heat sink 20 satisfy the following conditions:

[0073] ;

[0074] ;

[0075] ;

[0076] ;

[0077] ;

[0078] Where, a is the center-line spacing of the lengths of two adjacent rows of heat dissipation columns 20 of equal size, b is the center-line spacing of the widths of two staggered heat dissipation columns 20 in two adjacent rows, c is the actual length of the heat dissipation column 20 after chamfering, d1 is the width of the heat dissipation column 20, d2 is the length of the heat dissipation column 20 before chamfering, D1 is the center-line spacing of the widths of two adjacent heat dissipation columns 20 in the same row, and D2 is the center-line spacing of the lengths of one row of heat dissipation columns 20. , , , Theoretically, the smaller the size of the heat dissipation columns, the denser their arrangement, and the larger the heat dissipation area, the better the heat dissipation effect. However, to ensure the product's manufacturability, The minimum is 2.3mm, and b ≥ 2mm.

[0079] Combination Figure 4A , Figure 4B As shown, the solid line on the left and the dashed line on the right of the teardrop-shaped heat sink 20 together form an ellipse. The intersection of the two straight lines on the right side of the heat sink 20 is located on the right dashed ellipse. The solid line part is the solid part of the heat sink 20, and the dashed line part is not a solid part.

[0080] 2) The cross-section of the heat dissipation column 20 is a teardrop shape with a smooth transition at the corner, and the two rows of heat dissipation columns 20 are tangent in the length direction. In this embodiment, the dimensions of each heat dissipation column 20 in a row are equal, while the dimensions of the heat dissipation columns 20 in other rows are not equal.

[0081] Combination Figure 5A , Figure 5B As shown, the dimensional relationships of the heat dissipation pillars 20 satisfy the following conditions:

[0082] ;

[0083] ;

[0084] ;

[0085] Where c is the actual length of heat sink 20 after chamfering, d1 is the width of heat sink 20, d2 is the length of heat sink 20 before chamfering, and D2 is the center-line spacing of a row of heat sink 20. , , , Theoretically, the smaller the size of the heat dissipation columns, the denser their arrangement, and the larger the heat dissipation area, the better the heat dissipation effect. However, to ensure the product's manufacturability, The minimum is 2.3mm, and b ≥ 4mm.

[0086] Combination Figure 5A , Figure 5B As shown, the solid line on the left and the dashed line on the right of the teardrop-shaped heat sink 20 together form an ellipse. The intersection of the two straight lines on the right side of the heat sink 20 is located on the right dashed ellipse. The solid line part is the solid part of the heat sink 20, and the dashed line part is not a solid part.

[0087] Based on any of the above technical solutions and their combinations, the height of the heat dissipation column 20 of this utility model is increased from the inlet end to the outlet end. That is, the height of the heat dissipation column 20 can be distributed with varying heights throughout, or only a portion, such as the middle area, can be distributed with varying heights. The heights of the heat dissipation columns 20 near the inlet end are equal, and the heights of the heat dissipation columns 20 near the outlet end are equal.

[0088] The shape, size, and density of the heat dissipation columns directly affect the heat dissipation area and the flow rate of the cooling medium. These factors determine the amount of heat the radiator can remove per unit time. The shape, size, and spacing of the heat dissipation columns can be optimized using algorithms to achieve a reasonable design that increases the contact area between the columns and the coolant while reducing coolant resistance and increasing coolant flow. Furthermore, by adjusting the shape, size, and spacing of the heat dissipation columns based on the temperature differences of the coolant at different locations during radiator operation, the local convective heat transfer coefficient can be altered, resulting in a globally uniform heat dissipation across the entire radiator. Optimization algorithms used include, but are not limited to, genetic algorithms. Figure 7 (The flowchart shown), full factorial experimental design, orthogonal experimental method ( Figure 8(The process shown) and Latin hypercube design, etc.

[0089] When using a genetic algorithm, the process proceeds sequentially as follows: initializing the population, evaluating fitness, selecting individuals with higher fitness as the next generation parent, generating new individuals through poor mutation, generating the next generation population, determining whether a set threshold has been reached or whether convergence has occurred. If so, the optimal solution is output; otherwise, the process returns to the fitness evaluation process.

[0090] When using the orthogonal experimental method, the experimental objective is determined, experimental indicators are selected, factors and levels are selected, experimental methods are determined, experimental calculations are performed, experimental results are analyzed, and the optimal solution is output.

[0091] Orthogonal experimental design is an efficient method for designing multi-factor, multi-level experiments. The 3-factor, 3-level method lists the possible factors and levels in stages, as shown in Table 1.

[0092] Table 1 orthogonal experiment level factors

[0093] factor Level 1 Level 2 Level 3 k 0.05 0.08 0.1 Δd 0.01 0.02 0.03 <![CDATA[D10]]> 4 5 6

[0094] Based on the optimal size and spacing output by the optimization algorithm, the heat dissipation columns are redesigned to obtain teardrop-shaped heat dissipation column structures with different sizes and spacings. This structure can effectively control the convective heat transfer coefficient at different locations, thereby improving heat dissipation performance and making the operating temperature of electronic components on the heat sink surface more uniform.

[0095] This utility model also provides a liquid-cooled radiator, including the aforementioned uniform heat conduction device. The liquid-cooled radiator further includes a heat dissipation housing 30 for sealing assembly with the heat dissipation base plate 10, combined with… Figure 6 As shown, the heat dissipation base plate 10 is mounted on the upper surface of the heat dissipation housing 30, and is part of the upper surface of the heat dissipation housing 30.

[0096] The heat sink housing 30 is provided with a coolant inlet 301 and a coolant outlet 302. The cooling medium flows into the inner cavity of the heat sink housing 30 from the coolant inlet 301, exchanges heat, and then exits from the coolant outlet 302. This liquid-cooled radiator can achieve the technical effects described above.

[0097] To address the issue of uneven heat dissipation during radiator operation, this invention, based on the fundamental principle of convection heat transfer, modifies the shape of the heat dissipation columns while considering the temperature difference between the heat dissipation surface and the coolant under actual operating conditions. By employing an optimization algorithm, the size and distribution spacing of the heat dissipation columns are rationally designed. This improves heat dissipation performance while ensuring that the heat carried away by the coolant at different locations is more uniform, thereby enhancing the heat dissipation performance and service life of the radiator.

[0098] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A uniform heat conduction device, characterized in that, It includes a heat dissipation base plate (10) and heat dissipation columns (20). A plurality of the heat dissipation columns (20) are thermally fixed to the surface of the heat dissipation base plate (10). The heat of the heat dissipation base plate (10) can be conducted to the heat dissipation columns (20). The heat dissipation base plate (10) and the heat dissipation columns (20) simultaneously conduct heat to the cooling medium. Along the flow direction of the cooling medium, the heat dissipation area of ​​the heat dissipation column (20) per unit area gradually increases from the inlet end to the outlet end.

2. The uniform heat conduction device according to claim 1, characterized in that, The cross-section of the heat dissipation column (20) is one of the following shapes with a smooth transition at the corner: teardrop, circle, trapezoid, triangle, ellipse, rhombus, peanut, or dumbbell.

3. The uniform heat conduction device according to claim 2, characterized in that, Along the line connecting the inlet end to the outlet end, the heat dissipation columns (20) are distributed in an alternating pattern.

4. The uniform heat conduction device according to claim 3, characterized in that, The width midlines of the heat dissipation columns (20) in each row are collinear; The midlines of the lengths of each row of heat dissipation columns (20) are collinear.

5. The uniform heat conduction device according to claim 2, characterized in that, The heat dissipation column (20) has a teardrop-shaped cross-section, with an elliptical arc on the side near the inlet end and an angle formed by two straight lines on the side near the outlet end.

6. The uniform heat conduction device according to claim 5, characterized in that, The dimensions of two adjacent rows of heat dissipation columns (20) are equal; the two staggered rows of heat dissipation columns (20) are tangent in the length direction; The dimensional relationship of the heat dissipation column (20) is as follows: ； ； ； ； ； Where, a is the center-to-line distance between the lengths of two adjacent rows of heat dissipation columns (20) of equal size, b is the center-to-line distance between the widths of two staggered heat dissipation columns (20) in two adjacent rows, c is the actual length of the heat dissipation column (20) after chamfering, d1 is the width of the heat dissipation column (20), d2 is the length of the heat dissipation column (20) before chamfering, D1 is the center-to-line distance between the widths of two adjacent heat dissipation columns (20) in the same row, and D2 is the center-to-line distance between the lengths of one row of heat dissipation columns (20). , , , The parameters are set; The minimum is 2.3mm, and b ≥ 2mm.

7. The uniform heat conduction device according to claim 5, characterized in that, The cross-section of the heat dissipation column (20) is a teardrop shape with a smooth transition at the corner, and the two rows of heat dissipation columns (20) are tangent to each other in the length direction. The dimensional relationship of the heat dissipation column (20) is as follows: ； ； ； Where c is the actual length of the heat dissipation column (20) after chamfering, d1 is the width of the heat dissipation column (20), d2 is the length of the heat dissipation column (20) before chamfering, and D2 is the center-line spacing between rows of heat dissipation columns (20). , , , The parameters are set; The minimum is 2.3mm, and b ≥ 4mm.

8. The uniform heat conduction device according to any one of claims 1 to 7, characterized in that, The height of the heat dissipation column (20) is increased from the inlet end to the outlet end.

9. A liquid-cooled radiator, characterized in that, The liquid-cooled radiator includes the uniform heat conduction device according to any one of claims 1 to 8, and further includes a heat dissipation housing (30) for sealing assembly with the heat dissipation base plate (10), wherein the heat dissipation housing (30) is provided with a coolant inlet (301) and a coolant outlet (302).

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