An optical film assembly packaging apparatus

Abstract

The utility model relates to display equipment technical field, especially optical film subassembly packaging equipment, including base and pressure device, LED lamp board is embedded in the base, pressure device is set in the side close to LED lamp board relative to the base, optical film subassembly sets up between pressure device and base, and pressure device is used for pressing optical film subassembly and is attached to LED lamp board, the heating device is set up in the base corresponding LED lamp board, and the base bears LED lamp board, and the heating device is set up in the base, can heat LED lamp board, and pressure device exerts pressure on the optical film subassembly on LED lamp board, and the heat that transmits on LED lamp board helps the optical film subassembly to better adhere to LED lamp board, makes the process of adhering fast and convenient.

Description

[Technical Field]

[0001] This utility model relates to the field of display device technology, and in particular to an optical film component packaging device. [Background Technology]

[0002] The light emitted by LED chips typically has a high degree of brightness concentration, which can easily lead to light spots or uneven brightness. By adding an optical film component to the outer layer of the LED chip, the brightness difference between pixels can be effectively reduced, thus improving the display quality.

[0003] With the development of LED display technology, the requirements for light uniformity and diffusion are becoming increasingly stringent. The application of optical film components with light uniformity and brightness enhancement properties is becoming more widespread. However, in the existing optical film component packaging process, it is necessary to accurately align the optical film component with the LED chip in the early stage of packaging to ensure that the optical film component is accurately attached to the LED chip. Moreover, the packaging process is complex, and a long time is required for curing after packaging. Therefore, the packaging process of optical film components needs to be further improved. [Utility Model Content]

[0004] To address the problems of complex and low-tolerance packaging processes in existing optical film assembly processes, this invention provides an optical film assembly packaging device.

[0005] The present invention provides an optical film component encapsulation device for encapsulating the optical film component onto an LED light panel. The optical film component encapsulation device includes a base and a pressing device. The LED light panel is embedded in the base, and the pressing device is disposed on a side of the base near the LED light panel. The optical film component is disposed between the pressing device and the base, and the pressing device is used to press and attach the optical film component onto the LED light panel. A heating device is disposed inside the base corresponding to the LED light panel.

[0006] Preferably, the optical film assembly packaging equipment further includes a feeding device disposed on the same side as the pressurizing device, from which the optical film assembly is fed.

[0007] Preferably, the base has a clearance groove corresponding to the LED light panel, and the LED light panel is placed in the clearance groove.

[0008] Preferably, the heating device includes a heating component and a temperature controller that is signal-connected to the heating component, and the heating component is disposed near the bottom wall of the vented groove.

[0009] Preferably, the LED light board includes a substrate and LED chips electrically connected to the substrate, and the depth of the clearance groove is equal to or less than the height of the substrate.

[0010] Preferably, the optical film assembly includes a composite film layer and a carrier film, the composite film layer is arranged in an array on the carrier film, and when the optical film assembly is fed from the feeding device, the composite film layer is aligned with the LED chip.

[0011] Preferably, a first alignment mark is provided on the carrier film, and a second alignment mark is provided on the LED light board. The first alignment mark and the second alignment mark are aligned with the composite film layer and the LED chip through mechanical alignment and / or optical alignment.

[0012] Preferably, the optical film assembly packaging equipment further includes a driving device, which includes a first driving component signal-connected to the base and a second driving component signal-connected to the feeding device. The first driving component drives the base to move in a horizontal direction, and the second driving component drives the feeding device to feed the roll material in a circular motion.

[0013] Preferably, the first drive assembly drives the base to move along the side opposite to the feeding device.

[0014] Preferably, the driving device further includes a third driving component, which drives the pressurizing device to move in the vertical direction.

[0015] Compared with the prior art, the optical film assembly packaging equipment provided by this utility model has the following advantages:

[0016] 1. The optical film component encapsulation equipment provided in this embodiment of the utility model uses a pressurizing device for pressurization. In conjunction with a heating device set on the base corresponding to the LED light board, the optical film component can be hot-pressed and encapsulated. The pressurizing device is set on the side of the base closer to the LED light board. The pressurizing device applies pressure to the optical film component, promoting the one-time corresponding bonding of the optical film component. The encapsulation process of pressurization combined with heat bonding is simple and easy to operate. The heating device helps the optical film component to be accurately and firmly bonded to the LED light board. At the same time, since the heating device is set inside the base and does not directly contact the optical film component, the optical film component can be cured more quickly after bonding.

[0017] 2. The optical film component packaging equipment provided in this embodiment of the present invention has the feeding device and the pressurizing device set on the same side, which makes the entire process of optical film component from feeding to pressurizing and packaging smoother, reduces the difficulty of operation, and makes the feeding process faster and more efficient in providing new optical film components for the packaging process.

[0018] 3. In the optical film component packaging device provided in this embodiment of the utility model, the LED light board is embedded in the base, and the base has a clearance groove corresponding to the LED light board. The LED light board is placed in the clearance groove, which provides a precise placement position for the LED light board, ensuring that the LED light board can be stably embedded in the base and avoiding displacement or falling off during the packaging process. The clearance groove also helps the heating device to dissipate heat to a certain extent, optimizes the light propagation path, reduces light scattering and loss, thereby improving lighting efficiency and lighting quality.

[0019] 4. In the optical film component packaging equipment provided in this embodiment of the present invention, the heating component is the core part of the heating device, which is responsible for converting electrical energy or other forms of energy into heat energy. The temperature controller is used to monitor and regulate the temperature of the heating device to ensure that the heating component operates within a safe and effective range. The heating component is set below the cavity, so that the heat is more directly conducted to the LED light board.

[0020] 5. In the optical film assembly packaging device provided in this embodiment of the present invention, the depth of the clearance groove is equal to or less than the height of the substrate, the substrate of the LED light board and the surface of the base are on the same horizontal line or the substrate of the LED light board is slightly higher than the surface of the base, and the LED chip protrudes from the surface of the base. This helps to ensure that the light is emitted uniformly from the LED chip, and avoids the uneven light phenomenon caused by the gap between the LED light board and the clearance groove, and makes it easier for the optical film assembly to be directly attached to the substrate of the LED light board.

[0021] 6. The optical film assembly packaging device provided in this embodiment of the present invention includes a composite film layer and a carrier film. The composite film layer is pre-cut and arranged in an array on the carrier film. The carrier film is attached to the LED light board in one go. After the carrier film is attached to the LED light board, the composite film layer is precisely attached to and covers the LED chip based on the alignment with the LED chip, so as to achieve a more uniform light distribution. The composite film layer is arranged in an array on the carrier film. The composite film layer can be partially attached and can be arranged in any order based on the alignment with the LED chip.

[0022] 7. In the packaging equipment for optical film components provided in this embodiment of the present invention, during the packaging process, the composite film layer needs to be precisely aligned with the LED chip on the LED light board in order to achieve the expected lighting or display effect. Mechanical alignment or optical alignment, or a combination of both, can be used. Mechanical alignment relies on mechanical structure and positioning device, while optical alignment utilizes image recognition and processing technology to achieve accurate identification and positioning of alignment points. By using both mechanical alignment and optical alignment, the advantages of both can be fully utilized to achieve higher alignment accuracy and stability.

[0023] 8. The optical film component packaging equipment provided in this embodiment of the present invention can be driven by a drive device that can select a variety of different power supply methods such as manual, electric or stepper according to different application scenarios and needs. The first drive component is connected to the base by signal and drives the base to move in the horizontal direction. The second drive component is connected to the feeding device by signal and drives the feeding device to feed the roll material in a circular motion, realizing a motion mode of one end of the roll and the other end of the pull.

[0024] 9. In the optical film assembly packaging equipment provided in this utility model embodiment, the feeding device can feed material in a circular motion at a fixed position, or it can feed material horizontally along the base. However, regardless of whether the feeding device is stationary, the base is driven by the first driving component to move along a position away from the feeding device, and the optical film assembly can be evenly and continuously distributed on the LED light board.

[0025] 10. In the optical film component packaging equipment provided in this utility model embodiment, the third driving component drives the pressurizing device to move up and down in the vertical direction. When the pressurizing device is working, it can maintain a constant or reasonably dynamically adjustable distance from the base. When it is not working, it can be lifted away from the already packaged LED light board to avoid physical damage. [Attached Image Description]

[0026] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of the assembly of the optical film component packaging device, the optical film component, and the LED light board provided in the first embodiment of this utility model.

[0028] Figure 2 This is a three-dimensional schematic diagram of the optical film assembly provided in the first embodiment of this utility model.

[0029] Figure 3 This is a side view of the optical film assembly and LED light panel after assembly according to the first embodiment of this utility model.

[0030] Figure 4 This is a top view of the optical film assembly and LED light panel provided in the first embodiment of this utility model after assembly.

[0031] Figure 5 This is a block diagram of the optical film assembly packaging device provided in the first embodiment of this utility model.

[0032] Figure 6 This is a block diagram of the driving device of the optical film assembly packaging equipment provided in the first embodiment of this utility model.

[0033] Figure 7 This is a block diagram of the heating device of the optical film component packaging equipment provided in the first embodiment of this utility model.

[0034] Explanation of reference numerals in the attached diagram:

[0035] 100. Optical film module packaging equipment; 200. Optical film module; 201. Composite film layer; 202. Carrier film; 203. First alignment mark; 300. LED light board; 301. Substrate; 302. LED chip; 303. Second alignment mark

[0036] 1. Base; 2. Pressurizing device; 3. Heating device; 4. Discharging device; 5. Driving device;

[0037] 11. Void-avoiding slot; 31. Heating component; 32. Temperature controller; 51. First drive component; 52. Second drive component; 53. Third drive component.

Detailed Implementation Methods

[0038] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the scope of the present utility model.

[0039] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0040] In this invention, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this invention and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0041] Furthermore, in addition to indicating direction or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this utility model according to the specific circumstances.

[0042] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this utility model based on the specific circumstances.

[0043] Please see Figure 1 The first embodiment of this utility model provides an optical film component encapsulation device 100 for encapsulating an optical film component 200 onto an LED light panel 300. The optical film component encapsulation device 100 includes a base 1 and a pressing device 2. The LED light panel 300 is embedded in the base 1, and the pressing device 2 is disposed on the side of the base 1 near the LED light panel 300. The optical film component 200 is disposed between the pressing device 2 and the base 1, and the pressing device 2 is used to press and attach the optical film component 200 onto the LED light panel 300. A heating device 3 is disposed in the base 1 corresponding to the LED light panel 300.

[0044] Understandably, the base 1 is equipped with a heating device 3, which can heat the LED light panel 300. The pressurizing device 2 applies pressure to the optical film assembly 200 on the LED light panel 300. Combined with the heat transferred on the LED light panel 300, the optical film assembly 200 is better attached to the LED light panel 300. This can realize the hot-press encapsulation of the optical film assembly 200, making the bonding process fast and convenient.

[0045] Specifically, the pressurizing device 2 is positioned on the side of the base 1 near the LED light panel 300. The pressurizing device 2 applies pressure to the optical film assembly 200 to promote the one-time bonding of the optical film assembly 200. The encapsulation process of pressurizing and heat bonding is simple and easy to operate.

[0046] The heating device 3 is positioned corresponding to the LED light panel 300, transferring heat to the LED light panel 300. After the pressure device 2 applies pressure to the optical film assembly 200, the heat is transferred to the optical film assembly 200 through the LED light panel 300. The heating device 3 helps the optical film assembly 200 to adhere precisely and firmly to the LED light panel 300. At the same time, since the heating device 3 is located inside the base 1 and does not directly contact the optical film assembly 200, the optical film assembly 200 can be cured more quickly after it is adhered to the LED light panel 300.

[0047] In one non-limiting embodiment, the pressurizing device 2 includes a pressurizing roller that provides uniform pressure by rolling, distributing the pressure evenly across the entire contact surface. The pressurizing roller is made of rubber with good elasticity and shock absorption properties, which reduces air bubbles and gaps generated when the optical film assembly 200 is bonded to the LED light panel 300, thereby improving the bonding quality.

[0048] Further, please refer to Figure 1 and Figure 5 The optical film assembly packaging equipment 100 also includes a feeding device 4 disposed on the same side as the pressurizing device 2, from which the optical film assembly 200 is fed.

[0049] Understandably, the feeding device 4 and the pressurizing device 2 are set on the same side, which helps the optical film assembly 200 to go through the entire process from feeding to pressurizing and sealing smoothly and efficiently, and reduces the difficulty of operation.

[0050] Specifically, the feeding device 4 can be a roll feeding device 4, or a feeding device 4 that uses a mechanical structure and control system.

[0051] In one non-limiting embodiment, the present invention employs a roll unwinding device 4, which realizes the unwinding and storage of the roll material by rotating the roll shaft.

[0052] Furthermore, the roll unloading device 4 is equipped with a rotatable roller for supporting and winding the optical film assembly 200 roll, and is also equipped with a guiding mechanism to ensure that the roll is unwound smoothly and to prevent the optical film assembly 200 from deviating or wrinkling.

[0053] Understandably, the optical film assembly 200 is fed from the unloading device 4. The unloading device automatically releases the roll material, achieving continuous unloading, precisely controlling the unloading length and tension, reducing losses, and saving costs. The unloading device 4 can accommodate roll materials of different widths, thicknesses, and materials.

[0054] Furthermore, a clearance groove 11 is provided on the base 1 corresponding to the LED light panel 300, and the LED light panel 300 is placed in the clearance groove 11.

[0055] Specifically, the LED light panel 300 is embedded in the base 1, and the LED light panel 300 is embedded and fixed by setting a clearance groove 11 on the base 1.

[0056] Understandably, the clearance groove 11 can provide space for the LED light panel 300 to be embedded. The shape and size of the clearance groove 11 match the shape and size of the LED light panel 300, thereby improving the structural stability of the entire device and effectively preventing the LED light panel 300 from loosening or falling off due to vibration or external force during the movement of the base 1.

[0057] Optionally, the LED light board 300 can be magnetically fixed to the clearance groove 11, or the LED light board 300 can be fixed to the base 1 with screws, or the LED light board 300 can be fixed to the base 1 with hot melt adhesive. This utility model does not specifically limit the fixing method between the LED light board 300 and the base 1.

[0058] Further, please refer to Figure 7 The heating device 3 includes a heating component 31 and a temperature controller 32 that is signal-connected to the heating component 31. The heating component 31 is located near the bottom wall of the vented groove 11.

[0059] Understandably, the heating component 31 is responsible for converting electrical energy or other forms of energy into heat energy. The temperature controller 32 monitors and regulates the temperature of the heating device 3 to ensure that the heating component 31 operates within a safe and effective range. The heating component 31 is located below the bottom wall of the recessed groove 11, so that the heat is more directly conducted to the LED light panel 300.

[0060] Specifically, the temperature controller 32 has a built-in temperature sensor that measures the temperature of the heated LED panel 300 in real time. When the actual temperature deviates from the set value, the temperature controller 32 will output a control signal to drive the heating component 31 to perform corresponding actions, so that the temperature returns to the set value and the temperature remains stable.

[0061] In one non-limiting embodiment, the heating component 31 can be a heating component such as a resistance wire or a heating tube, which uses electrical energy to convert into heat energy to provide uniform heat to the LED light panel 300, helping the optical film assembly 200 to adhere more quickly.

[0062] Further, please refer to Figure 3 The LED light board 300 includes a substrate 301 and LED chips 302 electrically connected to the substrate 301, and the depth h of the clearance groove 11 (e.g., Figure 3 The height h in the figure is equal to or less than the height H of the substrate 301 (e.g., h). Figure 3 (H in the text).

[0063] Understandably, the depth h of the clearance slot 11 (e.g.) Figure 3 The height h in the figure is equal to or less than the height H of the substrate 301 (e.g., h). Figure 3 In the case of H), the substrate 301 of the LED light board 300 is on the same horizontal line as the surface of the base 1, or the substrate 301 of the LED light board 300 is slightly higher than the surface of the base 1, and the LED chip 302 protrudes from the surface of the base 1, which helps to ensure that light is emitted uniformly from the LED chip 302.

[0064] Specifically, a gap is formed between the sidewall of the LED light panel 300 and the sidewall of the clearance groove 11.

[0065] The height of the substrate 301 of the LED light panel 300 is greater than the depth of the clearance groove 11, which avoids uneven light caused by the gap between the LED light panel 300 and the clearance groove 11, and makes it easier for the optical film assembly 200 to be directly attached to the substrate 301 of the LED light panel 300.

[0066] To some extent, the gap can help dissipate heat from the sidewalls of the LED light board 300, preventing it from overheating and causing damage.

[0067] In one non-limiting embodiment, the depth of the recess 11 is less than the height of the substrate 301 of the LED light board 300, so as to prevent the light emitted by the LED chip 302 from being blocked by the base 1.

[0068] Optionally, the base 1 can be made of transparent or semi-transparent materials such as plastic or glass, so that some light can pass through the base 1 and the light is reduced.

[0069] A reflective structure can also be added in the gap between the LED light panel 300 and the clearance groove 11 to reflect light that may be blocked by the base 1 to other directions, thereby improving the utilization rate of light.

[0070] Furthermore, the optical film assembly 200 includes a composite film layer 201 and a carrier film 202. The composite film layer 201 is arranged in an array on the carrier film 202. When the optical film assembly 200 is fed from the feeding device 4, the composite film layer 201 and the LED chip 302 are aligned.

[0071] Understandably, the optical film assembly 200 includes a composite film layer 201 and a carrier film 202. The composite film layer 201 is pre-cut and arranged in an array on the carrier film 202. The carrier film 202 is attached to the LED light panel 300 in one go. After the carrier film 202 is attached to the LED light panel 300, the composite film layer 201 is precisely bonded to and covers the LED chip 302 based on its alignment, achieving a more uniform light distribution. The composite film layer 201 is arranged in an array on the carrier film 202, and the composite film layer 201 can be partially bonded and can be arranged in any order based on its alignment with the LED chip 302.

[0072] Specifically, the carrier film 202 has a load-bearing function. The carrier film 202 can separate or fix different substances in a specific position. In this utility model, the carrier film 202 can be separated after the composite film layer 201 and the LED chip 302 are aligned and bonded, or it can remain aligned and not separated.

[0073] Specifically, the composite film layer 201 is made of a light-diffusing film and an adhesive layer pressed together. The light-diffusing film makes the light evenly distributed and avoids the light from being too concentrated or producing light spots. The adhesive layer is used for bonding or encapsulation to ensure a tight bond between the composite film layer 201 and the LED chip 302.

[0074] Furthermore, when the optical film assembly 200 is fed from the feeding device 4 to the point where the composite film layer 201 is aligned with the LED chip 302, the pressing device 2 applies pressure to press and attach the composite film layer 201 onto the LED light board 300. The heat from the heating component 31 is transferred to the composite film layer 201 through the LED light board 300, and the composite film layer 201 is hot-pressed and encapsulated onto the LED light board 300.

[0075] Specifically, the packaging process of the optical film assembly packaging equipment 100 provided by this utility model is as follows: After receiving the feeding signal, the feeding device 4 starts feeding. After each composite film layer 201 on the carrier film 202 is aligned with the LED chip 302, the pressurizing device 2 presses the entire optical film assembly 200, pressing the composite film layer 201 onto the LED light board 300. During the bonding process, the composite film layer 201 covers the LED chip 302. The entire optical film assembly 200 is attached to the LED light board 300. The heat from the heating component 31 is transferred to the composite film layer 201 through the LED light board 300. After being heated, the composite film layer 201 can adhere more closely to the LED light board 300 according to its own hot melt adhesive characteristics, and is packaged onto the LED light board 300. The composite film layer 201 completely covers the LED chip 302. The heat transfer is intermittent, and the composite film layer 201 is not directly heated.

[0076] Further, please refer to Figure 2 and Figure 4 The carrier film 202 is provided with a first alignment mark 203, and the LED light board 300 is provided with a second alignment mark 303. The first alignment mark 203 and the second alignment mark 303 are aligned by mechanical alignment and / or optical alignment to achieve the alignment of the composite film layer 201 and the LED chip 302.

[0077] Understandably, during the encapsulation process, the composite film layer 201 needs to precisely correspond with the LED chip 302 on the LED light board 300. Mechanical alignment or optical alignment, or a combination of both, can be used. Mechanical alignment relies on mechanical structures and positioning devices, while optical alignment utilizes image recognition and processing technology to achieve accurate identification and positioning of alignment points. By employing both mechanical and optical alignment, the advantages of both can be fully utilized to achieve higher alignment accuracy and stability.

[0078] Specifically, when the first alignment mark 203 and the second alignment mark 303 are mechanically aligned, mechanical structures such as guide rails, positioning pins, and limiting blocks set at the alignment marks are used to align the carrier film 202 and the LED light panel 300; when optically aligned, the alignment marks of the carrier film 202 and the LED light panel 300 are detected by the reflection or transmission of a light beam, thereby achieving alignment.

[0079] It should be noted that, as Figure 2 and Figure 4 The first alignment mark 203 and the second alignment mark 303 shown are for illustrative purposes only and differ from the first alignment mark 203 and the second alignment mark 303 in the actual manufacturing process, but they all serve the same purpose of aligning the composite film layer 201 with the LED chip 302.

[0080] As a non-limiting embodiment, the composite film layer 201 and the LED chip 302 can also be aligned magnetically. Magnetic materials are provided on the carrier film 202 and the LED light board 300, and alignment is achieved through the action of magnetic force, so that they are precisely aligned.

[0081] Furthermore, please refer to Figure 6 The optical film component packaging equipment 100 also includes a driving device 5. The driving device 5 includes a first driving component 51 that is signal-connected to the base 1 and a second driving component 52 that is signal-connected to the feeding device 4. The first driving component 51 drives the base 1 to move in the horizontal direction, and the second driving component 52 drives the feeding device 4 to feed the roll material in a circular motion.

[0082] Understandably, the drive device 5 can select from various power supply methods such as manual, electric or stepper motor according to different application scenarios and needs. The first drive component 51 is signal-connected to the base 1 and drives the base 1 to move in the horizontal direction. The second drive component 52 is signal-connected to the feeding device 4 and drives the feeding device 4 to feed the roll material in a circular motion, realizing a motion mode of one end of the roll and the other end of the pull.

[0083] Furthermore, in the optical film component packaging device 100 provided by this utility model, the first driving component 51 drives the base 1 to move along the side away from the feeding device 4.

[0084] Optionally, the roll material device can move horizontally along the base 1, or be fixedly connected to other components in the optical film assembly encapsulation equipment 100 and remain stationary.

[0085] Specifically, the feeding device 4 can feed material in a circular motion at a fixed position, or it can feed material horizontally along the base 1. However, regardless of whether the feeding device 4 is stationary, the base 1 is driven by the first driving component 51 to move along a position away from the feeding device 4, and the optical film component 200 can be evenly and continuously distributed on the LED light panel 300.

[0086] Furthermore, the drive device 5 also includes a third drive component 53, which drives the pressurizing device 2 to move in the vertical direction.

[0087] Understandably, the third drive component 53 drives the pressurizing device 2 to move up and down in the vertical direction. When working, the pressurizing device 2 can maintain a constant or reasonably dynamically adjustable distance from the base 1. When not working, it can be lifted away from the encapsulated LED light board 300 to avoid physical damage to the LED light board 300.

[0088] Compared with the prior art, the optical film assembly packaging equipment provided by this utility model has the following advantages:

[0089] 1. The optical film component encapsulation equipment provided in this embodiment of the utility model uses a pressurizing device for pressurization. In conjunction with a heating device set on the base corresponding to the LED light board, the optical film component can be heat-pressurized encapsulation. The pressurizing device is set on the side of the base closer to the LED light board. The pressurizing device applies pressure to the optical film component, promoting the one-time corresponding bonding of the optical film component. The encapsulation process of pressurization combined with heat bonding is simple and easy to operate. The heating device helps the optical film component to be accurately and firmly bonded to the LED light board. At the same time, since the heating device is set inside the base and does not directly contact the optical film component, the optical film component can be cured more quickly after bonding.

[0090] 2. The optical film component packaging equipment provided in this embodiment of the present invention has the feeding device and the pressurizing device set on the same side, which makes the entire process of optical film component from feeding to pressurizing and packaging smoother, reduces the difficulty of operation, and makes the feeding process faster and more efficient in providing new optical film components for the packaging process.

[0091] 3. In the optical film component packaging device provided in this embodiment of the utility model, the LED light board is embedded in the base, and the base has a clearance groove corresponding to the LED light board. The LED light board is placed in the clearance groove, which provides a precise placement position for the LED light board, ensuring that the LED light board can be stably embedded in the base and avoiding displacement or falling off during the packaging process. The clearance groove also helps the heating device to dissipate heat to a certain extent, optimizes the light propagation path, reduces light scattering and loss, thereby improving lighting efficiency and lighting quality.

[0092] 4. In the optical film component packaging equipment provided in this embodiment of the present invention, the heating component is the core part of the heating device, which is responsible for converting electrical energy or other forms of energy into heat energy. The temperature controller is used to monitor and regulate the temperature of the heating device to ensure that the heating component operates within a safe and effective range. The heating component is set below the bottom wall of the vented groove, so that the heat is more directly conducted to the LED light board.

[0093] 5. In the optical film assembly packaging device provided in this embodiment of the present invention, the depth of the clearance groove is equal to or less than the height of the substrate, the substrate of the LED light board and the surface of the base are on the same horizontal line or the substrate of the LED light board is slightly higher than the surface of the base, and the LED chip protrudes from the surface of the base. This helps to ensure that the light is emitted uniformly from the LED chip, and avoids the uneven light phenomenon caused by the gap between the LED light board and the clearance groove, and makes it easier for the optical film assembly to be directly attached to the substrate of the LED light board.

[0094] 6. The optical film assembly packaging device provided in this embodiment of the present invention includes a composite film layer and a carrier film. The composite film layer is pre-cut and arranged in an array on the carrier film. The carrier film is attached to the LED light board in one go. After the carrier film is attached to the LED light board, the composite film layer is precisely attached to and covers the LED chip based on the alignment with the LED chip, so as to achieve a more uniform light distribution. The composite film layer is arranged in an array on the carrier film. The composite film layer can be partially attached and can be arranged in any order based on the alignment with the LED chip.

[0095] 7. In the packaging equipment for optical film components provided in this embodiment of the present invention, during the packaging process, the composite film layer needs to be precisely aligned with the LED chip on the LED light board in order to achieve the expected lighting or display effect. Mechanical alignment or optical alignment, or a combination of both, can be used. Mechanical alignment relies on mechanical structure and positioning device, while optical alignment utilizes image recognition and processing technology to achieve accurate identification and positioning of alignment points. By using both mechanical alignment and optical alignment, the advantages of both can be fully utilized to achieve higher alignment accuracy and stability.

[0096] 8. The optical film component packaging equipment provided in this embodiment of the present invention can be driven by a drive device that can select a variety of different power supply methods such as manual, electric or stepper according to different application scenarios and needs. The first drive component is connected to the base by signal and drives the base to move in the horizontal direction. The second drive component is connected to the feeding device by signal and drives the feeding device to feed the roll material in a circular motion, realizing a motion mode of one end of the roll and the other end of the pull.

[0097] 9. In the optical film assembly packaging equipment provided in this utility model embodiment, the feeding device can feed material in a circular motion at a fixed position, or it can feed material horizontally along the base. However, regardless of whether the feeding device is stationary, the base is driven by the first driving component to move along a position away from the feeding device, and the optical film assembly can be evenly and continuously distributed on the LED light board.

[0098] 10. In the optical film component packaging equipment provided in this utility model embodiment, the third driving component drives the pressurizing device to move up and down in the vertical direction. When the pressurizing device is working, it can maintain a constant or reasonably dynamically adjustable distance from the base. When it is not working, it can be lifted away from the already packaged LED light board to avoid physical damage.

[0099] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An optical film assembly encapsulation device for encapsulating the optical film assembly onto an LED light board, characterized in that: The optical film assembly packaging equipment includes a base and a pressurizing device. The LED light panel is embedded in the base, and the pressurizing device is disposed on the side of the base closer to the LED light panel. The optical film assembly is disposed between the pressurizing device and the base, and the pressurizing device is used to press and attach the optical film assembly to the LED light panel. A heating device is provided inside the base corresponding to the LED light panel.

2. The optical film assembly packaging equipment as described in claim 1, characterized in that: The optical film assembly packaging equipment also includes a feeding device disposed on the same side as the pressurizing device, from which the optical film assembly is fed.

3. The optical film assembly packaging equipment as described in claim 2, characterized in that: The base has a clearance groove corresponding to the LED light panel, and the LED light panel is placed in the clearance groove.

4. The optical film assembly packaging equipment as described in claim 3, characterized in that: The heating device includes a heating component and a temperature controller that is signal-connected to the heating component. The heating component is located near the bottom wall of the vented groove.

5. The optical film assembly packaging equipment as described in claim 4, characterized in that: The LED light board includes a substrate and LED chips electrically connected to the substrate, and the depth of the clearance groove is equal to or less than the height of the substrate.

6. The optical film assembly packaging equipment as described in claim 5, characterized in that: The optical film assembly includes a composite film layer and a carrier film. The composite film layer is arranged in an array on the carrier film. When the optical film assembly is fed from the feeding device, the composite film layer is aligned with the LED chip.

7. The optical film assembly packaging equipment as described in claim 6, characterized in that: The carrier film is provided with a first alignment mark, and the LED light board is provided with a second alignment mark. The first alignment mark and the second alignment mark are aligned with the composite film layer and the LED chip through mechanical alignment and / or optical alignment.

8. The optical film assembly packaging equipment as described in claim 2, characterized in that: The optical film assembly packaging equipment further includes a driving device, which includes a first driving component that is signal-connected to the base and a second driving component that is signal-connected to the feeding device. The first driving component drives the base to move in a horizontal direction, and the second driving component drives the feeding device to feed the roll material in a circular motion.

9. The optical film assembly packaging equipment as described in claim 8, characterized in that: The first drive component drives the base to move along the side away from the feeding device.

10. The optical film assembly packaging equipment as described in claim 8, characterized in that: The driving device further includes a third driving component, which drives the pressurizing device to move in the vertical direction.

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