Sealing assembly for clean environments

Abstract

This utility model discloses a sealing assembly suitable for clean environments, comprising a C-shaped ring and a back pressure ring disposed radially outside the C-shaped ring. The C-shaped ring comprises a ring body made of spring steel, with two axial ends forming a sealing portion. The sealing portion protrudes axially from the axial end face of the back pressure ring, and a polyimide coating is also provided on the outer side of the sealing portion. This sealing assembly does not require machining of the ring body during manufacturing, and the sealing portion exhibits excellent high-temperature resistance and wear resistance, thereby preventing the generation of particulate matter during use and meeting the sealing requirements of clean environments. This sealing assembly is particularly suitable for applications requiring high cleanliness, such as semiconductor manufacturing equipment, and for sealing scenarios involving alternating temperature and / or pressure changes and frequent, large-amplitude opening and closing.

Description

Technical Field

[0001] This utility model relates to the field of sealing technology, specifically to a sealing component suitable for clean environments. Background Technology

[0002] Semiconductor chip manufacturing has extremely high requirements for environmental cleanliness. For example, in the wafer cleaning process for manufacturing semiconductor chips, since the subsequent processes are coating and photolithography, if nanoscale particles stick to the wafer, they will block light and affect the yield of the finished product after photolithography.

[0003] In semiconductor chip manufacturing equipment, sealing elements need to simultaneously meet the requirements of complex operating conditions such as rapid pressure alternation, temperature alternation, frequent large-amplitude opening and closing, and long lifespan. Existing technologies do not offer satisfactory solutions. There are two main sealing schemes used in current equipment. One is to use a spring accumulator (also known as a plug) for sealing. However, this sealing scheme generates particles at many points during normal operation. For example, plug jackets are generally produced using CNC lathes or machining centers, inevitably resulting in many invisible burrs during machining. These burrs fall off during use and become particles that contaminate the wafer. Impurities in the plug jacket material are also removed during use; new particles are generated by repeated friction between the spring and the jacket; and new particles are generated by repeated friction between the jacket and the groove. The other method uses a machined metal sealing ring coated with polytetrafluoroethylene (PTFE). However, this seal can develop white blistering under high temperature and pressure conditions, and there is a risk of it falling off after prolonged use. This results in the production of particulate matter in sealed products during use in existing manufacturing equipment. From a nanometer perspective, particles are everywhere, which seriously affects the quality of finished semiconductor chips.

[0004] Therefore, it is necessary to provide a sealing component suitable for clean environments. Utility Model Content

[0005] The purpose of this invention is to overcome the shortcomings of the prior art and provide a sealing component suitable for clean environments.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is: a sealing assembly suitable for clean environments, the sealing assembly including a C-shaped ring and a back pressure ring disposed on the radially outer side of the C-shaped ring, wherein the C-shaped ring includes a ring body made of spring steel, the two axial ends of the ring body constitute a sealing part, the sealing part protrudes axially from the axial end face of the back pressure ring, and a polyimide coating is also provided on the outer side of the sealing part.

[0007] Preferably, the polyimide coating is provided on the entire outer periphery of the ring body.

[0008] Preferably, the ring body is an integral component made of spring steel through a rolling process.

[0009] Preferably, the inner periphery of the back pressure ring has an arc-shaped surface that arches outward in the radial direction, so that when the C-ring is compressed axially, the outer periphery of the C-ring can fit against the arc-shaped surface.

[0010] Furthermore, when the C-ring is not under axial pressure, the longitudinal cross-section of the C-ring is a circle with an opening, the arc surface is centered on the center of the circle, and the arc surface is spaced apart from the outer circumference of the C-ring.

[0011] Preferably, in the C-shaped ring, the thickness of the ring body is 0.5cm ± 0.3cm.

[0012] Preferably, the thickness of the polyimide coating is 100μm±50μm.

[0013] Preferably, when the C-ring is not under axial pressure, the height of the sealing part protruding axially from the end face of the back pressure ring is 1cm ± 0.5cm.

[0014] Preferably, the inner diameter of the C-ring is greater than 200 cm.

[0015] Preferably, the back pressure ring is a metal ring, which is disposed in the sealing groove, or the back pressure ring is integrally disposed with the component to be sealed having the sealing groove.

[0016] Due to the application of the above technical solution, this utility model has the following advantages compared with the prior art: The sealing assembly suitable for clean environments provided by the embodiments of this utility model achieves axial sealing between two components through the cooperation of a C-ring and a back pressure ring. The C-ring body is made of spring steel, and a polyimide coating is provided on the outer side of the sealing part. This not only provides good axial sealing stress but also avoids the need for machining the ring body. Furthermore, the sealing part has good high-temperature resistance and wear resistance, thereby preventing the generation of particulate matter during use and meeting the sealing requirements in clean environments. This sealing assembly is particularly suitable for sealing scenarios with high cleanliness requirements, such as semiconductor manufacturing equipment, and that need to withstand temperature and / or pressure alternation and frequent large-amplitude opening and closing. Attached Figure Description

[0017] To more clearly illustrate the technical solution of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of a sealing assembly according to an embodiment of the present invention;

[0019] Figure 2 for Figure 1 Enlarged schematic diagram of the cross-sectional structure along the AA direction;

[0020] Figure 3 for Figure 2 Enlarged schematic diagram of section B in the middle;

[0021] Wherein: 1. C-ring; 11. Ring body; 12. Polyimide coating; 1a. Sealing part;

[0022] 2. Back pressure ring; 21. Arc-shaped surface. Detailed Implementation

[0023] The technical solution of this utility model will be described in detail below with reference to the accompanying drawings and specific embodiments, so that the advantages and features of this utility model can be more easily understood by those skilled in the art. Obviously, the embodiments described in this application are only a part of the embodiments, not all of them. All other embodiments obtained by those skilled in the art based on the embodiments in this application without creative effort are within the scope of protection of this application.

[0024] See Figures 1 to 3 The sealing assembly shown includes a C-shaped ring 1 and a back pressure ring 2 disposed radially outside the C-shaped ring 1. The C-shaped ring 1 includes a ring body 11 made of spring steel. The longitudinal cross-section of the ring body 11 is C-shaped with the opening facing inward. The two axial ends of the ring body 11 form a sealing part 1a. The sealing part 1a protrudes axially from the axial end face of the corresponding side of the back pressure ring 2. The outer side of the sealing part 1a is also provided with a polyimide coating 12, also known as a PI coating.

[0025] Specifically, in this embodiment, a polyimide coating 12 is provided on the entire outer periphery of the ring body 11. Specifically, it is applied to the outer periphery of the ring body 11 by coating, forming a covering on the outer periphery of the ring body 11. When the sealing assembly is used for axial sealing connection between two components, the sealing assembly contacts the two components through the polyimide coating 12.

[0026] Because the polyimide coating 12 can withstand temperatures above 400°C, it can avoid the problem of white bubbling under high temperature and pressure. At the same time, the polyimide coating 12 also has good wear resistance. In sealing scenarios with frequent opening and closing, it is not easy to generate particles during friction with the groove, which can greatly improve the product's life. It is not easy to generate particles during use and can be used in sealing scenarios with high environmental cleanliness requirements, such as semiconductor manufacturing equipment.

[0027] In this embodiment, the ring body 11 is an integral component made of spring steel through rolling processing, which avoids machining and prevents burrs from forming on the ring body 11, thereby preventing burrs from falling off and forming particles during use; at the same time, the spring steel material has good bonding ability with the polyimide coating 12, so that the polyimide coating 12 can be stably and reliably attached to the outer surface of the ring body 11.

[0028] In this embodiment, the structure of each part of the sealing assembly is specifically set as follows:

[0029] A back pressure ring 2 is positioned radially outward from the C-ring 1 to limit the radial deformation of the C-ring 1 and prevent it from being crushed, thus avoiding sealing failure. The inner circumference of the back pressure ring 2 has an arc-shaped surface 21 that arches radially outward. When the C-ring 1 is axially compressed, its outer circumference can abut against this arc-shaped surface 21. Specifically, when the C-ring 1 is not axially compressed, its longitudinal cross-section is a circle with an opening. The arc-shaped surface 21 is centered on the center of this circle, and a gap is provided between the arc-shaped surface 21 and the outer circumference of the C-ring 1 to allow for a certain radial deformation of the C-ring 1 after axial compression, thereby providing sealing stress.

[0030] In the C-ring 1, the thickness of the ring body 11 is 0.5cm ± 0.3cm; the thickness of the polyimide coating 12 is 100μm ± 50μm; when the C-ring 1 is not under axial pressure, the sealing part 1a protrudes axially from the shaft end face on the corresponding side of the back pressure ring 2 by a height of 1cm ± 0.5cm.

[0031] In this sealing assembly, the inner diameter of the C-ring 1 can be greater than 200 cm to be used for axial sealing connections between sealing grooves with a diameter greater than 200 cm, which is suitable for the sealing requirements of semiconductor manufacturing equipment.

[0032] The back pressure ring 2 can specifically be a metal ring. When this sealing assembly is used for an axial sealing connection between two components, the back pressure ring 2 is fitted into the sealing groove. In some other embodiments, the back pressure ring can also be integrally formed with the component to be sealed, which has a sealing groove.

[0033] In summary, the sealing assembly suitable for clean environments provided by this utility model embodiment achieves axial sealing between the two components through the cooperation of a C-ring 1 and a back pressure ring 2. The ring body 11 of the C-ring 1 is made of spring steel, and a polyimide coating 12 is provided on the outer side of the sealing portion 1a of the ring body 11. This not only provides good axial sealing stress but also avoids the need for machining the ring body 11, and ensures the sealing area has good high-temperature resistance and wear resistance, thereby preventing the generation of particulate matter during use and meeting the sealing requirements in clean environments. This sealing assembly is particularly suitable for applications such as semiconductor manufacturing equipment that require high cleanliness and need to withstand temperature and / or pressure fluctuations and frequent, large-amplitude opening and closing.

[0034] The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be included within the scope of protection of this utility model.

Claims

1. A sealing component suitable for clean environments, characterized in that: The sealing assembly includes a C-ring and a back pressure ring disposed radially outside the C-ring. The C-ring includes a ring body made of spring steel. The two axial ends of the ring body constitute a sealing portion. The sealing portion protrudes axially from the axial end face of the back pressure ring. A polyimide coating is also disposed on the outer side of the sealing portion.

2. The sealing assembly suitable for clean environments according to claim 1, characterized in that: The polyimide coating is provided on the entire outer periphery of the ring body.

3. The sealing assembly suitable for clean environments according to claim 1, characterized in that: The ring body is an integral component made of spring steel through a rolling process.

4. The sealing assembly suitable for clean environments according to claim 1, characterized in that: The inner periphery of the back pressure ring has an arc-shaped surface that arches outward in the radial direction. When the C-ring is compressed axially, the outer periphery of the C-ring can fit against the arc-shaped surface.

5. The sealing assembly suitable for clean environments according to claim 4, characterized in that: When the C-ring is not under axial pressure, its longitudinal cross-section is a circle with an opening, the arc surface is centered on the center of the circle, and the arc surface is spaced apart from the outer circumference of the C-ring.

6. The sealing assembly suitable for clean environments according to claim 1, characterized in that: In the C-shaped ring, the thickness of the ring body is 0.5cm ± 0.3cm.

7. The sealing assembly suitable for clean environments according to claim 1, characterized in that: The thickness of the polyimide coating is 100μm±50μm.

8. The sealing assembly suitable for clean environments according to claim 1, characterized in that: When the C-ring is not under axial pressure, the sealing part protrudes axially from the end face of the back pressure ring by a height of 1cm ± 0.5cm.

9. The sealing assembly suitable for clean environments according to claim 1, characterized in that: The inner diameter of the C-ring is greater than 200 cm.

10. The sealing assembly suitable for clean environments according to claim 1, characterized in that: The back pressure ring is a metal ring, which is disposed in the sealing groove, or the back pressure ring is integrally disposed with the component to be sealed having a sealing groove.

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