A plasma cavity assembly and a plasma device

Abstract

The utility model discloses a kind of plasma cavity assembly and plasma equipment, including plasma processing machine, multiple clamping shells are equipped in two two groups in the cavity of plasma processing machine, wafer is equipped between each group of clamping shells, multiple installation grooves are equipped on the inner ring surface of clamping shell, rotating column is movably installed in installation groove, multiple silica gel heads are installed on the top surface and bottom surface of clamping shell inner cavity, channel matched with wafer thickness is formed between upper and lower silica gel heads, the outer ring of wafer is extended to clamping shell through channel, and it is contacted with the outer ring of rotating column and set.The utility model structure is simple, through the clamping shell of inwardly converging can hold positioning wafer in middle, reduce the friction between rotating column and clamping shell, and through silica gel head can set wafer in air, avoid the upper and lower surface of wafer and the inner wall surface of clamping shell contact, and through motor can drive the rotation of wafer, to ensure the quality of plasma cleaning.

Description

Technical Field

[0001] This utility model relates to the field of plasma processing technology, specifically to a plasma cavity assembly and plasma equipment. Background Technology

[0002] A plasma treatment machine is a high-tech device that uses plasma to clean, activate, etch, or coat material surfaces. It is widely used in semiconductor, medical, optical, automotive, and aerospace industries, and can efficiently remove contaminants, enhance material surface properties, or alter their chemical characteristics.

[0003] Currently, when cleaning wafers, they are usually placed on a tray. However, the tray comes into contact with the bottom of the wafer, which makes it impossible to effectively clean the contact area between the bottom of the wafer and the tray, affecting the cleaning quality. In addition, the simple structure of the tray makes it impossible to position the wafer, affecting the stability of the swing and cleaning process. Summary of the Invention

[0004] The technical problem to be solved by this utility model is to provide a plasma cavity assembly and plasma device, which can clamp and position the wafer by means of an inwardly closing clamping shell, so as to expose the upper and lower surfaces of the wafer, thereby solving the problems mentioned in the background art.

[0005] This utility model is achieved through the following technical solution: a plasma cavity assembly, including a plasma processor, wherein multiple clamping shells are arranged in pairs in the cavity of the plasma processor, and a wafer is arranged between each pair of clamping shells. Multiple mounting grooves are provided on the inner ring surface of each clamping shell, and a rotating column is movably installed in each mounting groove. A part of the rotating column extends to the outside through the opening of the mounting groove. Multiple silicone heads are installed on the top and bottom surfaces of the inner cavity of the clamping shell, and a channel matching the thickness of the wafer is formed between the upper and lower silicone heads. The outer ring of the wafer extends through the channel into the clamping shell and contacts the outer ring of the rotating column. A positioning drive mechanism is installed at one end of each pair of clamping shells.

[0006] As a preferred technical solution, the positioning drive mechanism includes a crossbar, multiple sliders, multiple compression springs, and multiple push rods. Both ends of the crossbar are mounted on the inner wall of the cavity. A groove is provided on the side of the crossbar facing the cavity opening. The sliders are all slidably disposed in the groove. One end of each push rod is mounted on the clamping shell, and the other end is mounted on the slider. The compression springs are all disposed inside the groove, with one end of each compression spring mounted on the slider and the other end mounted on the inner wall of the groove.

[0007] As a preferred technical solution, the positioning drive mechanism also includes a motor, a fixed frame, and a drive wheel. The fixed frame is mounted on the push rod and is arranged in an "L" shape. The motor is mounted at the end of the fixed frame away from the push rod. The motor shaft passes through the outer wall of the fixed frame and is fixedly connected to the drive wheel. A rubber layer is installed on the outer ring surface of the drive wheel, and the rubber layer is in frictional contact with the outer ring surface of the wafer.

[0008] As a preferred technical solution, the silicone head is uniformly reduced in size at one end facing the wafer, and one end of the silicone head is in contact with the outer surface of the wafer.

[0009] As a preferred technical solution, both the slider and the groove have trapezoidal cross-sections.

[0010] As a preferred technical solution, the cross-section of the mounting groove is set in a "C" shape, and the diameter of the rotating column is greater than the width of the mounting groove opening.

[0011] A plasma device, comprising the plasma cavity assembly.

[0012] The beneficial effects of this utility model are: the utility model has a simple structure, the inwardly close clamping shell can clamp and position the middle wafer to ensure the stability of placement, and the rotating column reduces the friction between the wafer and the clamping shell, while the silicone head can suspend the wafer in the air to avoid the upper and lower surfaces of the wafer from contacting the inner wall of the clamping shell, and the motor can drive the wafer to rotate to ensure the quality of plasma cleaning. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0014] Figure 2 This is a partially enlarged view of the present invention;

[0015] Figure 3 This is a schematic diagram of the structure of this utility model after removing the plasma treatment machine;

[0016] Figure 4 This is a schematic diagram of the structure of the clamping shell of this utility model.

[0017] In the diagram, 1. Plasma processor; 2. Cavity; 3. Wafer; 4. Clamping shell; 5. Crossbar; 6. Compression spring; 7. Slider; 8. Push rod; 9. Fixture; 10. Motor; 11. Drive wheel; 12. Rotating column; 13. Silicone head. Detailed Implementation

[0018] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0019] Example 1

[0020] like Figures 1-4 As shown, a plasma cavity assembly of this utility model includes a plasma processor 1. In the cavity 2 of the plasma processor 1, multiple clamping shells 4 are arranged in pairs. A wafer 3 is arranged between each pair of clamping shells 4. Multiple mounting grooves are provided on the inner ring surface of each clamping shell 4. A rotating column 12 is movably installed in each mounting groove. A part of the rotating column 12 extends to the outside through the opening of the mounting groove. Multiple silicone heads 13 are installed on the top and bottom surfaces of the inner cavity of the clamping shell 4. A channel matching the thickness of the wafer 3 is formed between the upper and lower silicone heads 13. The outer ring of the wafer 3 extends through the channel into the clamping shell 4 and contacts the outer ring of the rotating column 12. A positioning drive mechanism is installed at one end of each pair of clamping shells 4.

[0021] A silicone layer can be installed on the outer ring surface of the rotating pillar, allowing the rotating pillar to make flexible contact with the outer ring of the wafer, thus avoiding damage to the outer ring of the wafer caused by rigid contact.

[0022] In this embodiment, the positioning drive mechanism includes a crossbar 5, multiple sliders 7, multiple compression springs 6, and multiple push rods 8. Both ends of the crossbar 5 are installed on the inner wall of the cavity 2. A groove is provided on the side of the crossbar 5 facing the opening of the cavity 2. The sliders 7 are all slidably disposed in the groove. One end of each push rod 8 is installed on the clamping shell 4, and the other end is installed on the slider 7. The compression springs 6 are all disposed inside the groove. One end of each compression spring 6 is installed on the slider 7, and the other end is installed on the inner wall of the groove.

[0023] In this embodiment, the positioning drive mechanism also includes a motor 10, a fixed frame 9, and a drive wheel 11. The fixed frame 9 is mounted on the push rod 8 and is arranged in an "L" shape. The motor 10 is mounted at the end of the fixed frame 9 away from the push rod 8. The rotating shaft of the motor 10 passes through the outer wall of the fixed frame 9 and is fixedly connected to the drive wheel 11. A rubber layer is installed on the outer ring surface of the drive wheel 11, and the rubber layer is in frictional contact with the outer ring surface of the wafer 3. The rubber layer increases the friction with the outer ring of the wafer, thereby smoothly driving the wafer to rotate.

[0024] In this embodiment, the silicone head 13 is uniformly reduced in size at one end facing the wafer 3, and one end of the silicone head 13 is in contact with the outer surface of the wafer 3. By reducing the size at one end, the contact area with the wafer is reduced, thus reducing friction and enabling the wafer to rotate more smoothly.

[0025] In this embodiment, both the slider 7 and the slide groove have trapezoidal cross-sections, which allows the slider to move back and forth along the slide groove, thus preventing the slider from detaching from the slide groove.

[0026] In this embodiment, the cross-section of the mounting groove is C-shaped, and the diameter of the rotating column 12 is greater than the width of the mounting groove opening, so that the rotating column can only be in the mounting groove and avoids falling out of the mounting groove.

[0027] Example 2

[0028] A plasma device includes the plasma cavity assembly described in Example 1.

[0029] In use, push the clamping shell outward. The movement of the clamping shell drives the push rod and slider, causing the slider to move outward along the slide groove and compress the compression spring. At this time, the wafer can be placed between each set of clamping shells. After slowly releasing the clamping shell, the rebound of the compression spring can push the slider, push rod and clamping shell inward, so that the clamping shell can automatically move inward until the outer ring of the wafer passes through the channel and contacts the outer ring surface of the rotating column. The silicone head can lift the wafer vertically, avoiding contact with the upper and lower inner walls of the clamping shell cavity.

[0030] After the above is completed, the motor is started. The start of the motor drives the drive wheel, and the friction between the drive wheel and the wafer causes the wafer to rotate, so that the area of ​​the wafer that was originally located inside the clamping shell rotates to the outside, and the upper and lower surfaces of the wafer are not obstructed by other components, so as to ensure the cleaning quality of the plasma.

[0031] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any changes or substitutions conceived without inventive effort should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope defined in the claims.

Claims

1. A plasma cavity assembly, characterized in that: The system includes a plasma processor (1), in which a plurality of clamping shells (4) are arranged in pairs in the cavity (2) of the plasma processor (1). A wafer (3) is arranged between each pair of clamping shells (4). A plurality of mounting grooves are provided on the inner ring surface of each clamping shell (4). A rotating column (12) is movably installed in each mounting groove. A part of the rotating column (12) extends to the outside through the opening of the mounting groove. A plurality of silicone heads (13) are installed on the top and bottom surfaces of the inner cavity of the clamping shell (4). A channel matching the thickness of the wafer (3) is formed between the upper and lower silicone heads (13). The outer ring of the wafer (3) extends through the channel into the clamping shell (4) and contacts the outer ring of the rotating column (12). A positioning drive mechanism is installed at one end of each pair of clamping shells (4).

2. The plasma cavity assembly according to claim 1, characterized in that: The positioning drive mechanism includes a crossbar (5), multiple sliders (7), multiple compression springs (6) and multiple push rods (8). Both ends of the crossbar (5) are installed on the inner wall of the cavity (2). The side of the crossbar (5) facing the opening of the cavity (2) is provided with a groove. The sliders (7) are all slidably set in the groove. One end of the push rod (8) is installed on the clamping shell (4) and the other end is installed on the slider (7). The compression springs (6) are all set inside the groove. One end of the compression spring (6) is installed on the slider (7) and the other end is installed on the inner wall of the groove.

3. The plasma cavity assembly according to claim 2, characterized in that: The positioning drive mechanism also includes a motor (10), a fixed frame (9) and a drive wheel (11). The fixed frame (9) is mounted on the push rod (8). The fixed frame (9) is arranged in an "L" shape. The motor (10) is mounted on the end of the fixed frame (9) away from the push rod (8). The rotating shaft of the motor (10) passes through the outer wall of the fixed frame (9) and is fixedly connected to the drive wheel (11). The outer ring surface of the drive wheel (11) is equipped with a rubber layer, and the rubber layer is in frictional contact with the outer ring surface of the wafer (3).

4. The plasma cavity assembly according to claim 1, characterized in that: The silicone head (13) is uniformly reduced in size at one end facing the wafer (3), and one end of the silicone head (13) is in contact with the outer surface of the wafer (3).

5. The plasma cavity assembly according to claim 2, characterized in that: Both the slider (7) and the groove have trapezoidal cross-sections.

6. The plasma cavity assembly according to claim 1, characterized in that: The cross-section of the mounting slots is set in a "C" shape, and the diameter of the rotating column (12) is greater than the width of the mounting slot opening.

7. A plasma device, characterized in that: Includes the plasma cavity assembly as described in any one of claims 1-6.

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