PCBA high-temperature adhesive paper attaching device

Abstract

The utility model discloses a PCBA high temperature glue paper attaching device, it includes conveying mechanism, a plurality of sets of clamping turnover mechanism, it is set on conveying mechanism according to interval distance, is used for clamping fixed and overturning 180 DEG to PCBA, first attaching mechanism and second attaching mechanism are used for attaching high temperature glue paper to the front and back of PCBA, first pre -press mechanism and second pre -press mechanism are used for pre -pressing and attaching high temperature glue paper on the front and back of PCBA, first detection mechanism and second detection mechanism are used for detecting the attaching condition of high temperature glue paper on the front and back of PCBA, the utility model discloses a conveying mechanism drives a plurality of sets of clamping turnover mechanism to flow through front and back attaching station, pre -pressing station and detection station in proper order, effectively realizes overturning PCBA in limited space range to complete front and back attaching, pre -pressing and detecting high temperature paste paper, and operation procedure is strong, and attaching precision is high.

Description

Technical Field

[0001] This utility model relates to the field of PCBA production technology, specifically to a high-temperature adhesive tape application device for PCBA. Background Technology

[0002] In the PCBA manufacturing process, wave soldering is required for PCBAs. This necessitates the pre-application of a layer of high-temperature adhesive tape onto the PCBA board surface to ensure the soldering effect. However, existing high-temperature adhesive tape application devices cannot meet the requirements of high efficiency and high flatness, and they require a large amount of space to complete the front and back application and inspection processes, resulting in low application efficiency and low application quality. Utility Model Content

[0003] To overcome the above-mentioned technical problems, this utility model discloses a high-temperature adhesive tape application device for PCBA.

[0004] The technical solution adopted by this utility model to achieve the above objectives is as follows:

[0005] A high-temperature adhesive tape application device for PCBA, comprising:

[0006] The conveying mechanism is used to drive the PCBA to flow sequentially through the front and back bonding station, the pre-pressing station, and the inspection station;

[0007] Several sets of clamping and flipping mechanisms are arranged at intervals on the conveying mechanism for clamping, fixing and flipping the PCBA by 180°.

[0008] The first attaching mechanism and the second attaching mechanism are sequentially arranged at the front and back attaching stations along the conveying direction of the conveying mechanism. The attaching ends of the first attaching mechanism and the second attaching mechanism are both arranged corresponding to the clamping and flipping mechanism, and are used to attach high-temperature adhesive tape to the front and back of the PCBA.

[0009] The first pre-pressing mechanism and the second pre-pressing mechanism are arranged opposite each other at the pre-pressing station. The pressing ends of the first pre-pressing mechanism and the second pre-pressing mechanism are both arranged corresponding to the clamping and flipping mechanism, and are used to pre-press and attach high-temperature adhesive tape to the front and back of the PCBA.

[0010] The first and second testing mechanisms are arranged vertically opposite each other at the testing station. The testing ends of the first and second testing mechanisms are both set to correspond to the clamping and flipping mechanism, and are used to test the adhesion of high-temperature adhesive tape on the front and back of the PCBA.

[0011] The aforementioned PCBA high-temperature adhesive tape attaching device includes a clamping and flipping mechanism comprising two sets of clamping and flipping components disposed opposite to each other on the conveying mechanism, wherein a PCBA flipping cavity is formed between the two sets of clamping and flipping components for fixing and flipping the PCBA.

[0012] The clamping and flipping assembly includes a first gripper, a first cylinder for driving the first gripper to open and close, and a second cylinder for driving the first gripper to flip 180°. The first gripper is configured to correspond to the PCBA flipping cavity.

[0013] The aforementioned high-temperature adhesive tape application device for PCBA includes a first application mechanism comprising an adhesive tape traction assembly, a cutting assembly, a carrying assembly, and an incoming material detection assembly.

[0014] The material arrival detection component is disposed on the carrier component corresponding to the PCBA flipping cavity, and is used to detect whether the PCBA to be attached has reached the carrier component, and the material arrival detection component is electrically connected to the adhesive tape traction component;

[0015] The supporting component includes a supporting plate and a third cylinder for driving the supporting plate to rise and fall. A cutting groove and a supporting platform are sequentially arranged on the supporting plate along the conveying direction of the conveying mechanism.

[0016] The cutting component is arranged corresponding to the cutting groove, and the adhesive tape traction component moves back and forth between the cutting groove and the support table to pull the uncut adhesive tape forward along the conveying direction of the conveying mechanism so that the high-temperature adhesive tape is attached to the surface of the PCBA.

[0017] The aforementioned PCBA high-temperature adhesive tape attaching device includes a cutting component comprising a cutting scissor corresponding to the cutting groove and a fourth cylinder for driving the cutting scissor to reciprocate within the cutting groove.

[0018] The adhesive tape traction assembly includes an adhesive tape take-up and release structure, a first traction structure, a second traction structure, and a drive structure. The adhesive tape take-up and release structure holds the adhesive tape to be attached. The drive structure drives the first traction structure and the second traction structure to alternately move back and forth between the cutting groove and the support table, so as to realize that the first traction structure and the second traction structure alternately pull the adhesive tape forward along the conveying direction of the conveying mechanism, so that the high-temperature adhesive tape is attached to the surface of the PCBA.

[0019] In the aforementioned PCBA high-temperature adhesive tape application device, the first traction structure and the second traction structure have the same structure. The first traction structure includes a second gripper and a fifth cylinder for driving the second gripper to open and close. The second gripper is provided corresponding to the bearing component.

[0020] In the aforementioned high-temperature adhesive tape application device for PCBA, the structure of the second application mechanism is the same as that of the first application mechanism.

[0021] The aforementioned PCBA high-temperature adhesive tape application device, wherein the first pre-pressing mechanism includes a roller bar, a roller wheel, and a spring, the roller wheel is movably disposed at the end of the roller bar, the spring is pressed against the roller bar and the roller wheel, and the roller wheel is disposed corresponding to the PCBA flipping cavity.

[0022] In the aforementioned PCBA high-temperature adhesive tape application device, the structure of the second pre-pressing mechanism is the same as that of the first pre-pressing mechanism.

[0023] The aforementioned PCBA high-temperature adhesive tape attaching device includes a first detection mechanism comprising a first detection lens, which is positioned directly above the PCBA flipping cavity to identify the accuracy of the high-temperature adhesive tape on the front of the PCBA during its movement along the conveying direction of the conveying mechanism.

[0024] The aforementioned PCBA high-temperature adhesive tape attaching device includes a second detection mechanism comprising a second detection lens, which is positioned directly below the PCBA flipping cavity to identify the accuracy of the high-temperature adhesive tape on the reverse side of the PCBA during its movement along the conveying direction of the conveying mechanism.

[0025] The beneficial effects of this utility model are as follows: This utility model is reasonably and ingeniously designed. It utilizes the conveying mechanism to drive several sets of clamping and flipping mechanisms to flow sequentially through the front and back bonding station, the pre-pressing station, and the inspection station. This effectively achieves the flipping of the PCBA within a limited space to complete the front and back bonding, pre-pressing, and inspection of the high-temperature adhesive tape. The operation process is highly continuous and the bonding accuracy is high. Specifically, the first bonding mechanism and the second bonding mechanism sequentially bond high-temperature adhesive tape to the front and back of the PCBA. The first pre-pressing mechanism and the second pre-pressing mechanism simultaneously pre-press the high-temperature adhesive tape to the front and back of the PCBA. The first inspection mechanism and the second inspection mechanism simultaneously inspect the bonding status of the high-temperature adhesive tape on the front and back of the PCBA. Attached Figure Description

[0026] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0027] Figure 1 This is a top view of the structure of this utility model. Detailed Implementation

[0028] The present invention will be further described below through specific embodiments, so as to make the technical solution of the present invention easier to understand and master, rather than to limit the present invention.

[0029] Example: See Figure 1 This embodiment provides a high-temperature adhesive tape application device for PCBA, which includes:

[0030] Conveying mechanism 1 is used to drive the PCBA to flow sequentially through the front and back bonding station, the pre-pressing station and the inspection station;

[0031] Several sets of clamping and flipping mechanisms 2 are arranged at intervals on the conveying mechanism 1 for clamping, fixing and flipping the PCBA by 180°.

[0032] The first attaching mechanism 3 and the second attaching mechanism 4 are sequentially arranged at the front and back attaching stations along the conveying direction of the conveying mechanism 1. The attaching ends of the first attaching mechanism 3 and the second attaching mechanism 4 are both arranged corresponding to the clamping and flipping mechanism 2, and are used to attach high temperature adhesive tape to the front and back of the PCBA.

[0033] The first pre-pressing mechanism 5 and the second pre-pressing mechanism are arranged opposite each other at the pre-pressing station. The pressing ends of the first pre-pressing mechanism 5 and the second pre-pressing mechanism are both arranged corresponding to the clamping and flipping mechanism 2, and are used to pre-press and attach high-temperature adhesive tape to the front and back of the PCBA.

[0034] The first detection mechanism 6 and the second detection mechanism are arranged opposite each other at the detection station. The detection ends of the first detection mechanism 6 and the second detection mechanism are both set to the clamping and flipping mechanism 2, and are used to detect the adhesion of high temperature adhesive tape on the front and back of the PCBA.

[0035] Specifically, the conveying mechanism 1 drives several sets of clamping and flipping mechanisms 2 to sequentially flow through the front and back attaching station, the pre-pressing station, and the inspection station, effectively flipping the PCBA within a limited space to complete the front and back attaching, pre-pressing, and inspection of the high-temperature adhesive tape. The operation process is highly continuous and the attaching accuracy is high. Among them, the first attaching mechanism 3 and the second attaching mechanism 4 attach high-temperature adhesive tape to the front and back of the PCBA in sequence, the first pre-pressing mechanism 5 and the second pre-pressing mechanism simultaneously pre-press the high-temperature adhesive tape to the front and back of the PCBA, and the first inspection mechanism 6 and the second inspection mechanism simultaneously inspect the attachment status of the high-temperature adhesive tape on the front and back of the PCBA.

[0036] Preferably, the clamping and flipping mechanism 2 includes two sets of clamping and flipping components disposed opposite to each other on the conveying mechanism 1, and a PCBA flipping cavity for fixing and flipping the PCBA is formed between the two sets of clamping and flipping components;

[0037] The clamping and flipping assembly includes a first gripper, a first cylinder for driving the first gripper to open and close, and a second cylinder for driving the first gripper to flip 180°. The first gripper is configured corresponding to the PCBA flipping cavity. Specifically, after the first cylinder drives the first gripper to clamp the PCBA, the second cylinder drives the first gripper to flip 180° to achieve the switching of the front and back sides of the PCBA.

[0038] Preferably, the first attaching mechanism 3 includes an adhesive tape traction assembly, a cutting assembly, a carrying assembly, and an incoming material detection assembly;

[0039] The material arrival detection component is disposed on the carrier component corresponding to the PCBA flipping cavity, and is used to detect whether the PCBA to be attached has reached the carrier component, and the material arrival detection component is electrically connected to the adhesive tape traction component;

[0040] The supporting component includes a supporting plate and a third cylinder for driving the supporting plate to rise and fall. A cutting groove and a supporting platform are sequentially arranged on the supporting plate along the conveying direction of the conveying mechanism 1.

[0041] The cutting component is arranged corresponding to the cutting groove, and the adhesive tape traction component moves back and forth between the cutting groove and the support table to pull the uncut adhesive tape forward along the conveying direction of the conveying mechanism 1 so that the high-temperature adhesive tape is attached to the surface of the PCBA.

[0042] Specifically, when the PCBA is moved to the first attachment mechanism 3, the third cylinder drives the support plate to rise to support the PCBA. At the same time, the material guiding detection component detects that the PCBA is placed on the support plate and drives the adhesive tape traction component to pull the high-temperature adhesive tape forward along the conveying direction of the conveying mechanism 1 so that the high-temperature adhesive tape is attached to the surface of the PCBA. The cutting component cuts the high-temperature adhesive tape in the cutting groove to realize the high-temperature adhesive tape attachment operation.

[0043] Preferably, the cutting assembly includes cutting scissors disposed corresponding to the cutting groove, and a fourth cylinder for driving the cutting scissors to reciprocate within the cutting groove;

[0044] The adhesive tape traction assembly includes an adhesive tape take-up and release structure, a first traction structure, a second traction structure, and a drive structure. The adhesive tape take-up and release structure holds the adhesive tape to be attached. The drive structure drives the first traction structure and the second traction structure to alternately move back and forth between the cutting groove and the support table, so as to realize that the first traction structure and the second traction structure alternately pull the adhesive tape forward along the conveying direction of the conveying mechanism 1, so that the high-temperature adhesive tape is attached to the surface of the PCBA.

[0045] Specifically, the adhesive tape release structure releases high-temperature adhesive tape with release paper. The first traction structure picks up the starting end of the high-temperature adhesive tape. The driving structure drives the first traction structure forward along the conveying direction of the conveying mechanism 1, and simultaneously drives the second traction structure backward along the conveying direction of the conveying mechanism 1 to pick up the high-temperature adhesive tape. The fourth cylinder drives the cutting scissors to cut the high-temperature adhesive tape in the cutting groove so that the high-temperature adhesive tape is cut and attached to the PCBA surface. At this time, the position of the high-temperature adhesive tape picked up by the second traction structure is the starting end, and the adhesive tape release structure retracts the release paper that has been peeled off the high-temperature adhesive tape. The above operation is repeated to realize the periodic application and cutting of high-temperature adhesive tape.

[0046] Furthermore, the first traction structure and the second traction structure have the same structure. The first traction structure includes a second gripper and a fifth cylinder for driving the second gripper to open and close. The second gripper is provided corresponding to the bearing component.

[0047] Furthermore, the structure of the second attachment mechanism 4 is the same as that of the first attachment mechanism 3.

[0048] Preferably, the first pre-pressing mechanism 5 includes a roller bar, a roller wheel, and a spring. The roller wheel is movably disposed at the end of the roller bar, and the spring presses against the roller bar and the roller wheel. The roller wheel is disposed corresponding to the PCBA flipping cavity.

[0049] Specifically, when the PCBA is moved to the first pre-pressing mechanism 5, the roller presses the surface of the PCBA so that the high-temperature sticker is flatly attached to the surface of the PCBA. The spring is used to buffer the rolling process of the roller to avoid damage to the PCBA due to excessive rolling pressure.

[0050] Furthermore, the structure of the second pre-compression mechanism is the same as that of the first pre-compression mechanism 5.

[0051] Preferably, the first detection mechanism 6 includes a first detection lens, which is disposed directly above the PCBA flipping cavity, and is used to identify the accuracy of the high-temperature adhesive tape on the front of the PCBA during the process of the PCBA moving along the conveying direction of the conveying mechanism 1.

[0052] The second detection mechanism includes a second detection lens, which is positioned directly below the PCBA flipping cavity and is used to identify the accuracy of the high-temperature adhesive tape on the reverse side of the PCBA during its movement along the conveying direction of the conveying mechanism 1.

[0053] When this utility model is in operation, it includes the following steps:

[0054] Step 1: Fix the PCBA to be attached onto the clamping and flipping mechanism 2, and the conveying mechanism 1 drives the PCBA to flow sequentially through the forward and reverse attachment station, the pre-pressing station and the inspection station.

[0055] Step 2: When the PCBA is moved to the front and back attaching station, the first attaching mechanism 3 attaches high-temperature adhesive tape to the front side of the PCBA.

[0056] After the front side is attached, the clamping and flipping mechanism 2 drives the PCBA to flip 180°, and the second attaching mechanism 4 attaches high-temperature adhesive tape to the back side of the PCBA.

[0057] Step 3: When the PCBA is moved to the pre-pressing station, the first pre-pressing mechanism 5 and the second pre-pressing mechanism roll the surface of the PCBA so that the high-temperature adhesive tape is flatly attached to the front and back surfaces of the PCBA.

[0058] Step 4: When the PCBA is moved to the testing station, the first testing mechanism 6 and the second testing mechanism test the front and back of the PCBA to obtain the high-temperature adhesive tape adhesion test structure.

[0059] Step 5: Qualified PCBAs are discharged.

[0060] This utility model is reasonably and ingeniously designed. It utilizes the conveying mechanism to drive several sets of clamping and flipping mechanisms to sequentially flow through the front and back bonding station, the pre-pressing station, and the inspection station. This effectively achieves the flipping of the PCBA within a limited space to complete the front and back bonding, pre-pressing, and inspection of the high-temperature adhesive tape. The operation process is highly continuous and the bonding accuracy is high. Specifically, the first bonding mechanism and the second bonding mechanism sequentially bond high-temperature adhesive tape to the front and back of the PCBA, the first pre-pressing mechanism and the second pre-pressing mechanism simultaneously pre-press the high-temperature adhesive tape to the front and back of the PCBA, and the first inspection mechanism and the second inspection mechanism simultaneously inspect the bonding status of the high-temperature adhesive tape on the front and back of the PCBA.

[0061] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model in any way. Any person skilled in the art can make many possible variations and modifications to the technical solution of this utility model using the disclosed technical means and content, or modify it into equivalent embodiments with equivalent changes, without departing from the scope of the technical solution of this utility model. Therefore, all equivalent changes made based on the shape, structure, and principle of this utility model without departing from its technical solution should be covered within the protection scope of this utility model.

Claims

1. A high-temperature adhesive tape application device for PCBA, characterized in that, It includes: The conveying mechanism is used to drive the PCBA to flow sequentially through the front and back bonding station, the pre-pressing station, and the inspection station; Several sets of clamping and flipping mechanisms are arranged at intervals on the conveying mechanism for clamping, fixing and flipping the PCBA by 180°. The first attaching mechanism and the second attaching mechanism are sequentially arranged at the front and back attaching stations along the conveying direction of the conveying mechanism. The attaching ends of the first attaching mechanism and the second attaching mechanism are both arranged corresponding to the clamping and flipping mechanism, and are used to attach high-temperature adhesive tape to the front and back of the PCBA. The first pre-pressing mechanism and the second pre-pressing mechanism are arranged opposite each other at the pre-pressing station. The pressing ends of the first pre-pressing mechanism and the second pre-pressing mechanism are both arranged corresponding to the clamping and flipping mechanism, and are used to pre-press and attach high-temperature adhesive tape to the front and back of the PCBA. The first and second testing mechanisms are arranged vertically opposite each other at the testing station. The testing ends of the first and second testing mechanisms are both set to correspond to the clamping and flipping mechanism, and are used to test the adhesion of high-temperature adhesive tape on the front and back of the PCBA.

2. The PCBA high-temperature adhesive tape application device according to claim 1, characterized in that, The clamping and flipping mechanism includes two sets of clamping and flipping components arranged opposite to each other on the conveying mechanism, and a PCBA flipping cavity is formed between the two sets of clamping and flipping components for fixing and flipping the PCBA. The clamping and flipping assembly includes a first gripper, a first cylinder for driving the first gripper to open and close, and a second cylinder for driving the first gripper to flip 180°. The first gripper is configured to correspond to the PCBA flipping cavity.

3. The PCBA high-temperature adhesive tape application device according to claim 2, characterized in that, The first attaching mechanism includes an adhesive tape traction assembly, a cutting assembly, a bearing assembly, and an incoming material detection assembly; The material arrival detection component is disposed on the carrier component corresponding to the PCBA flipping cavity, and is used to detect whether the PCBA to be attached has reached the carrier component, and the material arrival detection component is electrically connected to the adhesive tape traction component; The supporting component includes a supporting plate and a third cylinder for driving the supporting plate to rise and fall. A cutting groove and a supporting platform are sequentially arranged on the supporting plate along the conveying direction of the conveying mechanism. The cutting component is arranged corresponding to the cutting groove, and the adhesive tape traction component moves back and forth between the cutting groove and the support table to pull the uncut adhesive tape forward along the conveying direction of the conveying mechanism so that the high-temperature adhesive tape is attached to the surface of the PCBA.

4. The PCBA high-temperature adhesive tape application device according to claim 3, characterized in that, The cutting assembly includes cutting scissors corresponding to the cutting groove and a fourth cylinder for driving the cutting scissors to reciprocate within the cutting groove; The adhesive tape traction assembly includes an adhesive tape take-up and release structure, a first traction structure, a second traction structure, and a drive structure. The adhesive tape take-up and release structure holds the adhesive tape to be attached. The drive structure drives the first traction structure and the second traction structure to alternately move back and forth between the cutting groove and the support table, so as to realize that the first traction structure and the second traction structure alternately pull the adhesive tape forward along the conveying direction of the conveying mechanism, so that the high-temperature adhesive tape is attached to the surface of the PCBA.

5. The PCBA high-temperature adhesive tape application device according to claim 4, characterized in that, The first traction structure and the second traction structure have the same structure. The first traction structure includes a second gripper and a fifth cylinder for driving the second gripper to open and close. The second gripper is provided corresponding to the bearing component.

6. The PCBA high-temperature adhesive tape application device according to claim 5, characterized in that, The structure of the second attachment mechanism is the same as that of the first attachment mechanism.

7. The PCBA high-temperature adhesive tape application device according to claim 1, characterized in that, The first pre-pressing mechanism includes a roller bar, a roller wheel, and a spring. The roller wheel is movably disposed at the end of the roller bar, and the spring presses against the roller bar and the roller wheel. The roller wheel is disposed corresponding to the PCBA flipping cavity.

8. The PCBA high-temperature adhesive tape application device according to claim 7, characterized in that, The structure of the second pre-compression mechanism is the same as that of the first pre-compression mechanism.

9. The PCBA high-temperature adhesive tape application device according to claim 1, characterized in that, The first detection mechanism includes a first detection lens, which is positioned directly above the PCBA flipping cavity and is used to identify the accuracy of the high-temperature adhesive tape on the front of the PCBA during its movement along the conveying direction of the conveying mechanism.

10. The PCBA high-temperature adhesive tape application device according to claim 9, characterized in that, The second detection mechanism includes a second detection lens, which is positioned directly below the PCBA flipping cavity and is used to identify the accuracy of the high-temperature adhesive tape on the reverse side of the PCBA as it moves along the conveying direction of the conveying mechanism.

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