Combined adas domain controller water cooling heat dissipation device
By employing a combined water-cooling device of turbulence columns and heat dissipation modules in the ADAS domain controller, the heat dissipation problem of high-power chips is solved, achieving efficient heat conduction and improved component reliability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANGHAI KEBODA INTELLIGENT TECH CO LTD
- Filing Date
- 2025-04-21
- Publication Date
- 2026-06-12
AI Technical Summary
Traditional natural heat dissipation methods are inefficient when dealing with high-power chips and cannot meet the heat dissipation requirements of ADAS domain controllers, leading to component damage and reduced reliability.
A combined ADAS domain controller water-cooling heat dissipation device is adopted. By setting turbulence columns and heat dissipation modules in the flow channel, the flow rate and heat transfer efficiency of the coolant are improved. Different inner diameters of the inlet and outlet are designed to increase the flow rate and reduce the pressure drop. Aluminum material is used to reduce costs.
It improves heat dissipation efficiency, reduces component temperature rise, extends lifespan, increases product reliability, reduces failure rate, and ensures stable operation of the domain controller.
Smart Images
Figure CN224356484U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of water cooling heat dissipation, and in particular to a combined ADAS domain controller water cooling heat dissipation device. Background Technology
[0002] With the development of the intelligent driving era, ADAS domain controllers have been more widely used. As the functions of domain controllers gradually increase, high efficiency, high integration, and high power density are important directions for their development. High temperatures can damage components in ADAS domain controllers, causing problems such as thermal aging of materials, cracking of solder balls, solder joint detachment, or increased mechanical stress between components. Statistics show that for every 2°C increase in electronic component temperature, reliability decreases by 10%; when the temperature rises by 50°C, the lifespan is only one-sixth of that when the temperature rises by 25°C. Component failure rates increase sharply with increasing temperature.
[0003] However, traditional natural heat dissipation methods have limitations when dealing with high-power chips. Therefore, researchers began to explore more efficient heat dissipation technologies, leading to the development of water-cooling technology. The basic principle of water-cooling technology is to use water as a coolant. Water has a high specific heat capacity, enabling it to absorb a large amount of heat while its own temperature rises relatively little. However, the current traditional single water-cooled plate has low cooling conduction efficiency and insufficient cooling effect, failing to adequately meet the heat dissipation requirements of ADAS domain controllers.
[0004] Therefore, considering the aforementioned technical problems, it is necessary to provide a new technical solution. Utility Model Content
[0005] To address at least one of the technical problems existing in the prior art, this utility model provides a combined ADAS domain controller water-cooling heat dissipation device, which can solve the heat dissipation problem of ADAS domain controllers during high-power operation, ensuring their stable and reliable operation. This device employs an added baffle column and heat dissipation module in its water-cooling channel to effectively conduct heat away from the ADAS domain controller motherboard through water cooling, improving heat dissipation efficiency. This design can better increase the heat transfer efficiency of the coolant, reduce temperature rise, lower the early failure rate of components, and greatly improve product reliability. The specific technical solution is as follows:
[0006] This utility model provides a combined ADAS domain controller water-cooling heat dissipation device, which includes a housing and a cover plate;
[0007] The shell is provided with flow channel grooves, inlet and outlet. Along the fluid flow direction, the flow channel grooves include a first flow channel groove, a second flow channel groove and a third flow channel groove in sequence.
[0008] At least one group of turbulence columns is provided in the first flow channel, and multiple turbulence columns in each group are distributed in a regular manner.
[0009] The third flow channel is equipped with a heat dissipation module, which has multiple spaced heat dissipation fins. Fluid is configured to flow through the gaps between adjacent heat dissipation fins.
[0010] The cover plate seals and fits onto the flow channel groove, and the flow channel groove is formed by the sealing and enclosure of the shell and the cover plate.
[0011] As a preferred embodiment of the combined ADAS domain controller water cooling device of this utility model, multiple sets of turbulence columns are provided in the first flow channel groove, and the multiple turbulence columns in each set of turbulence columns are distributed in an array.
[0012] As a preferred embodiment of the combined ADAS domain controller water-cooled heat dissipation device of this utility model, the width of the first flow channel gradually increases along the fluid flow direction.
[0013] As a preferred embodiment of the combined ADAS domain controller water cooling heat dissipation device of this utility model, the flow channel is filled with coolant, which is an aqueous solution of ethylene glycol, a coolant containing refrigerant R22, or a coolant containing refrigerant R23.
[0014] As a preferred embodiment of the combined ADAS domain controller water-cooled heat dissipation device of this utility model, the flow channel is a U-shaped flow channel.
[0015] As a preferred embodiment of the combined ADAS domain controller water-cooling heat dissipation device described in this utility model, the turbulence column is a cylindrical turbulence column.
[0016] As a preferred embodiment of the combined ADAS domain controller water-cooled heat dissipation device of this utility model, the heat dissipation module is separately installed in the third flow channel groove;
[0017] The heat dissipation module has mounting plates on both sides along the radial direction, and mounting holes are provided on the mounting plates. The third flow channel groove is also provided with a mounting structure at the position corresponding to the mounting hole. The heat dissipation module is fixedly installed in the third flow channel groove through the mounting hole and the mounting structure.
[0018] As a preferred embodiment of the combined ADAS domain controller water cooling heat dissipation device of this utility model, the mounting hole on one side of the mounting plate is a circular hole, and the mounting hole on the other side of the mounting plate is an oblong hole.
[0019] The mounting structure uses a circular pin.
[0020] As a preferred embodiment of the combined ADAS domain controller water cooling device of this utility model, the third flow channel is provided with a limiting slot, and the heat dissipation module is limited to the limiting slot.
[0021] As a preferred embodiment of the combined ADAS domain controller water cooling heat dissipation device of this utility model, the cover plate is sealed and welded to the shell by friction stir welding or high temperature brazing.
[0022] As a preferred embodiment of the combined ADAS domain controller water-cooling heat dissipation device of this utility model, the housing is an aluminum housing, the cover plate is an aluminum cover plate, and the heat dissipation module is an aluminum extrusion heat dissipation module.
[0023] As a preferred embodiment of the combined ADAS domain controller water cooling device described in this utility model, the inner diameter of the water inlet is smaller than the inner diameter of the water outlet.
[0024] As a preferred embodiment of the combined ADAS domain controller water cooling device described in this utility model, the water inlet and water outlet are connected by a hollow tube.
[0025] As a preferred embodiment of the combined ADAS domain controller water-cooling heat dissipation device of this utility model, both the housing and the cover plate are formed by die casting.
[0026] As a preferred embodiment of the combined ADAS domain controller water cooling device described in this utility model, the turbulence column, limiting groove and circular pin in the flow channel groove are all integrally die-cast with the shell.
[0027] Compared with the prior art, the technical solution of this utility model has at least one or more of the following beneficial effects:
[0028] Compared to traditional single water-cooled heat sinks, this patented water-cooled heat dissipation device, by modifying the turbulence columns and heat dissipation modules within the flow channel, can better increase the turbulence effect of the water-cooling system and the flow rate of the coolant, thereby better increasing the heat transfer efficiency of the coolant, increasing the heat dissipation efficiency of the coolant, reducing the temperature rise of the domain controller, reducing the failure rate of components, and greatly improving the reliability of the product.
[0029] The working principle of this patented water-cooled heat dissipation device is as follows: When the ADAS domain controller generates power and heat, the coolant enters the U-shaped flow channel from the inlet of the housing. The coolant passes through several circular heat dissipation turbulence columns within the U-shaped flow channel, then through the heat dissipation fins of the aluminum extrusion heat dissipation module, and finally flows out from the outlet of the housing. Through the internal flow channel design, the heat generated by the domain controller is effectively exchanged with the coolant, resulting in better heat dissipation for the domain controller.
[0030] The oblong hole design facilitates assembly and avoids installation difficulties caused by tolerances. The housing and cover are made of aluminum, which can more effectively save costs for users compared to traditional copper materials.
[0031] The inner diameter of the inlet is set smaller than that of the outlet to prevent errors and increase the flow velocity, while the inner diameter of the outlet is larger to reduce the pressure drop of the entire flow channel. This design helps to reduce the overall procurement cost and improve the safety of use.
[0032] This device features a simple and novel structure with superior performance. When the domain controller requires a large power load, this water-cooled heat dissipation device can fully exchange heat with the coolant through the internal flow channel design. Compared with the internal flow channel design of traditional water-cooled plates, it has higher heat exchange efficiency and better heat dissipation performance, ensuring the stable and reliable operation of the domain controller.
[0033] Compared to traditional heat dissipation methods, this device has the following advantages: a) High heat dissipation efficiency: The water-cooled plate can quickly transfer heat from the heat source to the water-cooling system. The turbulence effect of several heat dissipation turbulence columns within the flow channel and the extruded aluminum heat dissipation module greatly improves heat dissipation efficiency, achieving excellent heat dissipation and effectively preventing overheating of the domain controller. b) Good error prevention: The inlet and outlet are designed with different inner diameters. The smaller inlet diameter effectively prevents errors and increases the flow velocity in the flow channel; the larger outlet diameter reduces the pressure drop across the entire flow channel. c) High reliability: The shell, cover, and heat dissipation module are all made of thermally conductive materials, possessing excellent durability and thermal conductivity, enabling long-term stable operation and reducing the failure rate.
[0034] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description
[0035] To more clearly illustrate the technical solution of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0036] Figure 1 This is an exploded structural diagram of the combined ADAS domain controller water-cooling heat dissipation device described in this patent;
[0037] Figure 2 This is a top view of the housing structure described in this patent;
[0038] Figure 3 This is a top view of the housing structure described in this patent;
[0039] Figure 4 This is a three-dimensional structural diagram of the heat dissipation module described in this patent;
[0040] Figure 5 This is a top view of the cover plate described in this patent.
[0041] Among them, 1-shell, 2-cover plate, 11-flow channel groove, 110-limiting groove, 111-first flow channel groove, 112-second flow channel groove, 113-third flow channel groove, 114-turbulence column group, 115-heat dissipation module, 116-heat dissipation fins, 117-mounting plate, 118-circular hole, 119-slender hole, 12-water inlet, 13-water outlet. Detailed Implementation
[0042] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.
[0043] In the description of this utility model, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this utility model. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0044] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "provided with," "equipped with," "connected," "installed," "sleeved," "opened," and "fixed," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0045] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
[0046] Please refer to Figure 1-5 .like Figure 1-5 As shown, this utility model provides a combined ADAS domain controller water cooling heat dissipation device. This water cooling heat dissipation device is usually used on ADAS domain controllers. Of course, this water cooling heat dissipation device can also be applied to other heat dissipation devices. The water cooling heat dissipation device includes a housing 1 and a cover plate 2.
[0047] The shell 1 is provided with a flow channel 11, an inlet 12 and an outlet 13. Along the fluid flow direction, the flow channel 11 includes a first flow channel 111, a second flow channel 112 and a third flow channel 113 in sequence. At least one turbulence column group 114 is provided in the first flow channel 111. Multiple turbulence columns in each turbulence column group 114 are regularly distributed. A heat dissipation module 115 is provided in the third flow channel 113. Multiple heat dissipation fins 116 are provided on the heat dissipation module 115. The fluid is configured to flow through the gap between two adjacent heat dissipation fins 116.
[0048] The cover plate 2 is sealed and closed onto the flow channel 11, and the flow channel 11 is formed by the sealing and enclosure of the shell 1 and the cover plate 2.
[0049] In the example, the flow rates at the inlet and outlet of the casing can be adjusted and changed according to the actual situation.
[0050] Compared to traditional single water-cooled heat sinks, this patented water-cooled heat dissipation device, by modifying the turbulence columns and heat dissipation modules within the flow channel, can better increase the turbulence effect of the water-cooling system and the flow rate of the coolant, thereby better increasing the heat transfer efficiency of the coolant, increasing the heat dissipation efficiency of the coolant, reducing the temperature rise of the domain controller, reducing the failure rate of components, and greatly improving the reliability of the product.
[0051] The working principle of this patented water-cooled heat dissipation device is as follows: When the ADAS domain controller generates power and heat, the coolant enters the U-shaped flow channel from the inlet of the housing. The coolant passes through several circular heat dissipation turbulence columns within the U-shaped flow channel, then through the heat dissipation fins of the aluminum extrusion heat dissipation module, and finally flows out from the outlet of the housing. Through the internal flow channel design, the heat generated by the domain controller is effectively exchanged with the coolant, resulting in better heat dissipation for the domain controller.
[0052] In a preferred embodiment, such as Figure 1-3 As shown, multiple turbulence column groups 114 are provided in the first flow channel groove 111, and the multiple turbulence columns in the turbulence column group 114 are distributed in an array.
[0053] Preferably, the baffle pillars include, but are not limited to, cylindrical baffle pillars, polygonal cylindrical baffle pillars, elliptical cylindrical baffle pillars, etc. More preferably, the baffle pillars within each baffle pillar group can have the same or different shapes. In the example, the baffle pillars in each baffle pillar group are all cylindrical baffle pillars. In the example, the height of the baffle pillars is substantially the same as the depth of the first flow channel groove 111.
[0054] In a preferred example, the width of the first flow channel 111 gradually increases along the fluid flow direction.
[0055] Preferred examples, such as Figure 1-3 As shown, flow channel 11 is a U-shaped flow channel. In this example, the second flow channel 112 is an arc-shaped flow channel.
[0056] In a preferred embodiment, the heat dissipation module 115 is integrally connected to the third flow channel 113 or separately installed in the third flow channel 113.
[0057] In the example, such as Figure 1 As shown, the heat dissipation module 115 is separately installed in the third flow channel groove 113;
[0058] The heat dissipation module 115 has mounting plates 117 on both radial sides, and mounting holes are provided on the mounting plates 117. A mounting structure is also provided at the position corresponding to the mounting hole in the third flow channel groove 113. The heat dissipation module 115 is fixedly installed in the third flow channel groove 113 through the mounting holes and the mounting structure. In the example, a circular pin is fixedly provided at the position corresponding to the mounting hole in the third flow channel groove 113.
[0059] Preferably, the baffle column and circular pin in the flow channel 11 are integrally connected to the shell. More preferably, the baffle column, limiting groove and circular pin in the flow channel 11 are all integrally die-cast with the shell.
[0060] Preferably, the mounting hole on one side of the mounting plate 117 is a circular hole 118, and the mounting hole on the other side of the mounting plate 117 is an oblong hole 119. In the example, the circular hole 118 and the oblong hole 119 of the mounting plate 117 are drilled by machining. Setting the oblong hole makes assembly easier and avoids installation problems caused by tolerances.
[0061] In a further preferred embodiment, the third flow channel 113 has a limiting groove 110, and the heat dissipation module 115 is limited within the limiting groove 110.
[0062] In the example, the heat dissipation module 115 is formed by extrusion molding.
[0063] In the example, the heat dissipation module 115 is an aluminum heat dissipation module, which is formed by aluminum extrusion molding. In the example, the aluminum extrusion-molded heat dissipation module is composed of relatively dense heat dissipation fins.
[0064] In a preferred embodiment, the cover plate 2 is sealed and welded to the housing 1. More preferably, the cover plate 2 is sealed and welded to the housing 1 by friction stir welding or high-temperature brazing. In the example, the housing 1 is an aluminum housing. In the example, the cover plate 2 is an aluminum cover plate. Using aluminum for both the housing and the cover plate can more effectively save costs for the user compared to traditional copper materials. In the example, the housing 1 is formed by die casting. In the example, the cover plate 2 is formed by die casting.
[0065] In a preferred embodiment, the inner diameter of the inlet 12 is smaller than the inner diameter of the outlet 13. Setting the inner diameter of the inlet smaller than that of the outlet serves to prevent errors and increase flow velocity, while the larger inner diameter of the outlet helps to reduce the pressure drop of the entire flow channel. This design helps to reduce overall procurement costs and improve operational safety.
[0066] Preferably, the inlet 12 and the outlet 13 are connected. In the example, the inlet 12 and the outlet 13 are connected by a flexible hose or other hollow tube. In the example, the inlet and outlet are located on the same side of the housing 1.
[0067] Preferably, the flow channel 11 contains a coolant, which is an aqueous solution of ethylene glycol or other aqueous solutions with high specific heat and high thermal conductivity. In this example, the refrigerant can be any refrigerant, such as ethylene glycol solutions of different concentrations, various refrigerants R23 (trifluoromethane for cryogenic refrigerants), R22 (difluorochloromethane), etc. More preferably, the coolant is an aqueous solution of ethylene glycol, a coolant containing refrigerant R22, or a coolant containing refrigerant R23.
[0068] This device features a simple and novel structure with superior performance. When the domain controller requires a large power load, this water-cooled heat dissipation device can fully exchange heat with the coolant through the internal flow channel design. Compared with the internal flow channel design of traditional water-cooled plates, it has higher heat exchange efficiency and better heat dissipation performance, ensuring the stable and reliable operation of the domain controller.
[0069] Compared to traditional heat dissipation methods, this device has the following advantages: a) High heat dissipation efficiency: The water-cooled plate can quickly transfer heat from the heat source to the water-cooling system. The turbulence effect of several heat dissipation turbulence columns within the flow channel and the extruded aluminum heat dissipation module greatly improves heat dissipation efficiency, achieving excellent heat dissipation and effectively preventing overheating of the domain controller. b) Good error prevention: The inlet and outlet are designed with different inner diameters. The smaller inlet diameter effectively prevents errors and increases the flow velocity in the flow channel; the larger outlet diameter reduces the pressure drop across the entire flow channel. c) High reliability: The shell, cover, and heat dissipation module are all made of thermally conductive materials, possessing excellent durability and thermal conductivity, enabling long-term stable operation and reducing the failure rate.
[0070] It should be noted that, unless otherwise specified, all features in the above embodiments or embodiments described herein can be combined arbitrarily.
[0071] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "yet another embodiment," "another embodiment," "other embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Furthermore, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.
[0072] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications and variations to the above embodiments within the scope of the present invention.
Claims
1. A combined ADAS domain controller water-cooling heat dissipation device, characterized in that, It includes a shell (1) and a cover plate (2); The shell (1) is provided with a flow channel (11), an inlet (12) and an outlet (13). Along the fluid flow direction, the flow channel (11) includes a first flow channel (111), a second flow channel (112) and a third flow channel (113) in sequence. At least one turbulence column group (114) is provided in the first flow channel (111), and multiple turbulence columns in each turbulence column group (114) are regularly distributed. A heat dissipation module (115) is provided in the third flow channel (113). The heat dissipation module (115) is provided with a plurality of spaced heat dissipation fins (116). Fluid is configured to flow through the gap between two adjacent heat dissipation fins (116). The cover plate (2) is sealed and closed on the flow channel groove (11), and the flow channel groove (11) is sealed and closed by the shell (1) and the cover plate (2) to form a flow channel.
2. The combined ADAS domain controller water-cooling heat dissipation device according to claim 1, characterized in that, Multiple sets of turbulence columns are provided in the first flow channel (111), and the multiple turbulence columns in each set are arranged in an array.
3. The combined ADAS domain controller water-cooling heat dissipation device according to claim 1, characterized in that, Along the direction of fluid flow, the width of the first flow channel (111) gradually increases; The flow channel contains coolant, which is an aqueous solution of ethylene glycol, a coolant containing refrigerant R22, or a coolant containing refrigerant R23.
4. The combined ADAS domain controller water-cooling heat dissipation device according to claim 1, characterized in that, The flow channel (11) is a U-shaped flow channel; The turbulence-disrupting column is cylindrical.
5. The combined ADAS domain controller water-cooling heat dissipation device according to claim 1, characterized in that, The heat dissipation module (115) is separately installed in the third flow channel groove (113); The heat dissipation module (115) has mounting plates (117) on both sides along the radial direction. Mounting holes are provided on the mounting plates (117). The third flow channel groove (113) is also provided with mounting structures at the positions corresponding to the mounting holes. The heat dissipation module (115) is fixedly installed in the third flow channel groove (113) through the mounting holes and mounting structures.
6. The combined ADAS domain controller water-cooling heat dissipation device according to claim 5, characterized in that, The mounting hole on one side of the mounting plate (117) is a circular hole (118), and the mounting hole on the other side of the mounting plate (117) is an oblong hole (119). The mounting structure uses a circular pin.
7. The combined ADAS domain controller water-cooling heat dissipation device according to claim 6, characterized in that, The third flow channel (113) has a limiting slot (110) and the heat dissipation module (115) is limited to the limiting slot (110).
8. The combined ADAS domain controller water-cooling heat dissipation device according to claim 1, characterized in that, The cover plate (2) is sealed and welded to the shell (1) by friction stir welding or high temperature brazing; The housing (1) is an aluminum housing, the cover plate (2) is an aluminum cover plate, and the heat dissipation module (115) is a heat dissipation module formed by aluminum extrusion.
9. The combined ADAS domain controller water-cooling heat dissipation device according to claim 1, characterized in that, The inner diameter of the inlet (12) is smaller than the inner diameter of the outlet (13); The inlet (12) and outlet (13) are connected by a hollow tube.
10. The combined ADAS domain controller water-cooling heat dissipation device according to claim 7, characterized in that, Both the shell (1) and the cover plate (2) are formed by die casting; The turbulence column, limiting groove and circular pin in the flow channel (11) are all integrally die-cast with the shell.