Combined adas domain controller water cooling heat dissipation device

By employing a combined water-cooling device of turbulence columns and heat dissipation modules in the ADAS domain controller, the heat dissipation problem of high-power chips is solved, achieving efficient heat conduction and improved component reliability.

CN224356484UActive Publication Date: 2026-06-12SHANGHAI KEBODA INTELLIGENT TECH CO LTD +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHANGHAI KEBODA INTELLIGENT TECH CO LTD
Filing Date
2025-04-21
Publication Date
2026-06-12

AI Technical Summary

⚠Technical Problem

Traditional natural heat dissipation methods are inefficient when dealing with high-power chips and cannot meet the heat dissipation requirements of ADAS domain controllers, leading to component damage and reduced reliability.

⚗Method used

A combined ADAS domain controller water-cooling heat dissipation device is adopted. By setting turbulence columns and heat dissipation modules in the flow channel, the flow rate and heat transfer efficiency of the coolant are improved. Different inner diameters of the inlet and outlet are designed to increase the flow rate and reduce the pressure drop. Aluminum material is used to reduce costs.

🎯Benefits of technology

It improves heat dissipation efficiency, reduces component temperature rise, extends lifespan, increases product reliability, reduces failure rate, and ensures stable operation of the domain controller.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a combined ADAS field controller water -cooling heat abstractor, it includes casing and apron, is seted up with the water inlet and the water outlet in the casing on the flow channel groove, along the fluid flow direction, the flow channel groove includes first flow channel groove, second flow channel groove and third flow channel groove in proper order, at least one turbulence column group is provided in first flow channel groove, and the multiple turbulence columns in each turbulence column group are regularly distributed, and the heat dissipation module is provided in third flow channel groove, and a plurality of interval distribution's heat dissipation fin is provided on the heat dissipation module, and fluid is configured to be able to flow through the gap between two two adjacent heat dissipation fins, and the apron is sealed and covers on the flow channel groove, and the flow channel groove is sealed and is surrounded through the casing and apron and forms the flow channel, the water -cooling flow channel of the device adopts the turbulence column and heat dissipation module of increasing, and the heat is effectively conducted from ADAS field controller mainboard through the water -cooling mode, improves the heat dissipation efficiency, can better increase the cooling liquid heat conduction efficiency, reduces the temperature rise, and the reliability of product is greatly improved.
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