A jig for removing gold from a packaged device
By designing a multi-station limiting fixture, the problem that existing equipment can only clamp a single type of packaged device was solved, and efficient tinning and gold removal of various packaged devices was achieved, improving the applicability and efficiency of the equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN ZHENHUA MICROELECTRONICS
- Filing Date
- 2025-04-22
- Publication Date
- 2026-06-16
Smart Images
Figure CN224359479U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of tinning and gold removal, and in particular to a fixture for tinning and gold removal of packaged devices. Background Technology
[0002] Currently, there are two common methods for removing gold from the pins of packaged devices in electrical components: manual double-pot tinning and soldering iron manual tinning. The process for double-pot tinning is as follows: pick up the tinned device - immerse the pins in flux - immerse the pins in tin pot 1 (with fixture assistance) - immerse the pins in flux - immerse the pins in tin pot 2 (with fixture assistance). Double-pot tinning requires relatively high operator skill, as the immersion time of the packaged device pins is manually controlled, and the consistency of tinning quality cannot be guaranteed. The process for soldering iron tinning is as follows: place the device on a hot plate (with fixture assistance) - apply solder to the tinned pins - remove the solder from the pins using desoldering wire. Soldering iron tinning also requires high operator skill, and the process of adding and removing solder can easily contaminate other parts of the component that do not need tinning, resulting in poor consistency of tinning quality.
[0003] With the increasing variety of packaged devices using gold-plated leads, and the widespread application of devices such as DIP (dual in-line package), QFP (quad flat package), and SOP (small out-line package), there is a need to introduce corresponding automated soldering and gold removal equipment to improve the current lead soldering and gold removal process and enhance the soldering capability of packaged devices. However, current automated soldering and gold removal equipment can only clamp a single type of packaged device, thus limiting its applicability. Each time the type of packaged device is changed, the corresponding clamp must be replaced, resulting in low efficiency in soldering and gold removal. Utility Model Content
[0004] The technical problem to be solved by this utility model is to provide a fixture for removing gold from tin-plated devices, so as to solve the above-mentioned problem.
[0005] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: A fixture for tinning and gold removal of packaged devices includes: two tinning assembly strips, two connecting strips, multiple limiting components, a base plate, multiple partition strips, and multiple spur bolts; the two tinning assembly strips and the two connecting strips are arranged opposite each other, and the two tinning assembly strips and the two connecting strips are alternately connected end to end to form a rectangular ring structure; the base plate is set at the bottom end of the tinning assembly strips and the connecting strips; the multiple partition strips are arranged side by side between the two tinning assembly strips, and the two ends of the partition strips are connected to the two connecting strips one by one; a station for placing the packaged device is formed between two adjacent partition strips; the multiple limiting components are installed one by one on the multiple stations; the spur bolts pass through the limiting components, the connecting strips, and the base plate; the packaged device is set in the limiting components, and the pins pass through the base plate.
[0006] The beneficial effects of this utility model are as follows: A workstation for placing packaged devices is formed between two adjacent partition bars, which facilitates the formation of multiple workstations on a single fixture, improving the efficiency of tinning and gold removal. Placing the packaged device within the limiting component helps to limit the packaged device at the workstation, preventing it from falling out or becoming loose. It also facilitates the adaptation to various packaged devices, avoiding the need to change fixtures when changing the type of packaged device. The fact that the lead of the packaged device passes through the base plate allows for simultaneous tinning and gold removal of the lead of multiple packaged devices when the fixture is placed into the moving shaft fixture slot of the automatic tinning machine. Through improvements to the fixture, this utility model facilitates the clamping of various packaged devices and packaged devices of various specifications, improving the applicability and efficiency of the automatic tinning machine.
[0007] Based on the above technical solution, the present invention can be further improved as follows.
[0008] Furthermore, a locking hole is provided at the top of the connecting strip, and the locking hole is a strip-shaped through hole.
[0009] The beneficial effect of adopting the above-mentioned further solution is that the locking hole facilitates the provision of a channel for fixing the limit assembly and the encapsulated devices within the limit assembly to the spur bolt.
[0010] Furthermore, the limiting component includes a first limiting plate and a second limiting plate, which are respectively disposed at the top and bottom of the connecting strip.
[0011] The beneficial effects of adopting the above-mentioned further solution are: the first limiting plate and the second limiting plate help to hold the packaged device in the station and prevent the packaged device from falling out or loosening from the station.
[0012] Furthermore, the base plate is provided with multiple pin through holes and multiple bolt through holes. The multiple pin through holes are arranged side by side parallel to the tin-plated assembly strip. The pin through holes are strip-shaped through holes, and the bolt through holes are strip-shaped through holes provided on both sides of the pin through holes.
[0013] The advantages of adopting the above-mentioned further solutions are: pin through-holes facilitate the provision of channels for the pins of the packaged device to pass through the base plate, and bolt through-holes facilitate the provision of channels for the spur bolts to fix the limiting assembly and the packaged device within the limiting assembly.
[0014] Furthermore, the pin holes are located below the separator bars, and the multiple pin holes are staggered and correspond one-to-one with the multiple separator bars.
[0015] The beneficial effect of adopting the above-mentioned further solution is that it allows the pins of the packaged device to pass through the pin holes as close as possible after the packaged device is clamped on the work station.
[0016] Furthermore, the packaging device is disposed between the first limiting plate and the second limiting plate, and the pins of the packaging device pass through the pin holes.
[0017] The beneficial effect of adopting the above-mentioned further solution is that it helps to expose the pins of the packaged device, thereby facilitating the use of an automatic soldering machine to solder and remove gold from the pins of the packaged device.
[0018] Furthermore, the bolt holes are located below the locking holes, and the bolt holes are located on both sides of the workstation.
[0019] The advantage of adopting the above-mentioned further solution is that it helps to provide a fixed channel for the limit components at each workstation.
[0020] Furthermore, the ram's horn bolt passes through the locking hole, the first limiting plate, the second limiting plate, and the bolt through hole.
[0021] The beneficial effect of adopting the above-mentioned further solution is that it helps to fix the limiting component and the packaging device in the middle of the limiting component on the work station.
[0022] Furthermore, a locking groove is provided on the side of the two tin-plated assembly strips that are far apart from each other, and the locking groove is a strip-shaped groove structure.
[0023] The beneficial effect of adopting the above-mentioned further solution is that the positioning slot is conducive to matching with the moving shaft clamping slot in the automatic soldering machine, thereby fixing the clamp in the automatic soldering machine, and using the automatic soldering machine to solder and remove gold from the exposed pins on the base plate.
[0024] Furthermore, the tin-plated assembly strip and the connecting strip are made of aluminum, and the base plate is made of fiberglass.
[0025] The beneficial effect of adopting the above-mentioned further solution is that it helps to prevent molten solder from sticking to the soldering assembly strip, connecting strip, and base plate. Attached Figure Description
[0026] Figure 1 A schematic diagram of the overall structure provided for an embodiment of this utility model;
[0027] Figure 2 A bottom view of the overall structure provided for an embodiment of this utility model;
[0028] Figure 3 A top view of the tin-plated assembly strip, connecting strip, and partition strip provided in an embodiment of this utility model;
[0029] Figure 4 A schematic diagram of the structure of the base plate provided in an embodiment of this utility model;
[0030] Figure 5 A schematic diagram showing the connection between the limiting component and the connecting strip provided in an embodiment of this utility model.
[0031] The attached diagram lists the components represented by each number as follows:
[0032] 1. Tin-plated assembly strip; 2. Connecting strip; 3. Limiting assembly; 4. Base plate; 5. Separator strip; 6. Horn bolt; 11. Locking slot; 21. Locking hole; 31. First limiting plate; 32. Second limiting plate; 41. Pin through hole; 42. Bolt through hole. Detailed Implementation
[0033] The principles and features of this utility model are described below. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.
[0034] like Figure 1 and Figure 2 As shown, a fixture for removing gold from tin-plated packaging devices includes: two tin-plating assembly strips 1, two connecting strips 2, multiple limiting components 3, a base plate 4, multiple partition strips 5, and multiple spur bolts 6. The two tin-plating assembly strips 1 and the two connecting strips 2 are arranged opposite each other, and the two tin-plating assembly strips 1 and the two connecting strips 2 are connected end to end to form a rectangular ring structure. The base plate 4 is located at the bottom end of the tin-plating assembly strips 1 and the connecting strips 2. The multiple partition strips 5 are arranged side by side between the two tin-plating assembly strips 1, and the two ends of each partition strip 5 are connected to the two connecting strips 2. A station for placing the packaging device is formed between two adjacent partition strips 5. The multiple limiting components 3 are installed one-to-one on the multiple stations. The spur bolts 6 pass through the limiting components 3, the connecting strips 2, and the base plate 4. The packaging device is placed inside the limiting components 3, and its pins pass through the base plate 4.
[0035] The beneficial effects of this utility model are as follows: A workstation for placing packaged devices is formed between two adjacent partition bars, which facilitates the formation of multiple workstations on a single fixture, improving the efficiency of tinning and gold removal. Placing the packaged device within the limiting component helps to limit the packaged device at the workstation, preventing it from falling out or becoming loose. It also facilitates the adaptation to various packaged devices, avoiding the need to change fixtures when changing the type of packaged device. The fact that the lead of the packaged device passes through the base plate allows for simultaneous tinning and gold removal of the lead of multiple packaged devices when the fixture is placed into the moving shaft fixture slot of the automatic tinning machine. Through improvements to the fixture, this utility model facilitates the clamping of various packaged devices and packaged devices of various specifications, improving the applicability of the automatic tinning machine.
[0036] Preferred, such as Figure 3 As shown, the top end of the connecting strip 2 is provided with a locking hole 21, which is a strip-shaped through hole.
[0037] The advantages of adopting the above preferred solution are that the locking hole provides a channel for fixing the spur bolt to the limiting component and the encapsulated device within the limiting component.
[0038] Preferred, such as Figure 5 As shown, the limiting component 3 includes a first limiting plate 31 and a second limiting plate 32, which are respectively disposed at the top and bottom of the connecting strip 2.
[0039] The advantages of adopting the above preferred solution are: the first limiting plate and the second limiting plate help to hold the packaged device in the station and prevent the packaged device from falling out or loosening from the station.
[0040] Preferred, such as Figure 4 As shown, the base plate 4 is provided with a plurality of pin through holes 41 and a plurality of bolt through holes 42. The plurality of pin through holes 41 are arranged in parallel with the tin-plated assembly strip 1. The pin through holes 41 are strip-shaped through holes, and the bolt through holes 42 are strip-shaped through holes provided on both sides of the pin through holes 41.
[0041] The advantages of adopting the above preferred solution are: pin through-holes facilitate the provision of channels for the pins of the packaged device to pass through the base plate, and bolt through-holes facilitate the provision of channels for the spur bolts to fix the limiting assembly and the packaged device within the limiting assembly.
[0042] Preferred, such as Figure 1 and Figure 2 As shown, the pin through holes 41 are located below the separator strip 5, and the multiple pin through holes 41 are staggered and correspond one-to-one with the multiple separator strips 5.
[0043] It should be noted that "misaligned setting" means that the pin through hole 41 is set close to the separator 5, but the pin through hole 41 is not set directly below the separator 5. That is, from the top view, both the separator 5 and the pin through hole 41 next to the separator 5 can be seen at the same time. Therefore, the multiple separators 5 and the multiple pin through holes 41 are set in a one-to-one misaligned manner.
[0044] The advantage of adopting the above preferred solution is that it allows the pins of the packaged device to pass through the pin holes as close as possible after the packaged device is clamped on the work station.
[0045] Preferably, the encapsulation device is disposed between the first limiting plate 31 and the second limiting plate 32, and the pins of the encapsulation device pass through the pin through hole 41.
[0046] The advantages of adopting the above preferred solution are: it helps to expose the pins of the packaged device, thereby facilitating the use of an automatic soldering machine to solder and remove gold from the pins of the packaged device.
[0047] Preferred, such as Figure 2 and Figure 4 As shown, the bolt through hole 42 is located below the locking hole 21, and the bolt through hole 42 is located on both sides of the workstation.
[0048] The advantage of adopting the above preferred solution is that it helps to provide a fixed channel for the limiting components at each workstation.
[0049] Preferred, such as Figure 1 and Figure 5 As shown, the ram's horn bolt 6 passes through the locking hole 21, the first limiting plate 31, the second limiting plate 32, and the bolt through hole 42.
[0050] It should be noted that in the preferred embodiment of this utility model, after the spur bolt 6 passes through the lowest bolt hole 42, it can be connected to the nut. However, for easier disassembly and assembly, it can also be without connecting to the nut, and the limiting component 3 and the encapsulation device in the middle of the limiting component 3 can be fixed by the thread on the spur bolt 6 alone.
[0051] The advantages of adopting the above preferred solution are: it helps to fix the limiting component and the encapsulation device in the middle of the limiting component on the work station.
[0052] Preferred, such as Figure 1 and Figure 5 As shown, a locking groove 11 is provided on the side of the two tin-plated assembly strips 1 that are far apart from each other. The locking groove 11 is a strip-shaped groove structure.
[0053] The advantages of adopting the above preferred solution are: the positioning slot is conducive to matching with the moving shaft clamping slot in the automatic soldering machine, thereby fixing the clamp in the automatic soldering machine, and using the automatic soldering machine to solder and remove gold from the exposed pins on the base plate.
[0054] Preferably, the tin-plated assembly strip 1 and the connecting strip 2 are made of aluminum, and the base plate 4 is made of fiberglass.
[0055] The advantages of adopting the above preferred solution are: it helps to prevent molten solder from sticking to the soldering assembly strip, connecting strip, and base plate.
[0056] The working process of this utility model is described below:
[0057] like Figures 1 to 5 As shown, DIP, QFP, and SOP packaged devices are first placed between the first limiting plate 31 and the second limiting plate 32, and the pins on one side of the packaged device are passed through the pin through hole 41, while the pins on the other sides are blocked by the base plate 4; then the screw bolts 6 are tightened to limit the packaged device within the limiting component 3, and the limiting component 3 is fixed in the station formed by two adjacent partition bars 5; then the fixture of this utility model is placed in the moving shaft fixture slot of the automatic soldering machine, and the automatic soldering machine is used to perform soldering and gold removal operations on one side of the pins of DIP, SOP, and QFP packaged devices.
[0058] The tinning and gold removal process for the pins on the other sides of DIP, QFP, and SOP packages is the same as above. Simply adjust the position of the package on the workstation repeatedly, pass the pins on different sides through the pin holes 41 in sequence, and repeat the above operation.
[0059] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.
[0060] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0061] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0062] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0063] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.
[0064] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.
Claims
1. A fixture for removing gold from tin-plated packages, characterized in that, include: Two tin-plated assembly strips (1), two connecting strips (2), multiple limiting components (3), base plate (4), multiple partition strips (5), and multiple spur bolts (6); Two tinned assembly strips (1) and two connecting strips (2) are arranged opposite to each other. The two tinned assembly strips (1) and two connecting strips (2) are connected end to end to form a rectangular ring structure. The base plate (4) is set at the bottom end of the tinned assembly strips (1) and the connecting strips (2). Multiple partition strips (5) are arranged side by side between the two tinned assembly strips (1). The two ends of the partition strips (5) are connected to the two connecting strips (2) one by one. A station for placing the packaged device is formed between two adjacent partition strips (5). Multiple limiting components (3) are installed on multiple stations one by one. The spur bolts (6) pass through the limiting components (3), the connecting strips (2) and the base plate (4). The packaged device is set in the limiting components (3) and the pins pass through the base plate (4).
2. The fixture for removing gold plating from packaged devices according to claim 1, characterized in that, The top end of the connecting strip (2) is provided with a locking hole (21), which is a strip-shaped through hole.
3. The fixture for removing gold plating from packaged devices according to claim 2, characterized in that, The limiting component (3) includes a first limiting plate (31) and a second limiting plate (32), which are respectively disposed at the top and bottom of the connecting strip (2).
4. The fixture for removing gold plating from packaged devices according to claim 3, characterized in that, The base plate (4) is provided with a plurality of pin through holes (41) and a plurality of bolt through holes (42). The plurality of pin through holes (41) are arranged in parallel with the tin-plated assembly strip (1). The pin through holes (41) are strip-shaped through holes, and the bolt through holes (42) are strip-shaped through holes provided on both sides of the pin through holes (41).
5. The fixture for removing gold plating from packaged devices according to claim 4, characterized in that, The pin holes (41) are located below the separator (5), and the multiple pin holes (41) are staggered and correspond one-to-one with the multiple separators (5).
6. The fixture for removing gold plating from packaged devices according to claim 5, characterized in that, The packaged device is disposed between the first limiting plate (31) and the second limiting plate (32), and the pins of the packaged device pass through the pin through hole (41).
7. The fixture for removing gold plating from packaged devices according to claim 4, characterized in that, The bolt through hole (42) is located below the locking hole (21), and the bolt through hole (42) is located on both sides of the work station.
8. The fixture for removing gold plating from packaged devices according to claim 4, characterized in that, The ram bolt (6) passes through the locking hole (21), the first limiting plate (31), the second limiting plate (32) and the bolt through hole (42).
9. The fixture for removing gold plating from packaged devices according to claim 1, characterized in that, The two tin-plated assembly strips (1) are provided with a locking groove (11) on the side away from each other. The locking groove (11) is a strip-shaped groove structure.
10. The fixture for removing gold plating from packaged devices according to claim 1, characterized in that, The tin-plated assembly strip (1) and the connecting strip (2) are made of aluminum, and the base plate (4) is made of fiberglass.