Chip nozzle changing device and system

Abstract

The utility model discloses a kind of chip suction nozzle replacement device and system, chip suction nozzle replacement device includes: taking and placing module and placing module;Placing module is used to place at least one target suction nozzle;Taking and placing module includes vertical drive assembly, connecting component and suction component, vertical drive assembly is used to drive suction component to slide along the first surface of connecting component in vertical direction, suction component includes rotating motor, rotating shaft and taking and placing head, rotating motor is connected with the first end of rotating shaft, taking and placing head is connected with the second end of rotating shaft, rotating motor is used to rotate taking and placing head by rotating shaft, and taking and placing head is used to take and place target suction nozzle. By vertical drive assembly driving taking and placing head moves to placing module in vertical direction, and by rotating motor rotating taking and placing head to corresponding angle, accurately taking and placing target suction nozzle;Target suction nozzle can be quickly replaced, reduce replacement cost.

Description

Technical Field

[0001] This utility model relates to the field of chip adsorption equipment technology, and in particular to a chip suction nozzle replacement device and system. Background Technology

[0002] In the chip manufacturing and packaging process, specialized suction nozzles are frequently used to pick up chips. However, suction nozzles are not components that can be used for a long time; their lifespan is limited, and they often need to be replaced depending on changes in chip size, testing process requirements, and other conditions.

[0003] In existing technologies, nozzle replacement is usually done by direct human hand contact, which is cumbersome and costly. Utility Model Content

[0004] In view of this, the purpose of this utility model embodiment is to provide a chip nozzle replacement device and system that can quickly replace the nozzle and reduce replacement costs.

[0005] In a first aspect, this utility model provides a chip nozzle replacement device, including a pick-and-place module and a placement module; the placement module is used to place at least one target nozzle.

[0006] The pick-and-place module includes a vertical drive component, a connecting component, and a suction component. The vertical drive component is used to drive the suction component to slide along the first surface of the connecting component in the vertical direction. The suction component includes a rotary motor, a rotary shaft, and a pick-and-place head. The rotary motor is connected to the first end of the rotary shaft, and the pick-and-place head is connected to the second end of the rotary shaft. The rotary motor is used to rotate the pick-and-place head through the rotary shaft, and the pick-and-place head is used to pick up and place the target nozzle.

[0007] Optionally, the suction assembly further includes a sliding housing, the rotating shaft is disposed inside the sliding housing, the sliding housing is provided with a sliding groove, the first surface of the connecting assembly is provided with a slide rail, and the sliding groove is slidably connected to the slide rail.

[0008] Optionally, the pick-and-place head includes a suction block and a gripper, the first end of the gripper being connected to the suction block, the suction block being used to pick up the chip through the target nozzle, and the second end of the gripper being used to hold the target nozzle.

[0009] Optionally, the gripper includes a first clamping piece, a second clamping piece, and an elastic connecting piece. The first clamping piece and the second clamping piece are elastically connected through the elastic connecting piece. The first clamping piece is fixedly connected to the suction block. The second end of the second clamping piece is provided with a bending structure.

[0010] Optionally, the target nozzle includes a nozzle substrate and a nozzle connecting plate, wherein a first surface of the nozzle connecting plate is fixedly connected to a second surface of the nozzle substrate, and a through suction hole is provided between the nozzle substrate and the nozzle connecting plate.

[0011] Optionally, both the first and second ends of the nozzle substrate are provided with trapezoidal chamfers, which match the bending structure, and the first and second ends of the nozzle substrate are opposite to each other.

[0012] Optionally, the third and fourth ends of the suction nozzle substrate are provided with positioning grooves, and the suction block is provided with a first positioning post. The positioning grooves match the first positioning post, and the third and fourth ends of the suction nozzle substrate are opposite to each other.

[0013] Optionally, the suction nozzle connecting plate is provided with a cross groove, and the suction hole is provided at the center of the cross groove.

[0014] Optionally, the placement module includes a placement substrate and a plurality of placement grooves disposed on the placement substrate. Both the first and second ends of the placement grooves are provided with clearance grooves, and a second positioning post is provided at the corner of the placement groove. The placement groove is used to place the target suction nozzle, the clearance groove is used to avoid the bending structure, and the second positioning post is used to position the target suction nozzle.

[0015] Secondly, this utility model embodiment provides a chip nozzle replacement system, including the chip nozzle replacement device and a robotic arm, wherein the robotic arm is fixedly connected to the second surface of the connecting component.

[0016] The implementation of this utility model embodiment has the following beneficial effects: This utility model embodiment provides a chip nozzle replacement device, including a pick-and-place module and a placement module; the placement module is used to place at least one target nozzle; the pick-and-place module includes a vertical drive component, a connecting component, and a suction component. The vertical drive component is used to drive the suction component to slide along a first surface of the connecting component in a vertical direction. The suction component includes a rotary motor, a rotary shaft, and a pick-and-place head. The rotary motor is connected to a first end of the rotary shaft, and the pick-and-place head is connected to a second end of the rotary shaft. The rotary motor is used to rotate the pick-and-place head through the rotary shaft, and the pick-and-place head is used to pick up and place the target nozzle. By driving the pick-and-place head to move vertically onto the placement module through the vertical drive component, and by rotating the rotary shaft through the rotary motor, the rotary shaft rotates the pick-and-place head to a corresponding angle, accurately picking up and placing the target nozzle; it enables quick replacement of the target nozzle and reduces replacement costs. Attached Figure Description

[0017] Figure 1This is a schematic diagram of the structure of a chip nozzle replacement device provided in an embodiment of the present invention;

[0018] Figure 2 This is a schematic diagram of the suction head provided in an embodiment of the present invention;

[0019] Figure 3 This is a schematic diagram of the gripper structure provided in an embodiment of the present invention;

[0020] Figure 4 This is a schematic diagram of the structure of the suction nozzle provided in an embodiment of the present utility model;

[0021] Figure 5 This is a schematic diagram of the placement module provided in an embodiment of the present invention.

[0022] Reference numerals: Vertical drive assembly 100, rotary motor 110, connecting assembly 120, pick-and-place head 130, suction block 131, gripper 132, first clamping piece 1321, second clamping piece 1322, elastic connecting piece 133, target nozzle 134, nozzle base plate 1341, cross groove 1342, suction hole 1343, nozzle connecting plate 1344, trapezoidal chamfer 1345, positioning groove 1346, first positioning post 135;

[0023] The components include a placement module 200, a placement groove 210, a clearance groove 220, a second positioning post 230, and a placement substrate 240. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] In this embodiment of the invention, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design described as "exemplary" or "for example" in this embodiment of the invention should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0026] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0027] Reference Figure 1-2 This utility model provides a chip nozzle replacement device, including a pick-and-place module and a placement module 200;

[0028] The placement module 200 is used to place at least one target nozzle 134;

[0029] The pick-and-place module includes a vertical drive assembly 100, a connecting assembly 120, and a suction assembly. The vertical drive assembly 100 is used to drive the suction assembly to slide along the first surface of the connecting assembly 120 in the vertical direction. The suction assembly includes a rotary motor 110, a rotating shaft, and a pick-and-place head 130. The rotary motor 110 is connected to the first end of the rotating shaft, and the pick-and-place head 130 is connected to the second end of the rotating shaft. The rotary motor 110 is used to rotate the pick-and-place head 130 through the rotating shaft, and the pick-and-place head 130 is used to pick up and place the target suction nozzle 134.

[0030] Specifically, the vertical drive component 100 is configured as a vertical motor, which drives the entire suction component to slide vertically relative to the connecting component 120, thereby driving the pick-and-place head 130 to move closer to or away from the placement module 200 in the vertical direction. After the pick-and-place head 130 approaches the placement module 200, the rotary motor 110 rotates the rotating shaft, which synchronously rotates the pick-and-place head 130, thereby adjusting the angle of the pick-and-place head 130 so that it is aligned with the target area on the placement module 200, thereby placing or picking up the target nozzle 134 in the target area; it is easy to see that the target area is the area on the placement module 200 used to place the target nozzle 134. By automating the pick-and-place of the target nozzle 134, the tedious manual operation is eliminated, the replacement efficiency of the target nozzle 134 is high, and the replacement cost is low.

[0031] Optionally, the suction assembly further includes a sliding housing, the rotating shaft is disposed inside the sliding housing, the sliding housing is provided with a sliding groove, the first surface of the connecting assembly 120 is provided with a slide rail, and the sliding groove is slidably connected to the slide rail.

[0032] Specifically, the sliding housing is the housing used to house the rotating shaft. A rotary motor 110 is housed at the first end of the sliding housing, and a first through hole is provided at the first end of the sliding housing to allow the motor rod of the rotary motor 110 to pass through, connecting the motor rod to the rotating shaft. Similarly, a second through hole is provided at the second end of the sliding housing to allow the connecting rod on the pick-and-place head 130 to pass through. The connecting rod passes through the second through hole and is fixedly connected to the rotating shaft. The rotary motor 110 can rotate the pick-and-place head 130 via the rotating shaft, thereby adjusting the angle of the pick-and-place head 130 for precise alignment with the target area. The sliding housing is provided with a sliding groove, and the first surface of the connecting assembly 120 is provided with a slide rail. The sliding groove and the slide rail are slidably connected. Therefore, the vertical drive assembly 100 can drive the sliding housing to slide relative to the connecting assembly 120, thereby adjusting the position of the pick-and-place head 130 vertically. The second surface of the connecting component 120 can be used to connect a robotic arm or a fixing mechanism. The robotic arm can move the entire chip nozzle changing device to the corresponding position, or the fixing mechanism can fix the position of the entire chip nozzle changing device, and then the chip nozzle changing device can be moved by moving the fixing mechanism. The specific structure of the second surface of the connecting component 120 is not limited here.

[0033] Optionally, the pick-and-place head 130 includes a suction block 131 and a gripper 132. The first end of the gripper 132 is connected to the suction block 131. The suction block 131 is used to pick up the chip through the target nozzle 134. The second end of the gripper 132 is used to hold the target nozzle 134.

[0034] Specifically, refer to Figure 2 The suction block 131 is connected to a corresponding vacuum suction device, the specific location of which is not limited. The vacuum device picks up or releases the chip after passing through the suction block 131 and the target nozzle 134, thereby completing the chip transfer. Specifically, there are two grippers 132, which are respectively used to grip the first end and the second end of the target nozzle 134, thereby fixing the position of the nozzle so that it can pick up or release the chip.

[0035] Optionally, the gripper 132 includes a first clamping piece 1321, a second clamping piece 1322, and an elastic connecting piece 133. The first clamping piece 1321 and the second clamping piece 1322 are elastically connected through the elastic connecting piece 133. The first clamping piece 1321 is fixedly connected to the suction block 131. The second end of the second clamping piece 1322 is provided with a bending structure.

[0036] Specifically, refer to Figure 3The first clamping piece 1321 is fixedly connected to the suction block 131. The first clamping piece 1321 and the second clamping piece 1322 are elastically connected by an elastic connecting piece 133. A bending structure is provided at the second end of the second clamping piece 1322, which can clamp the target suction nozzle 134. The clamping or releasing of the target suction nozzle 134 by the second clamping piece 1322 can be completed by utilizing the elasticity of the elastic connecting piece 133.

[0037] Optionally, the target nozzle 134 includes a nozzle substrate 1341 and a nozzle connecting plate 1344. The first surface of the nozzle connecting plate 1344 is fixedly connected to the second surface of the nozzle substrate 1341, and a through suction hole 1343 is provided between the nozzle substrate 1341 and the nozzle connecting plate 1344.

[0038] Optionally, the first and second ends of the nozzle substrate 1341 are provided with trapezoidal chamfers 1345, which match the bending structure, and the first and second ends of the nozzle substrate 1341 are opposite to each other.

[0039] Specifically, refer to Figure 2-4 A through suction hole 1343 is provided between the suction nozzle substrate 1341 and the suction nozzle connecting plate 1344, and a corresponding through hole is also provided on the suction block 131 to match the suction hole 1343, so that the chip can be suctioned on the suction nozzle connecting plate 1344 through the suction hole 1343. Both the first and second ends of the nozzle substrate 1341 are provided with trapezoidal chamfers 1345. The trapezoidal chamfers 1345 and the bending structure of the second clamping piece 1322 are matched, so that after the bending structure presses down on the trapezoidal chamfers 1345, the elastic connecting piece 133 on the second clamping piece 1322 bends outward. After passing through the trapezoidal chamfers 1345 under the bending structure, the elastic connecting piece 133 returns to its original position inward, thereby driving the bending structure to clamp the target nozzle 134. Similarly, after the bending structure presses up on the trapezoidal chamfers 1345, the elastic connecting piece 133 on the second clamping piece 1322 bends outward. After passing through the trapezoidal chamfers 1345 under the bending structure, the elastic connecting piece 133 returns to its original position inward, thereby releasing the target nozzle 134.

[0040] Optionally, the third and fourth ends of the suction base plate 1341 are provided with positioning grooves 1346, and the suction block 131 is provided with a first positioning post 135. The positioning grooves 1346 match the first positioning post 135, and the third and fourth ends of the suction base plate 1341 are opposite to each other.

[0041] Specifically, the positioning grooves 1346 provided at the third and fourth ends of the suction base plate 1341 match the multiple first positioning posts 135 provided on the suction block 131. After the first positioning posts 135 pass through the positioning grooves 1346, the positioning of the suction base plate 1341 is completed, that is, the positioning of the target suction nozzle 134 is completed, so as to prevent the target suction nozzle 134 from shifting after being clamped by the gripper 132.

[0042] Optionally, the suction nozzle connecting plate 1344 is provided with a cross groove 1342, and the suction hole 1343 is provided at the center of the cross groove 1342.

[0043] Specifically, refer to Figure 4 The cross groove 1342 increases the vacuum area between the nozzle connecting plate 1344 and the chip, thereby increasing the adsorption stability between the nozzle connecting plate 1344 and the chip. Furthermore, the shape of the cross groove 1342 itself ensures the uniformity of chip adsorption, which also increases the stability of chip adsorption.

[0044] In some embodiments, the placement module 200 includes a placement substrate 240 and a plurality of placement grooves 210 disposed on the placement substrate 240. Both the first and second ends of the placement grooves 210 are provided with clearance grooves 220, and the corners of the placement grooves 210 are provided with second positioning posts 230. The placement grooves 210 are used to place the target suction nozzle 134, the clearance grooves 220 are used to avoid the bending structure, and the second positioning posts 230 are used to position the target suction nozzle 134.

[0045] Specifically, refer to Figure 5 The placement substrate 240 has multiple target areas, each of which has a placement groove 210, a clearance groove 220, and a second positioning post 230. The clearance groove 220 is located at the first and second ends of the placement groove 210, thereby avoiding the bending structure and allowing the bending structure to press down and clamp the target nozzle 134. By setting the second positioning post 230 at the corner of the placement groove 210, the corner of the target nozzle 134 is fixed by the second positioning post 230, preventing the target nozzle 134 from shifting.

[0046] The implementation of this utility model embodiment has the following beneficial effects: This utility model embodiment provides a chip nozzle replacement device, including a pick-and-place module and a placement module 200; the placement module 200 is used to place at least one target nozzle 134; the pick-and-place module includes a vertical drive component 100, a connecting component 120 and a suction component, the vertical drive component 100 is used to drive the suction component to slide along the first surface of the connecting component 120 in the vertical direction, the suction component includes a rotary motor 110, a rotary shaft and a pick-and-place head 130, the rotary motor 110 is connected to the first end of the rotary shaft, the pick-and-place head 130 is connected to the second end of the rotary shaft, the rotary motor 110 is used to rotate the pick-and-place head 130 through the rotary shaft, and the pick-and-place head 130 is used to pick up and place the target nozzle 134. The vertical drive assembly 100 drives the pick-and-place head 130 to move vertically onto the placement module 200, and the rotary motor 110 rotates the rotating shaft to rotate the pick-and-place head 130 to the corresponding angle, accurately picking up and placing the target nozzle 134; the target nozzle 134 can be quickly replaced, reducing replacement costs.

[0047] Secondly, this utility model embodiment provides a chip nozzle replacement system, including the chip nozzle replacement device and a robotic arm, wherein the robotic arm is fixedly connected to the second surface of the connecting component 120.

[0048] It can be seen that the chip nozzle replacement devices in the above embodiments are all applicable to this system embodiment. The specific functions implemented in this system embodiment are the same as those in the above chip nozzle replacement device embodiments, and the beneficial effects achieved are also the same as those achieved in the above chip nozzle replacement device embodiments.

[0049] In this specification, the reference to the term "in a particular embodiment" means that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0050] The above is a detailed description of the preferred embodiments of the present utility model. However, the present utility model is not limited to the described embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present utility model. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.

Claims

1. A chip nozzle replacement device, characterized in that, Includes a pick-and-place module and a placement module; The placement module is used to place at least one target nozzle; The pick-and-place module includes a vertical drive component, a connecting component, and a suction component. The vertical drive component is used to drive the suction component to slide along the first surface of the connecting component in the vertical direction. The suction component includes a rotary motor, a rotary shaft, and a pick-and-place head. The rotary motor is connected to the first end of the rotary shaft, and the pick-and-place head is connected to the second end of the rotary shaft. The rotary motor is used to rotate the pick-and-place head through the rotary shaft, and the pick-and-place head is used to pick up and place the target nozzle.

2. The chip nozzle replacement device according to claim 1, characterized in that, The suction assembly further includes a sliding housing, the rotating shaft is disposed inside the sliding housing, the sliding housing is provided with a sliding groove, the first surface of the connecting assembly is provided with a sliding rail, and the sliding groove is slidably connected to the sliding rail.

3. The chip nozzle replacement device according to claim 1, characterized in that, The pick-and-place head includes a suction block and a gripper. The first end of the gripper is connected to the suction block. The suction block is used to pick up the chip through the target nozzle. The second end of the gripper is used to hold the target nozzle.

4. The chip nozzle replacement device according to claim 3, characterized in that, The gripper includes a first clamping piece, a second clamping piece, and an elastic connecting piece. The first clamping piece and the second clamping piece are elastically connected through the elastic connecting piece. The first clamping piece is fixedly connected to the suction block. The second end of the second clamping piece is provided with a bending structure.

5. The chip nozzle replacement device according to claim 4, characterized in that, The target nozzle includes a nozzle substrate and a nozzle connecting plate. The first surface of the nozzle connecting plate is fixedly connected to the second surface of the nozzle substrate, and a through suction hole is provided between the nozzle substrate and the nozzle connecting plate.

6. The chip nozzle replacement device according to claim 5, characterized in that, Both the first and second ends of the nozzle substrate are provided with trapezoidal chamfers, which match the bending structure, and the first and second ends of the nozzle substrate are opposite to each other.

7. The chip nozzle replacement device according to claim 5, characterized in that, The third and fourth ends of the suction nozzle substrate are provided with positioning grooves, and the suction block is provided with a first positioning post. The positioning grooves match the first positioning post, and the third and fourth ends of the suction nozzle substrate are opposite to each other.

8. The chip nozzle replacement device according to claim 5, characterized in that, The suction nozzle connecting plate is provided with a cross groove, and the suction hole is provided at the center of the cross groove.

9. The chip nozzle replacement device according to claim 4, characterized in that, The placement module includes a placement substrate and a plurality of placement grooves disposed on the placement substrate. Both the first and second ends of the placement grooves are provided with clearance grooves, and a second positioning post is provided at the corner of the placement groove. The placement groove is used to place the target suction nozzle, the clearance groove is used to avoid the bending structure, and the second positioning post is used to position the target suction nozzle.

10. A chip nozzle replacement system, characterized in that, The device includes the chip nozzle changing apparatus and robotic arm as described in any one of claims 1-9, wherein the robotic arm is fixedly connected to the second surface of the connecting assembly.

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