Inductor, filter device, filter circuit, and electronic device
By designing a special pad layout on the inductor housing, the capacitor is moved from the PCB to the inductor, solving the balance between miniaturization and performance stability of electronic devices, and achieving PCB reduction and improved power load performance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANGHAI BIREN TECH CO LTD
- Filing Date
- 2026-05-09
- Publication Date
- 2026-06-16
Smart Images
Figure CN224366642U_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of circuit power supply technology, and in particular to an inductor, a filter device, a filter circuit, and an electronic device. Background Technology
[0002] With advancements in manufacturing processes, miniaturization of electronic devices has become a trend in equipment development. This miniaturization can reshape the economics and sustainability of data centers. Through chip process miniaturization, high-density motherboard design, and liquid cooling technology innovation, the computing power per unit space of servers in data centers has been significantly improved, directly reducing space occupancy and construction costs. Simultaneously, the miniaturization of electronic devices also helps achieve energy efficiency.
[0003] However, as the miniaturization of electronic devices gradually approaches the limits of their space, the difficulty of further miniaturization is increasing.
[0004] In addition, the miniaturization of electronic devices has also brought about some problems such as signal stability, which affects the performance of the devices. Therefore, there is a need to strike a balance between miniaturization of electronic devices and ensuring stable performance. Utility Model Content
[0005] In view of this, the present disclosure provides an inductor, a filter device, a filter circuit, and an electronic device to help improve the miniaturization of electronic devices and enhance the performance of electrical loads in electronic devices.
[0006] According to one aspect of the embodiments of this disclosure, an inductor is provided, comprising:
[0007] case;
[0008] The output pad is fixed to the housing. The output pad includes a first output solder joint and a second output solder joint. The first output solder joint is located on the first surface of the housing, and the second output solder joint is located on the second surface of the housing. The first surface and the second surface are two surfaces opposite to each other.
[0009] A grounding pad is fixed to the housing. The grounding pad includes a device connection solder joint and a grounding solder joint, wherein the device connection solder joint is located on the second surface and the grounding solder joint is located on the first surface.
[0010] In one possible implementation, the output pad extends from the first output solder joint through a third surface of the housing to the second output solder joint, wherein the third surface is adjacent to both the first surface and the second surface.
[0011] In one possible implementation, the ground pad extends from the device connection solder joint through the surface of the housing to the ground solder joint, and the ground pad avoids the output pad.
[0012] In one possible implementation, the grounding pad extends from the device connection solder joint via a fourth surface of the housing to the grounding solder joint, wherein the fourth surface is adjacent to the first surface, the second surface and the third surface simultaneously.
[0013] In one possible implementation, the grounding pad extends on the surface of the housing to form a ring-shaped structure surrounding the housing.
[0014] In one possible implementation, the inductor further includes:
[0015] The input pad is fixed to the first surface.
[0016] In one possible implementation, on the first surface, the grounding solder joint is located between the input pad and the first output solder joint.
[0017] According to another aspect of the embodiments of this disclosure, a filtering device is provided, comprising:
[0018] Inductors as described in any of the preceding items;
[0019] A capacitor, wherein the two solder joints of the capacitor are respectively coupled to the second output solder joint and the device connection solder joint.
[0020] According to another aspect of the embodiments of this disclosure, a filtering circuit is provided, comprising:
[0021] The filtering device described above, wherein the first surface faces the PCB;
[0022] The output trace is routed on the PCB and coupled to the first output solder joint;
[0023] The grounding trace is laid on the PCB and coupled to the grounding solder joint.
[0024] According to another aspect of the embodiments of this disclosure, an electronic device is provided, including an inductor as described in any of the preceding claims and / or a filtering device as described above.
[0025] As can be seen from the above scheme, the inductor, filter device, filter circuit, and electronic device disclosed herein achieve the mounting of other electronic components, such as capacitors, on the inductor surface by extending the output pad of the inductor to the housing surface away from the PCB and adding a grounding pad on the housing surface of the inductor that extends from the housing surface away from the PCB to the surface facing the PCB and is coupled to the ground wire in the PCB. This achieves a three-dimensional layout of electronic components. On the one hand, it can realize the relocation of some electronic components that were originally arranged on the PCB to the inductor, thereby saving the original layout space of electronic components such as capacitors on the PCB and contributing to the miniaturization of PCB and electronic devices. On the other hand, without changing the original arrangement of capacitors on the PCB, the additional capacitors installed on the inductor also help to increase the capacitance value of the overall filter circuit, thereby helping to reduce output voltage ripple and improve the performance of the electrical load. Attached Figure Description
[0026] Figure 1 This is a top view of a typical PCB component layout structure in related technologies;
[0027] Figure 2 yes Figure 1 A side sectional view of the layout shown;
[0028] Figure 3A This is a schematic diagram of the three-dimensional structure of the inductor according to a first embodiment of the present disclosure;
[0029] Figure 3B This is a second schematic diagram of the three-dimensional structure of the inductor according to the first embodiment of this disclosure;
[0030] Figure 4A This is a schematic diagram of a third-dimensional structure of the inductor according to a second embodiment of the present disclosure;
[0031] Figure 4B This is a second perspective structural diagram of the inductor according to a second embodiment of the present disclosure;
[0032] Figure 5 This is a side view of the filtering device according to an embodiment of the present disclosure;
[0033] Figure 6 This is a schematic diagram of a three-dimensional structure of a filter circuit according to an illustrative embodiment;
[0034] Figure 7 This is a schematic diagram illustrating the positional relationship between ground traces, output traces, and input traces on a PCB surface, according to an illustrative embodiment.
[0035] Figure 8A This is a top view schematic diagram of a PCB layout structure using a filtering device according to an embodiment of the present disclosure;
[0036] Figure 8B This is a side view of a PCB layout structure using a filtering device according to an embodiment of the present disclosure;
[0037] Figure 9A This is a top view schematic diagram of another PCB layout structure of the filtering device using an embodiment of the present disclosure;
[0038] Figure 9B This is a side view of another PCB layout structure of the filtering device using an embodiment of the present disclosure;
[0039] Figure 10 This is a schematic diagram of the filter circuit structure.
[0040] In the attached diagram, the component names represented by each number are as follows:
[0041] 100. Filtering device
[0042] 1. Inductor
[0043] 11. Shell,
[0044] 12. Output pads
[0045] 121. First output solder joint,
[0046] 122. Second output solder joint,
[0047] 13. Grounding pad,
[0048] 131. Component connection solder joints,
[0049] 132. Grounding solder joint,
[0050] 14. Input pads,
[0051] 151. First surface,
[0052] 152. Second surface
[0053] 153. The third surface.
[0054] 154. The fourth surface.
[0055] 2. Capacitors
[0056] 3. Electrical load,
[0057] 4. PCB
[0058] 41. Output wiring,
[0059] 411, Second pad,
[0060] 42. Grounding wiring,
[0061] 421, First pad,
[0062] 43. Input terminal routing,
[0063] 431. Third pad. Detailed Implementation
[0064] To make the objectives, technical solutions, and advantages of this disclosure clearer, the following detailed description is provided with reference to the accompanying drawings and embodiments.
[0065] It should be noted that the terms "first," "second," etc., in the specification, claims, and drawings of this disclosure are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.
[0066] As used in the specification and claims of this disclosure, “coupled (or connected)” may refer to any direct or indirect means of connection. For example, if a first device is coupled (or connected) to a second device, it should be interpreted as the first device being directly connected to the second device, or the first device being indirectly connected to the second device through other devices or some means of connection.
[0067] Figure 1 This is a top view of a typical PCB component layout structure in related technologies. Figure 2 yes Figure 1 A side sectional view of the layout shown. (See attached image.) Figure 1 , Figure 2 As shown, in the related technology, in the layout of devices on the PCB (Printed Circuit Board) 4, multiple inductors 1 and capacitors 2 are usually arranged around the electrical load (e.g., chip) 3. The filter circuit composed of these inductors 1 and capacitors 2 is part of the voltage regulator module (VRM) that supplies power to the electrical load 3, so as to filter out noise in the power supply and output a stable voltage.
[0068] from Figure 1 and Figure 2 As can be seen, inductor 1 and capacitor 2 are both directly arranged on the surface of PCB4. In order to ensure the stability of power supply, the number of inductors 1 and capacitors 2 arranged is usually large, and these inductors 1 and capacitors 2 will occupy part of the layout space of PCB4.
[0069] On the one hand, if the space occupied by these inductors 1 and capacitors 2 can be reduced, it will help to reduce the size of PCB4, which in turn will help to improve the miniaturization of electronic devices.
[0070] On the other hand, with the significant increase in the power of the electrical load 3, both the load step and load slew rate of the dynamic load current increase substantially. Supporting this significantly increased load step and load slew rate requires a larger capacitance to effectively maintain the amplitude of the output voltage ripple. As a filter circuit at the output, increasing the capacitance of the output capacitor helps improve the stability of the power supply system. Specifically, increasing the capacitance helps reduce the output voltage ripple. Reduced voltage ripple means a higher minimum output voltage (Vmin), thus helping to improve the performance of the electrical load 3. Therefore, the required number of capacitors also tends to increase. However, the trend towards miniaturization of electronic devices makes increasing the size of PCB4 to accommodate more electronic components not the optimal solution. Therefore, the number of capacitors that can be increased without increasing the size of PCB4 is very limited. It is evident that, given the limited size of PCB4, there is a contradiction between the need to increase the number of capacitors 2 and the difficulty in increasing the number of capacitors 2. Among them, load step refers to the situation where the power consumption demand of electrical load 3 changes suddenly (step change), load change rate refers to the rate at which the current or power of electrical load 3 changes with time, and ripple refers to the AC component superimposed on DC voltage or current.
[0071] In view of this, the present disclosure provides an inductor, a filter device, a filter circuit, and an electronic device. On the one hand, it reduces the space occupied by electronic devices on a PCB, thereby contributing to the miniaturization of electronic devices. On the other hand, it increases the capacitance value of the capacitors in the filter circuit by increasing the number of capacitors, at least without increasing or decreasing the PCB size, in order to help reduce output voltage ripple and thus help improve the performance of the electrical load in the electronic device.
[0072] Figure 3A This is a schematic diagram of the three-dimensional structure of the inductor according to a first embodiment of the present disclosure. Figure 3B This is a second schematic diagram of the three-dimensional structure of the inductor according to the first embodiment of this disclosure. Figure 3A , Figure 3BAs shown, the inductor 1 includes a housing 11, an output pad 12, and a ground pad 13. In the illustrative embodiment, the housing 11 has a cubic structure, and an inductor core (not shown) is disposed inside the housing 11. The output pad 12 is fixed to the housing 11 and coupled to the inductor core. The output pad 12 includes a first output solder joint 121 and a second output solder joint 122, wherein the first output solder joint 121 is located on the first surface 151 of the housing 11, and the second output solder joint 122 is located on the second surface 152 of the housing 11. The ground pad 13 is fixed to the housing 11 and includes a device connection solder joint 131 and a ground solder joint 132, wherein the device connection solder joint 131 is located on the second surface 152, and the ground solder joint 132 is located on the first surface 151.
[0073] In the illustrative embodiment, the first surface 151 and the second surface 152 are two surfaces opposite to each other, for example... Figure 3A , Figure 3B In the diagram, the first surface 151 is the surface of the housing 11 facing the opposite direction of the z-axis, and the second surface 152 is the surface of the housing 11 facing the positive direction of the z-axis. The orientations of the first surface 151 and the second surface 152 are opposite to each other. In the illustrative embodiment, the output pad 12 extends from the first output solder joint 121 through the third surface 153 of the housing 11 to the second output solder joint 122, wherein the third surface 153 is adjacent to both the first surface 151 and the second surface 152. In the illustrative embodiment, the third surface 153 is, for example... Figure 3A , Figure 3B The surface 153 faces the positive x-axis, and the orientation of the third surface 153 is perpendicular to the orientation of the first surface 151 and the second surface 152. The second output solder joint 122 and the device connection solder joint 131 are used to connect other electronic devices. In an illustrative embodiment, these other electronic devices may be, for example, capacitors.
[0074] like Figure 3A , Figure 3B As shown, in the illustrative embodiment, the ground pad 13 extends from the device connection solder joint 131 through the surface of the housing 11 to the ground solder joint 132, and the ground pad 13 avoids each other from the output pad 12.
[0075] Specifically, in the illustrative embodiment, the ground pad 13 extends from the device connection solder joint 131 via the fourth surface 154 of the housing 11 to the ground solder joint 132, wherein the fourth surface 154 is adjacent to the first surface 151, the second surface 152, and the third surface 153 simultaneously, for example... Figure 3A , Figure 3BAs shown, the fourth surface 154 is the surface facing the positive y-axis. Because the output pad 12 extends along the third surface 153 and the ground pad 13 extends along the fourth surface 154, a mutual avoidance structure can be naturally formed between the ground pad 13 and the output pad 12.
[0076] In addition to Figure 3A , Figure 3B In addition to the embodiment shown, another surface opposite the fourth surface 154 is also adjacent to the first surface 151, the second surface 152, and the third surface 153. Therefore, the ground pad 13 can also be connected from the device connection solder joint 131 via another surface of the housing 11 opposite the fourth surface 154 (e.g., Figure 3A , Figure 3B The surface shown (which faces the opposite direction of the y-axis and can be called the fifth surface) extends to the grounding solder point 132.
[0077] Considering the adequacy of grounding, the grounding pad 13 can extend along both the fourth surface 154 and the fifth surface simultaneously. Figure 4A This is a schematic diagram of a third-dimensional structure of the inductor according to a second embodiment of the present disclosure. Figure 4B This is a second perspective structural diagram of the inductor according to a second embodiment of this disclosure. Figure 3A , Figure 3B The only difference in their structures is that Figure 4A , Figure 4B In the illustrated embodiment, the grounding pad 13 extends simultaneously along both the fourth surface 154 and the fifth surface. Furthermore, in the illustrative embodiment, the grounding pad 13 extends on the surface of the housing 11 to form a ring-shaped structure surrounding the housing 11. This ring-shaped structure helps ensure adequate grounding; a break in either the fourth surface 154 or the fifth surface of the grounding pad 13 will not affect the grounding of the capacitor 2 on the inductor 1.
[0078] like Figure 3A , Figure 4A As shown, in the illustrative embodiment, the inductor 1 further includes an input pad 14, which is fixed to the first surface 151 of the housing 11. In the illustrative embodiment, on the first surface 151, the output pad 12 (first output solder joint 121) and the input pad 14 are located on opposite sides of the ground pad 13 (ground solder joint 132), i.e., the output pad 12 and the input pad 14 are isolated by the ground pad 13. In this way, the ground pad 13 can isolate the noise of the input pad 14, which helps to reduce or eliminate the influence of the input pad 14 on the power supply or signal of the output pad 12. After being mounted on the PCB, it can effectively reduce or even eliminate the influence of noise fluctuations in the power supply or signal on the input pad 14 side on the output power supply or signal of the output pad 12.
[0079] like Figure 3A , Figure 4A As shown, in the illustrative embodiment, on the first surface 151, the grounding pad 132 is located between the input pad 14 and the first output pad 121, thereby achieving isolation between the output pad 12 and the input pad 14 using the grounding pad 13.
[0080] In the illustrative embodiment, when mounted on a PCB, the second surface 152 is the surface of the housing 11 away from the PCB. This allows other electronic components coupled to the second output solder joint 122 and the device connection solder joint 131 to be mounted outside the PCB by the inductor 1. Therefore, the structure composed of the inductor 1 and other electronic components only occupies the space of the inductor 1 on the PCB, without occupying additional space for other electronic components, thus contributing to the reduction of PCB size and the miniaturization of electronic devices. Regarding the size of the second output solder joint 122, the figure shown is only illustrative. In a specific implementation, the size of the second output solder joint 122 can be comparable to that of the first output solder joint 121, or it can extend to the entire width of the second surface 152, thereby facilitating the parallel arrangement of more components, such as capacitors 2, between the device connection solder joint 131 and the second output solder joint 122.
[0081] Figure 5 This is a side view of the filtering device according to an embodiment of the present disclosure, as shown in the diagram. Figure 5 As shown, the filtering device 100 of this embodiment includes an inductor 1 and a capacitor 2. The inductor 1 is the inductor 1 described in any of the above embodiments. The two solder joints of the capacitor 2 are respectively coupled to a second output solder joint 122 and a device connection solder joint 131. In an illustrative embodiment, the number of capacitors 2 connected between the second output solder joint 122 and the device connection solder joint 131 can be one, two, or more. When the number of capacitors 2 is two or more, these capacitors 2 are connected in parallel between the second output solder joint 122 and the device connection solder joint 131. The specific number of capacitors 2 connected in parallel depends on the width of the second output solder joint 122 and the device connection solder joint 131, as well as the width of the capacitors 2. For example, if the width of the second output solder joint 122 and the device connection solder joint 131 exceeds five times the width of the capacitors 2, at least five capacitors 2 can be connected in parallel between the second output solder joint 122 and the device connection solder joint 131.
[0082] In an illustrative embodiment, in conjunction with a real-world application scenario, the first surface 151 is the surface of the inductor 1 facing the PCB.
[0083] The filtering device 100 of this embodiment extends the output pad 12 of the inductor 1 to the surface of the housing 11 away from the PCB, and adds a grounding pad 13 on the surface of the housing 11 of the inductor 1 that extends from the surface of the housing 11 away from the PCB (second surface) to the surface of the housing 11 facing the PCB (first surface) and is coupled to the ground wire in the PCB. This realizes the mounting of the capacitor 2 on the surface of the inductor 1 and achieves a three-dimensional layout of the inductor 1 and the capacitor 2. On the one hand, it can realize the relocation of the capacitor 2 originally arranged on the PCB to the inductor 1, thereby saving the original layout space of the capacitor 2 on the PCB and contributing to the miniaturization of the PCB and electronic equipment. On the other hand, without changing the original arrangement of the capacitor 2 on the PCB, the additional capacitor 2 installed on the inductor 1 also helps to increase the capacitance value in the filtering circuit as a whole, thereby helping to reduce the output voltage ripple and improve the performance of the electrical load 3.
[0084] In the illustrative embodiment, a filter circuit is also provided. Figure 6 This is a schematic diagram of a three-dimensional structure of a filter circuit according to an illustrative embodiment, such as... Figure 6 As shown, the filter circuit includes a filter device as described in the above embodiment, an output trace 41, and a ground trace 42, wherein the first surface 151 of the inductor 1 ( Figure 6 (Not shown) Oriented towards PCB4, i.e., towards the negative z-axis direction. Output trace 41 is routed on PCB4 and coupled to the first output solder joint 121. Ground trace 42 is routed on PCB4 and coupled to the ground solder joint 132. Of course, in most practical applications, ground trace 42 is directly coupled to the ground conductive area or ground pattern in PCB4 through a VIA (Vertical Interconnect Access) hole, such as a large area GND shape (ground copper) or GND layer (ground layer), rather than... Figure 6 The obvious trace shape in the middle. Figure 6 The representation of the grounding trace 42 is for illustrative purposes only.
[0085] In addition, in the illustrative embodiment, the filter circuit may further include an input trace 43. The input trace 43 is routed on PCB 4 and coupled to input pad 14 (because...). Figure 6 As it has a three-dimensional structure, the input pad 14 is obscured by the housing 11 of the inductor 1 and is therefore not shown.
[0086] In addition, similar to grounding trace 42, in most practical applications, input trace 43 and output trace 41 are usually connected using conductive patterns and conductive networks, such as large-area shape connections (copper connections), rather than trace connections. Figure 6 The representation of the input trace 43 and the output trace 41 is for illustrative purposes only.
[0087] Figure 7 This is a schematic diagram illustrating the positional relationship between ground traces, output traces, and input traces on a PCB surface, based on an exemplary embodiment. It is a top-view diagram of the PCB. Figure 7 As shown in the illustrative embodiment, the first pad 421 of the ground trace 42 is located between the second pad 411 of the output trace 41 and the third pad 431 of the input trace 43. In this way, in the PCB 4, the ground trace 42 also serves as a shield between the input trace 43 and the output trace 41. In this embodiment, the ground trace 42 simultaneously functions as both the grounding function of the inductor 1 and the noise interference shielding function.
[0088] Figure 8A This is a top view schematic diagram of a PCB layout structure using a filtering device according to an embodiment of this disclosure. Figure 8B This is a side view schematic diagram of a PCB layout structure using a filtering device according to an embodiment of this disclosure. Figure 8A , Figure 8B In the illustrated embodiment, because the filter device 100 places the capacitor 2 on top of the inductor 1, the layout of the PCB 4 is more compact, which helps to reduce the size of the PCB 4 and improve the miniaturization of electronic devices. Furthermore, because the space for the capacitor 2 is saved, the distance between the inductor 1 and the electrical load 3 can be placed closer. Therefore, the power supply distance from the inductor 1 to the electrical load 3 within the PCB 4 is shorter, which helps to reduce the line impedance from the inductor 1 to the electrical load 3, and also helps to reduce power loss and improve power efficiency.
[0089] Figure 9A This is a top view schematic diagram of another PCB layout structure for the filtering device using an embodiment of this disclosure. Figure 9B This is a side view schematic diagram of another PCB layout structure for the filtering device using an embodiment of this disclosure. Figure 9A , Figure 9B In the illustrated embodiment, while employing the filter device 100 of this disclosure embodiment, the original capacitor 2 arranged on the PCB4 is retained. Thus, the capacitor 2 in the filter device 100 of this disclosure embodiment and the capacitor 2 arranged on the PCB4 together become the capacitor of the filter circuit. Therefore, based on the original filter circuit, the capacitor of the filter circuit is increased by adding the capacitor 2 on the inductor 1, which helps to reduce the output voltage ripple and improve the performance of the electrical load 3.
[0090] Figure 10 This is a schematic diagram of the filter circuit structure, such as... Figure 10 And compare Figure 6 As shown, one end of capacitor 2 is coupled to the output terminal (output terminal pad 12) of inductor 1, and the other end of capacitor 2 is grounded through ground pad 13. Therefore, the filtering device 100 of this embodiment does not change the actual circuit structure, even when applied to... Figure 9A , Figure 9B In this scenario, there is no need to change the original wiring structure in PCB4, so the modification cost of PCB4 is almost zero. It should be noted that, generally speaking, in order to reduce or eliminate the interference of power network noise on the input pad 14 side of inductor 1 to the output pad 12 side, in the PCB4 wiring of related technologies, a grounded shielding line is usually laid below the location where inductor 1 is placed to shield the interference of input trace 43 to output trace 41. When using the filter device 100 of this embodiment, the grounding solder point 132 of the grounding pad 13 on inductor 1 can be directly coupled to the shielding line.
[0091] Based on a typical electronic device's PCB4 circuitry design, in an illustrative embodiment, the electrical load 3 is a chip. In this illustrative embodiment, the chip can be any of a CPU (Central Processing Unit), GPU (Graphics Processing Unit), TPU (Tensor Processing Unit), NPU (Neural Network Processing Unit), DPU (Deep Learning Processing Unit), APU (Accelerated Processing Unit), and GPGPU (General-Purpose Computing on Graphics Processing Unit). In this illustrative embodiment, the chip can be a single-core chip or a SoC (System on Chip) chip.
[0092] In an illustrative embodiment, an electronic device is also provided, which includes an inductor 1 and / or a filter device 100 as described in any of the preceding embodiments. In an illustrative embodiment, the electronic device may, for example, be an artificial intelligence server.
[0093] It should be noted that the accompanying drawings in this disclosure are only used to show the relative positions and connections between the components and do not represent the actual specific implementation structure. Furthermore, structural parts that are not closely related to the embodiments of this application are omitted.
[0094] In addition, in the description of the embodiments of this disclosure, the x-axis, y-axis, and z-axis are perpendicular to each other.
[0095] The above description is merely a preferred embodiment of this disclosure and is not intended to limit this disclosure. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.
Claims
1. An inductor, characterized in that, include: case; The output pad is fixed to the housing. The output pad includes a first output solder joint and a second output solder joint. The first output solder joint is located on the first surface of the housing, and the second output solder joint is located on the second surface of the housing. The first surface and the second surface are two surfaces opposite to each other. A grounding pad is fixed to the housing. The grounding pad includes a device connection solder joint and a grounding solder joint, wherein the device connection solder joint is located on the second surface and the grounding solder joint is located on the first surface.
2. The inductor according to claim 1, characterized in that: The output pad extends from the first output solder joint through the third surface of the housing to the second output solder joint, wherein the third surface is adjacent to both the first surface and the second surface.
3. The inductor according to claim 2, characterized in that: The grounding pad extends from the device connection solder joint through the surface of the housing to the grounding solder joint, and the grounding pad avoids the output pad.
4. The inductor according to claim 2, characterized in that: The grounding pad extends from the device connection solder joint through the fourth surface of the housing to the grounding solder joint, wherein the fourth surface is adjacent to the first surface, the second surface and the third surface.
5. The inductor according to claim 2, characterized in that: The grounding pad extends on the surface of the housing to form a ring-shaped structure surrounding the housing.
6. The inductor according to claim 1, characterized in that, The inductor also includes: The input pad is fixed to the first surface.
7. The inductor according to claim 6, characterized in that: On the first surface, the grounding solder joint is located between the input pad and the first output solder joint.
8. A filtering device, characterized in that, include: The inductor as described in any one of claims 1 to 7; A capacitor, wherein the two solder joints of the capacitor are respectively coupled to the second output solder joint and the device connection solder joint.
9. A filter circuit, characterized in that, include: The filtering device as claimed in claim 8, wherein the first surface faces the PCB; The output trace is routed on the PCB and coupled to the first output solder joint; The grounding trace is laid on the PCB and coupled to the grounding solder joint.
10. An electronic device, characterized in that, Includes the inductor as described in any one of claims 1 to 7 and / or the filter as described in claim 8.