A semiconductor package jig

Abstract

The utility model discloses a kind of semiconductor packaging jigs, it is related to semiconductor packaging technical field, including shell, the top middle part of shell is equipped with positioning slot, the inside of shell is provided with ejection mechanism, the ejection mechanism includes connecting rod, the top of connecting rod is fixed with ejector plate, the outside of connecting rod is sleeved with reset spring, the bottom of connecting rod is fixed with connecting plate, the bottom of connecting plate is fixed with moving block;The semiconductor packaging jig, by the setting of ejection mechanism, through the start of electric telescopic rod, drive extruding block to move, so that the inclined plane of extruding block extrudes the inclined plane of moving block, so that moving block drives connecting plate to rise, so that connecting rod drives ejector plate to rise, after the substrate of packaging is ejected, make substrate and positioning slot separate, so as to facilitate the substrate to be taken out, avoid forcibly taking out to cause product damage, improve the convenience of device to be taken out.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, specifically a semiconductor packaging fixture. Background Technology

[0002] Semiconductor packaging refers to the process of processing tested wafers into individual chips according to product models and functional requirements. The packaging process is as follows: the wafer from the front-end wafer process is cut into small wafers by a dicing process. Then, the cut wafers are glued onto the islands of the corresponding substrate (lead frame). Then, ultra-fine metal (gold, tin, copper, aluminum) wires or conductive resin are used to connect the bonding pads of the wafers to the corresponding pins of the substrate to form the required circuit. Finally, the individual wafers are encapsulated and protected with plastic shells.

[0003] Current semiconductor packaging fixtures typically place the substrate in the positioning groove of the fixture for packaging when packaging plastic housings. After packaging, the finished product is difficult to remove from the positioning groove because the substrate is attached to it. To address this, we propose a semiconductor packaging fixture. Utility Model Content

[0004] The purpose of this invention is to provide a semiconductor packaging fixture to solve the problem in the prior art where, when packaging plastic housings, the substrate is attached to the positioning groove, making it difficult to remove the finished product from the positioning groove.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor packaging fixture, including a housing, a positioning groove being provided in the center of the top of the housing, an ejection mechanism being provided inside the housing, and a clamping mechanism being provided on the outside of the housing;

[0006] The ejection mechanism includes a connecting rod, an ejection plate fixed to the top of the connecting rod, a return spring sleeved on the outer side of the connecting rod, a connecting plate fixed to the bottom of the connecting rod, a moving block fixed to the bottom of the connecting plate, an electric telescopic rod fixed to the left and right sides of the inner cavity of the outer shell, and a pressing block fixed to the output shaft end of the electric telescopic rod.

[0007] Preferably, the top end of the reset spring is fixedly connected to the top of the inner cavity of the housing, and the bottom end of the reset spring is fixedly connected to the top of the connecting plate, so as to facilitate the connecting plate to drive the moving block to reset.

[0008] Preferably, the top of the extrusion block and both sides of the moving block are provided with inclined surfaces, so that the moving block moves when the extrusion block extrudes the moving block, and the input end of the electric telescopic rod is electrically connected to the output end of an external power supply.

[0009] Preferably, the outer wall of the ejector plate fits against the inner wall of the positioning groove, and the bottom of the housing is provided with a through hole for easy wiring.

[0010] Preferably, the clamping mechanism includes mounting seats symmetrically fixed to the top of the housing, a pressure rod rotatably inside the mounting seat, a fixing seat fixed to the bottom edge of the pressure rod, a connecting block rotatably inside the fixing seat, a threaded cylinder fixed to the bottom of the connecting block, connecting seats fixed to the bottom of both sides of the housing, a rotating block rotatably inside the connecting seat, a fixing plate fixed to the top of the rotating block, a drive motor fixed to the top center of the fixing plate, and a screw fixed to the end of the output shaft of the drive motor.

[0011] Preferably, the clamping mechanism further includes limiting cavities symmetrically opened at the bottom of the threaded cylinder, and limiting rods symmetrically fixed at the top of the fixing plate.

[0012] Preferably, the limiting rod is slidably connected to the inside of the limiting cavity, and a baffle is fixed to the end of the limiting rod to prevent the limiting rod from disengaging from the limiting cavity. The threaded cylinder is screwed to the outside of the screw, and the input end of the drive motor is electrically connected to the output end of an external power supply.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] 1. In this application, the ejection mechanism is used to move the extrusion block by activating the electric telescopic rod. The inclined surface of the extrusion block presses against the inclined surface of the moving block, causing the moving block to lift the connecting plate. This, in turn, causes the connecting rod to lift the ejection plate, ejecting the packaged substrate and separating it from the positioning groove. This facilitates the removal of the substrate, avoids damage to the product caused by forced removal, and improves the ease of removal of the device.

[0015] 2. In this application, by using a clamping mechanism, after the plastic shell and the substrate are glued together, the drive motor is started to drive the screw to rotate. The limiting rod and the limiting cavity cooperate to limit the threaded cylinder. When the screw rotates, the threaded cylinder moves, thereby causing the connecting block to rotate around the fixed seat. This causes the pressure rod to deflect around the mounting seat, so that the pressure rod clamps the encapsulated plastic shell, making the encapsulation tight, preventing the plastic shell from delaminating later, and ensuring the encapsulation quality. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the ejection mechanism of this utility model;

[0018] Figure 3 This is a schematic diagram of the main structure of the ejection mechanism of this utility model;

[0019] Figure 4 This is a schematic diagram of the pressing mechanism of this utility model;

[0020] Figure 5 This is a schematic diagram of the screw mounting structure of this utility model.

[0021] The following numbers are labeled in the diagram: 100, outer casing; 200, positioning groove; 300, ejection mechanism; 310, connecting rod; 320, ejection plate; 330, return spring; 340, connecting plate; 350, moving block; 360, electric telescopic rod; 370, pressing block; 400, clamping mechanism; 410, mounting base; 420, pressure rod; 430, fixed base; 431, connecting block; 440, threaded cylinder; 441, limiting cavity; 450, connecting base; 460, rotating block; 470, fixed plate; 471, limiting rod; 480, drive motor; 490, screw. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Example: Figure 1 - Figure 5 As shown, this utility model provides a technical solution for a semiconductor packaging fixture, including a housing 100, a positioning groove 200 provided in the top center of the housing 100, an ejection mechanism 300 provided inside the housing 100, and a pressing mechanism 400 provided on the outside of the housing 100.

[0024] Please see Figure 2 and Figure 3The ejection mechanism 300 includes a connecting rod 310, an ejection plate 320 fixed to the top of the connecting rod 310, a return spring 330 sleeved on the outer side of the connecting rod 310, a connecting plate 340 fixed to the bottom of the connecting rod 310, a moving block 350 fixed to the bottom of the connecting plate 340, an electric telescopic rod 360 fixed to the left and right sides of the inner cavity of the outer shell 100, and a pressing block 370 fixed to the end of the output shaft of the electric telescopic rod 360; the top of the return spring 330 is fixedly connected to the top of the inner cavity of the outer shell 100, and the bottom of the return spring 330 is fixedly connected to the top of the connecting plate 340; the top of the pressing block 370 and both sides of the moving block 350 are provided with inclined surfaces, and the electric telescopic rod 360... The input end of the telescopic rod 360 is electrically connected to the output end of the external power supply; the outer side wall of the ejector plate 320 fits against the inner side wall of the positioning groove 200, and a through hole is provided at the bottom of the outer casing 100; by using the ejector mechanism 300, the electric telescopic rod 360 is activated to drive the pressing block 370 to move, so that the inclined surface of the pressing block 370 presses against the inclined surface of the moving block 350, causing the moving block 350 to drive the connecting plate 340 to rise, thereby causing the connecting rod 310 to drive the ejector plate 320 to rise, ejecting the packaged substrate, separating the substrate from the positioning groove 200, thereby facilitating the removal of the substrate, avoiding product damage caused by forced removal, and improving the ease of removal of the device.

[0025] Please see Figure 4 and Figure 5The clamping mechanism 400 includes mounting seats 410 symmetrically fixed to the top of the housing 100. A pressure rod 420 rotatably rotates inside the mounting seat 410. A fixing seat 430 is fixed to the bottom edge of the pressure rod 420. A connecting block 431 rotatably rotates inside the fixing seat 430. A threaded cylinder 440 is fixed to the bottom of the connecting block 431. Connecting seats 450 are fixed to the bottom of both sides of the housing 100. A rotating block 460 rotatably rotates inside the connecting seat 450. A fixing plate 470 is fixed to the top of the rotating block 460. A drive motor 480 is fixed to the top center of the fixing plate 470. A screw 490 is fixed to the end of the output shaft of the drive motor 480. The clamping mechanism 400 also includes limiting cavities 441 symmetrically opened at the bottom of the threaded cylinder 440. Limiting rods 471 are symmetrically fixed to the top of the fixing plate 470. Positioning rod 471 is slidably connected inside limiting cavity 441, and a baffle is fixed at the end of limiting rod 471. Threaded cylinder 440 is screwed to the outside of screw 490. The input end of drive motor 480 is electrically connected to the output end of external power supply. With the setting of clamping mechanism 400, after the plastic shell and substrate are glued together, drive motor 480 is started to drive screw 490 to rotate. Using the cooperation between limiting rod 471 and limiting cavity 441, threaded cylinder 440 is limited. When screw 490 rotates, threaded cylinder 440 moves, thereby causing connecting block 431 to rotate around fixed seat 430, which in turn causes pressure rod 420 to deflect around mounting seat 410, so that pressure rod 420 presses the encapsulated plastic shell tightly, making the encapsulation tight, preventing the plastic shell from delaminating later, and ensuring encapsulation quality.

[0026] In use, this invention works as follows: During encapsulation, the semiconductor substrate is placed in the positioning groove 200, and the plastic shell is encapsulated with sealant to connect the plastic shell to the semiconductor substrate. Then, the drive motor 480 is activated, driving the screw 490 to rotate. The limiting rod 471, in cooperation with the limiting cavity 441, limits the threaded cylinder 440. As the screw 490 rotates, the threaded cylinder 440 moves, causing the connecting block 431 to rotate around the fixed base 430. This, in turn, causes the pressure rod 420 to deflect around the mounting base 410, pressing the encapsulated plastic shell tightly to ensure a tight seal, preventing later delamination and guaranteeing encapsulation quality. Afterward, the drive motor 480 is reversed, causing the screw 490 to reverse, thus resetting the threaded cylinder 440 and the pressure rod 420. At this point, the electric telescopic rod 360 is activated, extending the electric telescopic rod... The activation of the telescopic rod 360 moves the pressing block 370, causing its inclined surface to press against the inclined surface of the moving block 350. This causes the moving block 350 to lift the connecting plate 340, simultaneously pressing the reset spring 330. Consequently, the connecting rod 310 lifts the ejector plate 320, ejecting the packaged substrate and separating it from the positioning groove 200. This facilitates the removal of the packaged semiconductor substrate, avoiding damage caused by forced removal and improving the ease of removal. Activating the electric telescopic rod 360 resets the pressing block 370. The reset spring 330 then resets the connecting plate 340, which in turn resets the connecting rod 310, causing the ejector plate 320 to return to its original position in the positioning groove 200. The above steps are repeated to package the semiconductor substrate.

[0027] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A semiconductor package fixture, comprising: Including the shell (100), the top middle of the shell (100) is provided with a positioning slot (200), the inside of the shell (100) is provided with an ejection mechanism (300), the outside of the shell (100) is provided with a compression mechanism (400); The ejection mechanism (300) includes a connecting rod (310), the top end of the connecting rod (310) is fixed with an ejection plate (320), the outside of the connecting rod (310) is sleeved with a reset spring (330), the bottom end of the connecting rod (310) is fixed with a connecting plate (340), the bottom of the connecting plate (340) is fixed with a moving block (350), the left and right sides of the inner cavity of the shell (100) are fixed with an electric telescopic rod (360), the output shaft end of the electric telescopic rod (360) is fixed with a extrusion block (370).

2. The semiconductor package fixture of claim 1, wherein: The top end of the reset spring (330) is fixedly connected with the top of the inner cavity of the shell (100), and the bottom end of the reset spring (330) is fixedly connected with the top of the connecting plate (340).

3. The semiconductor package fixture of claim 1, wherein: The top of the extrusion block (370) and the two sides of the moving block (350) are provided with inclined surfaces, and the input end of the electric telescopic rod (360) is electrically connected with the output end of the external power supply.

4. The semiconductor package fixture of claim 1, wherein: The outer wall of the ejection plate (320) is fitted with the inner wall of the positioning slot (200), and the bottom of the shell (100) is provided with a through hole.

5. The semiconductor package fixture of claim 1, wherein: The compression mechanism (400) includes a mounting seat (410) symmetrically fixed to the top of the shell (100), a pressure rod (420) rotates in the inside of the mounting seat (410), a fixed seat (430) is fixed to the bottom of the pressure rod (420), a connecting block (431) rotates in the inside of the fixed seat (430), a threaded cylinder (440) is fixed to the bottom of the connecting block (431), a connecting seat (450) is fixed to the bottom of the two sides of the shell (100), a rotating block (460) rotates in the inside of the connecting seat (450), a fixed plate (470) is fixed to the top of the rotating block (460), a drive motor (480) is fixed to the top middle of the fixed plate (470), and a screw rod (490) is fixed to the output shaft end of the drive motor (480).

6. The semiconductor package fixture of claim 5, wherein: The compression mechanism (400) further includes a limiting cavity (441) symmetrically formed in the bottom of the threaded cylinder (440), and a limiting rod (471) is symmetrically fixed to the top of the fixed plate (470).

7. The semiconductor package fixture of claim 6, wherein: The limiting rod (471) is slidingly connected in the inside of the limiting cavity (441), the end of the limiting rod (471) is fixed with a baffle, the threaded cylinder (440) is screwed on the outside of the screw rod (490), and the input end of the drive motor (480) is electrically connected with the output end of the external power supply.

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