High performance DFN leadframe

Abstract

The utility model discloses a high -performance DFN lead frame, including frame body, frame body adopts etching process production, and frame body includes the main function area of four big units in the centre, and the positioning area for positioning is designed to the upside and downside two sides, and the adhesive uncovering area for uncovering adhesive is used to the left and right two sides, and the back four corners are designed to have the foolproof frame for preventing adhesive tape to paste offset, and every big unit includes the small unit of vertical and horizontal interlaced distribution in the centre, and the air hole for identifying cutting and releasing stress is used to the four around, and the glue inlet hole for the glue inlet is designed between every two big units. The high -performance DFN lead frame of the new type is applicable to 0.5mm thickness's package, can adopt BBOS lead bonding process, need not form Bump ball, solves the quality hidden danger of pad wire tail, improves the yield of product, and the lead frame arrangement is more compact, can effectively save the space of material, improves the utilization of material, and production efficiency is effectively improved, and the cost of production and material is saved.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit technology, and in particular to a high-performance DFN lead frame. Background Technology

[0002] Driven by electrification and smart technology, the "chip" content of daily life is increasing, and more and more electronic functions are being integrated into our everyday tools to meet people's pursuit of a high-quality life. However, every electronic product strives to achieve more functions in a smaller space. To cram more functions into a limited space, there is only one solution: "miniaturization".

[0003] For electronic products, a key step in miniaturization is to "compress" the size of components to maximize the utilization of precious PCB space. This makes the optimization of component packaging technology particularly important. Excellent packaging technology not only ensures a compact component form factor but also meets heat dissipation requirements to support higher power densities. DFN packaging, due to its small size, maximizes form factor while ensuring high thermal and electrical performance, meeting the demands of higher power density applications. The lead frame is a crucial component, primarily used for heat dissipation and signal transmission, and its demand is steadily increasing.

[0004] like Figure One For existing DFN lead frames, Figure Two This invention addresses the challenges of producing high-performance DFN leadframes. Existing DFN leadframes typically have larger package sizes, occupying more product area after packaging. Furthermore, they require fewer products to be manufactured using the same materials, resulting in a looser arrangement and lower production efficiency and material utilization. This invention solves these problems by reducing product size, enhancing product performance, increasing the number of product rows, and improving layout density in the leadframe design. Utility Model Content

[0005] This utility model discloses a high-performance DFN lead frame, which solves the problems of the loose arrangement and small number of existing DFN lead frame products, resulting in low material utilization, higher raw material consumption, increased production costs, and easy deformation and bending during production, which seriously affects product production efficiency. Through the research and development of new products, the package size is further reduced, while the original functions are met and the performance is further improved, and the production efficiency of the product is effectively improved.

[0006] To achieve the above objectives, the technical solution of this utility model is as follows:

[0007] A high-performance DFN lead frame includes a frame body manufactured using an etching process. The frame body comprises a main functional area consisting of four large central units, positioning areas on the top and bottom sides for positioning, adhesive removal areas on the left and right sides for adhesive removal, and anti-misalignment frames at the four corners of the back to prevent tape misalignment. Each large unit includes crisscrossing small units distributed in the center, with ventilation holes around the perimeter for identifying cuts and releasing stress. An adhesive inlet hole is designed between every two large units for adhesive injection.

[0008] In a preferred improvement of this utility model, the frame body is prepared by electroplating followed by etching to ensure the quality and stability of the plating layer.

[0009] In a preferred improvement of this utility model, the lead frame is manufactured using an etching process to ensure the precision and reliability of the product. The frame body is a cuboid with a length of 258mm, a width of 78mm, and a thickness of 0.127mm. The small units are connected by connecting ribs, and the thickness of the connecting ribs is half that of the raw material.

[0010] As a preferred improvement of this utility model, the frame body is made of C19400 FH 0.127mm copper alloy. The smaller material thickness makes the package size smaller, and the copper alloy has more strength while having excellent conductivity.

[0011] As a preferred improvement of this utility model, the spacing of each large unit in the X direction on the frame body is 61.5mm, the center distance from the left side is 37.25mm, and the center distance from the right side is 36.25mm.

[0012] As a preferred improvement of this utility model, each large unit on the frame body is distributed with 66 rows and 41 columns of interlaced small units.

[0013] As a preferred improvement of this utility model, the connecting ribs between the various small units are all made by semi-etching, which facilitates the stability of the molding and the cutting and separation after molding.

[0014] As a preferred improvement of this utility model, the anti-foolproof frames at the four corners of the back of the frame body are semi-etched areas with a length of 2.00 mm, a width of 0.6 mm, and a depth of 0.0335-0.0935 mm.

[0015] The beneficial effects of the high-performance DFN lead frame provided by this utility model are as follows:

[0016] 1. The small unit package size of the lead frame has been reduced from 1.0*1.0mm to 1.0*0.72mm. With the same area of ​​etching board, more products can be produced, materials can be used more fully, and material waste can be reduced.

[0017] 2. By changing from three large units to four large units, an additional connecting rib between two large units was added, improving the overall strength of the product;

[0018] 3. By adding connecting columns between the connecting ribs of small units, the overall strength of the frame is improved, reducing the problem of easy deformation due to weak materials during the production process and improving the overall yield of the product.

[0019] 4. Add a base post to the top of the two pins in the middle of the small unit to connect with the connecting rib, providing more chip soldering area and wire bonding area for the product, ensuring greater compatibility and stability. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein:

[0021] Figure 1 This is a schematic diagram of the structure of an existing DFN lead frame of the same type;

[0022] Figure 2 This is a schematic diagram of the overall structure of the high-performance DFN lead frame of this utility model;

[0023] Figure 3 This is a schematic diagram of the front view of a small unit of the high-performance DFN lead frame of this utility model;

[0024] Figure 4 This is a schematic diagram of the reverse side of a small unit of the high-performance DFN lead frame of this utility model. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0026] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0027] Furthermore, in this utility model, the use of terms such as "first," "second," etc., is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0028] In this utility model, unless otherwise explicitly specified and limited, the terms "connection," "fixing," etc., should be interpreted broadly. For example, "fixing" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0029] Furthermore, the technical solutions of the various embodiments of this utility model can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0030] Please see Figure 2 , Figure 3 and Figure 4 As shown, a high-performance DFN lead frame includes a frame body 1, which is manufactured using an etching process. The frame body 1 includes a main functional area composed of four large units 11 in the center, positioning areas 12 for positioning on the upper and lower sides, adhesive removal areas 13 for adhesive removal on the left and right sides, and anti-misalignment frames 14 designed at the four corners of the back to prevent tape misalignment. Each large unit 11 includes small units 111 distributed in a crisscross pattern in the center, and ventilation holes 112 around the perimeter for identifying cuts and releasing stress. An adhesive inlet hole 15 is designed between every two large units 11 for adhesive inlet.

[0031] The four large units 11 on the frame body 1 are all 56.5mm long and 70mm wide, serving as sealing areas for plastic sealing.

[0032] The positioning areas 12 designed on the upper and lower sides of the frame body 1 include positioning circular holes 121 with a diameter of 1.524 mm and positioning elliptical holes 122 with an arc radius of 0.762 mm and a major axis of 2.324 mm.

[0033] Each large unit 11 contains 66 rows and 41 columns, totaling 2706 small units 111, and the frame body 1 contains a total of 10824 small units 111.

[0034] The adhesive removal area 13 of the frame body 1 has an adhesive removal area 131 with a 2.0mm indentation on the far left and an adhesive removal area 132 with a 0.5mm indentation on the right.

[0035] The semi-etched adhesive tape around the back of the frame body 1 has anti-fouling frames numbered 141, 142, 143, and 144, respectively.

[0036] The small unit 111 is divided into a front side 1111 and a back side 1112. The small units 111 are fixed together by connecting ribs 112. There is a reinforcing rib 113 in the middle of every four small units 111 to enhance the strength of the product. The front side 1111 includes six pins 11111. The six pins 11111 are covered with a layer of silver plating 11112. The two middle pins 11111 are designed with a base post 11113 connected to the connecting rib 112. The back side 1112 of the small unit 111 includes a back half-etched area 11121 and a bottom corner 11122.

[0037] The beneficial effects of the high-performance DFN lead frame provided by this utility model are as follows:

[0038] 1. The small unit package size of the lead frame has been reduced from 1.0*1.0mm to 1.0*0.72mm. With the same area of ​​etching board, more products can be produced, materials can be used more fully, and material waste can be reduced.

[0039] 2. By changing from three large units to four large units, an additional connecting rib between two large units was added, improving the overall strength of the product;

[0040] 3. By adding connecting columns between the connecting ribs of small units, the overall strength of the frame is improved, reducing the problem of easy deformation due to weak materials during the production process and improving the overall yield of the product.

[0041] 4. Add a base post to the top of the two pins in the middle of the small unit to connect with the connecting rib, providing more chip soldering area and wire bonding area for the product, ensuring greater compatibility and stability.

[0042] Although the embodiments of this utility model have been disclosed above, they are not limited to the applications listed in the specification and embodiments. They can be applied to various fields suitable for this utility model. For those skilled in the art, other modifications can be easily made. Therefore, without departing from the general concept defined by the claims and their equivalents, this utility model is not limited to the specific details and the illustrations shown and described herein.

Claims

1. A high-performance DFN lead frame, characterized in that, include: The frame body is produced by etching process. The frame body includes a main functional area composed of four large central units, positioning areas for positioning on the upper and lower sides, adhesive removal areas for adhesive removal on the left and right sides, and anti-mistake frames designed at the four corners of the back to prevent the tape from being misplaced. Each of the large units includes crisscrossing smaller units distributed around the center, with ventilation holes around the perimeter for identifying cuts and releasing stress, and a glue inlet is designed between every two of the large units for glue injection.

2. The high-performance DFN lead frame as described in claim 1, characterized in that, The lead frame must be manufactured using an etching process to ensure the precision and reliability of the product.

3. The high-performance DFN lead frame as described in claim 1, characterized in that, The frame body is a cuboid with a length of 258mm, a width of 78mm, and a thickness of 0.127mm.

4. A high-performance DFN lead frame as described in claim 1, characterized in that, Each large unit of the frame body includes several neatly arranged small units with a package size of 1.0 x 0.72 mm.

5. A high-performance DFN lead frame as described in claim 1, characterized in that, The positioning areas on the upper and lower sides of the frame body include positioning circular holes and positioning elliptical holes.

6. A high-performance DFN lead frame as described in claim 4, characterized in that, The small units are connected by connecting ribs, the thickness of which is half that of the raw material.

7. A high-performance DFN lead frame as described in claim 6, characterized in that, The ventilation holes designed around each large unit of the frame body correspond to the connecting ribs of the smaller units.

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